TWI383435B - 含矽磊晶層之形成 - Google Patents

含矽磊晶層之形成 Download PDF

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Publication number
TWI383435B
TWI383435B TW096144842A TW96144842A TWI383435B TW I383435 B TWI383435 B TW I383435B TW 096144842 A TW096144842 A TW 096144842A TW 96144842 A TW96144842 A TW 96144842A TW I383435 B TWI383435 B TW I383435B
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TW
Taiwan
Prior art keywords
source
deposition
substrate
gas
decane
Prior art date
Application number
TW096144842A
Other languages
English (en)
Chinese (zh)
Other versions
TW200834667A (en
Inventor
Zhiyuan Ye
Andrew Lam
Yihwan Kim
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200834667A publication Critical patent/TW200834667A/zh
Application granted granted Critical
Publication of TWI383435B publication Critical patent/TWI383435B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02529—Silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/0257—Doping during depositing
    • H01L21/02573—Conductivity type
    • H01L21/02576—N-type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/0257—Doping during depositing
    • H01L21/02573—Conductivity type
    • H01L21/02579—P-type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/027—Manufacture or treatment of FETs having insulated gates [IGFET] of lateral single-gate IGFETs
    • H10D30/0275—Manufacture or treatment of FETs having insulated gates [IGFET] of lateral single-gate IGFETs forming single crystalline semiconductor source or drain regions resulting in recessed gates, e.g. forming raised source or drain regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs 
    • H10D30/608—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs  having non-planar bodies, e.g. having recessed gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/791—Arrangements for exerting mechanical stress on the crystal lattice of the channel regions
    • H10D30/797—Arrangements for exerting mechanical stress on the crystal lattice of the channel regions being in source or drain regions, e.g. SiGe source or drain

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Chemical Vapour Deposition (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Recrystallisation Techniques (AREA)
TW096144842A 2006-12-12 2007-11-26 含矽磊晶層之形成 TWI383435B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/609,590 US20080138955A1 (en) 2006-12-12 2006-12-12 Formation of epitaxial layer containing silicon

Publications (2)

Publication Number Publication Date
TW200834667A TW200834667A (en) 2008-08-16
TWI383435B true TWI383435B (zh) 2013-01-21

Family

ID=39498580

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096144842A TWI383435B (zh) 2006-12-12 2007-11-26 含矽磊晶層之形成

Country Status (6)

Country Link
US (1) US20080138955A1 (enExample)
JP (1) JP5808522B2 (enExample)
KR (1) KR101432150B1 (enExample)
CN (2) CN101548363A (enExample)
TW (1) TWI383435B (enExample)
WO (1) WO2008073926A2 (enExample)

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MY149853A (en) * 2006-09-07 2013-10-31 Actelion Pharmaceuticals Ltd Pyridin-4-yl derivatives as immunomodulating agents
CL2007002594A1 (es) * 2006-09-08 2008-06-06 Actelion Pharmaceuticals Ltd Compuestos derivados de piridin-3-il, agentes inmunomoduladores; composicion farmaceutica que comprende a dicho compuesto; y uso del compuesto en el tratamiento de enfermedades asociadas con un sistema inmunologico activado. .
US7833883B2 (en) * 2007-03-28 2010-11-16 Intel Corporation Precursor gas mixture for depositing an epitaxial carbon-doped silicon film
US7994015B2 (en) 2009-04-21 2011-08-09 Applied Materials, Inc. NMOS transistor devices and methods for fabricating same
US8999798B2 (en) * 2009-12-17 2015-04-07 Applied Materials, Inc. Methods for forming NMOS EPI layers
DE102010055564A1 (de) * 2010-12-23 2012-06-28 Johann-Wolfgang-Goethe Universität Frankfurt am Main Verfahren und Vorrichtung zur Abscheidung von Silizium auf einem Substrat
WO2012102755A1 (en) * 2011-01-28 2012-08-02 Applied Materials, Inc. Carbon addition for low resistivity in situ doped silicon epitaxy
TWI521600B (zh) * 2011-06-03 2016-02-11 應用材料股份有限公司 在矽基材上形成高生長速率低電阻率的鍺膜之方法〈一〉
KR101371435B1 (ko) 2012-01-04 2014-03-12 주식회사 유진테크 처리유닛을 포함하는 기판 처리 장치
KR101677560B1 (ko) 2014-03-18 2016-11-18 주식회사 유진테크 공정공간 높이별 가열온도를 조절할 수 있는 히터를 구비한 기판 처리 장치
RU2618279C1 (ru) * 2016-06-23 2017-05-03 Акционерное общество "Эпиэл" Способ изготовления эпитаксиального слоя кремния на диэлектрической подложке
US11018002B2 (en) * 2017-07-19 2021-05-25 Asm Ip Holding B.V. Method for selectively depositing a Group IV semiconductor and related semiconductor device structures
US11374112B2 (en) 2017-07-19 2022-06-28 Asm Ip Holding B.V. Method for depositing a group IV semiconductor and related semiconductor device structures
US11404270B2 (en) * 2018-11-30 2022-08-02 Texas Instruments Incorporated Microelectronic device substrate formed by additive process
US10861715B2 (en) 2018-12-28 2020-12-08 Texas Instruments Incorporated 3D printed semiconductor package
US10910465B2 (en) 2018-12-28 2021-02-02 Texas Instruments Incorporated 3D printed semiconductor package
KR102189557B1 (ko) * 2019-03-05 2020-12-11 에스케이머티리얼즈 주식회사 박막 트랜지스터 및 이의 제조방법
EP3832696A1 (en) * 2019-12-06 2021-06-09 Imec VZW Formation of a sige(:b):ga layer
TW202208659A (zh) * 2020-06-16 2022-03-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 沉積含硼之矽鍺層的方法
KR20210158809A (ko) * 2020-06-24 2021-12-31 에이에스엠 아이피 홀딩 비.브이. 실리콘이 구비된 층을 형성하는 방법
CN115491655A (zh) * 2022-10-05 2022-12-20 江苏筑磊电子科技有限公司 一种半导体技术中用于低温清洁和沉积的微波等离子辅助方法

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Also Published As

Publication number Publication date
JP5808522B2 (ja) 2015-11-10
CN104599945B (zh) 2017-11-28
JP2010512669A (ja) 2010-04-22
US20080138955A1 (en) 2008-06-12
CN101548363A (zh) 2009-09-30
KR20090088431A (ko) 2009-08-19
WO2008073926A2 (en) 2008-06-19
TW200834667A (en) 2008-08-16
WO2008073926A3 (en) 2009-01-15
CN104599945A (zh) 2015-05-06
KR101432150B1 (ko) 2014-08-20

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