TWI414046B - 降低封裝串擾及損耗之半導體裝置 - Google Patents

降低封裝串擾及損耗之半導體裝置 Download PDF

Info

Publication number
TWI414046B
TWI414046B TW095139041A TW95139041A TWI414046B TW I414046 B TWI414046 B TW I414046B TW 095139041 A TW095139041 A TW 095139041A TW 95139041 A TW95139041 A TW 95139041A TW I414046 B TWI414046 B TW I414046B
Authority
TW
Taiwan
Prior art keywords
die
buffer
covering
filler
dielectric constant
Prior art date
Application number
TW095139041A
Other languages
English (en)
Chinese (zh)
Other versions
TW200729427A (en
Inventor
康狄 布萊恩Ｗ
麻哈林根 馬里
夏爾 麥哈許Ｋ
Original Assignee
飛思卡爾半導體公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 飛思卡爾半導體公司 filed Critical 飛思卡爾半導體公司
Publication of TW200729427A publication Critical patent/TW200729427A/zh
Application granted granted Critical
Publication of TWI414046B publication Critical patent/TWI414046B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW095139041A 2005-10-24 2006-10-23 降低封裝串擾及損耗之半導體裝置 TWI414046B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/257,802 US7435625B2 (en) 2005-10-24 2005-10-24 Semiconductor device with reduced package cross-talk and loss

Publications (2)

Publication Number Publication Date
TW200729427A TW200729427A (en) 2007-08-01
TWI414046B true TWI414046B (zh) 2013-11-01

Family

ID=37968396

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095139041A TWI414046B (zh) 2005-10-24 2006-10-23 降低封裝串擾及損耗之半導體裝置

Country Status (5)

Country Link
US (2) US7435625B2 (https=)
JP (1) JP2009513019A (https=)
KR (1) KR101296701B1 (https=)
TW (1) TWI414046B (https=)
WO (1) WO2007050420A2 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4870509B2 (ja) * 2006-09-27 2012-02-08 新光電気工業株式会社 電子装置
DE102009026804A1 (de) * 2009-06-08 2010-12-09 Robert Bosch Gmbh Verfahren zur Herstellung elektronischer Bauteile
JP5018909B2 (ja) * 2009-06-30 2012-09-05 株式会社デンソー 半導体装置
JP2011054806A (ja) * 2009-09-02 2011-03-17 Renesas Electronics Corp 半導体装置およびその製造方法
EP2564527B1 (en) * 2010-04-28 2017-11-15 Huawei Technologies Co., Ltd. Cross-talk reduction in a bidirectional optoelectronic device
JP5532419B2 (ja) * 2010-06-17 2014-06-25 富士電機株式会社 絶縁材、金属ベース基板および半導体モジュール並びにこれらの製造方法
CN102714542B (zh) * 2010-06-25 2015-08-19 Hoya美国公司 双向光电子设备中的串扰减小
KR20120000805A (ko) * 2010-06-28 2012-01-04 삼성전자주식회사 반도체 패키지의 몰딩 방법
WO2012033724A2 (en) * 2010-09-06 2012-03-15 Hoya Corporation Usa Cross-talk reduction in a bidirectional optoelectronic device
WO2013063410A1 (en) 2011-10-28 2013-05-02 Hoya Corporation Usa Optical waveguide splitter on a waveguide substrate for attenuating a light source
AU2013240253B2 (en) 2012-03-27 2015-12-10 3M Innovative Properties Company Composite particles, methods of making, and articles including the same
KR101905893B1 (ko) * 2012-06-13 2018-10-08 에스케이하이닉스 주식회사 복수의 유전층을 포함하는 임베디드 패키지 및 제조 방법
US9226428B2 (en) * 2012-06-28 2015-12-29 Intel Corporation High heat capacity electronic components and methods for fabricating
US20140103508A1 (en) * 2012-10-11 2014-04-17 Texas Instruments Incorporated Encapsulating package for an integrated circuit
EP2731130A1 (en) * 2012-11-12 2014-05-14 Nxp B.V. Cavity package for an integrated circuit
US9312231B2 (en) * 2013-10-31 2016-04-12 Freescale Semiconductor, Inc. Method and apparatus for high temperature semiconductor device packages and structures using a low temperature process
US9461005B2 (en) * 2015-02-12 2016-10-04 Ampleon Netherlands B.V. RF package with non-gaseous dielectric material
US10431526B2 (en) 2017-10-09 2019-10-01 Cree, Inc. Rivetless lead fastening for a semiconductor package
US10897824B2 (en) * 2017-10-30 2021-01-19 Baker Hughes, A Ge Company, Llc Encapsulation of downhole microelectronics and method the same
EP3706164A4 (en) * 2017-10-31 2021-08-11 Nagase ChemteX Corporation Method for producing package structure and sheet used in same
US10446414B2 (en) * 2017-12-22 2019-10-15 Texas Instruments Incorporated Semiconductor package with filler particles in a mold compound
US10672703B2 (en) 2018-09-26 2020-06-02 Nxp Usa, Inc. Transistor with shield structure, packaged device, and method of fabrication

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6379353A (ja) * 1986-09-24 1988-04-09 Hitachi Ltd 樹脂封止型半導体装置
US4788583A (en) * 1986-07-25 1988-11-29 Fujitsu Limited Semiconductor device and method of producing semiconductor device
JPH05283561A (ja) * 1992-03-30 1993-10-29 Nec Corp 樹脂封止型半導体装置
US5382829A (en) * 1992-07-21 1995-01-17 Mitsubishi Denki Kabushiki Kaisha Packaged microwave semiconductor device
TW200529088A (en) * 2004-02-04 2005-09-01 Semiconductor Energy Lab ID label, ID tag, and ID card

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4079162A (en) * 1974-03-20 1978-03-14 Aim Associates, Inc. Soundproof structure
US4041009A (en) * 1976-12-08 1977-08-09 Fujitsu Limited Process for producing anti-blocking and low pressure moldable diallyl phthalate resin molding materials
US6191492B1 (en) * 1988-08-26 2001-02-20 Semiconductor Energy Laboratory Co., Ltd. Electronic device including a densified region
JP2712618B2 (ja) * 1989-09-08 1998-02-16 三菱電機株式会社 樹脂封止型半導体装置
JP2656356B2 (ja) * 1989-09-13 1997-09-24 株式会社東芝 多重モールド型半導体装置及びその製造方法
JP2906282B2 (ja) * 1990-09-20 1999-06-14 富士通株式会社 ガラスセラミック・グリーンシートと多層基板、及び、その製造方法
EP0634792B1 (en) * 1991-03-08 1998-04-29 Japan Gore-Tex, Inc. Resin-sealed semiconductor device containing porous fluororesin
JPH04314394A (ja) * 1991-04-12 1992-11-05 Fujitsu Ltd ガラスセラミック回路基板とその製造方法
US5598034A (en) * 1992-07-22 1997-01-28 Vlsi Packaging Corporation Plastic packaging of microelectronic circuit devices
US5785789A (en) * 1993-03-18 1998-07-28 Digital Equipment Corporation Low dielectric constant microsphere filled layers for multilayer electrical structures
US5379186A (en) * 1993-07-06 1995-01-03 Motorola, Inc. Encapsulated electronic component having a heat diffusing layer
JP2531382B2 (ja) * 1994-05-26 1996-09-04 日本電気株式会社 ボ―ルグリッドアレイ半導体装置およびその製造方法
US5578860A (en) * 1995-05-01 1996-11-26 Motorola, Inc. Monolithic high frequency integrated circuit structure having a grounded source configuration
JPH0927573A (ja) * 1995-07-13 1997-01-28 Mitsubishi Electric Corp 半導体装置
JP2871591B2 (ja) * 1996-05-14 1999-03-17 日本電気株式会社 高周波用電子部品および高周波用電子部品の製造方法
JP3870301B2 (ja) * 1996-06-11 2007-01-17 ヤマハ株式会社 半導体装置の組立法、半導体装置及び半導体装置の連続組立システム
JP3403417B2 (ja) * 1997-04-02 2003-05-06 三洋化成工業株式会社 ポリウレタンフォーム、その製法及びフォーム形成用組成物
US6001673A (en) * 1999-02-11 1999-12-14 Ericsson Inc. Methods for packaging integrated circuit devices including cavities adjacent active regions
US6384487B1 (en) * 1999-12-06 2002-05-07 Micron Technology, Inc. Bow resistant plastic semiconductor package and method of fabrication
US6521703B2 (en) * 2000-01-18 2003-02-18 General Electric Company Curable resin composition, method for the preparation thereof, and articles derived thereform
US6630153B2 (en) * 2001-02-23 2003-10-07 Smith & Nephew, Inc. Manufacture of bone graft substitutes
ATE327097T1 (de) * 2000-04-07 2006-06-15 Fuji Photo Film Co Ltd Wärmeempfindlicher lithographischer druckplattevorläufer
US6509415B1 (en) * 2000-04-07 2003-01-21 Honeywell International Inc. Low dielectric constant organic dielectrics based on cage-like structures
US6627669B2 (en) * 2000-06-06 2003-09-30 Honeywell International Inc. Low dielectric materials and methods of producing same
US6423811B1 (en) * 2000-07-19 2002-07-23 Honeywell International Inc. Low dielectric constant materials with polymeric networks
US6794481B2 (en) * 2001-06-28 2004-09-21 Mitsubishi Gas Chemical Company, Inc. Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof
US6744117B2 (en) * 2002-02-28 2004-06-01 Motorola, Inc. High frequency semiconductor device and method of manufacture

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4788583A (en) * 1986-07-25 1988-11-29 Fujitsu Limited Semiconductor device and method of producing semiconductor device
JPS6379353A (ja) * 1986-09-24 1988-04-09 Hitachi Ltd 樹脂封止型半導体装置
JPH05283561A (ja) * 1992-03-30 1993-10-29 Nec Corp 樹脂封止型半導体装置
US5382829A (en) * 1992-07-21 1995-01-17 Mitsubishi Denki Kabushiki Kaisha Packaged microwave semiconductor device
TW200529088A (en) * 2004-02-04 2005-09-01 Semiconductor Energy Lab ID label, ID tag, and ID card

Also Published As

Publication number Publication date
WO2007050420A3 (en) 2007-08-30
US7701074B2 (en) 2010-04-20
WO2007050420A2 (en) 2007-05-03
US20070090542A1 (en) 2007-04-26
JP2009513019A (ja) 2009-03-26
TW200729427A (en) 2007-08-01
US7435625B2 (en) 2008-10-14
KR20080065980A (ko) 2008-07-15
US20090001614A1 (en) 2009-01-01
KR101296701B1 (ko) 2013-08-20

Similar Documents

Publication Publication Date Title
TWI414046B (zh) 降低封裝串擾及損耗之半導體裝置
TWI482261B (zh) 三維系統級封裝堆疊式封裝結構
US7145253B1 (en) Encapsulated sensor device
CN100477141C (zh) 半导体封装器件及其制造和测试方法
US6876087B2 (en) Chip scale package with heat dissipating part
CN112018055B (zh) 电磁屏蔽散热封装结构及其制备方法
TWI470747B (zh) 具晶粒介面層之塑料封裝裝置
JP2009513029A (ja) 封止の改善された半導体装置
JPH0714974A (ja) プラスチックモールドした集積回路パッケージ
JP6802314B2 (ja) 半導体パッケージ及びその製造方法
CN1868058A (zh) 用于减小或消除半导体器件引线偏移的系统和方法
TWI358797B (en) A wireless communication module with power amplifi
TWI452667B (zh) 具有空腔結構之半導體封裝元件及其封裝方法
US6818968B1 (en) Integrated circuit package and process for forming the same
CN1945805A (zh) 半导体封装方法以及用于半导体封装的载体
CN113972189A (zh) 屏蔽的电子封装和制造方法
CN116724396A (zh) 在微电子装置的封装件内的区域屏蔽
TW407446B (en) Electric apparatus with multi-chip stacked package and the method of forming the same
TW202401842A (zh) 影像感測器封裝
KR100387395B1 (ko) 에어캐비티를 갖는 플라스틱 패캐지 및 그 제조방법
CN120511235A (zh) 半导体模块装置、用于半导体模块装置的电子器件载体以及用于制造半导体模块装置的方法
JP2000133762A (ja) 半導体装置およびその製造方法
JP2026052574A (ja) 半導体装置
CN118053849A (zh) 衬底装置以及生产衬底装置的方法
JP2000200862A (ja) 半導体装置およびその製造方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees