TWI382811B - A method of manufacturing a phase change type heat sink, a flow path structure, an electronic machine, and a phase change type heat sink - Google Patents
A method of manufacturing a phase change type heat sink, a flow path structure, an electronic machine, and a phase change type heat sink Download PDFInfo
- Publication number
- TWI382811B TWI382811B TW097133914A TW97133914A TWI382811B TW I382811 B TWI382811 B TW I382811B TW 097133914 A TW097133914 A TW 097133914A TW 97133914 A TW97133914 A TW 97133914A TW I382811 B TWI382811 B TW I382811B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- plate
- phase change
- heat sink
- flow path
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007243891A JP2009076650A (ja) | 2007-09-20 | 2007-09-20 | 相変化型ヒートスプレッダ、流路構造体、電子機器及び相変化型ヒートスプレッダの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200930278A TW200930278A (en) | 2009-07-01 |
TWI382811B true TWI382811B (zh) | 2013-01-11 |
Family
ID=40467752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097133914A TWI382811B (zh) | 2007-09-20 | 2008-09-04 | A method of manufacturing a phase change type heat sink, a flow path structure, an electronic machine, and a phase change type heat sink |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100326632A1 (ja) |
JP (1) | JP2009076650A (ja) |
KR (1) | KR20100057038A (ja) |
TW (1) | TWI382811B (ja) |
WO (1) | WO2009037928A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11504863B2 (en) | 2019-11-07 | 2022-11-22 | Delta Electronics, Inc. | Heat dissipation device and robot using same |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4557055B2 (ja) * | 2008-06-25 | 2010-10-06 | ソニー株式会社 | 熱輸送デバイス及び電子機器 |
US20100071880A1 (en) * | 2008-09-22 | 2010-03-25 | Chul-Ju Kim | Evaporator for looped heat pipe system |
JP2010243035A (ja) * | 2009-04-03 | 2010-10-28 | Sony Corp | 熱輸送装置、電子機器及び熱輸送装置の製造方法 |
BR112012020282A2 (pt) * | 2010-02-13 | 2016-05-03 | Mcalister Technologies Llc | dispositivo de transferência térmica, e sistemas e métodos associados |
JP5180385B1 (ja) * | 2012-03-08 | 2013-04-10 | 株式会社Welcon | ベーパチャンバ |
US20130291555A1 (en) | 2012-05-07 | 2013-11-07 | Phononic Devices, Inc. | Thermoelectric refrigeration system control scheme for high efficiency performance |
US8893513B2 (en) | 2012-05-07 | 2014-11-25 | Phononic Device, Inc. | Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance |
JP6176433B2 (ja) * | 2013-01-10 | 2017-08-09 | 株式会社Welcon | ベーパチャンバ |
JP6213807B2 (ja) * | 2013-02-26 | 2017-10-18 | 株式会社Welcon | ヒートパイプ |
WO2014157147A1 (ja) * | 2013-03-27 | 2014-10-02 | 古河電気工業株式会社 | 冷却装置 |
US9593871B2 (en) | 2014-07-21 | 2017-03-14 | Phononic Devices, Inc. | Systems and methods for operating a thermoelectric module to increase efficiency |
US10458683B2 (en) | 2014-07-21 | 2019-10-29 | Phononic, Inc. | Systems and methods for mitigating heat rejection limitations of a thermoelectric module |
FR3027379B1 (fr) | 2014-10-15 | 2019-04-26 | Euro Heat Pipes | Caloduc plat avec fonction reservoir |
WO2017037921A1 (ja) | 2015-09-03 | 2017-03-09 | 富士通株式会社 | ループヒートパイプ及びその製造方法並びに電子機器 |
JP6291000B2 (ja) * | 2016-09-01 | 2018-03-07 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
US10352626B2 (en) * | 2016-12-14 | 2019-07-16 | Shinko Electric Industries Co., Ltd. | Heat pipe |
JP2018173193A (ja) * | 2017-03-31 | 2018-11-08 | 古河電気工業株式会社 | ヒートシンク |
US10976111B2 (en) * | 2017-10-27 | 2021-04-13 | Shinko Electric Industries Co., Ltd. | Loop type heat pipe |
