WO2009037928A1 - 相変化型ヒートスプレッダ、流路構造体、電子機器及び相変化型ヒートスプレッダの製造方法 - Google Patents

相変化型ヒートスプレッダ、流路構造体、電子機器及び相変化型ヒートスプレッダの製造方法 Download PDF

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Publication number
WO2009037928A1
WO2009037928A1 PCT/JP2008/064300 JP2008064300W WO2009037928A1 WO 2009037928 A1 WO2009037928 A1 WO 2009037928A1 JP 2008064300 W JP2008064300 W JP 2008064300W WO 2009037928 A1 WO2009037928 A1 WO 2009037928A1
Authority
WO
WIPO (PCT)
Prior art keywords
phase change
type heat
heat spreader
change type
electronic apparatus
Prior art date
Application number
PCT/JP2008/064300
Other languages
English (en)
French (fr)
Inventor
Hiroyuki Nagai
Hiroyuki Ryoson
Takashi Yajima
Mitsuo Hashimoto
Original Assignee
Sony Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corporation filed Critical Sony Corporation
Priority to US12/733,567 priority Critical patent/US20100326632A1/en
Publication of WO2009037928A1 publication Critical patent/WO2009037928A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

相変化型ヒートスプレッダ、流路構造体、及び、この相変化型ヒートスプレッダを備えた電子機器これに用いられる流路構造体の相変化による熱効率を向上させ、熱抵抗を低減するために、溝４０５を構成する壁面に、毛細管板材を貫通する複数の開口４０８が、溝４０５の長手方向に沿って配置されている毛細管板材４０１～毛細管板材４０４を、各層の溝４０５がそれぞれ直交する方向に延びるように、Ｘ−Ｙ平面で９０度ずつ回転させて積層し、複数の開口４０８は、受熱板で受けた熱により蒸発した蒸気冷媒が流通する気相流路の一部として機能する相変化型ヒートスプレッダ、流路構造体、及び、この相変化型ヒートスプレッダを備えた電子機器これに用いられる流路構造体等を提供する。
PCT/JP2008/064300 2007-09-20 2008-08-08 相変化型ヒートスプレッダ、流路構造体、電子機器及び相変化型ヒートスプレッダの製造方法 WO2009037928A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/733,567 US20100326632A1 (en) 2007-09-20 2008-08-08 Phase-change-type heat spreader, flow-path structure, electronic apparatus,and method of producing a phase-change-type heat spreader

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-243891 2007-09-20
JP2007243891A JP2009076650A (ja) 2007-09-20 2007-09-20 相変化型ヒートスプレッダ、流路構造体、電子機器及び相変化型ヒートスプレッダの製造方法

Publications (1)

Publication Number Publication Date
WO2009037928A1 true WO2009037928A1 (ja) 2009-03-26

Family

ID=40467752

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064300 WO2009037928A1 (ja) 2007-09-20 2008-08-08 相変化型ヒートスプレッダ、流路構造体、電子機器及び相変化型ヒートスプレッダの製造方法

Country Status (5)

Country Link
US (1) US20100326632A1 (ja)
JP (1) JP2009076650A (ja)
KR (1) KR20100057038A (ja)
TW (1) TWI382811B (ja)
WO (1) WO2009037928A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5180385B1 (ja) * 2012-03-08 2013-04-10 株式会社Ｗｅｌｃｏｎ ベーパチャンバ
JP2013545956A (ja) * 2010-02-13 2013-12-26 マクアリスター テクノロジーズ エルエルシー 熱伝達装置、ならびに関連したシステムおよび方法
US20190293362A1 (en) * 2018-03-26 2019-09-26 Shinko Electric Industries Co., Ltd. Loop heat pipe
CN115900404A (zh) * 2022-11-21 2023-04-04 上海交通大学 加热平板沸腾强化微结构改性表面及其实现方法

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JP4557055B2 (ja) * 2008-06-25 2010-10-06 ソニー株式会社 熱輸送デバイス及び電子機器
US20100071880A1 (en) * 2008-09-22 2010-03-25 Chul-Ju Kim Evaporator for looped heat pipe system
JP2010243035A (ja) * 2009-04-03 2010-10-28 Sony Corp 熱輸送装置、電子機器及び熱輸送装置の製造方法
US8893513B2 (en) 2012-05-07 2014-11-25 Phononic Device, Inc. Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
JP6176433B2 (ja) * 2013-01-10 2017-08-09 株式会社Ｗｅｌｃｏｎ ベーパチャンバ
JP6213807B2 (ja) * 2013-02-26 2017-10-18 株式会社Ｗｅｌｃｏｎ ヒートパイプ
CN205092233U (zh) * 2013-03-27 2016-03-16 古河电气工业株式会社 冷却装置
US9593871B2 (en) 2014-07-21 2017-03-14 Phononic Devices, Inc. Systems and methods for operating a thermoelectric module to increase efficiency
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
FR3027379B1 (fr) 2014-10-15 2019-04-26 Euro Heat Pipes Caloduc plat avec fonction reservoir
WO2017037921A1 (ja) 2015-09-03 2017-03-09 富士通株式会社 ループヒートパイプ及びその製造方法並びに電子機器
JP6291000B2 (ja) * 2016-09-01 2018-03-07 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
US10352626B2 (en) 2016-12-14 2019-07-16 Shinko Electric Industries Co., Ltd. Heat pipe
JP2018173193A (ja) * 2017-03-31 2018-11-08 古河電気工業株式会社 ヒートシンク
US10976111B2 (en) * 2017-10-27 2021-04-13 Shinko Electric Industries Co., Ltd. Loop type heat pipe
JP6951267B2 (ja) * 2018-01-22 2021-10-20 新光電気工業株式会社 ヒートパイプ及びその製造方法
JP7027253B2 (ja) * 2018-05-30 2022-03-01 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
US10962301B2 (en) * 2018-07-23 2021-03-30 Shinko Electric Industries Co., Ltd. Loop heat pipe
JP6801698B2 (ja) * 2018-09-04 2020-12-16 セイコーエプソン株式会社 冷却装置及びプロジェクター
JP7153515B2 (ja) * 2018-09-25 2022-10-14 新光電気工業株式会社 ループ型ヒートパイプ
TWI690684B (zh) * 2019-01-31 2020-04-11 雙鴻科技股份有限公司 均溫板與具有該均溫板的散熱裝置
US20200376538A1 (en) * 2019-05-27 2020-12-03 Asia Vital Components (China) Co., Ltd. Manufacturing method of roll bond plate evaporator structure
CN110278696A (zh) * 2019-07-19 2019-09-24 深圳市英维克科技股份有限公司 重力热管散热器及电子设备
CN112776003B (zh) 2019-11-07 2022-05-06 台达电子工业股份有限公司 散热装置及其适用的机器人
US11587798B2 (en) * 2020-01-03 2023-02-21 Rolls-Royce North American Technologies Inc. High heat flux power electronics cooling design
US11473849B2 (en) 2020-05-15 2022-10-18 Murata Manufacturing Co., Ltd. Vapor chamber
US11013145B1 (en) 2020-05-15 2021-05-18 Murata Manufacturing Co., Ltd. Vapor chamber
US11473850B2 (en) 2020-05-15 2022-10-18 Murata Manufacturing Co., Ltd. Vapor chamber
US11585606B2 (en) 2020-05-15 2023-02-21 Murata Manufacturing Co., Ltd. Vapor chamber
KR102605791B1 (ko) * 2021-12-13 2023-11-23 중앙대학교 산학협력단 반도체 소자 열관리 모듈 및 이의 제조 방법
CN116914322B (zh) * 2023-09-13 2024-01-09 比亚迪股份有限公司 冷却系统、电池包箱体、电池包和车辆

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JPS6267843A (ja) * 1985-09-20 1987-03-27 Hitachi Ltd 半導体冷却装置
JPS62105496A (ja) * 1985-11-01 1987-05-15 株式会社日立製作所 熱伝達装置
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JPS6267843A (ja) * 1985-09-20 1987-03-27 Hitachi Ltd 半導体冷却装置
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013545956A (ja) * 2010-02-13 2013-12-26 マクアリスター テクノロジーズ エルエルシー 熱伝達装置、ならびに関連したシステムおよび方法
JP5180385B1 (ja) * 2012-03-08 2013-04-10 株式会社Ｗｅｌｃｏｎ ベーパチャンバ
US20190293362A1 (en) * 2018-03-26 2019-09-26 Shinko Electric Industries Co., Ltd. Loop heat pipe
US10876799B2 (en) * 2018-03-26 2020-12-29 Shinko Electric Industries Co., Ltd. Loop heat pipe
CN115900404A (zh) * 2022-11-21 2023-04-04 上海交通大学 加热平板沸腾强化微结构改性表面及其实现方法

Also Published As

Publication number Publication date
US20100326632A1 (en) 2010-12-30
KR20100057038A (ko) 2010-05-28
JP2009076650A (ja) 2009-04-09
TW200930278A (en) 2009-07-01
TWI382811B (zh) 2013-01-11

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