TWI413567B - Printing substrate processing machine - Google Patents

Printing substrate processing machine Download PDF

Info

Publication number
TWI413567B
TWI413567B TW097105138A TW97105138A TWI413567B TW I413567 B TWI413567 B TW I413567B TW 097105138 A TW097105138 A TW 097105138A TW 97105138 A TW97105138 A TW 97105138A TW I413567 B TWI413567 B TW I413567B
Authority
TW
Taiwan
Prior art keywords
processing machine
beam portion
printed circuit
circuit board
column
Prior art date
Application number
TW097105138A
Other languages
English (en)
Chinese (zh)
Other versions
TW200840679A (en
Inventor
Toshiyuki Iwata
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of TW200840679A publication Critical patent/TW200840679A/zh
Application granted granted Critical
Publication of TWI413567B publication Critical patent/TWI413567B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/16—Perforating by tool or tools of the drill type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Drilling And Boring (AREA)
  • Machine Tool Units (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
TW097105138A 2007-03-28 2008-02-14 Printing substrate processing machine TWI413567B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007085844A JP4367863B2 (ja) 2007-03-28 2007-03-28 プリント基板加工機

Publications (2)

Publication Number Publication Date
TW200840679A TW200840679A (en) 2008-10-16
TWI413567B true TWI413567B (zh) 2013-11-01

Family

ID=39910309

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097105138A TWI413567B (zh) 2007-03-28 2008-02-14 Printing substrate processing machine

Country Status (4)

Country Link
JP (1) JP4367863B2 (ja)
KR (1) KR101427811B1 (ja)
CN (1) CN101274373B (ja)
TW (1) TWI413567B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103203772B (zh) * 2013-03-21 2015-04-22 晋城凤凰实业有限责任公司 一种自动化双主轴钻孔装置
CN108162053B (zh) * 2017-12-19 2023-08-15 上海荣南科技有限公司 一种多工位打孔设备及其操作方法
CN111438474B (zh) * 2020-04-13 2021-08-31 马鞍山市帅诚科技发展有限公司 一种钢结构建筑钢梁焊接固定夹具
CN111546419A (zh) * 2020-05-19 2020-08-18 崔亮 一种印刷电路板钻孔装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09248724A (ja) * 1996-03-14 1997-09-22 Hitachi Seiko Ltd プリント基板穴明機
TW393366B (en) * 1997-07-23 2000-06-11 Howa Machinery Ltd Tool changing mechanism
TW442355B (en) * 1997-10-02 2001-06-23 Pluritec Italia Machine tool featuring a number of machining heads for machining printed circuit boards
JP2007021606A (ja) * 2005-07-13 2007-02-01 Hitachi Via Mechanics Ltd ドリル穴明機及びその方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11277351A (ja) * 1998-03-30 1999-10-12 Nippon Seiko Kk 直動テーブル
DE10221532B4 (de) * 2002-05-15 2005-09-22 Schmoll Maschinen Gmbh Automatisierte Werkzeugmaschine
CN2787367Y (zh) * 2005-03-30 2006-06-14 杭州贝克机械有限公司 钻床多立柱机架

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09248724A (ja) * 1996-03-14 1997-09-22 Hitachi Seiko Ltd プリント基板穴明機
TW393366B (en) * 1997-07-23 2000-06-11 Howa Machinery Ltd Tool changing mechanism
TW442355B (en) * 1997-10-02 2001-06-23 Pluritec Italia Machine tool featuring a number of machining heads for machining printed circuit boards
JP2007021606A (ja) * 2005-07-13 2007-02-01 Hitachi Via Mechanics Ltd ドリル穴明機及びその方法

Also Published As

Publication number Publication date
JP2008238376A (ja) 2008-10-09
CN101274373A (zh) 2008-10-01
KR20080088373A (ko) 2008-10-02
CN101274373B (zh) 2011-06-01
KR101427811B1 (ko) 2014-08-07
TW200840679A (en) 2008-10-16
JP4367863B2 (ja) 2009-11-18

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MM4A Annulment or lapse of patent due to non-payment of fees