JP6951267B2 (ja) * | 2018-01-22 | 2021-10-20 | 新光電気工業株式会社 | ヒートパイプ及びその製造方法 |
JP7015197B2 (ja) * | 2018-03-26 | 2022-02-02 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
JP7027253B2 (ja) * | 2018-05-30 | 2022-03-01 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
US10962301B2 (en) * | 2018-07-23 | 2021-03-30 | Shinko Electric Industries Co., Ltd. | Loop heat pipe |
JP6801698B2 (ja) * | 2018-09-04 | 2020-12-16 | セイコーエプソン株式会社 | 冷却装置及びプロジェクター |
JP7153515B2 (ja) * | 2018-09-25 | 2022-10-14 | 新光電気工業株式会社 | ループ型ヒートパイプ |
TWI690684B (zh) * | 2019-01-31 | 2020-04-11 | 雙鴻科技股份有限公司 | 均溫板與具有該均溫板的散熱裝置 |
US20200376538A1 (en) * | 2019-05-27 | 2020-12-03 | Asia Vital Components (China) Co., Ltd. | Manufacturing method of roll bond plate evaporator structure |
CN110278696A (zh) * | 2019-07-19 | 2019-09-24 | 深圳市英维克科技股份有限公司 | 重力热管散热器及电子设备 |
US11587798B2 (en) * | 2020-01-03 | 2023-02-21 | Rolls-Royce North American Technologies Inc. | High heat flux power electronics cooling design |
US11473849B2 (en) | 2020-05-15 | 2022-10-18 | Murata Manufacturing Co., Ltd. | Vapor chamber |
US11013145B1 (en) | 2020-05-15 | 2021-05-18 | Murata Manufacturing Co., Ltd. | Vapor chamber |
US11473850B2 (en) | 2020-05-15 | 2022-10-18 | Murata Manufacturing Co., Ltd. | Vapor chamber |
US11585606B2 (en) | 2020-05-15 | 2023-02-21 | Murata Manufacturing Co., Ltd. | Vapor chamber |
KR102605791B1 (ko) * | 2021-12-13 | 2023-11-23 | 중앙대학교 산학협력단 | 반도체 소자 열관리 모듈 및 이의 제조 방법 |
CN115900404B (zh) * | 2022-11-21 | 2023-07-21 | 上海交通大学 | 加热平板沸腾强化微结构改性表面及其实现方法 |
CN116914322B (zh) * | 2023-09-13 | 2024-01-09 | 比亚迪股份有限公司 | 冷却系统、电池包箱体、电池包和车辆 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1131768A (ja) * | 1997-07-11 | 1999-02-02 | Denso Corp | 沸騰冷却装置 |
TWM245742U (en) * | 2003-10-31 | 2004-10-01 | Cpumate Inc | Heat sink structure with multiple flowing paths |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6267843A (ja) * | 1985-09-20 | 1987-03-27 | Hitachi Ltd | 半導体冷却装置 |
JPS62105496A (ja) * | 1985-11-01 | 1987-05-15 | 株式会社日立製作所 | 熱伝達装置 |
JP2002327993A (ja) * | 2001-05-01 | 2002-11-15 | Fujitsu Ltd | 薄型ヒートパイプ、薄型ヒートシンク、熱制御システムおよび薄型ヒートパイプの製造方法 |
JP2004020116A (ja) * | 2002-06-19 | 2004-01-22 | Mitsubishi Electric Corp | 平板型ヒートパイプ |
JP2007266153A (ja) * | 2006-03-28 | 2007-10-11 | Sony Corp | プレート型熱輸送装置及び電子機器 |
-
2007
- 2007-09-20 JP JP2007243891A patent/JP2009076650A/ja active Pending
-
2008
- 2008-08-08 WO PCT/JP2008/064300 patent/WO2009037928A1/ja active Application Filing
- 2008-08-08 US US12/733,567 patent/US20100326632A1/en not_active Abandoned
- 2008-08-08 KR KR1020107005469A patent/KR20100057038A/ko not_active Application Discontinuation
- 2008-09-04 TW TW097133914A patent/TWI382811B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1131768A (ja) * | 1997-07-11 | 1999-02-02 | Denso Corp | 沸騰冷却装置 |
TWM245742U (en) * | 2003-10-31 | 2004-10-01 | Cpumate Inc | Heat sink structure with multiple flowing paths |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11504863B2 (en) | 2019-11-07 | 2022-11-22 | Delta Electronics, Inc. | Heat dissipation device and robot using same |
Also Published As
Publication number | Publication date |
---|---|
WO2009037928A1 (ja) | 2009-03-26 |
KR20100057038A (ko) | 2010-05-28 |
JP2009076650A (ja) | 2009-04-09 |
US20100326632A1 (en) | 2010-12-30 |
TW200930278A (en) | 2009-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |