TWI398900B - 用於產生輻射之方法及源、器件製造方法及微影系統 - Google Patents
用於產生輻射之方法及源、器件製造方法及微影系統 Download PDFInfo
- Publication number
- TWI398900B TWI398900B TW097129921A TW97129921A TWI398900B TW I398900 B TWI398900 B TW I398900B TW 097129921 A TW097129921 A TW 097129921A TW 97129921 A TW97129921 A TW 97129921A TW I398900 B TWI398900 B TW I398900B
- Authority
- TW
- Taiwan
- Prior art keywords
- plasma
- source
- fuel
- radiation
- substance
- Prior art date
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 168
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000001459 lithography Methods 0.000 title claims description 58
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000000446 fuel Substances 0.000 claims abstract description 72
- 239000000126 substance Substances 0.000 claims abstract description 45
- 229910052738 indium Inorganic materials 0.000 claims abstract description 11
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 7
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 5
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 4
- 229910052745 lead Inorganic materials 0.000 claims abstract 3
- 210000002381 plasma Anatomy 0.000 claims description 129
- 239000000758 substrate Substances 0.000 claims description 55
- 239000000203 mixture Substances 0.000 claims description 16
- 229910052718 tin Inorganic materials 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 12
- 238000000059 patterning Methods 0.000 claims description 6
- 230000002829 reductive effect Effects 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 229910052724 xenon Inorganic materials 0.000 claims description 5
- 229910052744 lithium Inorganic materials 0.000 claims description 2
- 229910052789 astatine Inorganic materials 0.000 claims 2
- 230000003287 optical effect Effects 0.000 description 14
- 238000004898 kneading Methods 0.000 description 13
- 239000010410 layer Substances 0.000 description 13
- 238000005286 illumination Methods 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 8
- 230000003595 spectral effect Effects 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000000356 contaminant Substances 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 238000001228 spectrum Methods 0.000 description 5
- 238000007654 immersion Methods 0.000 description 4
- 230000033001 locomotion Effects 0.000 description 4
- 238000009304 pastoral farming Methods 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000003491 array Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000008240 homogeneous mixture Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000010363 phase shift Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000005381 magnetic domain Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000005469 synchrotron radiation Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05G—X-RAY TECHNIQUE
- H05G2/00—Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
- H05G2/001—Production of X-ray radiation generated from plasma
- H05G2/002—Supply of the plasma generating material
- H05G2/0027—Arrangements for controlling the supply; Arrangements for measurements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Optics & Photonics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- X-Ray Techniques (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/882,853 US8493548B2 (en) | 2007-08-06 | 2007-08-06 | Lithographic apparatus and device manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200912999A TW200912999A (en) | 2009-03-16 |
| TWI398900B true TWI398900B (zh) | 2013-06-11 |
Family
ID=39846624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097129921A TWI398900B (zh) | 2007-08-06 | 2008-08-06 | 用於產生輻射之方法及源、器件製造方法及微影系統 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8493548B2 (enExample) |
| EP (1) | EP2186386A1 (enExample) |
| JP (1) | JP2010536142A (enExample) |
