TWI394780B - 固化系統、黏著劑系統、電子裝置 - Google Patents
固化系統、黏著劑系統、電子裝置 Download PDFInfo
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- TWI394780B TWI394780B TW95112029A TW95112029A TWI394780B TW I394780 B TWI394780 B TW I394780B TW 95112029 A TW95112029 A TW 95112029A TW 95112029 A TW95112029 A TW 95112029A TW I394780 B TWI394780 B TW I394780B
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- Prior art keywords
- anhydride
- curing
- curing system
- solid
- curing agent
- Prior art date
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- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229940070765 laurate Drugs 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- OAIJSZIZWZSQBC-GYZMGTAESA-N lycopene Chemical compound CC(C)=CCC\C(C)=C\C=C\C(\C)=C\C=C\C(\C)=C\C=C\C=C(/C)\C=C\C=C(/C)\C=C\C=C(/C)CCC=C(C)C OAIJSZIZWZSQBC-GYZMGTAESA-N 0.000 description 1
- 239000001751 lycopene Substances 0.000 description 1
- 229960004999 lycopene Drugs 0.000 description 1
- 235000012661 lycopene Nutrition 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- QCGKUFZYSPBMAY-UHFFFAOYSA-N methyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1C(C(=O)OC)CCC2OC21 QCGKUFZYSPBMAY-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- RUOPINZRYMFPBF-UHFFFAOYSA-N pentane-1,3-diol Chemical compound CCC(O)CCO RUOPINZRYMFPBF-UHFFFAOYSA-N 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- ZCIHMQAPACOQHT-ZGMPDRQDSA-N trans-isorenieratene Natural products CC(=C/C=C/C=C(C)/C=C/C=C(C)/C=C/c1c(C)ccc(C)c1C)C=CC=C(/C)C=Cc2c(C)ccc(C)c2C ZCIHMQAPACOQHT-ZGMPDRQDSA-N 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/011—Crosslinking or vulcanising agents, e.g. accelerators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US66865105P | 2005-04-05 | 2005-04-05 | |
| US11/165,092 US7405246B2 (en) | 2005-04-05 | 2005-06-23 | Cure system, adhesive system, electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200708545A TW200708545A (en) | 2007-03-01 |
| TWI394780B true TWI394780B (zh) | 2013-05-01 |
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| TW95112029A TWI394780B (zh) | 2005-04-05 | 2006-04-04 | 固化系統、黏著劑系統、電子裝置 |
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| Country | Link |
|---|---|
| US (1) | US7405246B2 (https=) |
| EP (2) | EP2264096A1 (https=) |
| JP (1) | JP5258553B2 (https=) |
| MY (1) | MY141875A (https=) |
| TW (1) | TWI394780B (https=) |
| WO (1) | WO2006107792A1 (https=) |
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| US20060147719A1 (en) * | 2002-11-22 | 2006-07-06 | Slawomir Rubinsztajn | Curable composition, underfill, and method |
| US20050266263A1 (en) * | 2002-11-22 | 2005-12-01 | General Electric Company | Refractory solid, adhesive composition, and device, and associated method |
| JP2006312702A (ja) * | 2005-04-08 | 2006-11-16 | Hitachi Chem Co Ltd | エポキシ樹脂用硬化剤、その製造方法、それを用いたエポキシ樹脂組成物、その硬化物及び光半導体 |
| US20080039542A1 (en) * | 2006-08-11 | 2008-02-14 | General Electric Company | Composition and associated method |
| KR101023844B1 (ko) | 2007-06-25 | 2011-03-22 | 주식회사 엘지화학 | 접착수지 조성물, 접착필름, 다이싱 다이 본딩 필름 및반도체 장치 |
| US8053031B2 (en) * | 2007-07-26 | 2011-11-08 | Raven Lining Systems Inc. | Two-part epoxy composition |
| US20090111925A1 (en) * | 2007-10-31 | 2009-04-30 | Burnham Kikue S | Thermal interface materials, methods of production and uses thereof |
| KR101362870B1 (ko) * | 2010-12-29 | 2014-02-14 | 제일모직주식회사 | 반도체용 접착 조성물 및 이를 포함하는 접착 필름 |
| WO2012091306A2 (ko) * | 2010-12-27 | 2012-07-05 | 제일모직 주식회사 | 반도체용 접착 조성물 및 이를 이용하는 접착 필름 |
| KR101374364B1 (ko) * | 2010-12-27 | 2014-03-17 | 제일모직주식회사 | 반도체용 접착 조성물 및 이를 포함하는 접착 필름 |
| WO2013011421A1 (en) * | 2011-07-15 | 2013-01-24 | Henkel Ireland Limited | Cyanoacrylate compositions |
| KR101355852B1 (ko) * | 2011-08-11 | 2014-01-27 | 제일모직주식회사 | 반도체용 접착 조성물 및 이를 포함하는 접착 필름 |
| US9565773B2 (en) * | 2014-03-31 | 2017-02-07 | Apple Inc. | Methods for assembling electronic devices with adhesive |
| JP6079931B2 (ja) * | 2014-04-18 | 2017-02-15 | 株式会社村田製作所 | 押圧センサ |
| JP6252680B2 (ja) * | 2014-07-02 | 2017-12-27 | 株式会社村田製作所 | タッチパネル |
| WO2017052905A1 (en) * | 2015-09-22 | 2017-03-30 | Applied Materials, Inc. | Apparatus and method for selective deposition |
| CN107779153A (zh) * | 2017-11-15 | 2018-03-09 | 株洲时代新材料科技股份有限公司 | 一种高导热阻燃环氧树脂灌封胶及其制备方法 |
| TWI654218B (zh) | 2018-01-08 | 2019-03-21 | 財團法人工業技術研究院 | 樹脂組合物與導熱材料的形成方法 |
Citations (1)
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| US20040101688A1 (en) * | 2002-11-22 | 2004-05-27 | Slawomir Rubinsztajn | Curable epoxy compositions, methods and articles made therefrom |
Family Cites Families (99)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US653174A (en) * | 1898-05-12 | 1900-07-03 | Charles Guillaume Diederichs | Machine for clearing silk or other textile threads. |
| NL299937A (https=) | 1963-10-30 | |||
| GB1104870A (en) | 1966-02-28 | 1968-03-06 | Ncr Co | Autogenously reactive minute polymer capsules |
| US3479317A (en) | 1966-12-19 | 1969-11-18 | Grace W R & Co | Adhesive additives for curable liquid resins |
| US4066625A (en) | 1967-05-02 | 1978-01-03 | Amicon Corporation | Unitary curable resin compositions |
| US4336367A (en) | 1969-05-15 | 1982-06-22 | The United States Of America As Represented By The Secretary Of The Navy | Epoxy adhesive composition |
| US3666695A (en) | 1970-10-06 | 1972-05-30 | Gen Mills Chem Inc | An epoxy resin adhesive containing a polymeric fatty-amido amine and monomeric fatty-amido amine mixture as the curing agent |
| US3864426A (en) | 1973-05-23 | 1975-02-04 | Union Carbide Corp | Thermal shock resistant epoxy compositions |
| US4026862A (en) | 1974-02-11 | 1977-05-31 | Westinghouse Electric Corporation | Carboxylic acid storage stabilizers for latent catalyst cured epoxy resins |
| US3956214A (en) | 1974-11-05 | 1976-05-11 | Southwire Company | Method of preparing curable pellets of polyethylene with a motionless mixer |
| US4042550A (en) | 1975-11-28 | 1977-08-16 | Allied Chemical Corporation | Encapsulant compositions based on anhydride-hardened epoxy resins |
| DE2642465C3 (de) | 1976-09-21 | 1981-01-22 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung einer VerguBmasse |
| CA1094706A (en) | 1977-07-25 | 1981-01-27 | Ralph W. Nussbaum | Encapsulant compositions based on anhydride-hardened epoxy resins |
| US4217438A (en) | 1978-12-15 | 1980-08-12 | General Electric Company | Polycarbonate transesterification process |
| US4331582A (en) | 1980-01-14 | 1982-05-25 | Hitco | Epoxy latent catalyst |
| EP0038292B2 (de) | 1980-02-21 | 1993-07-28 | Ciba-Geigy Ag | Verwendung von synthetischem kristallinem Calciumsilikat |
| JPS6022018B2 (ja) | 1981-11-27 | 1985-05-30 | 信越化学工業株式会社 | シリコ−ン水性エマルジヨン組成物 |
| US4521490A (en) | 1983-08-11 | 1985-06-04 | Minnesota Mining And Manufacturing Co. | Two-part epoxy composition |
| US4692272A (en) | 1984-10-15 | 1987-09-08 | Stauffer Chemical Company | Thermally stable adhesive comprising soluble polyimide resin and epoxy resin |
| US4684678A (en) | 1985-05-30 | 1987-08-04 | Minnesota Mining And Manufacturing Company | Epoxy resin curing agent, process, and composition |
| IE60275B1 (en) | 1987-06-19 | 1994-06-29 | Loctite Ireland Ltd | Diazabicyclo and triazabicyclo primer compositions and use thereof in bonding non-polar substrates |
| GB8817280D0 (en) | 1988-07-20 | 1988-08-24 | Tioxide Group Plc | Particulate material |
| JPH02169619A (ja) | 1988-12-23 | 1990-06-29 | Toshiba Corp | 封止用エポキシ樹脂組成物及びこれを用いてなる光半導体素子 |
| GB8924877D0 (en) | 1989-11-03 | 1989-12-20 | Bowers Frank | Polymeric compositions |
| US5376403A (en) | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
| US4999699A (en) | 1990-03-14 | 1991-03-12 | International Business Machines Corporation | Solder interconnection structure and process for making |
| US5121190A (en) | 1990-03-14 | 1992-06-09 | International Business Machines Corp. | Solder interconnection structure on organic substrates |
| US5128746A (en) | 1990-09-27 | 1992-07-07 | Motorola, Inc. | Adhesive and encapsulant material with fluxing properties |
| US5212261A (en) | 1990-12-17 | 1993-05-18 | Henkel Research Corporation | Latent, heat-curable epoxy resin compositions containing metal carboxylate curing systems |
| US5194930A (en) | 1991-09-16 | 1993-03-16 | International Business Machines | Dielectric composition and solder interconnection structure for its use |
| US5616633A (en) | 1991-09-20 | 1997-04-01 | Ciba-Geigy Corporation | Liquid epoxy resin composition |
| US5417771A (en) | 1994-02-16 | 1995-05-23 | Takeda Chemical Industries, Ltd. | Soldering flux |
| TW357180B (en) | 1994-07-19 | 1999-05-01 | Sumitomo Chemical Co | An epoxy resin composition and semiconductor device sealed with the above epoxy resin composition |
| US5471027A (en) | 1994-07-22 | 1995-11-28 | International Business Machines Corporation | Method for forming chip carrier with a single protective encapsulant |
| US6103379A (en) | 1994-10-06 | 2000-08-15 | Bar-Ilan University | Process for the preparation of microspheres and microspheres made thereby |
| US5580655A (en) | 1995-03-03 | 1996-12-03 | Dow Corning Corporation | Silica nanoparticles |
| US5821456A (en) | 1996-05-01 | 1998-10-13 | Motorola, Inc. | Microelectronic assembly including a decomposable encapsulant, and method for forming and reworking same |
| US5700581A (en) | 1996-06-26 | 1997-12-23 | International Business Machines Corporation | Solvent-free epoxy based adhesives for semiconductor chip attachment and process |
| US6344271B1 (en) | 1998-11-06 | 2002-02-05 | Nanoenergy Corporation | Materials and products using nanostructured non-stoichiometric substances |
| US5985043A (en) | 1997-07-21 | 1999-11-16 | Miguel Albert Capote | Polymerizable fluxing agents and fluxing adhesive compositions therefrom |
| US6180696B1 (en) | 1997-02-19 | 2001-01-30 | Georgia Tech Research Corporation | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant |
| US6010577A (en) | 1997-06-23 | 2000-01-04 | Delco Electronics Corporation | Multifunctional soldering flux with borneol |
| US6017634A (en) | 1997-07-21 | 2000-01-25 | Miguel Albert Capote | Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive |
| JPH1167981A (ja) * | 1997-08-11 | 1999-03-09 | Toshiba Chem Corp | 一液性エポキシ樹脂組成物 |
| US6096808A (en) * | 1998-01-29 | 2000-08-01 | Alpha Metals, Inc.. | Snap cure adhesive based on anhydride/epoxy resins |
| US6059894A (en) | 1998-04-08 | 2000-05-09 | Hewlett-Packard Company | High temperature flip chip joining flux that obviates the cleaning process |
| US6232264B1 (en) | 1998-06-18 | 2001-05-15 | Vanderbilt University | Polymetallic precursors and compositions and methods for making supported polymetallic nanocomposites |
| US6380322B1 (en) | 1998-06-19 | 2002-04-30 | Georgia Tech Research Corporation | Reworkable high temperature adhesives |
| US6235865B1 (en) | 1998-07-02 | 2001-05-22 | Shin-Etsu Chemical Co., Ltd. | Phosphonium borate compound, making method, curing catalyst, and epoxy resin composition |
| US6531704B2 (en) | 1998-09-14 | 2003-03-11 | Nanoproducts Corporation | Nanotechnology for engineering the performance of substances |
| KR100563509B1 (ko) | 1998-09-25 | 2006-03-23 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 에폭시 수지 조성물 및 이 에폭시 수지 조성물을 사용한 적층 필름 및 반도체 장치 |
| US6194788B1 (en) | 1999-03-10 | 2001-02-27 | Alpha Metals, Inc. | Flip chip with integrated flux and underfill |
| JP3674675B2 (ja) * | 1999-03-17 | 2005-07-20 | 信越化学工業株式会社 | フリップチップ型半導体装置用アンダーフィル材 |
| US6372839B1 (en) | 1999-03-17 | 2002-04-16 | Shin-Etsu Chemical Co., Ltd. | Flip-chip type semiconductor device underfill |
| SG97811A1 (en) | 1999-09-24 | 2003-08-20 | Advanpack Solutions Pte Ltd | Fluxing adhesive |
| US6576718B1 (en) | 1999-10-05 | 2003-06-10 | General Electric Company | Powder coating of thermosetting resin(s) and poly(phenylene ethers(s)) |
| CN1156533C (zh) | 1999-10-06 | 2004-07-07 | 日东电工株式会社 | 半导体密封用树脂组合物和使用它的半导体装置及制法 |
| JP4633214B2 (ja) | 1999-12-08 | 2011-02-16 | 富士通株式会社 | エポキシ樹脂組成物 |
| JP2001220495A (ja) * | 2000-02-08 | 2001-08-14 | Mitsubishi Rayon Co Ltd | 液状エポキシ樹脂封止材及び半導体装置 |
| US6570029B2 (en) | 2000-03-29 | 2003-05-27 | Georgia Tech Research Corp. | No-flow reworkable epoxy underfills for flip-chip applications |
| JP4844776B2 (ja) | 2000-04-07 | 2011-12-28 | ナガセケムテックス株式会社 | 電気的接続可能な半導体用接着剤 |
| FI110515B (fi) | 2000-05-15 | 2003-02-14 | Panipol Oy | Korroosiolta suojaavat pinnoitteet |
| US6661922B1 (en) * | 2000-06-21 | 2003-12-09 | Hewlett-Packard Development Company, L.P. | Method of determining a nearest numerical neighbor point in multi-dimensional space |
| US6379799B1 (en) | 2000-06-29 | 2002-04-30 | Cytec Technology Corp. | Low moisture absorption epoxy resin systems with alkylated diamine hardeners |
| US6437026B1 (en) | 2001-01-05 | 2002-08-20 | Cookson Singapore Pte Ltd. | Hardener for epoxy molding compounds |
| US6866741B2 (en) | 2001-01-08 | 2005-03-15 | Fujitsu Limited | Method for joining large substrates |
| US6458472B1 (en) | 2001-01-08 | 2002-10-01 | Henkel Loctite Corporation | Fluxing underfill compositions |
| US6444495B1 (en) | 2001-01-11 | 2002-09-03 | Honeywell International, Inc. | Dielectric films for narrow gap-fill applications |
| FR2819432B1 (fr) | 2001-01-18 | 2003-04-11 | Rhodia Chimie Sa | Catalyseur mesostructure integrant des particules de dimensions nanometriques |
| US6794761B2 (en) | 2001-04-26 | 2004-09-21 | Intel Corporation | No-flow underfill material |
| US20030004268A1 (en) | 2001-05-14 | 2003-01-02 | General Electric Company | Polyimide blends, method of making, and articles made therefrom |
| US6617400B2 (en) | 2001-08-23 | 2003-09-09 | General Electric Company | Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst |
| US6617401B2 (en) | 2001-08-23 | 2003-09-09 | General Electric Company | Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst |
| JP3959264B2 (ja) * | 2001-09-29 | 2007-08-15 | 株式会社東芝 | 積層型半導体装置 |
| US6689469B2 (en) | 2001-12-31 | 2004-02-10 | Bridgestone Corporation | Crystalline polymer nano-particles |
| US6956084B2 (en) | 2001-10-04 | 2005-10-18 | Bridgestone Corporation | Nano-particle preparation and applications |
| US6548189B1 (en) | 2001-10-26 | 2003-04-15 | General Electric Company | Epoxy adhesive |
| US6624213B2 (en) | 2001-11-08 | 2003-09-23 | 3M Innovative Properties Company | High temperature epoxy adhesive films |
| US6710011B2 (en) | 2001-12-21 | 2004-03-23 | Saudi Basic Industries Corporatioin | Catalyst compositions for the ammoxidation of alkanes and olefins, methods of making and of using same |
| US6620512B2 (en) | 2001-12-21 | 2003-09-16 | Intel Corporation | Anhydride polymers for use as curing agents in epoxy resin-based underfill material |
| US6624216B2 (en) | 2002-01-31 | 2003-09-23 | National Starch And Chemical Investment Holding Corporation | No-flow underfill encapsulant |
| US20030164555A1 (en) * | 2002-03-01 | 2003-09-04 | Tong Quinn K. | B-stageable underfill encapsulant and method for its application |
| US6769437B2 (en) | 2002-04-08 | 2004-08-03 | Philip Morris Incorporated | Use of oxyhydroxide compounds for reducing carbon monoxide in the mainstream smoke of a cigarette |
| WO2003101164A1 (en) | 2002-05-23 | 2003-12-04 | 3M Innovative Properties Company | Nanoparticle filled underfill |
| US6967172B2 (en) | 2002-07-03 | 2005-11-22 | Honeywell International Inc. | Colloidal silica composite films for premetal dielectric applications |
| US6773958B1 (en) | 2002-10-17 | 2004-08-10 | Altera Corporation | Integrated assembly-underfill flip chip process |
| US20050170188A1 (en) * | 2003-09-03 | 2005-08-04 | General Electric Company | Resin compositions and methods of use thereof |
| US20050048291A1 (en) | 2003-08-14 | 2005-03-03 | General Electric Company | Nano-filled composite materials with exceptionally high glass transition temperature |
| US20040102529A1 (en) | 2002-11-22 | 2004-05-27 | Campbell John Robert | Functionalized colloidal silica, dispersions and methods made thereby |
| US20050049334A1 (en) | 2003-09-03 | 2005-03-03 | Slawomir Rubinsztain | Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications |
| US20060147719A1 (en) * | 2002-11-22 | 2006-07-06 | Slawomir Rubinsztajn | Curable composition, underfill, and method |
| US20050266263A1 (en) * | 2002-11-22 | 2005-12-01 | General Electric Company | Refractory solid, adhesive composition, and device, and associated method |
| US7022410B2 (en) * | 2003-12-16 | 2006-04-04 | General Electric Company | Combinations of resin compositions and methods of use thereof |
| US6857431B2 (en) | 2002-12-09 | 2005-02-22 | Philip Morris Usa Inc. | Nanocomposite copper-ceria catalysts for low temperature or near-ambient temperature catalysis and methods for making such catalysts |
| US6822341B1 (en) | 2002-12-19 | 2004-11-23 | Henkel Corporation | Latent catalysts for molding compounds |
| US20050049350A1 (en) | 2003-08-25 | 2005-03-03 | Sandeep Tonapi | Thin bond-line silicone adhesive composition and method for preparing the same |
| RU2363071C2 (ru) * | 2003-09-03 | 2009-07-27 | Моментив Перформанс Матириалз Инк. | Состав на основе модифицированной растворителем смолы и способы его использования |
| US7189768B2 (en) | 2003-11-25 | 2007-03-13 | 3M Innovative Properties Company | Solution containing surface-modified nanoparticles |
| US7446136B2 (en) * | 2005-04-05 | 2008-11-04 | Momentive Performance Materials Inc. | Method for producing cure system, adhesive system, and electronic device |
-
2005
- 2005-06-23 US US11/165,092 patent/US7405246B2/en not_active Expired - Lifetime
-
2006
- 2006-03-31 EP EP20100011308 patent/EP2264096A1/en not_active Withdrawn
- 2006-03-31 JP JP2008505397A patent/JP5258553B2/ja not_active Expired - Fee Related
- 2006-03-31 WO PCT/US2006/012130 patent/WO2006107792A1/en not_active Ceased
- 2006-03-31 EP EP20060749096 patent/EP1907469A1/en not_active Withdrawn
- 2006-04-03 MY MYPI20061483A patent/MY141875A/en unknown
- 2006-04-04 TW TW95112029A patent/TWI394780B/zh not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040101688A1 (en) * | 2002-11-22 | 2004-05-27 | Slawomir Rubinsztajn | Curable epoxy compositions, methods and articles made therefrom |
Also Published As
| Publication number | Publication date |
|---|---|
| MY141875A (en) | 2010-07-16 |
| JP2008537760A (ja) | 2008-09-25 |
| WO2006107792A1 (en) | 2006-10-12 |
| US20060223933A1 (en) | 2006-10-05 |
| EP1907469A1 (en) | 2008-04-09 |
| JP5258553B2 (ja) | 2013-08-07 |
| EP2264096A1 (en) | 2010-12-22 |
| TW200708545A (en) | 2007-03-01 |
| US7405246B2 (en) | 2008-07-29 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |