M384507 四、指定代表圖： (一) 本案指定代表圖為··第（五）圖。 (二) 本代表圖之元件符號簡單說明： 11——基座 13 —注入孔 14 --毛細結構 14 1--槽孔 111--支稽結構 五、新型說明： 【新型所屬之技術領域】 本創作係有關一種均溫散熱器，尤指一種提供容置空 間内之流體之流速更為順暢而提升散熱效果之均溫散= 器。 【先前技術】 按，現今由於時代進度神速科技發展快速，所以 電子設備而1：採用了多種電子零件，而該電子零件於操; 中即產生熱源。 、 再著，現今電子設備更追求操作快速及附有多功能 需求下’⑽或其他零件的發熱量越來越A，故如何解決 M384507 散熱問題時為顯其重要。 然’如第一圖所示，係為一種習之的均溫板la，該 •均溫板la係由一本體11a及一蓋體12a相互結合並形成 為一中空體，而本體11a及蓋體12a相互對應之一側分別 k有毛細組織（wick structure) 13a ，且於本體11a及 蓋體12a間放置有複數個支撐體14a，以使將工作流體 (working fluid)灌入中空體中後内部進行抽真空（或稱 鲁除氣作業）’而使毛細組織（wick structure) 1把能與 支標體14&相抵接觸，並讓工作流體（working fluid)得 以於均溫板la之中空體流動，以達到將熱源均勻散熱之 效果。 就般之毛細紐^織13a，如第三圖所示，該毛細組織 13a複數個槽孔13la，使該支撐結構14&得以凸出該槽 孔，如第二圖所示，然該槽孔131a之孔徑大多略大於支 撐結構14a，以使當毛細組織13a結合於支撐結構Ua 時，該槽孔131a之緣面處ΐ311β並無法抵觸於支撐結構 -14a，亦或是當整體結合後進行結合時其毛細組織之i3a 槽孔131a有可能無法準確的對準於支撐結構14&，而使 毛細組織相對於支撐結構14a有偏移現象，而造成工作流 體於均溫板la之中空體流動’無法有較好的流動引導以 致影響其散熱之效果。 3 【新型内容】 槽孔目的係提供—種設置具有複數個 3 η支稽結構得以藉由槽孔形成-定位空 ★構與切結構間形成較佳之結合，而提 將支;結速更為順暢而提升散熱效果外更能 爲達上述之目的，本創作之「具有金屬網散熱結構之 均溫散熱器」其均溫散熱器麵—基座以及—蓋板所形成 -真空密閉空間之容置腔室，該容置空間内填充有散熱液 體，且於容置空間内設置有複數個支撐結構，其重點在 於：基座於相對容置空間一側設置具有複數個槽孔之毛細 結構之金屬網，該毛細結構係以燒結方式固定於基座上， 該每一個槽孔係對應於容置空間内設置之支撐結構，使該 支撐結構得以藉由槽孔形成一定位空間。 該毛細結構係批覆於基座内壁面，然其可進一步設有 第二毛細結構並使其批覆於蓋板内壁面，而第二毛細結構 同樣設置具有複數個槽孔，該槽孔係對應於容置空間内設 置之支撐結構，而提供整體均溫散熱器之散熱效果。 M384507 【圖式簡單說明】 第一圖係為本創作中習知均溫板之立體分解圖》 第二圖係為本創作中習知均溫板之結構示意圖。 第三圖係為本創作中習知毛細結構之立體圖。 第四圖係為本創作中均溫散熱器之立體分解圖。 第五圖係為本創作中金屬網散熱結構示意圖。 *第六圖係為本創作中金屬網散熱結構與支撐體之結構示 .意圖。 #第七圖係為本創作中均溫散熱器之剖視圖。 第八圖係為本創作中均溫散熱器之立體圖。 【主要元件代表符號說明】 I a--均溫板 11a--本體 12a--蓋體 13a--毛細組織 14--毛細結構 14 1--槽孔 142--定位空間 1 5--毛細結構 152——槽孔 • 1 4a——支撐體 10--均溫散熱器 II —基座 111—一支樓結構 1 2--蓋板 13--注入孔M384507 IV. Designated representative map: (1) The representative representative of the case is the picture of (5). (2) The symbol of the symbol of this representative figure is briefly described: 11——Base 13—Injection hole 14—Capillary structure 14 1--Slot hole 111--Section structure 5. New description: [New technical field] The present invention relates to a uniform temperature radiator, and more particularly to a uniform temperature distribution device that provides a smoother flow rate of a fluid in a housing space and enhances the heat dissipation effect. [Prior Art] According to the current progress of the rapid development of science and technology, electronic equipment 1: a variety of electronic components, and the electronic components in the operation; Moreover, today's electronic devices are more demanding for quick operation and with multi-functional requirements. (10) or other parts have more and more heat, so how to solve the M384507 heat dissipation problem is very important. However, as shown in the first figure, it is a conventional temperature equalizing plate la, which is combined with a body 11a and a cover 12a and formed into a hollow body, and the body 11a and the cover The body 12a has a wick structure 13a on one side of each other, and a plurality of support bodies 14a are placed between the body 11a and the cover body 12a to allow a working fluid to be poured into the hollow body. The inside is vacuumed (or called degassing operation), and the wick structure is placed in contact with the support body 14& and the working fluid is allowed to be in the hollow body of the temperature equalization plate. Flow to achieve the effect of evenly dissipating heat from the heat source. As shown in the third figure, the capillary structure 13a has a plurality of slots 13la, so that the support structure 14& can