| KR (1) | KR101331069B1 (enExample) |
| CN (1) | CN101779524B (enExample) |
| NL (1) | NL1035746A1 (enExample) |
| TW (1) | TWI398900B (enExample) |
| WO (1) | WO2009020390A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7872244B2 (en) * | 2007-08-08 | 2011-01-18 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP5896910B2 (ja) * | 2009-10-29 | 2016-03-30 | コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． | ガス放電光源用の電極システム |
| US10217625B2 (en) * | 2015-03-11 | 2019-02-26 | Kla-Tencor Corporation | Continuous-wave laser-sustained plasma illumination source |
| KR102669150B1 (ko) | 2016-07-27 | 2024-05-27 | 삼성전자주식회사 | 자외선(uv) 노광 장치를 구비한 극자외선(euv) 노광 시스템 |
| US12437883B1 (en) | 2019-03-27 | 2025-10-07 | Consolidated Nuclear Security, LLC | Diode assembly for pulsed fusion events |
| US11437152B1 (en) | 2019-06-27 | 2022-09-06 | Consolidated Nuclear Security, LLC | Diode assembly and method of forming a diode assembly for pulsed fusion events |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6232613B1 (en) * | 1997-03-11 | 2001-05-15 | University Of Central Florida | Debris blocker/collector and emission enhancer for discharge sources |
| US6452194B2 (en) * | 1999-12-17 | 2002-09-17 | Asml Netherlands B.V. | Radiation source for use in lithographic projection apparatus |
| US20040105082A1 (en) * | 2002-09-19 | 2004-06-03 | Asml Netherlands B. V. | Radiation source, lithographic apparatus and device manufacturing method |
| US20040141165A1 (en) * | 2002-10-03 | 2004-07-22 | Asml Netherlands B.V. | Radiation source, lithographic apparatus, and device manufacturing method |
| US20040256575A1 (en) * | 1998-05-05 | 2004-12-23 | Carl Zeiss Smt Ag | Illumination system with a plurality of light sources |
| TW200727089A (en) * | 2005-12-06 | 2007-07-16 | Asml Netherlands Bv | Radiation system and lithographic apparatus |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3586244T2 (de) * | 1984-12-26 | 2000-04-20 | Kabushiki Kaisha Toshiba | Vorrichtung zur Erzeugung von Weich-Röntgenstrahlen durch ein Hochenergiebündel. |
| US5523193A (en) | 1988-05-31 | 1996-06-04 | Texas Instruments Incorporated | Method and apparatus for patterning and imaging member |
| WO1991017483A1 (de) | 1990-05-02 | 1991-11-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Belichtungsvorrichtung |
| SE502094C2 (sv) * | 1991-08-16 | 1995-08-14 | Sandvik Ab | Metod för diamantbeläggning med mikrovågsplasma |
| JPH0917595A (ja) * | 1995-06-28 | 1997-01-17 | Nikon Corp | Ｘ線発生装置 |
| DE69711929T2 (de) | 1997-01-29 | 2002-09-05 | Micronic Laser Systems Ab, Taeby | Verfahren und gerät zur erzeugung eines musters auf einem mit fotoresist beschichteten substrat mittels fokusiertem laserstrahl |
| SE509062C2 (sv) | 1997-02-28 | 1998-11-30 | Micronic Laser Systems Ab | Dataomvandlingsmetod för en laserskrivare med flera strålar för mycket komplexa mikrokolitografiska mönster |
| US6815700B2 (en) * | 1997-05-12 | 2004-11-09 | Cymer, Inc. | Plasma focus light source with improved pulse power system |
| US6972421B2 (en) | 2000-06-09 | 2005-12-06 | Cymer, Inc. | Extreme ultraviolet light source |
| DE10139677A1 (de) * | 2001-04-06 | 2002-10-17 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zum Erzeugen von extrem ultravioletter Strahlung und weicher Röntgenstrahlung |
| KR100408405B1 (ko) * | 2001-05-03 | 2003-12-06 | 삼성전자주식회사 | 반도체 소자의 제조 장치 |
| US7372056B2 (en) * | 2005-06-29 | 2008-05-13 | Cymer, Inc. | LPP EUV plasma source material target delivery system |
| DE10219173A1 (de) * | 2002-04-30 | 2003-11-20 | Philips Intellectual Property | Verfahren zur Erzeugung von Extrem-Ultraviolett-Strahlung |
| DE10256663B3 (de) * | 2002-12-04 | 2005-10-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Gasentladungslampe für EUV-Strahlung |
| DE10310623B8 (de) * | 2003-03-10 | 2005-12-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zum Erzeugen eines Plasmas durch elektrische Entladung in einem Entladungsraum |
