TWI747262B - Notebook computer, vapor chamber device and method for fabricating the vapor chamber device - Google Patents

Abstract

The present invention discloses a notebook computer, a uniform temperature board device and a manufacturing method thereof. First, a lower shell is provided, which has an evaporation zone and a condensation zone, and forms a first fine layer of metal wool on the lower shell to Cover the evaporation zone and the condensation zone, and then form metal powder in the first fine metal velvet layer directly above the evaporation region, and then form a second fine metal velvet layer on the first fine metal velvet layer. High-temperature sintering is performed on the metal powder and the fine layer of metal wool to fix the metal powder and the fine layer of metal wool. Finally, an upper shell plate is provided, the bottom of which extends downward to form a supporting column, and the supporting column is fixed on the second metal velvet fine layer to complete the uniform temperature plate device, and this can be integrated into a thin notebook computer. To increase its heat dissipation efficiency.

Description

Notebook computer, uniform temperature board device and manufacturing method thereof

The present invention relates to a notebook computer and its uniform temperature board manufacturing technology, and particularly to a notebook computer, a uniform temperature board device and a manufacturing method thereof.

At present, the Vapor chamber is a kind of plate-shaped heat pipe. Its principle is the same as that of a heat pipe. It passes through the internal vacuum environment, so that the working fluid injected into it can generate liquid due to heat. The vapor phase changes, and then the heat is transferred by the vapor, and then it returns to a liquid state due to the cold, and then circulates in a reflux.

However, the uniform temperature plate and the heat pipe are different in manufacturing. The tube body of the heat pipe is usually tubular. The tube body can be closed at one end, and then the other end is opened to perform operations such as injecting working fluid, degassing or vacuuming. When the degassing is completed, the tube body is immediately closed, that is The production of heat pipes can be completed. However, the plate body of the uniform temperature plate is plate-shaped and usually consists of two cover plates covering the upper and lower sides. Therefore, it is formed into a plate shape instead of a tube; and the uniform temperature plate uses its upper and lower cover plates. The two plates with a larger surface area are respectively used as the heating end and the condensation end. Therefore, the uniform temperature plate is in a flat state when in use, and the working fluid is absorbed by the wick structure on its inner wall and gathers on it. At the bottom of its interior. In this situation, the heat equalizing plate mostly uses the central part of the heated end to attach the heat source, and the capillary structure of the heated end and the condensing end cannot effectively vaporize the working fluid, thus affecting the heat transfer effect. In addition, among the notebook computers with high wattage heat dissipation, such as notebook computers with specifications above 75 watts, because of the internal mechanism Considering that the distance between the condensing end and the heating end is relatively long, and screw holes are required in the channel for fixing with the chip, and the width of the condensing end should be less than 30 millimeters (mm), more heating elements are used, and the condensing effect is also relatively good. Good, it is not easy for the condensation end to return water, so a heat sink with better heat dissipation effect must be used to maintain the operating performance of the notebook computer. Although the heat dissipation performance of the heat pipe is good, the heat pipe is thicker, which does not meet the needs of thin and light notebook computers. If the existing temperature equalizing plate is used, in order to increase the capillary gradient, a thicker capillary structure must be used. However, this method does not meet the needs of thin and light notebook computers, and will increase the cost and manufacturing process. For example, for a 150-watt laptop, the width of the condensing zone is about 70-75mm, and the transmission distance between the center of the heat source and the end of the condensing zone may exceed 150mm. Effective heat dissipation, but often because of insufficient capillary force to successfully return water, it can only be used up to half the distance, which means that the heat dissipation capacity can only reach 50%, so the thickness of the capillary structure needs to be increased.

Therefore, the present invention aims at solving the above-mentioned problems and proposes a notebook computer, a uniform temperature plate device and a manufacturing method thereof, so as to solve the problems caused by the prior art.

The invention provides a notebook computer, a temperature equalizing plate device and a manufacturing method thereof, which increase the capillary gradient, thereby improving the heat dissipation efficiency.

The present invention provides a notebook computer, which includes a motherboard, at least one processor, at least one heat dissipation fin, at least one heat dissipation fan, and a uniform temperature plate device. The processor is arranged on the motherboard, and the heat dissipation fins are arranged on the motherboard and are separated from the processor. The cooling fan is arranged on the motherboard and corresponding to the cooling fins. The uniform temperature board device is arranged across the processor and the heat dissipation fins. The uniform temperature plate device includes a lower shell plate, a first fine metal velvet layer, a plurality of metal powders, a second fine metal velvet layer and an upper shell plate. The lower shell plate has an evaporation zone and a condensation zone, the evaporation zone is arranged on the processor, and the condensation zone is arranged on the radiating fins. The first metal wool fine layer is arranged on the lower shell plate and covers the evaporation zone and the condensation zone, wherein the first metal wool fine layer has a plurality of first cavities. The metal powder is filled into the first cavity directly above the evaporation zone, where The space of each first cavity directly above the evaporation zone is larger than the volume occupied by its corresponding metal powder. The second metal velvet capillary layer is arranged on the first metal velvet capillary layer, wherein the second metal velvet capillary layer has a plurality of second cavities, and the aperture of the second cavity is larger than the aperture of the first cavity. The bottom of the upper shell plate extends downward to form a plurality of supporting pillars, and the supporting pillars are used to fix the second metal wool fine layer.

In an embodiment of the present invention, the lower shell plate further includes an edge zone, the edge zone surrounds the evaporation zone and the condensation zone, the edge zone extends upward to form a convex wall, the convex wall surrounds the first fine metal velvet layer, metal powder , The second metal velvet fine layer and the supporting column, and the upper shell plate is fixed on the convex wall.

In an embodiment of the present invention, the second cavity is filled with hydrophilic microstructures.

In an embodiment of the present invention, the density of the second cavity is less than the density of the first cavity.

In an embodiment of the present invention, the surface area of the metal powder is 25-75% of the cross-sectional area of the corresponding first cavity.

In an embodiment of the present invention, the materials of the upper shell plate, the lower shell plate, the metal powder, the supporting column, the first metal wool fine layer and the second metal wool fine layer are all the same.

In an embodiment of the present invention, the materials of the upper shell plate, the lower shell plate, the metal powder, the supporting column, the first metal velvet fine layer and the second metal velvet fine layer are all copper, alloy copper or oxygen-free copper.

In an embodiment of the present invention, the number of processors, the number of cooling fins, and the number of cooling fans are all the same.

In an embodiment of the present invention, the processor is a central processing unit or a graphics processing unit.

In an embodiment of the present invention, the notebook computer further includes a casing that covers the motherboard, the processor, the heat dissipation fins, the heat dissipation fan and the uniform temperature plate device.

The present invention also provides a uniform temperature plate device, which includes a lower shell, a first fine layer of metal velvet, a plurality of metal powders, a second fine layer of velvet, and an upper shell. The lower shell plate has an evaporation zone and a condensation zone, the evaporation zone is arranged on the processor, and the condensation zone is arranged on the radiating fins. The first metal wool fine layer is arranged on the lower shell plate and covers the evaporation zone and the condensation zone, wherein the first metal wool fine layer has a plurality of first cavities. The metal powder is filled into the first cavity directly above the evaporation zone, and the space of each first cavity directly above the evaporation zone is larger than the volume occupied by the corresponding metal powder. The second metal velvet capillary layer is arranged on the first metal velvet capillary layer, wherein the second metal velvet capillary layer has a plurality of second cavities, and the aperture of the second cavity is larger than the aperture of the first cavity. The bottom of the upper shell plate extends downward to form a plurality of supporting pillars, and the supporting pillars are used to fix the second metal wool fine layer.

The present invention also provides a method for manufacturing a uniform temperature plate device, which includes the following steps: providing a lower shell plate, which has an evaporation zone and a condensation zone, and forming a first fine layer of metal wool on the lower shell plate, and The evaporation zone and the condensation zone are covered by the first fine metal velvet layer, wherein the first fine metal velvet layer has a plurality of first cavities; a plurality of metal powders are formed in the first cavities directly above the evaporation zone, and the evaporation zone is directly above the evaporation zone. The space of each first cavity above is larger than the volume occupied by the corresponding metal powder; a second metal velvet capillary layer is formed on the first metal velvet capillary layer, wherein the second metal velvet capillary layer has a plurality of second cavities , And the pore size of the second cavity is larger than the pore size of the first cavity; high-temperature sintering of the first fine metal velvet layer, metal powder, and second fine metal velvet layer to fix the fine metal powder and the second fine metal velvet layer on the first metal On the velvet hair layer; and an upper shell plate is provided, the bottom of which extends downward to form a plurality of support columns, and the support columns are used to fix the second metal velvet layer.

In one embodiment of the present invention, in the step of forming the metal powder in the first cavity directly above the evaporation zone, spraying the metal powder in the first cavity directly above the evaporation zone middle.

In an embodiment of the present invention, in the step of forming the metal powder in the first cavity directly above the evaporation zone, a porous material is used to adhere the metal powder to transfer the metal powder directly above the evaporation zone In the first hole.

In an embodiment of the present invention, the first fine metal velvet layer, the metal powder, and the second fine metal velvet layer are sintered at a high temperature at 700-800 degrees Celsius.

In an embodiment of the present invention, after the step of fixing the metal powder and the second metal velvet capillary layer on the first metal velvet capillary layer, the method further includes the following steps: filling the first cavity with a volatile solution, and To cover the metal powder; use a porous material to adhere to the hydrophilic sol-gel that is incompatible with the volatile solution, and coat the hydrophilic sol-gel in the second cavity; and The volatile solution and the hydrophilic hydrogel are sintered at a high temperature to volatilize the volatile solution, and the hydrophilic hydrogel is converted into a hydrophilic microstructure, and then the step of providing an upper shell plate is performed.

In an embodiment of the present invention, the volatile solution and the hydrophilic solvogel are sintered at a high temperature at 500-600 degrees Celsius.

In an embodiment of the present invention, the volatile solution is alcohol or acetone.

In an embodiment of the present invention, the component of the hydrophilic lyogel is IPA-based oxide.

Based on the above, the embodiment of the present invention fills the metal velvet capillary layer with metal powder and hydrophilic microstructures, and at the same time, the metal velvet capillary layer is designed to have large cavities in the upper layer and small cavities in the lower layer to increase the capillary gradient and improve the heat dissipation efficiency. And help to thin the notebook computer.

In order to enable your reviewers to have a better understanding and understanding of the structural features of the present invention and the effects achieved, I would like to provide a better embodiment diagram and detailed descriptions. The description is as follows:

10: Uniform temperature plate device

12: Lower shell

122: Evaporation Zone

124: Condensation zone

126: fringe zone

128: Protruding Wall

14: The first fine layer of metal velvet

142: The First Hole

16: metal powder

18: The second fine layer of metal velvet

182: The Second Hole

20: Upper shell

202: support column

22: Hydrophilic microstructure

24: Volatile solution

26: Hydrophilic solvogel

30: laptop

32: Motherboard

34: processor

36: cooling fins

38: cooling fan

40: shell

Figure 1 is a perspective view of an embodiment of the uniform temperature plate device of the present invention.

Figure 2 is an exploded view of an embodiment of the uniform temperature plate device of the present invention.

Figure 3 is a cross-sectional view of an embodiment of the present invention along the line A-A' in Figure 1.

Figures 4(a) to 4(e) are cross-sectional views of the structure of each step of an embodiment of the apparatus for manufacturing a uniform temperature plate of the present invention.

Fig. 5(a) to Fig. 5(h) are cross-sectional views of the structure of each step of another embodiment of the apparatus for manufacturing a uniform temperature plate of the present invention.

Figure 6 is a top view of an embodiment of the notebook computer of the present invention.

Fig. 7 is a cross-sectional view of an embodiment of the present invention along the line B-B' in Fig. 5.

The embodiments of the present invention will be further explained by following relevant drawings. As far as possible, in the drawings and the description, the same reference numerals represent the same or similar components. In the drawings, the shape and thickness may be exaggerated based on simplification and convenient labeling. It can be understood that the elements not specifically shown in the drawings or described in the specification are in the form known to those skilled in the art. Those skilled in the art can make various changes and modifications based on the content of the present invention.

When an element is called "on", it can generally mean that the element is directly on other elements, or there can be other elements existing in both. Conversely, when an element is said to be "directly in" another element, it cannot have other elements in between. As used herein, the term "and/or" includes any combination of one or more of the listed related items.

The following description of "one embodiment" or "an embodiment" refers to at least one specific element, structure, or feature related to the embodiment. Therefore, it appears in many places below Multiple descriptions of "one embodiment" or "an embodiment" are not directed to the same embodiment. Furthermore, specific components, structures, and features in one or more embodiments can be combined in an appropriate manner.

Figure 1 is a perspective view of an embodiment of the uniform temperature plate device of the present invention. Please refer to Figure 1 below to introduce an embodiment of the uniform temperature plate device 10 of the present invention. The shape can be rectangular or T-shaped, but the present invention is not limited to this.

Fig. 2 is an exploded view of an embodiment of the uniform temperature plate device of the present invention, and Fig. 3 is a structural cross-sectional view of an embodiment of the present invention along the line A-A' in Fig. 1. Please refer to Figure 2 and Figure 3 at the same time below. In an embodiment of the present invention, the uniform temperature plate device 10 includes a lower shell 12, a first metal velvet capillary layer 14, a plurality of metal powders 16, a second metal velvet capillary layer 18, and an upper shell plate 20, The metal powder 16 may be spherical, dendritic or irregular, but the present invention is not limited thereto.

The lower shell 12 has an evaporation zone 122 and a condensation zone 124. The first metal wool fine layer 14 is disposed on the lower shell plate 12 and covers the evaporation zone 122 and the condensation zone 124. The first metal wool fine layer 14 has a plurality of first cavities 142. All the metal powder 16 is filled in the first cavity 142 directly above the evaporation zone 122, and the space of each first cavity 142 directly above the evaporation zone 122 is larger than the volume occupied by the corresponding metal powder 16. For example, the surface area of the metal powder 16 is 25-75% of the cross-sectional area of the corresponding first cavity 142, preferably 50%. The presence of the metal powder 16 can form a larger capillary pressure gradient in the evaporation zone 122, so that the returning liquid receives a larger capillary force and is replenished to the evaporation zone 122 more quickly, so as to improve the anti-drying ability and uniformity of the evaporation zone 122. The heat dissipation efficiency of the warm plate device 10. Therefore, the evaporation zone 122 can maintain sufficient liquid to perform the phase change, thereby reducing the probability that after the liquid in the evaporation zone 122 is vaporized, it is too late to replenish the liquid to the evaporation zone 122, so that the heat source will continue to rise. As the heat dissipation efficiency is improved, the thickness of the uniform temperature plate device 10 can also be designed to be thinner. The second metal wool fine layer 18 is arranged on the first metal wool fine layer 14, wherein the second metal wool fine layer The fine layer 18 has a plurality of second cavities 182, and the pore diameter of the second cavities 182 is larger than the pore diameter of the first cavities 142, so as to increase the flow rate of the returning liquid. In some embodiments of the present invention, the density of all the second cavities 182 may be less than the density of all the first cavities 142 to increase the probability of liquid flowing from the condensation zone 124 to the evaporation zone 122. The bottom of the upper shell plate 20 extends downward to form a plurality of supporting pillars 202, and all the supporting pillars 202 are fixed on the second metal wool fine layer 18. The spaces around all supporting columns 202 are connected to each other to allow liquid to flow after vaporization. In order to have better heat dissipation efficiency, the materials of the upper shell plate 20, the lower shell plate 12, all the metal powder 16, all the support columns 202, the first metal velvet capillary layer 14 and the second metal velvet capillary layer 18 can all be the same. For example, it is copper, alloy copper or oxygen-free copper, but the present invention is not limited thereto.

In order to seal all the metal powder 16, all the support columns 202, the first metal velvet capillary layer 14 and the second metal velvet capillary layer 18, so that the liquid will not escape to the outside, the lower shell plate 12 may further include an edge area 126, an edge area 126 surrounds the evaporation zone 122 and the condensation zone 124, and the edge zone 126 extends upward to form a convex wall 128. The convex wall 128 surrounds the first fine metal velvet layer 14, all the metal powder 16, the second fine metal velvet layer 18 and all supports The pillar 202 and the upper shell plate 20 are fixed on the convex wall 128. In addition, in some embodiments of the present invention, all the second cavities 182 may be filled with hydrophilic microstructures 22 to improve the hydrophilicity and allow the liquid to flow back to the evaporation zone 122 more quickly.

When a heat source is provided under the evaporation zone 122 and a cooling source is provided under the condensation zone 124, the moisture on the evaporation zone 122 will be gradually evaporated by the heat source to form water vapor and flow upwards until it is covered around the support column 202 Space. The cooling source can lower the temperature of the water vapor above itself. When the water vapor cools down, it will form water droplets and fall. When the water vapor above the condensation zone 124 decreases, the water vapor above the evaporation zone 122 will flow above the condensation zone 124. The water droplets accumulated on the condensation zone 124 will move to the evaporation zone 122 by the cohesion and capillary force of the metal powder 16, the hydrophilic microstructure 22, the first metal velvet capillary layer 14 and the second metal velvet capillary layer 18, To complete a heat dissipation cycle.

Figures 4(a) to 4(e) are cross-sectional views of the structure of each step of an embodiment of the apparatus for manufacturing a uniform temperature plate of the present invention. Please refer to Fig. 4(a) to Fig. 4(e) below to introduce an embodiment of the method for manufacturing the uniform temperature plate device of the present invention. First, as shown in Figure 4(a), a lower shell 12 is provided, which has an evaporation zone 122 and a condensation zone 124, and forms a first metal velvet capillary layer 14 on the lower shell 12, and uses the first metal velvet capillary The layer 14 covers the evaporation zone 122 and the condensation zone 124, wherein the first metal wool fine layer 14 has a plurality of first cavities 142. Then, as shown in Figure 4(b), the metal powder 16 is formed in the first cavity 142 directly above the evaporation region 122, wherein the space of each first cavity 142 directly above the evaporation region 122 is larger than its corresponding metal The volume occupied by powder 16. In one embodiment, all the metal powder 16 is sprayed in the first cavity 142 directly above the evaporation zone 122. In another embodiment, a porous material, such as, but not limited to, porous sponge or graphite is used to adhere all the metal powder 16 to transfer all the metal powder 16 to the first cavity 142 directly above the evaporation zone 122 middle. Furthermore, as shown in FIG. 4(c), a second metal velvet hair layer 18 is formed on the first metal velvet hair layer 14. The second metal velvet hair layer 18 has a plurality of second cavities 182, and the second metal velvet hair layer 18 has a plurality of second cavities 182. The aperture of the cavity 182 is larger than the aperture of the first cavity 142. In addition, the density of all the second cavities 182 may be less than the density of all the first cavities 142. After the formation is completed, as shown in Figure 4(d), the first fine metal velvet layer 14, all metal powders 16 and the second fine metal velvet layer 18 are sintered at a high temperature to fix all the metal powder 16 and the second metal velvet. The capillary layer 18 is on the first metal wool capillary layer 14. For example, the first fine metal velvet layer 14, all metal powders 16, and the second fine metal velvet layer 18 are sintered at a high temperature at 700-800 degrees Celsius, but the high-temperature sintering temperature is not limited to 700-800 degrees Celsius. The temperature is used to fix all the metal powder 16 and the second fine metal wool layer 18 on the first fine metal wool layer 14. Finally, as shown in Figure 4(e), an upper shell plate 20 is provided, the bottom of which extends downward to form a plurality of support columns 202, and all the support columns 202 are fixed to On the second fine layer of metal velvet 18.

Fig. 5(a) to Fig. 5(h) are cross-sectional views of the structure of each step of another embodiment of the apparatus for manufacturing a uniform temperature plate of the present invention. Please refer to Fig. 5(a) to Fig. 5(h) below to introduce another embodiment of the manufacturing method of the uniform temperature plate device. The steps in Fig. 5(a) to Fig. 5(d) are the same as those in Fig. 4(a) to Fig. 4(d) respectively, and will not be repeated here. After completing the steps in Figure 5(d), in order to further increase the heat dissipation efficiency, the following steps can be performed:

As shown in Figure 5(e), all the first cavities 142 are filled with the volatile solution 24 to cover all the metal powders 16, and fill the gaps between the metal powders 16, so as to separate the metal powders 16 from others. The external structure is isolated, and the volatile solution 24 can be alcohol or acetone, but the present invention is not limited to this. The method of filling all the first cavities 142 with the volatile solution 24 and thereby covering all the metal powder 16 and filling the gaps of the metal powder 16 can be achieved by gravity and capillary pulling force, but the present invention is not limited to this . Next, as shown in Figure 5(f), use a porous material, such as, but not limited to, porous sponge or graphite to adhere to a hydrophilic soluble gel with low thermal resistance that is incompatible with the volatile solution 24 (sol-gel) 26, and the hydrophilic gel 26 glue is coated in all the second cavities 182. For example, the component of the hydrophilic lyogel 26 may be IPA-based oxide or other suitable hydrophilic components. Because the volatile solution 24 and the hydrophilic solvate 26 have different viscosities, the volatile solution 24 can effectively isolate the hydrophilic solvate 26 and the metal powder 16. Next, as shown in Figure 5(g), the volatile solution 24 and the hydrophilic solvogel 26 are sintered at a high temperature to volatilize or burn dry the volatile solution 24 and convert the hydrophilic solvogel 26 into It is a hydrophilic microstructure 22. For example, the volatile solution 24 and the hydrophilic gel 26 are sintered at a high temperature at 500-600 degrees Celsius, but the high-temperature sintering temperature is not limited to 700-800 degrees Celsius. The high-temperature sintering temperature can be adjusted according to requirements. . In some embodiments of the present invention, the amount of the volatile solution 24 should be controlled as far as possible so as not to touch the hydrophilic gel 26, so that the thickness of the hydrophilic microstructure 22 can be increased. In addition, according to The volume of the first cavity 142 can be calculated for the amount of the volatile solution 24 required, and the volatile solution 24 can be injected with a quantitative syringe to avoid touching the hydrophilic gel 26. Finally, as shown in FIG. 5(h), an upper shell 20 is provided, the bottom of which extends downward to form a plurality of support columns 202, and all the support columns 202 are used to fix the second metal wool fine layer 18.

Figure 6 is a top view of an embodiment of the notebook computer of the present invention. Fig. 7 is a cross-sectional view of an embodiment of the present invention along the line B-B' in Fig. 5. Please refer to FIGS. 6 and 7 below to introduce an embodiment of the notebook computer of the present invention. The notebook computer 30 includes a motherboard 32, at least one processor 34, at least one heat dissipation fin 36, at least one heat dissipation fan 38, and a uniform temperature board device 10. The processor 34 may be a central processing unit or a graphics processing unit. However, the present invention is not limited to this, and the processor 34 can also be other electronic devices that generate heat. The number of processors 34, the number of cooling fins 36, and the number of cooling fans 38 are not limited. The number of processors 34, the number of cooling fins 36, and the number of cooling fans 38 can all be the same, that is, they are all one or All are two or more. In addition, in some embodiments of the present invention, the notebook computer 30 may further include a casing 40 to achieve the purpose of being portable. The structure shown in Fig. 6 can be applied to Fig. 1 or other embodiments of the present invention, but is not limited to this.

The processor 34, the heat dissipation fin 36 and the heat dissipation fan 38 are all disposed on the motherboard 32, the processor 34 and the heat dissipation fin 36 are separated from each other, and the heat dissipation fan 38 is arranged corresponding to the heat dissipation fin 36. The uniform temperature plate device 10 is arranged across the processor 34 and the heat dissipation fin 36. The internal structure of the uniform temperature plate device 10 is the same as that of the previous embodiment, and will not be repeated here. The casing 40 covers the motherboard 32, the processor 34, the heat dissipation fins 36, the heat dissipation fan 38 and the uniform temperature plate device 10. In a high-wattage notebook computer, the processor 34 is arranged in the center of the motherboard 32, and the heat dissipation fins 36 are close to the edge of the motherboard 32. Therefore, the distance between the processor 34 and the heat dissipation fins 36 is relatively long. Notebook computers have requirements for lightness and thinness. With the uniform temperature plate device 10 of the present invention, it can meet the trend of lightness and thinness. Under the premise of improving heat dissipation efficiency, the thickness of the notebook computer 30 can be further thinned.

To sum up, in the above embodiment, the metal velvet capillary layer is filled with metal powder and hydrophilic microstructure, and the metal velvet capillary layer is designed to have large cavities in the upper layer and small cavities in the lower layer to increase the capillary gradient and improve the heat dissipation efficiency. And help to thin the notebook computer.

The above is only a preferred embodiment of the present invention, and is not used to limit the scope of implementation of the present invention. Therefore, all the shapes, structures, characteristics and spirits described in the scope of the patent application of the present invention are equally changed and modified. , Should be included in the scope of patent application of the present invention.

10: Uniform temperature plate device

12: Lower shell

122: Evaporation Zone

124: Condensation zone

126: fringe zone

128: Protruding Wall

14: The first fine layer of metal velvet

142: The First Hole

16: metal powder

18: The second fine layer of metal velvet

182: The Second Hole

20: Upper shell

202: support column

22: Hydrophilic microstructure

Claims (25)

A notebook computer includes: a motherboard; at least one processor arranged on the motherboard; at least one heat dissipation fin arranged on the motherboard and separated from the at least one processor; at least one cooling fan , Arranged on the motherboard and corresponding to at least one heat dissipation fin; and a uniform temperature board device straddling the at least one processor and the at least one heat dissipation fin, the uniform temperature board device includes: a lower shell The plate has an evaporation zone and a condensation zone, the evaporation zone is arranged on the at least one processor, the condensation zone is arranged on the at least one heat dissipation fin; a first fine layer of metal wool is arranged on the lower shell plate , And cover the evaporation zone and the condensation zone, wherein the first fine layer of metal velvet has a plurality of first cavities; a plurality of metal powders are filled in the first cavity directly above the evaporation zone, wherein the evaporation zone The space of each of the first holes directly above is larger than the volume occupied by the corresponding metal powder; a second fine metal velvet layer is arranged on the fine layer of the first metal velvet, wherein the second metal velvet finely The layer has a plurality of second cavities, and the aperture of the second cavity is larger than the aperture of the first cavity; and an upper shell plate, the bottom of which extends downward to form a plurality of supporting columns, and the supporting columns are fixed to the On the second fine layer of metal velvet. The notebook computer according to claim 1, wherein the lower shell further includes an edge Zone, the edge zone surrounds the evaporation zone and the condensation zone, the edge zone extends upward to form a convex wall surrounding the first fine metal velvet layer, the metal powders, and the second fine metal velvet layer And the supporting columns, and the upper shell plate is fixed on the convex wall. The notebook computer according to claim 1, wherein the second cavities are filled with hydrophilic microstructures. The notebook computer according to claim 1, wherein the density of the second cavities is less than the density of the first cavities. The notebook computer according to claim 1, wherein the surface area of the metal powder is 25-75% of the cross-sectional area of the corresponding first cavity. The notebook computer according to claim 1, wherein the materials of the upper shell plate, the lower shell plate, the metal powders, the support columns, the first metal velvet hair layer and the second metal velvet hair layer are all For the same. The notebook computer according to claim 1, wherein the materials of the upper shell plate, the lower shell plate, the metal powders, the support columns, the first metal velvet hair layer and the second metal velvet hair layer are all It is copper, alloyed copper or oxygen-free copper. The notebook computer according to claim 1, wherein the number of the at least one processor, the number of the at least one heat dissipation fin, and the number of the at least one heat dissipation fan are all the same. The notebook computer according to claim 1, wherein the at least one processor is a central processing unit or a graphics processor. The notebook computer according to claim 1, further comprising a casing covering the motherboard, the at least one processor, the at least one heat dissipation fin, the at least one heat dissipation fan, and the uniform temperature plate device. A uniform temperature plate device, comprising: a lower shell plate having an evaporation zone and a condensation zone; a first fine layer of metal wool, arranged on the lower shell plate, and covering the evaporation zone and the condensation zone, wherein the second A fine layer of metal velvet has a plurality of first cavities; a plurality of metal powders are filled in the first cavities directly above the evaporation zone, wherein the space of each of the first cavities directly above the evaporation zone is larger than its Corresponding to the volume occupied by the metal powder; a second fine metal velvet layer is arranged on the fine layer of the first metal velvet, wherein the second fine metal velvet layer has a plurality of second cavities, and the second cavities The hole diameter is larger than the hole diameter of the first cavity; and an upper shell plate, the bottom of which extends downward to form a plurality of supporting pillars, and the supporting pillars are used to fix the second metal wool fine layer. The uniform temperature plate device according to claim 11, wherein the lower shell plate further includes an edge area surrounding the evaporation area and the condensation area, and the edge area extends upward to form a convex wall, the convex wall Surrounding the first fine metal velvet layer, the metal powders, the second fine metal velvet layer and the supporting columns, and the upper shell plate is fixed on the convex wall. The uniform temperature plate device according to claim 11, wherein the second cavities are filled with hydrophilic microstructures. The uniform temperature plate device according to claim 11, wherein the density of the second cavities is less than the density of the first cavities. The uniform temperature plate device according to claim 11, wherein the surface area of the metal powder is 25-75% of the cross-sectional area of the corresponding first cavity. The uniform temperature plate device according to claim 11, wherein the materials of the upper shell plate, the lower shell plate, the metal powders, the support columns, the first metal velvet capillary layer and the second metal velvet capillary layer All are the same. The uniform temperature plate device according to claim 11, wherein the materials of the upper shell plate, the lower shell plate, the metal powders, the support columns, the first metal velvet fine layer and the second metal velvet fine layer All are copper, alloy copper or oxygen-free copper. A method for manufacturing a uniform temperature plate device includes the following steps: providing a lower shell, which has an evaporation zone and a condensation zone, and forming a first fine layer of metal wool on the lower shell, and using the first metal The velvet hair layer covers the evaporation zone and the condensation zone, wherein the first metal velvet hair layer has a plurality of first cavities; a plurality of metal powders are formed in the first cavity directly above the evaporation zone, wherein the evaporation zone The space of each first cavity directly above is larger than the volume occupied by the corresponding metal powder; forming a second fine metal velvet layer on the first fine metal velvet layer, wherein the second fine metal velvet layer There are a plurality of second cavities, and the pore diameter of the second cavities is larger than the pore diameter of the first cavities; the first fine metal velvet layer, the metal powders, and the second fine metal velvet layer are sintered at a high temperature to fix the Some metal powders and the second metal velvet capillary layer are on the first metal velvet capillary layer; and an upper shell plate is provided, the bottom of which extends downward to form a plurality of supporting pillars, and the supporting pillars are fixed to the first Two fine layers of metal velvet. The method for manufacturing a uniform temperature plate device according to claim 18, wherein in the step of forming the metal powders in the first cavity directly above the evaporation zone, spraying The metal powders are in the first cavity directly above the evaporation zone. The method for manufacturing a uniform temperature plate device according to claim 18, wherein in the step of forming the metal powders in the first cavity directly above the evaporation zone, a porous material is used to adhere the metals Powder to transfer the metal powder in the first cavity directly above the evaporation zone. The manufacturing method of the uniform temperature plate device according to claim 18, wherein the first fine metal velvet layer, the metal powders and the second fine metal velvet layer are sintered at a high temperature at 700-800 degrees Celsius. The method for manufacturing a uniform temperature plate device according to claim 18, wherein after the step of fixing the metal powders and the second metal wool fine layer on the first metal wool fine layer, the method further comprises the following steps: The first cavities are filled with a volatile solution to cover the metal powder; a porous material is used to attach a hydrophilic sol-gel that is incompatible with the volatile solution, And coating the hydrophilic sol gel in the second cavities; and sintering the volatile solution and the hydrophilic sol gel at a high temperature to volatilize the volatile solution and coagulate the hydrophilic The glue is transformed into a hydrophilic microstructure, and then the step of providing the upper shell plate is carried out. The method for manufacturing a uniform temperature plate device according to claim 22, wherein the volatile solution and the hydrophilic soluble gel are sintered at a high temperature at 500-600 degrees Celsius. The method for manufacturing a uniform temperature plate device according to claim 22, wherein the volatile solution is alcohol or acetone. The method for manufacturing a uniform temperature plate device according to claim 22, wherein the hydrophilic coagulation The composition of the glue is IPA-based oxide.

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