protrude from the slot, as shown in the second figure, the slot The aperture of 131a is mostly slightly larger than the supporting structure 14a, so that when the capillary structure 13a is bonded to the supporting structure Ua, the edge 311β of the slot 131a does not interfere with the supporting structure-14a, or is combined when integrally bonded. When the i3a slot 131a of the capillary structure may not be accurately aligned with the support structure 14&, the capillary structure is offset with respect to the support structure 14a, and the working fluid flows in the hollow body of the temperature equalization plate la' There is no good flow guidance that affects the effect of heat dissipation. 3 [New content] The purpose of the slot is to provide a combination of a plurality of 3 η structures to form a better combination of the slot formation and positioning structure and the cutting structure, and to raise the branch; In order to achieve the above purpose, the "heat-balanced radiator with metal mesh heat dissipation structure" of the present invention is formed by the uniform temperature radiator surface - the base and the cover - the vacuum sealed space The accommodating space is filled with a heat dissipating liquid, and a plurality of supporting structures are disposed in the accommodating space, and the main point is that the pedestal is provided with a capillary structure having a plurality of slots on the side of the accommodating space. The metal mesh is fixed to the susceptor in a sintered manner, and each of the slots corresponds to a supporting structure disposed in the accommodating space, so that the supporting structure can form a positioning space by the slot. The capillary structure is applied to the inner wall surface of the base, but it may further be provided with a second capillary structure and coated on the inner wall surface of the cover plate, and the second capillary structure is also provided with a plurality of slots, the slot corresponding to The supporting structure is arranged in the accommodating space, and the heat dissipation effect of the overall uniform temperature radiator is provided. M384507 [Simple description of the diagram] The first diagram is a three-dimensional exploded view of the conventional uniform temperature plate in the creation. The second diagram is a schematic diagram of the structure of the conventional uniform temperature plate in the creation. The third figure is a perspective view of the conventional capillary structure in the creation. The fourth picture is a three-dimensional exploded view of the uniform temperature radiator in this creation. The fifth picture is a schematic diagram of the heat dissipation structure of the metal mesh in the creation. *The sixth figure is the structure of the heat dissipation structure and support structure of the metal mesh in this creation. The seventh figure is a cross-sectional view of the uniform temperature radiator in the creation. The eighth picture is a perspective view of the uniform temperature radiator in this creation. [Description of main component representative symbols] I a--Wall temperature plate 11a--body 12a--lid body 13a--capillary structure 14--capillary structure 14 1--slot hole 142--positioning space 1 5--capillary structure 152——Slot • 1 4a——Support body 10--Alleviation radiator II—Base 111—One floor structure 1 2--Cover 13--Injection hole