| DE10342239B4 (de) * | 2003-09-11 | 2018-06-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zum Erzeugen von Extrem-Ultraviolettstrahlung oder weicher Röntgenstrahlung |
| US20070019789A1 (en) * | 2004-03-29 | 2007-01-25 | Jmar Research, Inc. | Systems and methods for achieving a required spot says for nanoscale surface analysis using soft x-rays |
| JP4337648B2 (ja) * | 2004-06-24 | 2009-09-30 | 株式会社ニコン | Ｅｕｖ光源、ｅｕｖ露光装置、及び半導体デバイスの製造方法 |
| JP4301094B2 (ja) * | 2004-06-25 | 2009-07-22 | トヨタ自動車株式会社 | 燃料又は還元剤添加装置及び方法、並びにプラズマトーチ |
| DE102004042501A1 (de) * | 2004-08-31 | 2006-03-16 | Xtreme Technologies Gmbh | Vorrichtung zur Bereitstellung eines reproduzierbaren Targetstromes für die energiestrahlinduzierte Erzeugung kurzwelliger elektromagnetischer Strahlung |
| US7154109B2 (en) * | 2004-09-30 | 2006-12-26 | Intel Corporation | Method and apparatus for producing electromagnetic radiation |
| DE102005041567B4 (de) | 2005-08-30 | 2009-03-05 | Xtreme Technologies Gmbh | EUV-Strahlungsquelle mit hoher Strahlungsleistung auf Basis einer Gasentladung |
| US7462851B2 (en) * | 2005-09-23 | 2008-12-09 | Asml Netherlands B.V. | Electromagnetic radiation source, lithographic apparatus, device manufacturing method and device manufactured thereby |
| US7705331B1 (en) * | 2006-06-29 | 2010-04-27 | Kla-Tencor Technologies Corp. | Methods and systems for providing illumination of a specimen for a process performed on the specimen |
| TW200808134A (en) * | 2006-07-28 | 2008-02-01 | Ushio Electric Inc | Light source device for producing extreme ultraviolet radiation and method of generating extreme ultraviolet radiation |
-
2007
- 2007-08-06 US US11/882,853 patent/US8493548B2/en not_active Expired - Fee Related
-
2008
- 2008-07-23 NL NL1035746A patent/NL1035746A1/nl active Search and Examination
- 2008-08-05 JP JP2010519881A patent/JP2010536142A/ja active Pending
- 2008-08-05 CN CN2008801023982A patent/CN101779524B/zh not_active Expired - Fee Related
- 2008-08-05 WO PCT/NL2008/050536 patent/WO2009020390A1/en not_active Ceased
- 2008-08-05 EP EP08779074A patent/EP2186386A1/en not_active Withdrawn
- 2008-08-05 KR KR1020107002713A patent/KR101331069B1/ko not_active Expired - Fee Related
- 2008-08-06 TW TW097129921A patent/TWI398900B/zh not_active IP Right Cessation
-
2013
- 2013-06-25 US US13/926,625 patent/US20130287968A1/en not_active Abandoned
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6232613B1 (en) * | 1997-03-11 | 2001-05-15 | University Of Central Florida | Debris blocker/collector and emission enhancer for discharge sources |
| US20040256575A1 (en) * | 1998-05-05 | 2004-12-23 | Carl Zeiss Smt Ag | Illumination system with a plurality of light sources |
| US6452194B2 (en) * | 1999-12-17 | 2002-09-17 | Asml Netherlands B.V. | Radiation source for use in lithographic projection apparatus |
| US20040105082A1 (en) * | 2002-09-19 | 2004-06-03 | Asml Netherlands B. V. | Radiation source, lithographic apparatus and device manufacturing method |
| US20040141165A1 (en) * | 2002-10-03 | 2004-07-22 | Asml Netherlands B.V. | Radiation source, lithographic apparatus, and device manufacturing method |
| TW200727089A (en) * | 2005-12-06 | 2007-07-16 | Asml Netherlands Bv | Radiation system and lithographic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| US20130287968A1 (en) | 2013-10-31 |
| WO2009020390A1 (en) | 2009-02-12 |
| KR20100029849A (ko) | 2010-03-17 |
| US20090040491A1 (en) | 2009-02-12 |
| US8493548B2 (en) | 2013-07-23 |
| EP2186386A1 (en) | 2010-05-19 |
| CN101779524B (zh) | 2012-12-05 |
| KR101331069B1 (ko) | 2013-11-19 |
| CN101779524A (zh) | 2010-07-14 |
| JP2010536142A (ja) | 2010-11-25 |
| NL1035746A1 (nl) | 2009-02-09 |
| TW200912999A (en) | 2009-03-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |