TWM245742U - Heat sink structure with multiple flowing paths - Google Patents

Heat sink structure with multiple flowing paths Download PDF

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Publication number
TWM245742U
TWM245742U TW92219358U TW92219358U TWM245742U TW M245742 U TWM245742 U TW M245742U TW 92219358 U TW92219358 U TW 92219358U TW 92219358 U TW92219358 U TW 92219358U TW M245742 U TWM245742 U TW M245742U
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Taiwan
Prior art keywords
hot plate
heat
scope
flow paths
heat sink
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TW92219358U
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Chinese (zh)
Inventor
Wei-Geng Lin
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Cpumate Inc
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Priority to TW92219358U priority Critical patent/TWM245742U/en
Publication of TWM245742U publication Critical patent/TWM245742U/en

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Description

五、創作說明(1) 【新型所屬之技術領域】 本創作係有關於—插θ 士々 指-種將熱傳特性佳之敎板路之散熱器結 …、板/、複數中空管體 尤 ,以谣A — C3 · 〇合,並於 流路之|办 、 < ^熱器結 官體上串接散熱鰭片, - 構者。 以構成一具有多重 【先前技術】V. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation is about—insertion θ Shiji refers to a type of heat sink junction with good heat transfer characteristics ..., plate /, multiple hollow tube bodies, etc. A, C3 · 〇 is combined, and the fins of the flow path are connected in series with the heat sink fins,-the constructor. To form one with multiple [prior art]

度之電子元件電Kj:速:升級’已發展出許多古 僅功能增強、運作:; = :隨= 的提昇U ,因此’為維持電子元件於其之$ :::的大幅提昇 決的課題之一。 所毛人員最迫切急需解 如第-圖所示’係為一種習知的散 用以裝設於如中央處理器(cpu )等雷^ ^ ,其主要係 括一導熱基座(Heat Sink) 1〇a及複數/管,,、广件上,包 )11a、散熱鰭片123 ;其中,各埶管Ha、之—^eat Pipe 置以固定於該導熱基座10a上,㈣-二n 等之間隔穿設固定於各熱管lla之另一迪、韓/128則以相 係藉由其導熱基座 ’俾令電子發熱元件將其所產生 之”、、里傳導至該政熱器13之導熱基座1〇a上,使固設於導 熱基座10a上之各熱管Ua隨其受熱,並使各熱管内部 之工作流體(working fluid ) 13a受熱後氣化,以吸收該 導熱基座10a上之熱量而使其溫度降低,而當氣化後之工 M245742 五、創作說明(2) 作流體13a上升並遠離導熱基座1〇a時,即可恢復成液態並 為各熱管11a内壁上之毛細組織(wick structure)丨“所 ,同時,熱量可擴散至各亊接於熱管Ua i之散熱鰭 P i 1 進而使電子發熱元件所產生之熱量能以較快之速 二、基座1〇a傳導至各該散熱鰭片12a上進行散熱,從 而達到快速散熱之目的。Degree of electronic components Kj: speed: upgrade 'has developed many ancient functions enhancement and operation:; =: With the improvement of U, therefore,' to maintain the electronic components in the substantial improvement of $ ::: one. The most urgent need for solution is as shown in Figure-'It is a kind of conventional loose device for mounting on a central processing unit (CPU) and other mines ^ ^, which mainly includes a heat sink (Heat Sink) 10a and plural / pipes, on a wide piece, including) 11a, radiating fins 123; among them, each of the tubes Ha, of which ^ eat Pipe is placed to be fixed on the heat conducting base 10a, ㈣-n The other Di, Han / 128, which are fixed to each heat pipe 11a at equal intervals, are connected to the thermal heater 13 through the heat conduction base 'order the electronic heating element to generate it', On the heat conducting base 10a, each heat pipe Ua fixed on the heat conducting base 10a is heated with it, and the working fluid 13a inside each heat pipe is heated to vaporize to absorb the heat conducting base. The heat on 10a lowers its temperature, and when the gasification process M245742 V. Creation Instructions (2) When the working fluid 13a rises away from the thermally conductive base 10a, it can be restored to a liquid state and become the inner wall of each heat pipe 11a. The wick structure on the upper side of the heat sink can be diffused to the heat radiating fins P i 1 connected to the heat pipes Ua i. The generated heat of the electric heating element can be a faster rate of two, each of the base 1〇a conducted to the fin 12a on heat dissipation, thereby to achieve the purpose of rapid cooling.

該導各熱管山須以膠合或其它結合手段固定於 介質成&上以致各熱管Ua與導熱基座10a有其它 個熱ίίίί此之間的熱傳阻隔,又該導熱基座10a在整 率=# k私中恆為固態,並無相變化的產生,故其埶傳效 丰不:’難以彰顯熱管lla高效快速傳熱之特性,、專A 特:脊有鑑於此,本創作人係為改善並解決上述之缺失,乃 特潛心研究並配合學理之運用, 3 :乃 有效改善上述缺失之本創作。、於kih合理且 【新型内容】 散敎之目的’在於可提供-種具有多重流路之 相結;:並丄::2用熱:特性佳之熱板與複數中空管體 上共同串接i數二Ϊ内部j熱板之内部相通,1各管體 器結構者。月“、、鰭片,以構成-具有多重流路之散熱 路之^:5述〉目㈤’本創作係提供-種具有多重流 體;執^:二括—熱板以及複數内部呈中空狀之管 …、板包含一上蓋盥一下篆, _ ^ ^ 於熱板内部形成一中空容室:糸相互蓋合’以 令至用以填充適量之工作流體,The heat pipes must be fixed to the medium by gluing or other bonding means so that each heat pipe Ua and the heat conduction base 10a have other heat transfer barriers between them, and the heat conduction base 10a is at the same rate. = # kzhongzhongheng is solid and has no phase change, so its heat transfer effect is not: 'It is difficult to highlight the characteristics of efficient and fast heat transfer of the heat pipe lla. Special A: In view of this, the author is To improve and solve the above-mentioned shortcomings is to concentrate on research and cooperate with the application of theories. 3: It is to effectively improve the original creation of the above-mentioned shortcomings. , Yukih is reasonable and [new content] The purpose of dispersal is to provide-a kind of junction with multiple flow paths ;: and: 2: heat use: a hot plate with good characteristics and a plurality of hollow tubes are connected in series The number i is two, the inside j is the same as the inside of the hot plate, and the structure of each pipe body is 1. "", Fins to constitute-a heat-dissipating path with multiple flow paths ^: 5 descriptions> heading 'this creative department provides-a kind of multiple fluids; executive ^: two-the hot plate and a plurality of interiors are hollow The tube ..., the plate contains an upper cover and a shower, _ ^ ^ forms a hollow container inside the hot plate: 糸 cover each other, so as to fill the appropriate amount of working fluid,

第6頁 M245742 五、創作說明(3) '" 而各熱管則分佈於熱板表面上並豎立設置,各管體内部皆 f熱板之中空容室相通,且管體上係串接複數間隔排列之 散熱鰭片;藉此,當熱板受熱後,因各管體内部皆與熱板 之中空容室相通,故工作流體經相變化而氣化,可直接將Page 6 M245742 V. Creative Instructions (3) '" The heat pipes are distributed on the surface of the hot plate and are erected. The interior of each pipe is connected to the empty space in the hot plate, and a plurality of pipes are connected in series. Spaced heat-dissipating fins; as a result, when the hot plate is heated, the interior of each tube communicates with the empty space in the hot plate, so the working fluid is vaporized by the phase change and can be directly charged.

熱量快速帶離至各散熱鰭片上,以達更佳之熱傳效率及供 速散熱之目的者。 N 【實施方式】 為了使貴審查委員能更進一步瞭解本創作之特徵及 技術内谷,請參閱以下有關本創作之詳細說明與附圖,然 而所附圖式僅提供參考與說明用,並非用來對本創作加= 限制者。 請參閱第二圖、第三圖及第四圖,係分別為本創作之 立體分解圖、立體組合圖及平面剖視圖。本創作係提供一 種具有多重流路之散熱器結構,包括一熱板1 、以及賢I 於該熱板1表面上之複數管體2,其中: 立 該熱板1係呈一平板狀體,其包含一上蓋丨0盥一 τ金 11,該上、下蓋10、11皆以導熱性良好之材質所製成,= 銅等’且該上、下蓋1 0、11係彼此相對並相互緊密蓋人 以於二者之間形成一封閉且位於該熱板1内部之中命二6 12’並於該中空容室12内填充有適量之工作 該等管體2内部皆呈中空狀’ α分別於各管體 成一腔室20,各官體2係分佈於熱板i表面上,其一接 於該熱板1之上盍10頂面處,並使各管體2之腔室20皆與=The heat is quickly dissipated to each heat dissipation fin to achieve better heat transfer efficiency and the purpose of rapid heat dissipation. N [Embodiment] In order to allow your reviewers to further understand the characteristics and technical valleys of this creation, please refer to the following detailed descriptions and drawings of this creation, but the drawings are provided for reference and explanation only, not for Let's add = limiters to this creation. Please refer to the second, third, and fourth images, which are respectively a three-dimensional exploded view, a three-dimensional combination view, and a plan sectional view of this creation. The present invention provides a heat sink structure with multiple flow paths, including a hot plate 1 and a plurality of tubes 2 on the surface of the hot plate 1, wherein: the hot plate 1 is a flat plate, It includes an upper cover, 0 and a τ gold 11, the upper and lower covers 10, 11 are made of a material with good thermal conductivity, = copper, etc., and the upper and lower covers 10, 11 are opposite each other and each other Closely cover the person so as to form a closed space between the two and locate inside the hot plate 1 and hit the second 6 12 'and fill the hollow volume 12 with a proper amount of work. The interior of the tube body 2 is hollow.' α forms a cavity 20 in each tube body, and each official body 2 is distributed on the surface of the hot plate i. One of them is connected to the top surface of the hot plate 1 and 10, and the cavity 20 of each tube body 2 is formed. Both with =

第7頁 M245742 五、創作說明(4) 熱板1之中空谷室12相通,而各管體2之另一端則由上蓋1〇 頂面處分別垂直向上延伸而獨自豎立設置,以於各管體2 上共同串接複數上、下間隔排列之散熱鰭片2 1,且各散熱 鰭片21上穿設有與該等管體2之分佈位置相對且數量相等 之穿孔22 ’以供各管體2分別串入之。 前述各管體2亦可為内部設有毛細組織與工作流體之 熱管。 提供工作 具有二種 吸附擴散 支撐效果 結構強度 方式製成 結構者, 能確保該 作具有多 元件3 上 子發熱元 腔室2 0皆 變化而氣 内,以達 21 ,將 βφPage 7 M245742 V. Creation instructions (4) The hollow valley chamber 12 in the hot plate 1 is in communication, and the other end of each tube body 2 is extended vertically upward from the top surface of the upper cover 10 and is erected independently so that each tube A plurality of heat radiating fins 21 arranged in an up-and-down space are connected in series on the body 2, and each heat radiating fin 21 is provided with perforations 22 'opposite to the distribution position of the pipe bodies 2 and the same number of holes 22' for each pipe. Body 2 is strung in separately. Each of the aforementioned pipe bodies 2 may be a heat pipe provided with a capillary tissue and a working fluid inside. Provide work with two kinds of absorption and diffusion support effects, structural strength, and the method of making the structure, can ensure that the work has multiple elements 3 neutron heating element chambers 20 are all changed and inside the air to reach 21, βφ

本創作更於該熱板1之中空容室12内設有一 流體吸附擴散之支撐結構丨3,該支撐結構丨3必須 作用:一為前述提供中空容室丨2内之工作流體作 之用、另一為其本身在結構上應具有一定強度之 ,以於該熱板1施以抽真空作業時,提供適當之 ;故或支撐結構1 3可為高分子之毛細材料以發泡 ’如陶曼’或亦可為粉末冶金製成具有多孔性之 以令該支撐結構1 3可同時兼具上述二種作用,而 熱板1可維持高效快速傳熱之特性。 是以’藉由上述之構造組成,即可得到本創 重流路之散熱器結構。 如第,圖所示,當本創作應用於一電子發熱 時,係將忒熱板1之下蓋11底面緊密貼設於該電 件3之表面,而一旦熱板i受熱後,因各管體2之 與癌熱$1之中空容室1 2相通,ϋ工作流體經相 化可#,將熱置快速地帶至各管體2之腔室20 更佳之熱傳效率,並透過各管體2上之散熱.籍片In this creation, a support structure for fluid adsorption and diffusion is provided in the hollow chamber 12 of the hot plate 1 and the support structure 3 must function: one is to provide the working fluid in the hollow chamber 1 as described above, The other is that it should have a certain strength in the structure, so that when the hot plate 1 is subjected to a vacuum operation, it is appropriate; therefore, the support structure 13 can be a high-molecular capillary material to be foamed, such as pottery. Mann may also be made of powder metallurgy with porosity so that the supporting structure 13 can have both of the above functions at the same time, and the hot plate 1 can maintain the characteristics of efficient and rapid heat transfer. Based on the above structure, the heat sink structure of the original heavy flow path can be obtained. As shown in the figure, when this creation is applied to an electronic heating, the bottom surface of the lower cover 11 of the hot plate 1 is closely attached to the surface of the electric component 3, and once the hot plate i is heated, it is caused by each tube. The body 2 communicates with the empty chamber 12 in the cancer heat $ 1, and the working fluid can be brought to the chamber 20 of each tube body 2 through the phase of the chemical fluid, which has a better heat transfer efficiency and passes through each tube body 2 On the heat.

第8頁 M245742 五、創作說明(5) 室2 0内之熱量引導至外界空氣中而逐一擴散、降溫,完成 高熱通量及快速散逸之目的;俟氣化之工作流體獲得冷卻 而恢復成液態時’即可順著各管體2之腔室2 0壁面回流至 中空谷至12内’並為支撐結構13所吸附而均勻擴散,至再 次受熱後即循環上述步驟以不斷進行相變化之熱傳工作。 因此,由於本創作具有多重流路之散熱器結構,係將 熱板1與複數管體2相結合,各管體2之内部與熱板丨之内部 互通,且管體2上更設有複數散熱鰭片21,故可藉由工作 流體的相變化而直接將熱量快速傳遞,而不需經由不必要 之阻隔介質,同時,該支撐結構13兼具毛細與支撐之作用 ,可有效維持該熱板1高效快速散熱之特性,以達更佳之 熱傳效率及快速散熱之目的。 破可ΐΐΐί ’本創作實為不可多得之新型創作產品,其 = ; = : = 解:習:之缺失,又因極具 權Ϊ。’敬請詳查並賜准本案專利,以保障創作人之 惟以上所述僅為本創 拘限本創作之專利範圍, 内容所為之等效結構變化 内,合予陳明。 作之較佳可行實施例,非因此即 故舉凡運用本創作說明書及圖式 ’均同理皆包含於本創作之範圍Page 8 M245742 V. Creation instructions (5) The heat in the room 20 is guided to the outside air to diffuse and cool one by one to complete the purpose of high heat flux and rapid dissipation; the gasified working fluid is cooled and restored to a liquid state At that time, 'it can flow back to the hollow valley to 12 along the wall 20 of the chamber 2 of each pipe body 2' and diffuse uniformly for the adsorption of the support structure 13. After heating again, the above steps are repeated to continuously carry out the phase change heat. Pass work. Therefore, due to the heat sink structure with multiple flow paths in this creation, the hot plate 1 is combined with a plurality of tube bodies 2, the interior of each tube body 2 and the interior of the heat plate 丨, and the tube body 2 is provided with a plurality of The radiating fins 21 can directly transfer heat quickly through the phase change of the working fluid without passing through an unnecessary blocking medium. At the same time, the support structure 13 has both the function of capillaries and support, which can effectively maintain the heat. Board 1 features high efficiency and fast heat dissipation for better heat transfer efficiency and fast heat dissipation. Ϊ́ΐΐ 可 ΐΐΐί ’This creation is a rare new creative product, its =; =: = Solution: Xi: The lack of it, because it is very powerful. ’Please check and grant the patent in this case in order to protect the creator. However, the above is only for the original to limit the scope of the patent for the creation, and the content is equivalent to the changes in the equivalent structure. As a preferred and feasible embodiment, it is not for this reason that any use of this creation manual and drawings is equally included in the scope of this creation

M245742 圖式簡單說明 【圖式簡單說明】 第一圖 係習知散熱器之剖視示意圖。 第二圖 係本創作之立體分解圖。 第三圖 係本創作之立體組合圖。 第四圖 係本創作之平面剖視圖。 第五圖 係本創作使用狀態之另一平面剖視圖。 〔元件代表符號〕 <習知> 散熱器 1 a 導熱基座 10a 熱管 11a 散熱鰭片 12a 工作流體 13a 毛細組織 14a <本創作> 熱板 1 上蓋 10 下蓋 11 中空容室 12 支撐結構 13 管體 2 腔室 20 散熱鰭片 21 穿孔 22M245742 Brief description of the drawings [Simplified description of the drawings] The first diagram is a schematic sectional view of a conventional radiator. The second picture is a three-dimensional exploded view of this creation. The third picture is a three-dimensional combination picture of this creation. The fourth figure is a plan sectional view of this creation. The fifth figure is another plan sectional view of the state of use of this creation. [Representative Symbols of Components] < Knowledge > Radiator 1 a Thermally conductive base 10a Heat pipe 11a Radiating fins 12a Working fluid 13a Capillary tissue 14a < This creation > Hot plate 1 Upper cover 10 Lower cover 11 Hollow container 12 Support Structure 13 Tube body 2 Chamber 20 Radiating fin 21 Perforation 22

電子發熱元件 3Electronic heating element 3

第10頁Page 10

Claims (1)

M245742 六、申請專利範圍 1 、一種具有多重流路之散熱器結構,包括: 一熱板,包含一上蓋與一下蓋,該上、下蓋係相互蓋 合,以於該熱板内部形成一中空容室,並於該中空容室内 填充工作流體;及 複數内部呈中空狀之管體,係分佈於該熱板表面上並 豎立設置,各該管體内部皆與該熱板之中空容室相通,且 該等管體上係串接複數間隔排列之散熱鰭片。 2、 如申請專利範圍第1項所述之具有多重流路之散 熱器結構,其中該熱板之中空容室内係設有一提供工作流 體吸附擴散之支撐結構。 3、 如申請專利範圍第2項所述之具有多重流路之散 熱器結構,其中該支撐結構係為粉末冶金製成而具有多孔 性之結構者。 4、 如申請專利範圍第2項所述之具有多重流路之散 熱器結構,其中該支撐結構係為高分子之毛細材料以發泡 方式製成者。 5、 如申請專利範圍第4項所述之具有多重流路之散 熱器結構,其中該高分子之毛細材料係為陶瓷。 6、 如申請專利範圍第1項所述之具有多重流路之散 熱器結構,其中該等管體係為内部設有毛細組織與工作流 體之熱管。 7、 如申請專利範圍第1項所述之具有多重流路之散 熱器結構,其中各該散熱鰭片上係穿設有與該等管體之分 佈位置相對且數量相等之穿孔,以供各該管體分別串入之M245742 6. Scope of patent application 1. A radiator structure with multiple flow paths, including: a hot plate, including an upper cover and a lower cover, the upper and lower covers are closed to each other to form a hollow inside the hot plate The hollow chamber is filled with a working fluid; and a plurality of hollow-shaped tubes are distributed on the surface of the hot plate and are erected, and the interior of each tube is in communication with the hollow chamber of the hot plate. And, a plurality of spaced-apart heat radiating fins are connected in series to the pipe bodies. 2. The heat sink structure with multiple flow paths as described in item 1 of the scope of the patent application, wherein a support structure is provided in the hollow space of the hot plate to provide adsorption and diffusion of the working fluid. 3. The heat sink structure with multiple flow paths as described in item 2 of the scope of patent application, wherein the support structure is a structure made of powder metallurgy and having a porous structure. 4. The heat sink structure with multiple flow paths as described in item 2 of the scope of the patent application, wherein the support structure is a polymer capillary material made by foaming. 5. The heat sink structure with multiple flow paths as described in item 4 of the scope of the patent application, wherein the capillary material of the polymer is ceramic. 6. The heat sink structure with multiple flow paths as described in item 1 of the scope of the patent application, wherein these pipe systems are heat pipes with capillary tissue and working fluid inside. 7. The radiator structure with multiple flow paths as described in item 1 of the scope of the patent application, wherein each of the radiating fins is perforated with an equal number of perforations opposite to the distribution position of the pipe bodies for each of the The tubes are connected in series 第11頁 M245742 六、申請專利範圍 11111Page 11 M245742 VI. Application scope 11111
TW92219358U 2003-10-31 2003-10-31 Heat sink structure with multiple flowing paths TWM245742U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI382811B (en) * 2007-09-20 2013-01-11 Sony Corp A method of manufacturing a phase change type heat sink, a flow path structure, an electronic machine, and a phase change type heat sink

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI382811B (en) * 2007-09-20 2013-01-11 Sony Corp A method of manufacturing a phase change type heat sink, a flow path structure, an electronic machine, and a phase change type heat sink

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