TWI398350B - 高黏著性聚醯亞胺銅箔積層板及其製造方法 - Google Patents
高黏著性聚醯亞胺銅箔積層板及其製造方法 Download PDFInfo
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- TWI398350B TWI398350B TW97104940A TW97104940A TWI398350B TW I398350 B TWI398350 B TW I398350B TW 97104940 A TW97104940 A TW 97104940A TW 97104940 A TW97104940 A TW 97104940A TW I398350 B TWI398350 B TW I398350B
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- TW
- Taiwan
- Prior art keywords
- copper foil
- group
- bis
- aminophenoxy
- coupling agent
- Prior art date
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- 229920001721 polyimide Polymers 0.000 title claims description 56
- 239000004642 Polyimide Substances 0.000 title claims description 55
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 50
- 229910052802 copper Inorganic materials 0.000 title description 4
- 239000010949 copper Substances 0.000 title description 4
- 238000004519 manufacturing process Methods 0.000 title description 3
- 239000000853 adhesive Substances 0.000 title description 2
- 230000001070 adhesive effect Effects 0.000 title description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 64
- 239000011889 copper foil Substances 0.000 claims description 46
- 239000002243 precursor Substances 0.000 claims description 37
- 239000007822 coupling agent Substances 0.000 claims description 32
- 239000000178 monomer Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 17
- 150000004985 diamines Chemical class 0.000 claims description 15
- 150000008064 anhydrides Chemical class 0.000 claims description 13
- -1 acryloxy, methacryloxy, chloromethylphenyl Chemical group 0.000 claims description 11
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 9
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims description 7
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 7
- 239000000945 filler Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 238000012536 packaging technology Methods 0.000 claims description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 6
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 230000003746 surface roughness Effects 0.000 claims description 6
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 4
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 4
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 claims description 4
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 claims description 4
- LDFYRFKAYFZVNH-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenoxy]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 LDFYRFKAYFZVNH-UHFFFAOYSA-N 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229930003836 cresol Natural products 0.000 claims description 3
- 125000004663 dialkyl amino group Chemical group 0.000 claims description 3
- 229940018564 m-phenylenediamine Drugs 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 125000004076 pyridyl group Chemical group 0.000 claims description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea group Chemical group NC(=O)N XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 3
- DIIIISSCIXVANO-UHFFFAOYSA-N 1,2-Dimethylhydrazine Chemical compound CNNC DIIIISSCIXVANO-UHFFFAOYSA-N 0.000 claims description 2
- XROLBZOMVNMIFN-UHFFFAOYSA-N 1-(1-benzofuran-4-yl)propan-2-amine Chemical compound CC(N)CC1=CC=CC2=C1C=CO2 XROLBZOMVNMIFN-UHFFFAOYSA-N 0.000 claims description 2
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 claims description 2
- RYYUUQPLFHRZOY-UHFFFAOYSA-N 4-[2-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC=C1OC1=CC=C(N)C=C1 RYYUUQPLFHRZOY-UHFFFAOYSA-N 0.000 claims description 2
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 claims description 2
- WOYZXEVUWXQVNV-UHFFFAOYSA-N 4-phenoxyaniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC=C1 WOYZXEVUWXQVNV-UHFFFAOYSA-N 0.000 claims description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-L Malonate Chemical compound [O-]C(=O)CC([O-])=O OFOBLEOULBTSOW-UHFFFAOYSA-L 0.000 claims description 2
- HDJGANPLOWXKTM-UHFFFAOYSA-N NC(=O)NCCCC(C(OCC)(OCC)OCC)CCCCCCCC Chemical group NC(=O)NCCCC(C(OCC)(OCC)OCC)CCCCCCCC HDJGANPLOWXKTM-UHFFFAOYSA-N 0.000 claims description 2
- KFVRLGCEGVHRAR-UHFFFAOYSA-N NC1=CC=C(OC2=C(C)C=C(C=C2)OC2=CC=C(C=C2)N)C=C1.NC1=CC=C(OC2=C(C)C=C(C=C2)OC2=CC=C(C=C2)N)C=C1 Chemical compound NC1=CC=C(OC2=C(C)C=C(C=C2)OC2=CC=C(C=C2)N)C=C1.NC1=CC=C(OC2=C(C)C=C(C=C2)OC2=CC=C(C=C2)N)C=C1 KFVRLGCEGVHRAR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000654 additive Substances 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 125000000524 functional group Chemical group 0.000 claims description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 2
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical compound C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 claims 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 2
- CTXKDHZPBPQKTD-UHFFFAOYSA-N ethyl n-(carbamoylamino)carbamate Chemical compound CCOC(=O)NNC(N)=O CTXKDHZPBPQKTD-UHFFFAOYSA-N 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 125000002883 imidazolyl group Chemical group 0.000 claims 2
- DAZXVJBJRMWXJP-UHFFFAOYSA-N n,n-dimethylethylamine Chemical compound CCN(C)C DAZXVJBJRMWXJP-UHFFFAOYSA-N 0.000 claims 2
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 claims 1
- BLZVCIGGICSWIG-UHFFFAOYSA-N 2-aminoethoxydiphenylborane Chemical compound C=1C=CC=CC=1B(OCCN)C1=CC=CC=C1 BLZVCIGGICSWIG-UHFFFAOYSA-N 0.000 claims 1
- QCQPSSJUXNVOBU-UHFFFAOYSA-N 4-[4-(3,4-dicarboxyphenoxy)phenoxy]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 QCQPSSJUXNVOBU-UHFFFAOYSA-N 0.000 claims 1
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 claims 1
- ZHBXLZQQVCDGPA-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)sulfonyl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(S(=O)(=O)C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 ZHBXLZQQVCDGPA-UHFFFAOYSA-N 0.000 claims 1
- GTYSQFFAEMLWBG-UHFFFAOYSA-N C1C2=C(C3=C1C(=C(C(=C3C(=O)O)C(=O)O)C(=O)O)C(=O)O)C(=C(C=C2)C4=CC=CC=C4)C5=CC=CC=C5 Chemical compound C1C2=C(C3=C1C(=C(C(=C3C(=O)O)C(=O)O)C(=O)O)C(=O)O)C(=C(C=C2)C4=CC=CC=C4)C5=CC=CC=C5 GTYSQFFAEMLWBG-UHFFFAOYSA-N 0.000 claims 1
- UNVWJAYEKZVDDL-UHFFFAOYSA-N N(C(=O)N)CCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound N(C(=O)N)CCCC(C(OC)(OC)OC)CCCCCCCC UNVWJAYEKZVDDL-UHFFFAOYSA-N 0.000 claims 1
- QBYQOGFRBGTEFA-UHFFFAOYSA-N NCC(=O)O.C1CO1 Chemical compound NCC(=O)O.C1CO1 QBYQOGFRBGTEFA-UHFFFAOYSA-N 0.000 claims 1
- 235000010290 biphenyl Nutrition 0.000 claims 1
- 239000004305 biphenyl Substances 0.000 claims 1
- 125000004093 cyano group Chemical group *C#N 0.000 claims 1
- 239000010410 layer Substances 0.000 description 30
- 239000002184 metal Substances 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000011888 foil Substances 0.000 description 12
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 9
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- 239000012790 adhesive layer Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000011143 downstream manufacturing Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- DUCHOMQDJBOBMI-UHFFFAOYSA-N 2-[4-[4-(2-aminophenoxy)phenyl]phenoxy]aniline Chemical group NC1=CC=CC=C1OC1=CC=C(C=2C=CC(OC=3C(=CC=CC=3)N)=CC=2)C=C1 DUCHOMQDJBOBMI-UHFFFAOYSA-N 0.000 description 1
- DDOQBQRIEWHWBT-UHFFFAOYSA-N 2-azaniumyl-4-phosphonobutanoate Chemical compound OC(=O)C(N)CCP(O)(O)=O DDOQBQRIEWHWBT-UHFFFAOYSA-N 0.000 description 1
- XUSNPFGLKGCWGN-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine Chemical compound NCCCN1CCN(CCCN)CC1 XUSNPFGLKGCWGN-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- LVACOMKKELLCHJ-UHFFFAOYSA-N 3-trimethoxysilylpropylurea Chemical compound CO[Si](OC)(OC)CCCNC(N)=O LVACOMKKELLCHJ-UHFFFAOYSA-N 0.000 description 1
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 description 1
- BBTGUNMUUYNPLH-UHFFFAOYSA-N 5-[4-[(1,3-dioxo-2-benzofuran-5-yl)oxy]phenoxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC2=CC=C(C=C2)OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 BBTGUNMUUYNPLH-UHFFFAOYSA-N 0.000 description 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
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- 229920006362 Teflon® Polymers 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 150000004982 aromatic amines Chemical group 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- FNAQSUUGMSOBHW-UHFFFAOYSA-H calcium citrate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O FNAQSUUGMSOBHW-UHFFFAOYSA-H 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 125000001951 carbamoylamino group Chemical group C(N)(=O)N* 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
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- 125000006159 dianhydride group Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
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- 238000010295 mobile communication Methods 0.000 description 1
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- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
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- 150000004986 phenylenediamines Chemical class 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
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- 229920005989 resin Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 125000000467 secondary amino group Chemical class [H]N([*:1])[*:2] 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
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- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97104940A TWI398350B (zh) | 2008-02-05 | 2008-02-05 | 高黏著性聚醯亞胺銅箔積層板及其製造方法 |
| US12/117,026 US20090197104A1 (en) | 2008-02-05 | 2008-05-08 | Highly adhesive polyimide copper clad laminate and method of making the same |
| CN2009801039862A CN101932629B (zh) | 2008-02-05 | 2009-01-30 | 高粘合剂的聚酰亚胺覆铜层压板及其制备方法 |
| US12/865,746 US20100323161A1 (en) | 2008-02-05 | 2009-01-30 | Highly adhesive polyimide copper clad laminate and method of making the same |
| PCT/US2009/032550 WO2009099918A1 (en) | 2008-02-05 | 2009-01-30 | Highly adhesive polyimide copper clad laminate and method of making the same |
| JP2010545937A JP2011514266A (ja) | 2008-02-05 | 2009-01-30 | 高接着性ポリイミド銅張積層板およびその製造方法 |
| US13/602,966 US20130244000A1 (en) | 2008-02-05 | 2012-09-04 | Highly adhesive polyimide copper clad laminate and method of making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97104940A TWI398350B (zh) | 2008-02-05 | 2008-02-05 | 高黏著性聚醯亞胺銅箔積層板及其製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200934654A TW200934654A (en) | 2009-08-16 |
| TWI398350B true TWI398350B (zh) | 2013-06-11 |
Family
ID=40931988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97104940A TWI398350B (zh) | 2008-02-05 | 2008-02-05 | 高黏著性聚醯亞胺銅箔積層板及其製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US20090197104A1 (enExample) |
| JP (1) | JP2011514266A (enExample) |
| CN (1) | CN101932629B (enExample) |
| TW (1) | TWI398350B (enExample) |
| WO (1) | WO2009099918A1 (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2501740B1 (en) * | 2009-11-20 | 2016-03-16 | E. I. du Pont de Nemours and Company | Thin film transistor compositions, and methods relating thereto |
| JP5347980B2 (ja) * | 2010-01-14 | 2013-11-20 | 住友金属鉱山株式会社 | 金属化ポリイミドフィルム、及びそれを用いたフレキシブル配線板 |
| CN102855975B (zh) * | 2011-06-30 | 2017-06-06 | 日立金属株式会社 | 绝缘电线及使用该绝缘电线的线圈 |
| CN103050616B (zh) * | 2011-10-13 | 2015-10-28 | 昆山雅森电子材料科技有限公司 | 复合式导热铜箔基板 |
| CN102532543B (zh) * | 2011-12-20 | 2014-01-29 | 中国科学院化学研究所 | 共聚型可热封接聚酰亚胺及其制备方法与应用 |
| JP2013131424A (ja) * | 2011-12-22 | 2013-07-04 | Hitachi Cable Ltd | 絶縁電線及びそれを用いたコイル |
| WO2013125193A1 (ja) * | 2012-02-23 | 2013-08-29 | 日立化成デュポンマイクロシステムズ株式会社 | 樹脂組成物、及びこれを用いたポリイミド樹脂膜、ディスプレイ基板とその製造方法 |
| JP5362921B1 (ja) * | 2012-11-09 | 2013-12-11 | Ｊｘ日鉱日石金属株式会社 | 表面処理銅箔及びそれを用いた積層板 |
| KR101441344B1 (ko) * | 2013-01-15 | 2014-09-18 | 애경유화주식회사 | 고투과 고선택성 공중합체 폴리이미드 소재 및 그의 합성 방법 |
| US10435510B2 (en) | 2013-02-07 | 2019-10-08 | Kaneka Corporation | Alkoxysilane-modified polyamic acid solution, laminate and flexible device each produced using same, and method for producing laminate |
| CN103680700B (zh) * | 2013-12-18 | 2019-05-24 | 南昌大学 | 含聚酰亚胺改性的硅烷偶联剂涂层的漆包线 |
| WO2016024457A1 (ja) * | 2014-08-12 | 2016-02-18 | 株式会社カネカ | アルコキシシラン変性ポリアミド酸溶液、それを用いた積層体及びフレキシブルデバイス、並びに積層体の製造方法 |
| CN105238338A (zh) * | 2015-11-12 | 2016-01-13 | 烟台德邦科技有限公司 | 一种晶圆减薄高温临时粘结剂及其制备方法 |
| CN106085338B (zh) * | 2016-06-20 | 2019-07-12 | 新黎明科技股份有限公司 | 一种玻璃灯罩修补液 |
| MY190764A (en) * | 2016-08-16 | 2022-05-12 | Commw Scient Ind Res Org | Chemistry for fines and water control |
| CN107134542A (zh) * | 2017-04-10 | 2017-09-05 | 珠海亚泰电子科技有限公司 | 透明单面覆铜板制作工艺 |
| KR101959807B1 (ko) * | 2018-08-22 | 2019-03-20 | 에스케이씨코오롱피아이 주식회사 | 방향족 카르복실산을 포함하는 도체 피복용 폴리이미드 바니쉬 및 이의 제조방법 |
| CN109852330B (zh) * | 2018-12-21 | 2022-01-11 | 东华大学 | 一种3,5-二氨基苯甲酸型含硅胶粘剂及其制备方法 |
| CN110572933A (zh) * | 2019-08-23 | 2019-12-13 | 李龙凯 | 一种高频线路板新型材料层结构的制备方法及其制品 |
| CN110868799A (zh) * | 2019-11-15 | 2020-03-06 | 江苏上达电子有限公司 | 一种透明cof设计方法 |
| CN111040156B (zh) * | 2019-11-28 | 2022-05-31 | 李南文 | 一种耐溶剂且高尺寸稳定性的交联型聚酰亚胺薄膜 |
| US12031013B2 (en) | 2021-07-19 | 2024-07-09 | Momentive Performance Materials Inc. | Silane coupling agents to improve resin adhesion |
| KR102564595B1 (ko) * | 2021-07-20 | 2023-08-09 | 피아이첨단소재 주식회사 | 폴리아믹산 조성물 및 이를 포함하는 폴리이미드 피복물 |
| CN113619224B (zh) * | 2021-07-23 | 2024-02-02 | 中山新高电子材料股份有限公司 | 一种低吸水率氟材柔性覆铜板及其制备方法 |
| CN116332526A (zh) * | 2023-01-16 | 2023-06-27 | 江西沃格光电股份有限公司 | 柔性盖板及其制备方法与应用 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4868584A (en) * | 1987-01-31 | 1989-09-19 | Kabushiki Kaisha Toshiba | Heat-resistant polyimide insulative coated thermal head |
| US6924024B2 (en) * | 2002-07-19 | 2005-08-02 | Ube Industries Ltd. | Copper-clad laminate |
| JP2006007632A (ja) * | 2004-06-28 | 2006-01-12 | Shin Etsu Chem Co Ltd | フレキシブル金属箔ポリイミド積層板及びその製造方法 |
| US20070276086A1 (en) * | 2006-05-25 | 2007-11-29 | Industrial Technology Research Institute | Thermoplastic polyimide composition |
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| JPS6368641A (ja) * | 1986-09-09 | 1988-03-28 | Hitachi Chem Co Ltd | ポリイミド成形品の表面処理方法 |
| EP0304022A3 (en) * | 1987-08-21 | 1990-12-19 | E.I. Du Pont De Nemours And Company | Polyimide coating composition |
| JP2776056B2 (ja) * | 1991-06-04 | 1998-07-16 | 日立化成工業株式会社 | ポリアミノビスマレイミド樹脂組成物及びそれを用いた銅張積層板の製造方法 |
| JPH0794834A (ja) * | 1993-09-20 | 1995-04-07 | Toshiba Chem Corp | フレキシブル印刷回路基板 |
| JP3534151B2 (ja) * | 1996-10-29 | 2004-06-07 | 宇部興産株式会社 | ポリイミド前駆体組成物及びポリイミド膜 |
| WO2003037620A1 (en) * | 2001-11-01 | 2003-05-08 | Arakawa Chemical Industries, Ltd. | Polyimide-metal layered products and polyamideimide-metal layered product |
| CN1301046C (zh) * | 2002-05-13 | 2007-02-14 | 三井金属鉱业株式会社 | 膜上芯片用软性印刷线路板 |
| JP3977790B2 (ja) * | 2003-09-01 | 2007-09-19 | 古河サーキットフォイル株式会社 | キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板 |
| JP4957059B2 (ja) * | 2005-04-19 | 2012-06-20 | 宇部興産株式会社 | ポリイミドフィルム積層体 |
| CN101017285A (zh) * | 2006-02-07 | 2007-08-15 | Jsr株式会社 | 垂直取向型液晶取向剂和垂直取向型液晶显示元件 |
-
2008
- 2008-02-05 TW TW97104940A patent/TWI398350B/zh not_active IP Right Cessation
- 2008-05-08 US US12/117,026 patent/US20090197104A1/en not_active Abandoned
-
2009
- 2009-01-30 US US12/865,746 patent/US20100323161A1/en not_active Abandoned
- 2009-01-30 WO PCT/US2009/032550 patent/WO2009099918A1/en not_active Ceased
- 2009-01-30 CN CN2009801039862A patent/CN101932629B/zh not_active Expired - Fee Related
- 2009-01-30 JP JP2010545937A patent/JP2011514266A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4868584A (en) * | 1987-01-31 | 1989-09-19 | Kabushiki Kaisha Toshiba | Heat-resistant polyimide insulative coated thermal head |
| US6924024B2 (en) * | 2002-07-19 | 2005-08-02 | Ube Industries Ltd. | Copper-clad laminate |
| JP2006007632A (ja) * | 2004-06-28 | 2006-01-12 | Shin Etsu Chem Co Ltd | フレキシブル金属箔ポリイミド積層板及びその製造方法 |
| US20070276086A1 (en) * | 2006-05-25 | 2007-11-29 | Industrial Technology Research Institute | Thermoplastic polyimide composition |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090197104A1 (en) | 2009-08-06 |
| WO2009099918A1 (en) | 2009-08-13 |
| CN101932629B (zh) | 2013-02-13 |
| US20100323161A1 (en) | 2010-12-23 |
| JP2011514266A (ja) | 2011-05-06 |
| TW200934654A (en) | 2009-08-16 |
| CN101932629A (zh) | 2010-12-29 |
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