KR101331069B1 - 리소그래피 장치 및 디바이스 제조 방법 - Google Patents

리소그래피 장치 및 디바이스 제조 방법 Download PDF

Info

Publication number
KR101331069B1
KR101331069B1 KR1020107002713A KR20107002713A KR101331069B1 KR 101331069 B1 KR101331069 B1 KR 101331069B1 KR 1020107002713 A KR1020107002713 A KR 1020107002713A KR 20107002713 A KR20107002713 A KR 20107002713A KR 101331069 B1 KR101331069 B1 KR 101331069B1
Authority
KR
South Korea
Prior art keywords
radiation
plasma
delete delete
fuel
source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020107002713A
Other languages
English (en)
Korean (ko)
Other versions
KR20100029849A (ko
Inventor
블라디미르 비탈에비치 이바노프
바딤 예프겐예비치 바니네
콘스탄틴 니콜라에비치 코셀레프
블라디미르 미하일로비치 크리브트선
Original Assignee
에이에스엠엘 네델란즈 비.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이에스엠엘 네델란즈 비.브이. filed Critical 에이에스엠엘 네델란즈 비.브이.
Publication of KR20100029849A publication Critical patent/KR20100029849A/ko
Application granted granted Critical
Publication of KR101331069B1 publication Critical patent/KR101331069B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008Production of exposure light, i.e. light sources
    • G03F7/70033Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05GX-RAY TECHNIQUE
    • H05G2/00Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
    • H05G2/001Production of X-ray radiation generated from plasma
    • H05G2/002Supply of the plasma generating material
    • H05G2/0027Arrangements for controlling the supply; Arrangements for measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • X-Ray Techniques (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020107002713A 2007-08-06 2008-08-05 리소그래피 장치 및 디바이스 제조 방법 Expired - Fee Related KR101331069B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/882,853 2007-08-06
US11/882,853 US8493548B2 (en) 2007-08-06 2007-08-06 Lithographic apparatus and device manufacturing method
PCT/NL2008/050536 WO2009020390A1 (en) 2007-08-06 2008-08-05 Lithographic apparatus and device manufacturing method

Publications (2)

Publication Number Publication Date
KR20100029849A KR20100029849A (ko) 2010-03-17
KR101331069B1 true KR101331069B1 (ko) 2013-11-19

Family

ID=39846624

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107002713A Expired - Fee Related KR101331069B1 (ko) 2007-08-06 2008-08-05 리소그래피 장치 및 디바이스 제조 방법

Country Status (8)

Country Link
US (2) US8493548B2 (enExample)
EP (1) EP2186386A1 (enExample)
JP (1) JP2010536142A (enExample)
KR (1) KR101331069B1 (enExample)
CN (1) CN101779524B (enExample)
NL (1) NL1035746A1 (enExample)
TW (1) TWI398900B (enExample)
WO (1) WO2009020390A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7872244B2 (en) * 2007-08-08 2011-01-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP5896910B2 (ja) * 2009-10-29 2016-03-30 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. ガス放電光源用の電極システム
US10217625B2 (en) * 2015-03-11 2019-02-26 Kla-Tencor Corporation Continuous-wave laser-sustained plasma illumination source
KR102669150B1 (ko) 2016-07-27 2024-05-27 삼성전자주식회사 자외선(uv) 노광 장치를 구비한 극자외선(euv) 노광 시스템
US12437883B1 (en) 2019-03-27 2025-10-07 Consolidated Nuclear Security, LLC Diode assembly for pulsed fusion events
US11437152B1 (en) 2019-06-27 2022-09-06 Consolidated Nuclear Security, LLC Diode assembly and method of forming a diode assembly for pulsed fusion events

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010062437A (ko) * 1999-12-17 2001-07-07 에이에스엠 리소그라피 비.브이. 전사투영장치용 방사원
KR20040025632A (ko) * 2002-09-19 2004-03-24 에이에스엠엘 네델란즈 비.브이. 방사선소스, 리소그래피장치 및 디바이스 제조방법
KR20040101571A (ko) * 2002-04-30 2004-12-02 코닌클리케 필립스 일렉트로닉스 엔.브이. 극자외선 복사를 발생시키는 방법
KR20070019736A (ko) * 2004-06-24 2007-02-15 가부시키가이샤 니콘 Euv 광원, euv 노광 장치 및 반도체 장치의 제조방법

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3586244T2 (de) * 1984-12-26 2000-04-20 Kabushiki Kaisha Toshiba Vorrichtung zur Erzeugung von Weich-Röntgenstrahlen durch ein Hochenergiebündel.
US5523193A (en) 1988-05-31 1996-06-04 Texas Instruments Incorporated Method and apparatus for patterning and imaging member
WO1991017483A1 (de) 1990-05-02 1991-11-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Belichtungsvorrichtung
SE502094C2 (sv) * 1991-08-16 1995-08-14 Sandvik Ab Metod för diamantbeläggning med mikrovågsplasma
JPH0917595A (ja) * 1995-06-28 1997-01-17 Nikon Corp X線発生装置
DE69711929T2 (de) 1997-01-29 2002-09-05 Micronic Laser Systems Ab, Taeby Verfahren und gerät zur erzeugung eines musters auf einem mit fotoresist beschichteten substrat mittels fokusiertem laserstrahl
SE509062C2 (sv) 1997-02-28 1998-11-30 Micronic Laser Systems Ab Dataomvandlingsmetod för en laserskrivare med flera strålar för mycket komplexa mikrokolitografiska mönster
US6232613B1 (en) 1997-03-11 2001-05-15 University Of Central Florida Debris blocker/collector and emission enhancer for discharge sources
US6815700B2 (en) * 1997-05-12 2004-11-09 Cymer, Inc. Plasma focus light source with improved pulse power system
US7329886B2 (en) * 1998-05-05 2008-02-12 Carl Zeiss Smt Ag EUV illumination system having a plurality of light sources for illuminating an optical element
US6972421B2 (en) 2000-06-09 2005-12-06 Cymer, Inc. Extreme ultraviolet light source
DE10139677A1 (de) * 2001-04-06 2002-10-17 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Erzeugen von extrem ultravioletter Strahlung und weicher Röntgenstrahlung
KR100408405B1 (ko) * 2001-05-03 2003-12-06 삼성전자주식회사 반도체 소자의 제조 장치
US7372056B2 (en) * 2005-06-29 2008-05-13 Cymer, Inc. LPP EUV plasma source material target delivery system
SG129259A1 (en) * 2002-10-03 2007-02-26 Asml Netherlands Bv Radiation source lithographic apparatus, and device manufacturing method
DE10256663B3 (de) * 2002-12-04 2005-10-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Gasentladungslampe für EUV-Strahlung
DE10310623B8 (de) * 2003-03-10 2005-12-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zum Erzeugen eines Plasmas durch elektrische Entladung in einem Entladungsraum
DE10342239B4 (de) * 2003-09-11 2018-06-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zum Erzeugen von Extrem-Ultraviolettstrahlung oder weicher Röntgenstrahlung
US20070019789A1 (en) * 2004-03-29 2007-01-25 Jmar Research, Inc. Systems and methods for achieving a required spot says for nanoscale surface analysis using soft x-rays
JP4301094B2 (ja) * 2004-06-25 2009-07-22 トヨタ自動車株式会社 燃料又は還元剤添加装置及び方法、並びにプラズマトーチ
DE102004042501A1 (de) * 2004-08-31 2006-03-16 Xtreme Technologies Gmbh Vorrichtung zur Bereitstellung eines reproduzierbaren Targetstromes für die energiestrahlinduzierte Erzeugung kurzwelliger elektromagnetischer Strahlung
US7154109B2 (en) * 2004-09-30 2006-12-26 Intel Corporation Method and apparatus for producing electromagnetic radiation
DE102005041567B4 (de) 2005-08-30 2009-03-05 Xtreme Technologies Gmbh EUV-Strahlungsquelle mit hoher Strahlungsleistung auf Basis einer Gasentladung
US7462851B2 (en) * 2005-09-23 2008-12-09 Asml Netherlands B.V. Electromagnetic radiation source, lithographic apparatus, device manufacturing method and device manufactured thereby
US7332731B2 (en) * 2005-12-06 2008-02-19 Asml Netherlands, B.V. Radiation system and lithographic apparatus
US7705331B1 (en) * 2006-06-29 2010-04-27 Kla-Tencor Technologies Corp. Methods and systems for providing illumination of a specimen for a process performed on the specimen
TW200808134A (en) * 2006-07-28 2008-02-01 Ushio Electric Inc Light source device for producing extreme ultraviolet radiation and method of generating extreme ultraviolet radiation

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010062437A (ko) * 1999-12-17 2001-07-07 에이에스엠 리소그라피 비.브이. 전사투영장치용 방사원
KR20040101571A (ko) * 2002-04-30 2004-12-02 코닌클리케 필립스 일렉트로닉스 엔.브이. 극자외선 복사를 발생시키는 방법
KR20040025632A (ko) * 2002-09-19 2004-03-24 에이에스엠엘 네델란즈 비.브이. 방사선소스, 리소그래피장치 및 디바이스 제조방법
KR20070019736A (ko) * 2004-06-24 2007-02-15 가부시키가이샤 니콘 Euv 광원, euv 노광 장치 및 반도체 장치의 제조방법

Also Published As

Publication number Publication date
US20130287968A1 (en) 2013-10-31
WO2009020390A1 (en) 2009-02-12
KR20100029849A (ko) 2010-03-17
US20090040491A1 (en) 2009-02-12
US8493548B2 (en) 2013-07-23
EP2186386A1 (en) 2010-05-19
CN101779524B (zh) 2012-12-05
CN101779524A (zh) 2010-07-14
JP2010536142A (ja) 2010-11-25
NL1035746A1 (nl) 2009-02-09
TW200912999A (en) 2009-03-16
TWI398900B (zh) 2013-06-11

Similar Documents

Publication Publication Date Title
KR101652361B1 (ko) 방사선 소스, 리소그래피 장치 및 디바이스 제조방법
TWI420257B (zh) 微影裝置及元件製造方法
US8593617B2 (en) Lithographic apparatus, plasma source, and reflecting method
TWI414213B (zh) 輻射源,微影裝置及器件製造方法
US7193229B2 (en) Lithographic apparatus, illumination system and method for mitigating debris particles
KR20120045025A (ko) 극자외(euv) 방사선 시스템 및 리소그래피 장치
KR101148959B1 (ko) 오염 방지 시스템, 리소그래피 장치, 방사선 소스 및 디바이스 제조방법
KR101331069B1 (ko) 리소그래피 장치 및 디바이스 제조 방법
JP4875753B2 (ja) EUV源におけるデブリ抑制用影つけ電極(shadowingelectrode)
KR20080086486A (ko) 방사선 시스템 및 리소그래피 장치
TWI452440B (zh) 多層鏡及微影裝置
KR20100102682A (ko) 극자외 방사선 소스 및 극자외 방사선을 생성하는 방법
US7309869B2 (en) Lithographic apparatus, device manufacturing method and radiation system
JP4384082B2 (ja) かすめ入射ミラー、かすめ入射ミラーを含むリソグラフィ装置、かすめ入射ミラーを提供する方法、かすめ入射ミラーのeuv反射を強化する方法、デバイス製造方法およびそれによって製造したデバイス
KR20090117824A (ko) 전자기 방사선을 생성하는 방법 및 방사선 소스
US7872244B2 (en) Lithographic apparatus and device manufacturing method

Legal Events

Date Code Title Description
A201 Request for examination
AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

J201 Request for trial against refusal decision
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

PB0901 Examination by re-examination before a trial

St.27 status event code: A-6-3-E10-E12-rex-PB0901

B601 Maintenance of original decision after re-examination before a trial
PB0601 Maintenance of original decision after re-examination before a trial

St.27 status event code: N-3-6-B10-B17-rex-PB0601

J301 Trial decision

Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20120329

Effective date: 20130830

PJ1301 Trial decision

St.27 status event code: A-3-3-V10-V15-crt-PJ1301

Decision date: 20130830

Appeal event data comment text: Appeal Kind Category : Appeal against decision to decline refusal, Appeal Ground Text : 2010 7002713

Appeal request date: 20120329

Appellate body name: Patent Examination Board

Decision authority category: Office appeal board

Decision identifier: 2012101003042

PS0901 Examination by remand of revocation

St.27 status event code: A-6-3-E10-E12-rex-PS0901

S901 Examination by remand of revocation
GRNO Decision to grant (after opposition)
PS0701 Decision of registration after remand of revocation

St.27 status event code: A-3-4-F10-F13-rex-PS0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20161114

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20161114

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000