JP5258553B2 - 硬化系、接着系、電子機器 - Google Patents
硬化系、接着系、電子機器 Download PDFInfo
- Publication number
- JP5258553B2 JP5258553B2 JP2008505397A JP2008505397A JP5258553B2 JP 5258553 B2 JP5258553 B2 JP 5258553B2 JP 2008505397 A JP2008505397 A JP 2008505397A JP 2008505397 A JP2008505397 A JP 2008505397A JP 5258553 B2 JP5258553 B2 JP 5258553B2
- Authority
- JP
- Japan
- Prior art keywords
- anhydride
- curing
- curing system
- soluble solid
- acid anhydride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000853 adhesive Substances 0.000 title claims description 42
- 230000001070 adhesive effect Effects 0.000 title claims description 41
- 239000007787 solid Substances 0.000 claims description 46
- 229920005989 resin Polymers 0.000 claims description 39
- 239000011347 resin Substances 0.000 claims description 39
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 38
- 239000003795 chemical substances by application Substances 0.000 claims description 31
- 239000000203 mixture Substances 0.000 claims description 27
- -1 alicyclic carboxylic acid anhydride Chemical class 0.000 claims description 24
- 239000007788 liquid Substances 0.000 claims description 22
- 229920000647 polyepoxide Polymers 0.000 claims description 19
- 239000003822 epoxy resin Substances 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 18
- 239000003054 catalyst Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- 239000000945 filler Substances 0.000 claims description 14
- 150000008064 anhydrides Chemical class 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 10
- 239000003085 diluting agent Substances 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 7
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 5
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 claims description 4
- 239000003063 flame retardant Substances 0.000 claims description 4
- NOGFHTGYPKWWRX-UHFFFAOYSA-N 2,2,6,6-tetramethyloxan-4-one Chemical compound CC1(C)CC(=O)CC(C)(C)O1 NOGFHTGYPKWWRX-UHFFFAOYSA-N 0.000 claims description 3
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 claims description 3
- 125000002723 alicyclic group Chemical group 0.000 claims description 3
- 239000004844 aliphatic epoxy resin Substances 0.000 claims description 3
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 3
- YHASWHZGWUONAO-UHFFFAOYSA-N butanoyl butanoate Chemical compound CCCC(=O)OC(=O)CCC YHASWHZGWUONAO-UHFFFAOYSA-N 0.000 claims description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 3
- WYVAMUWZEOHJOQ-UHFFFAOYSA-N propionic anhydride Chemical compound CCC(=O)OC(=O)CC WYVAMUWZEOHJOQ-UHFFFAOYSA-N 0.000 claims description 3
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 2
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 claims description 2
- HHCHLHOEAKKCAB-UHFFFAOYSA-N 2-oxaspiro[3.5]nonane-1,3-dione Chemical compound O=C1OC(=O)C11CCCCC1 HHCHLHOEAKKCAB-UHFFFAOYSA-N 0.000 claims description 2
- IHYAGCYJVNHXCT-UHFFFAOYSA-N 3,3,4,4,5,5-hexafluorooxane-2,6-dione Chemical compound FC1(F)C(=O)OC(=O)C(F)(F)C1(F)F IHYAGCYJVNHXCT-UHFFFAOYSA-N 0.000 claims description 2
- PAVNZLVXYJDFNR-UHFFFAOYSA-N 3,3-dimethyloxane-2,6-dione Chemical compound CC1(C)CCC(=O)OC1=O PAVNZLVXYJDFNR-UHFFFAOYSA-N 0.000 claims description 2
- YQLVIOYSGHEJDA-UHFFFAOYSA-N 3-methyloxane-2,6-dione Chemical compound CC1CCC(=O)OC1=O YQLVIOYSGHEJDA-UHFFFAOYSA-N 0.000 claims description 2
- NVPRNSAYSSEIGR-UHFFFAOYSA-N 3-phenyloxane-2,6-dione Chemical compound O=C1OC(=O)CCC1C1=CC=CC=C1 NVPRNSAYSSEIGR-UHFFFAOYSA-N 0.000 claims description 2
- BBZNDDYIRWVIKP-UHFFFAOYSA-N 3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione;2-methylpropanoyl 2-methylpropanoate Chemical compound CC(C)C(=O)OC(=O)C(C)C.C1CCCC2C(=O)OC(=O)C21 BBZNDDYIRWVIKP-UHFFFAOYSA-N 0.000 claims description 2
- MMVIDXVHQANYAE-UHFFFAOYSA-N 5-nitro-2-benzofuran-1,3-dione Chemical compound [O-][N+](=O)C1=CC=C2C(=O)OC(=O)C2=C1 MMVIDXVHQANYAE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 2
- 150000008065 acid anhydrides Chemical class 0.000 claims description 2
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims description 2
- FLISWPFVWWWNNP-BQYQJAHWSA-N dihydro-3-(1-octenyl)-2,5-furandione Chemical compound CCCCCC\C=C\C1CC(=O)OC1=O FLISWPFVWWWNNP-BQYQJAHWSA-N 0.000 claims description 2
- VANNPISTIUFMLH-UHFFFAOYSA-N glutaric anhydride Chemical compound O=C1CCCC(=O)O1 VANNPISTIUFMLH-UHFFFAOYSA-N 0.000 claims description 2
- 239000003607 modifier Substances 0.000 claims description 2
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 claims description 2
- 229940014800 succinic anhydride Drugs 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims 2
- KMOUUZVZFBCRAM-UHFFFAOYSA-N 1,2,3,6-tetrahydrophthalic anhydride Chemical compound C1C=CCC2C(=O)OC(=O)C21 KMOUUZVZFBCRAM-UHFFFAOYSA-N 0.000 claims 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 claims 1
- GFWLMILMVMCJDI-UHFFFAOYSA-N 8-oxaspiro[4.5]decane-7,9-dione Chemical compound C1C(=O)OC(=O)CC11CCCC1 GFWLMILMVMCJDI-UHFFFAOYSA-N 0.000 claims 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims 1
- 239000002318 adhesion promoter Substances 0.000 claims 1
- 239000002518 antifoaming agent Substances 0.000 claims 1
- 125000005487 naphthalate group Chemical group 0.000 claims 1
- 239000000463 material Substances 0.000 description 26
- 239000002904 solvent Substances 0.000 description 14
- 239000008119 colloidal silica Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical group C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 8
- 150000003839 salts Chemical class 0.000 description 8
- 239000012530 fluid Substances 0.000 description 7
- 239000004848 polyfunctional curative Substances 0.000 description 7
- 239000000565 sealant Substances 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
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- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 5
- 238000002161 passivation Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- 239000008393 encapsulating agent Substances 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- XINAQPROOGNKIN-UHFFFAOYSA-N C1C(C(=O)O)CCC=C1CC1=CCCCC1 Chemical compound C1C(C(=O)O)CCC=C1CC1=CCCCC1 XINAQPROOGNKIN-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
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- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
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- 238000009833 condensation Methods 0.000 description 3
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- 125000005372 silanol group Chemical group 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 2
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 2
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- RBHIUNHSNSQJNG-UHFFFAOYSA-N 6-methyl-3-(2-methyloxiran-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2(C)OC2CC1C1(C)CO1 RBHIUNHSNSQJNG-UHFFFAOYSA-N 0.000 description 2
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- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 230000009471 action Effects 0.000 description 2
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- 230000003287 optical effect Effects 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- RUOPINZRYMFPBF-UHFFFAOYSA-N pentane-1,3-diol Chemical compound CCC(O)CCO RUOPINZRYMFPBF-UHFFFAOYSA-N 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000768 polyamine Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002195 soluble material Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- LZWMWONAYYGKMP-UHFFFAOYSA-N trimethyl-[methyl-bis[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silyl]oxysilane Chemical compound C1CC2OC2CC1CC[Si](C)(O[Si](C)(C)C)CCC1CC2OC2CC1 LZWMWONAYYGKMP-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/011—Crosslinking or vulcanising agents, e.g. accelerators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US66865105P | 2005-04-05 | 2005-04-05 | |
| US60/668,651 | 2005-04-05 | ||
| US11/165,092 | 2005-06-23 | ||
| US11/165,092 US7405246B2 (en) | 2005-04-05 | 2005-06-23 | Cure system, adhesive system, electronic device |
| PCT/US2006/012130 WO2006107792A1 (en) | 2005-04-05 | 2006-03-31 | Cure system, adhesive system, electronic device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008537760A JP2008537760A (ja) | 2008-09-25 |
| JP2008537760A5 JP2008537760A5 (https=) | 2013-04-18 |
| JP5258553B2 true JP5258553B2 (ja) | 2013-08-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008505397A Expired - Fee Related JP5258553B2 (ja) | 2005-04-05 | 2006-03-31 | 硬化系、接着系、電子機器 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7405246B2 (https=) |
| EP (2) | EP2264096A1 (https=) |
| JP (1) | JP5258553B2 (https=) |
| MY (1) | MY141875A (https=) |
| TW (1) | TWI394780B (https=) |
| WO (1) | WO2006107792A1 (https=) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20060147719A1 (en) * | 2002-11-22 | 2006-07-06 | Slawomir Rubinsztajn | Curable composition, underfill, and method |
| US20050266263A1 (en) * | 2002-11-22 | 2005-12-01 | General Electric Company | Refractory solid, adhesive composition, and device, and associated method |
| JP2006312702A (ja) * | 2005-04-08 | 2006-11-16 | Hitachi Chem Co Ltd | エポキシ樹脂用硬化剤、その製造方法、それを用いたエポキシ樹脂組成物、その硬化物及び光半導体 |
| US20080039542A1 (en) * | 2006-08-11 | 2008-02-14 | General Electric Company | Composition and associated method |
| KR101023844B1 (ko) | 2007-06-25 | 2011-03-22 | 주식회사 엘지화학 | 접착수지 조성물, 접착필름, 다이싱 다이 본딩 필름 및반도체 장치 |
| US8053031B2 (en) * | 2007-07-26 | 2011-11-08 | Raven Lining Systems Inc. | Two-part epoxy composition |
| US20090111925A1 (en) * | 2007-10-31 | 2009-04-30 | Burnham Kikue S | Thermal interface materials, methods of production and uses thereof |
| KR101362870B1 (ko) * | 2010-12-29 | 2014-02-14 | 제일모직주식회사 | 반도체용 접착 조성물 및 이를 포함하는 접착 필름 |
| WO2012091306A2 (ko) * | 2010-12-27 | 2012-07-05 | 제일모직 주식회사 | 반도체용 접착 조성물 및 이를 이용하는 접착 필름 |
| KR101374364B1 (ko) * | 2010-12-27 | 2014-03-17 | 제일모직주식회사 | 반도체용 접착 조성물 및 이를 포함하는 접착 필름 |
| WO2013011421A1 (en) * | 2011-07-15 | 2013-01-24 | Henkel Ireland Limited | Cyanoacrylate compositions |
| KR101355852B1 (ko) * | 2011-08-11 | 2014-01-27 | 제일모직주식회사 | 반도체용 접착 조성물 및 이를 포함하는 접착 필름 |
| US9565773B2 (en) * | 2014-03-31 | 2017-02-07 | Apple Inc. | Methods for assembling electronic devices with adhesive |
| JP6079931B2 (ja) * | 2014-04-18 | 2017-02-15 | 株式会社村田製作所 | 押圧センサ |
| JP6252680B2 (ja) * | 2014-07-02 | 2017-12-27 | 株式会社村田製作所 | タッチパネル |
| WO2017052905A1 (en) * | 2015-09-22 | 2017-03-30 | Applied Materials, Inc. | Apparatus and method for selective deposition |
| CN107779153A (zh) * | 2017-11-15 | 2018-03-09 | 株洲时代新材料科技股份有限公司 | 一种高导热阻燃环氧树脂灌封胶及其制备方法 |
| TWI654218B (zh) | 2018-01-08 | 2019-03-21 | 財團法人工業技術研究院 | 樹脂組合物與導熱材料的形成方法 |
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| US20050266263A1 (en) * | 2002-11-22 | 2005-12-01 | General Electric Company | Refractory solid, adhesive composition, and device, and associated method |
| US7022410B2 (en) * | 2003-12-16 | 2006-04-04 | General Electric Company | Combinations of resin compositions and methods of use thereof |
| US6857431B2 (en) | 2002-12-09 | 2005-02-22 | Philip Morris Usa Inc. | Nanocomposite copper-ceria catalysts for low temperature or near-ambient temperature catalysis and methods for making such catalysts |
| US6822341B1 (en) | 2002-12-19 | 2004-11-23 | Henkel Corporation | Latent catalysts for molding compounds |
| US20050049350A1 (en) | 2003-08-25 | 2005-03-03 | Sandeep Tonapi | Thin bond-line silicone adhesive composition and method for preparing the same |
| RU2363071C2 (ru) * | 2003-09-03 | 2009-07-27 | Моментив Перформанс Матириалз Инк. | Состав на основе модифицированной растворителем смолы и способы его использования |
| US7189768B2 (en) | 2003-11-25 | 2007-03-13 | 3M Innovative Properties Company | Solution containing surface-modified nanoparticles |
| US7446136B2 (en) * | 2005-04-05 | 2008-11-04 | Momentive Performance Materials Inc. | Method for producing cure system, adhesive system, and electronic device |
-
2005
- 2005-06-23 US US11/165,092 patent/US7405246B2/en not_active Expired - Lifetime
-
2006
- 2006-03-31 EP EP20100011308 patent/EP2264096A1/en not_active Withdrawn
- 2006-03-31 JP JP2008505397A patent/JP5258553B2/ja not_active Expired - Fee Related
- 2006-03-31 WO PCT/US2006/012130 patent/WO2006107792A1/en not_active Ceased
- 2006-03-31 EP EP20060749096 patent/EP1907469A1/en not_active Withdrawn
- 2006-04-03 MY MYPI20061483A patent/MY141875A/en unknown
- 2006-04-04 TW TW95112029A patent/TWI394780B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| MY141875A (en) | 2010-07-16 |
| JP2008537760A (ja) | 2008-09-25 |
| WO2006107792A1 (en) | 2006-10-12 |
| US20060223933A1 (en) | 2006-10-05 |
| TWI394780B (zh) | 2013-05-01 |
| EP1907469A1 (en) | 2008-04-09 |
| EP2264096A1 (en) | 2010-12-22 |
| TW200708545A (en) | 2007-03-01 |
| US7405246B2 (en) | 2008-07-29 |
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