TWI382811B - A method of manufacturing a phase change type heat sink, a flow path structure, an electronic machine, and a phase change type heat sink - Google Patents

Description

Phase change type heat sink, flow path structure, electronic device, and method of manufacturing phase change type heat sink

The present invention relates to a phase change type heat sink that receives heat from a heat source by a phase change of a working fluid, and a flow path structure used therein, and a phase change type heat sink Electronic machines and methods of manufacturing phase change heat sinks.

From the past, as a means for absorbing the heat of the heat source and diffusing it, there is a solid metal heat sink. Such a solid type metal heat sink is, for example, thermally connected to a CPU (Central Processing Unit) of a PC (Personal Computer), and spreads heat from the CPU. At this metal heat sink, for example, a heat sink is mounted, and in general, heat is transferred from the metal heat sink to the heat sink and dissipated.

However, in a solid metal heat sink, since the efficiency of thermal diffusion depends on the heat conduction of the metal, there is a problem that the heat diffusion response is slow. Further, since there is a variation in temperature in the heat diffusion surface of the metal heat sink, it is difficult to significantly lower the temperature of the heat source.

In order to solve such a problem, a phase change type heat sink has been proposed from the past (for example, refer to Patent Document 1). The heat sink described in Patent Document 1 is configured by laminating a heat receiving plate (3), a heat releasing plate (4), and a narrow groove plate (5) and a coarse groove plate (6). Heated plate (3) The heat from the heating element (2) is received, and the refrigerant in the sealed container (1) boils. This vapor mainly passes through the respective grooves (6a) of the coarse groove plate (6) and diffuses inside the entire closed container (1), and is condensed at the inner wall surface of the closed container (1). The liquefied refrigerant is supplied to the heat receiving portion through the groove (5a) of the rill plate (5) disposed at the heat receiving plate (3). By the phase change of such a refrigerant, the heat system is diffused into the entire heat dissipation plate.

[Patent Document 1] Japanese Laid-Open Patent Publication No. 11-31768 (paragraph [0015], Figs. 1 to 4)

In the heat sink of Patent Document 1, the groove (6a) through which the refrigerant of the vapor passes and the groove (5a) through which the liquid refrigerant passes are separated from each other. That is, it is intended that the vapor and the liquid pass through the grooves (6a) and (5a), respectively, to constitute a heat sink. However, when the heat load due to the heat source is large, steam may also flow into the liquid groove (5a). Since the steam has a property of expanding the volume once, if the vapor flows into the liquid groove (5a), the vapor system continues to expand at the groove (5a). As a result, the supply amount of the working fluid is reduced, and it is a result of dry out.

In view of the above-described general circumstances, an object of the present invention is to provide a phase change type heat sink, a flow path structure, and a phase change type heat dissipation which can increase thermal efficiency due to phase change and can reduce thermal impedance. The electronic device of the device, the flow path structure used therein, and the like.

Another object of the present invention is to provide a method of manufacturing a phase change type heat sink which is easy to manufacture and has high reliability.

In order to achieve the above object, a phase change type heat sink according to the present invention is a phase change type heat sink that diffuses heat by a phase change of a working fluid, and is characterized in that: a container (closed container) is provided a heat receiving side and a heat releasing side disposed opposite to the heat receiving side; and a plurality of flow paths provided with a wall surface through which the working fluid of the liquid phase is circulated by capillary force, and is heated from the foregoing The side is placed in the container so as to be stacked in the direction of the heat radiation side, and the gas phase flow path is provided with an opening penetrating the wall surface so as to be in communication with the plurality of flow paths, and The working fluid in the gas phase is circulated so that the operating fluid in the gas phase evaporated by the heat received on the heat receiving side flows through the opening and faces the heat releasing side.

In the present invention, the heat source is thermally connected to the heated side. The action flow system evaporates by the heat received on the heated side. The gas-phase working fluid flows through the openings that extend through the plurality of flow paths, and flows from the heat receiving side toward the heat releasing side. When the working fluid in the gas phase reaches the side close to the heat releasing side, it condenses, and the working fluid in the liquid phase flows through a plurality of flow paths by capillary force.

In the present invention, the flow paths of the liquid phase and the gas phase operating fluid are not structurally separated as in the above-described Patent Document 1. this invention It is based on the premise that the working fluids in the gas phase and the liquid phase are mixed, and is based on the basic idea of controlling the flow directions.

The liquid phase operating fluid flows through a plurality of flow paths in a plane between the heat receiving side and the heat releasing side. On the other hand, the gas phase operating fluid is mainly flow path impedance through a plurality of flow paths. Circulate with smaller openings. That is, most of the working fluid in the vapor phase after evaporation moves substantially in the vertical direction through the opening, and the flow amount of the working fluid in the gas phase in a plurality of flow paths is small. Therefore, it is possible to prevent the flow of the working fluid in the liquid phase flowing through the plurality of flow paths from being hindered. Thereby, the thermal efficiency due to the phase change is improved, and the thermal impedance can be reduced.

In the present invention, the gas phase flow path is provided between the heat radiation side and the plurality of flow paths, and is connected to the plurality of flow paths via the opening to cause the gas phase The condensed area where the action fluid condenses. Thereby, the working fluid in the gas phase that has passed through the opening from the side close to the heat receiving side is condensed by the condensed region, and the heat can be efficiently radiated.

In the present invention, the phase change type heat sink further includes a return flow path for returning the working fluid of the liquid phase condensed in the condensation region to the plurality of flow paths. Typically, the return flow path is disposed at a position where the temperature of the heat source is the highest (heat source center) and is distant from the plane direction in the entire heat receiving side of the container.

In the present invention, the condensation region includes a first flow path layer including a plurality of the flow of the working fluid in the first direction. a first condensing flow path; and a second flow path layer including a second plurality of the working fluid flowing in a second direction different from the first direction and communicating with the first condensing flow path The condensation flow path is a layer different from the first flow path layer in a direction from the heat receiving side toward the heat radiation side. In other words, the first wall that partitions the first condensing flow paths and the second wall that divides the second condensing flow paths are different directions, and the first wall and the second wall are in the same direction. At the overlapping portion of the wall, a column structure is formed. Thereby, it is possible to ensure the strength enough to withstand the compressive stress applied to the phase change type heat sink from the outside.

For example, by performing the diffusion bonding between the first wall and the second wall, it is possible to obtain an intensity sufficient to withstand the tensile stress. The tensile stress is, for example, a stress applied to the phase change type heat sink when the operating fluid evaporates in the phase change type heat sink and the internal pressure is increased.

In the present invention, the plurality of flow paths include a first flow path layer including a plurality of first flow paths that flow the working fluid toward the first direction, and a second flow path layer. a second flow path that causes the working fluid to flow in a second direction that is different from the first direction, and is in a direction from the heat receiving side toward the heat radiation side, and the first flow path layer is Different layers. According to the present invention, the first wall that partitions the first flow paths and the second wall that partitions the second flow paths are different directions, and the first wall and the first wall At the overlapping portion of the wall 2, a column structure is formed. Thereby, the strength sufficient to withstand the compressive stress from the outside can be ensured in the same manner as described above. Moreover, in the present invention, the bonding between the first wall and the second wall is diffusion bonded. The same effect can be obtained with respect to the strength of the tensile stress.

In the present invention, the gas phase flow path is provided with a plurality of openings so that the openings are arranged side by side in a direction in which the plurality of flow paths are stacked. Thereby, the working fluid in the gas phase is easily circulated through the plurality of openings in the stacking direction of the plurality of channels, and the channel impedance of the gas phase channel can be reduced.

In the present invention, the heat receiving side of the container includes an injection port for the working fluid, and an injection path for connecting at least one of the plurality of flow paths to the injection port, and After the operation fluid is injected into the plurality of flow paths via the injection port and the injection path, the phase change heat sink is further pressed to apply pressure to the heat receiving side to block the injection path. The column portion is provided at a position corresponding to the pressing region and is erected in a stacking direction of the plurality of flow paths. Thereby, at the time of manufacture of the phase change type heat sink, after the injection fluid is injected into the plurality of flow paths, when the injection path is pushed and blocked, the position on the column on the heated side is pushed. . Thereby, it is possible to avoid a situation in which a plurality of flow paths or gas phase flows are crushed and blocked by the pressing force.

It is also possible to provide a structure in which a dedicated pressing region is provided on the injection path on the heat receiving side so that a plurality of flow paths or gas phase flow paths are not formed at positions corresponding to the injection paths. However, at a position corresponding to such a dedicated pressing region, since there is no plural flow path or gas phase flow path, the pressing region is a region having a low function of thermal diffusion. . According to the invention, at the periphery of the column, due to the system Since a plurality of flow paths or gas phase flow paths are arranged, in essence, the efficiency of heat diffusion can be improved in the entirety of the phase change type heat sink.

Instead of the heated side, the above-described injection port and injection path may be provided on the heat release side.

In the present invention, in the plurality of flow paths, the height of the plurality of flow paths in the stacking direction is 10 to 50 μm. Thereby, the capillary force which is most suitable for the working fluid in the liquid phase can be generated. If the height is lower than 10 μm, the flow rate of the working fluid in the liquid phase is lowered, and the thermal efficiency is lowered. If the height is higher than 50 μm, the desired capillary force does not act at the working fluid, and the thermal efficiency is lowered. In particular, in the present invention, typically, multiple systems are used in the case where the flow system is pure water or ethanol.

In the present invention, the phase change type heat sink further includes: a first constituent member constituting the plurality of flow paths; and a second constituent member constituting the gas phase flow passage, the container and the first constituent member And at least one of the second constituent members is made of copper.

A phase change type heat sink according to another aspect of the present invention is a phase change type heat sink that diffuses heat by a phase change of a working fluid, and is characterized in that: a heat receiving plate; and a heat releasing plate are provided a plurality of first plates are stacked in a direction from the heat receiving plate toward the heat radiating plate, and each of the first plates is provided with a liquid phase. a first groove through which the operating fluid flows by capillary force and an opening through which the first groove is connected to each other, and which evaporate by heat received at the heat receiving plate The operating fluid in the gas phase flows through the opening; and the second plate material includes a second groove through which the working fluid in the gas phase through which the opening flows is distributed, and is disposed on the heat radiating plate Between the first plurality of sheets of the foregoing plurality.

In the present invention, the heat source is thermally connected to the heat receiving plate. The action flow system evaporates by the heat received by the heated plate. The gas-phase working fluid flows through the opening of the first plate material so as to open the first groove. When the working fluid in the gas phase reaches the side close to the heat radiating plate, it condenses, and the working fluid in the liquid phase flows through the first groove by capillary force.

Further, in the design of the phase change type heat sink, by appropriately setting the number of the first plate members, it is possible to design an optimum phase change type heat sink in accordance with the heat generated by the heat source.

A plurality of second plates can also be provided. In this case, the number of the second plate members may be set in the same manner as the setting of the number of the first plate members.

The flow path structure of the present invention is used in a heat-receiving plate and a heat-radiating plate provided to face the heat-receiving plate, and a gas phase having a vaporization state by heat received at the heat-receiving plate a plate material in which a working fluid is a groove for circulation, and a phase change type heat sink that diffuses heat received at the heat receiving plate by a phase change of the working fluid is laminated between the heat receiving plate and the plate The flow path structure is characterized in that: a plurality of ribs are provided, which are provided to extend in a plane between the heat receiving plate and the heat radiating plate; and a wall surface, The present invention is provided with an opening through which the working fluid of the gas phase flows so that the working fluid in the gas phase is directed toward the heat radiation plate, and penetrates the flow path structure, and is provided between the plurality of ribs. The aforementioned working fluid in the liquid phase flows through the capillary force.

The electronic device of the present invention is provided with a heat source and a phase change type heat sink that diffuses heat of the heat source. This phase change type heat sink uses a heat sink of various phase changes as described above.

In the method for producing a phase change type heat sink according to the present invention, the heat receiving plate and the heat receiving plate are stacked so as to hold a plurality of sheets having a groove through which a working fluid flows, between the heat receiving plate and the heat radiating plate. a plurality of sheets and the heat radiating plate are formed by diffusion-joining the heat-receiving plate, the plurality of plate materials, and the heat radiating plate, which are stacked, thereby forming a flow path corresponding to the working fluid of the groove, and Forming an injection path of the working fluid formed in the heat transfer plate or the heat radiation plate and connected to the flow path, and injecting the working fluid into the groove, and returning after the injection of the working fluid Before the heat receiving plate is connected to the heat source by welding, the inside of the flow path is sealed by clogging the injection path.

In the present invention, since the heat receiving plate, the plurality of plates, and the heat releasing plate are diffusion bonded, even after the injection of the working fluid, even if the heat source is connected to the heat receiving plate by reflowing, it does not occur. problem. That is, at the time of reflow, when the operating fluid in the flow path evaporates to increase the pressure in the flow path, it is possible to ensure the strength sufficient to withstand the tensile stress applied to the phase change type heat sink.

When the above strength is low, it is necessary to inject the working fluid into the flow path after the reflow process. In other words, in the reflow process, the temperature of the heat receiving plate or the plurality of plates is increased by welding or the like. Therefore, in this case, if there is a working fluid in the flow path, the working fluid The evaporation, the internal pressure is increased, and the phase change type heat sink is destroyed.

The rework engineering and the manufacturing of phase change radiators are also carried out in different locations (for example, at other plants). Therefore, when the operating fluid is injected after the reflow, for example, the phase change type radiator is necessary to make a round trip between the factories, and there is a cost due to the cost, the labor and time of the operator. Or the problem of particles generated in the round trip between factories. According to the present invention, it is possible to perform reflow after the completion of the phase change type heat sink. Therefore, in the present invention, such a problem can be solved, and the reliability of the product can be improved.

As described above, according to the phase change type heat sink of the present invention, the thermal efficiency due to the phase change is improved, and the thermal impedance can be reduced.

According to the method for producing a phase change type heat sink of the present invention, the manufacturing system is easy, and the reliability can be improved.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Fig. 1 is a plan view showing a phase change type heat sink of one embodiment of the present invention. 2 is a side view showing the phase change type heat sink 100 in a state where a heat source is connected to the phase change type heat sink 100. FIG. 3 is an exploded perspective view of the phase change type heat sink 100.

As shown in FIG. 2, the phase change type heat sink 100 is generally provided with a heat receiving plate 500, a heat releasing plate 200 disposed opposite to the heat receiving plate 500, and laminated between the heat receiving plate 500 and the heat releasing plate 200. And a plurality of flow path sheets 600 constituting a flow path of a refrigerant (working fluid).

At the surface 501 of the heat receiving plate 500, a heat source 50 is thermally connected. The heat source 50 is, for example, an electronic component such as an IC (Integrated Circuit) or a resistor, or another device that generates heat.

As shown in FIG. 3, the plurality of flow path sheets 600 include, for example, a plurality of capillary sheets constituting a flow path through which a liquid phase refrigerant (hereinafter referred to as a liquid refrigerant) is circulated by capillary force ( The first plate member, the flow path structure, and the first constituent member 400). Further, the plurality of flow path sheets 600 include a plurality of vapor phase sheets constituting a part of a gas phase flow path through which a refrigerant (hereinafter referred to as a vapor refrigerant) which is mainly vaporized in the vapor phase can be circulated. 2 plate material, second component member) 300.

The number of the capillary sheets 400 is, for example, 10 to 30 pieces, and typically 20 pieces. However, the number of the capillary sheets 400 may be appropriately changed depending on the amount of heat generated from the heat source 50 thermally connected to the heat receiving plate 500, and is not limited to 10 to 30 pieces. The number of the vapor phase sheets 300 is, for example, 1 to 20, and typically 8 pieces. turn off The gas phase sheet 300 is also the same as the capillary sheet 400, and the number thereof may be appropriately changed, and is not limited to 1 to 20.

Figure 4 is a cross-sectional view showing a portion of the A-A line cross section shown in Figure 1. In this case, in order to make the description easy to understand, for example, four examples of the capillary plate 400 and the vapor phase plate 300 are provided (401 to 404, 301 to 304).

In FIG. 4, a heat receiving plate 500, a plurality of capillary sheets 400 (hereinafter referred to as capillary sheet group 410), and a plurality of vapor phase sheets 300 (hereinafter referred to as a vapor phase sheet group) are laminated in this order. 310), heat release plate 200. In the capillary sheet group 410, the capillary plate 404 located at the lowermost portion is joined to the heat receiving plate 500, and the capillary plate 401 at the uppermost portion is joined to the lowermost vapor phase plate 304. The uppermost vapor phase sheet 301 is joined to the heat release plate 200.

In the known description, the capillary plates 401 to 404 have the same configuration, and any one of the capillary sheets 400 is described. In this case, it is referred to as "capillary sheet 400". . Similarly, when the vapor phase sheet 300 of any one of the vapor phase sheets 301 to 304 is described, it is referred to as "vapor phase sheet 300".

FIG. 5 is a perspective view showing a portion of the inner side of the heat receiving plate 500. At the inner side 509 of the heated plate 500, a plurality of grooves 505 are formed. The depth of the groove 505 is 10 to 50 μm, and is typically about 20 μm, but is not limited to this range. The depth of the groove 505 is set to a value that can apply a suitable capillary force to the liquid refrigerant.

A plurality of ribs 506 are formed between the grooves 505 by the plurality of grooves 505 being formed. The case where the rib 506 is formed is the same for the capillary sheet 400, the vapor phase sheet 300, and the heat release plate 200 which will be described later.

At the heat receiving plate 500, an injection path and an injection port of a refrigerant (not shown) are formed. The injection path and the injection port may also be formed at the heat release plate 200.

Fig. 6 is a perspective view showing a part of a capillary sheet 400 in which, for example, two sheets are laminated. Fig. 7 is a plan view showing a portion of a capillary sheet group 410, and Fig. 8 is a cross-sectional view taken along line B-B of Fig. 7. Figure 9 is a plan view showing the entirety of the capillary sheet 400.

At the surface of the capillary sheet 400, a plurality of grooves (first grooves) 405 are formed. The depth of the groove 405 is 10 to 50 μm, and is typically about 20 μm, but is not limited to this range. The depth of the groove 405 is set to a value that can apply a suitable capillary force to the liquid refrigerant.

In addition, in the capillary sheet 400 shown in FIG. 9, in order to make the figure easy to understand, the size of the groove 405 etc. is shown large with respect to the magnitude|size of the whole capillary plate 400. The same applies to FIGS. 11 and 12 which will be described later.

The capillary plate 401 to the capillary plate 404 are laminated such that the grooves 405 of the respective layers extend in the direction orthogonal to each other, and are rotated 90 degrees at a time on the X-Y plane. On the wall surface 430 (refer to FIGS. 7 and 8) constituting the groove 405 of the capillary sheet 400, the capillary plate is penetrated. The plurality of openings 408 of the material 400 are disposed along the length of the trench 405 (e.g., in the X direction of Figure 7). The wall surface 430 constituting the groove 405 is formed via the side surface 431 of the rib and the floor 432, wherein the plurality of openings 408 are formed at the floor 432.

For example, attention is paid to the capillary sheet 401 and the capillary sheet 402 adjacent thereto. The groove 405 of the capillary plate 401 and the groove 405 of the capillary plate 402 are connected to each other via the opening 408 of the capillary plate 401, and the capillary plates 401 and 402 are disposed and joined oppositely.

That is, the capillary sheet 401 is attached in such a manner that the rib 406 of the capillary sheet 402 is not blocked by the opening 408 of the capillary sheet 401, and the back surface of the capillary sheet 401 is joined to the rib 406 of the capillary sheet 402. And 402 are configured and joined. The positions of the other capillary plates 402 and 403 and the capillary plates 403 and 404 are also the same.

The openings 408 function as part of a gas phase flow path through which the vapor refrigerant evaporating by the heat received by the heat receiving plate 500 circulates.

The openings 408 of the respective layers are arranged side by side in the direction in which the flow path sheets 600 are stacked (Z direction), that is, such that the opening surfaces face each other. As a result, the flow path resistance when the vapor refrigerant flows through the openings 408 arranged in the Z direction is reduced, and the thermal efficiency is improved. However, it is not necessary to configure the openings 408 in a side-by-side manner in the Z direction, but also to open a certain layer. The opening 408 of the layer 408 and its adjacent layer is configured to be slightly offset in the Y direction or in the X direction.

The capillary sheet 401 and the capillary sheet 402 adjacent thereto are again noticed. As shown in Fig. 8, generally, the wall surface 430 of the groove 405 constituting the capillary sheet 402 and the ceiling surface 433 which is the back surface side of the capillary sheet 401 opposite to the floor surface 432 of the wall surface 430, the area surrounded by the both, It mainly acts as a flow path due to the capillary force of the liquid refrigerant. However, since the opening 408 is provided in the floor 432 and the ceiling surface 433, the area penetrated through the opening 408 in the Z direction acts as a flow path of the vapor refrigerant.

More specifically, the capillary force is the strongest effect on the liquid refrigerant at the boundary between the wall surface 430 and the side surface 431 and the floor 432, and the boundary between the wall surface 430 and the side surface 431 and the ceiling surface 433. As a result, the liquid refrigerant is generally distributed in the region 440 after avoiding the opening 408 as shown in FIG. Further, in the concept of "wall surface", not only the side surface 431 and the floor surface 432 but also the ceiling surface 433 may be included.

For example, when each of the grooves 405 of the capillary sheet 401 functions as the first flow path layer, each of the grooves 405 of the capillary sheet 402 adjacent thereto functions as a second flow path layer.

As shown in Fig. 7, generally, the width b of the groove 405 is 100 to 200 μm, the width c of the rib 406 is 50 to 100 μm, and the diameter d of the opening 408 is 50 to 100 m. However, it is not limited to these ranges, and may be appropriately changed depending on the heat of the heat source 50 or the like.

The shape of the opening 408 is typically circular, but may be various shapes such as an ellipse, a long hole, or a polygon.

Figure 10 is a perspective view showing a portion of a vapor phase sheet 300, for example, in which two sheets are laminated. In Fig. 10, attention is mainly made to the vapor phase sheets 301 and 302.

The vapor phase sheet 300 is typically constructed of two types of sheets. Figure 11 is a plan view showing the entirety of the vapor phase sheet 301. Figure 12 is a plan view showing the entirety of the vapor phase plate 302. The common configuration of the vapor phase plates 301 and 302 is to provide a plurality of grooves (second grooves) 305 that penetrate the Z direction. The depth of the groove 305 is 50 to 150 μm, and is typically about 100 μm, but is not limited to this range. The depth of the groove 305 is set to a value that allows the vapor refrigerant to flow and appropriately condense.

A plurality of ribs 306 are formed by providing one gas phase plate 300 with a plurality of grooves 305. As shown in FIG. 10, in a manner in which the direction in which the groove 305 of the vapor phase plate 301 extends is orthogonal to the direction in which the groove 305 of the vapor phase plate 302 adjacent to the vapor phase plate 301 extends, The vapor phase plates 301 and 302 are arranged in a rotational direction shifted by 90 degrees in the XY plane. The vapor phase plates 303 and 304 also have the same configuration, and the vapor phase plates 301 to 304 are arranged in a 90 degree order.

The groove 305 of the vapor phase plates 301 to 304 is mainly a region through which a vapor refrigerant flows, and these grooves 305 function as a condensation region which is a part of the gas phase flow path.

As shown in Fig. 12, in general, the vapor phase plate 302 is provided around the region in which the groove 305 is formed, and is provided with a liquid refrigerant which is formed to cause condensation and liquid to return to the groove 405 of the capillary plate 400. The area of the return hole 308 (return flow path). The vapor phase plate 301 is not provided with a return hole 305, and a groove 305 of the vapor phase plate 301 is present at an adjacent position in the Z direction corresponding to the return hole 308 of the vapor phase plate 302.

Although the diameter of the return hole 308 is set to about 50 to 150 μm, it is not limited to this range, and can be appropriately changed. The diameter of the return hole 308 is set to a value at which a capillary force can be applied to the liquid refrigerant when the vapor refrigerant is condensed and becomes a liquid refrigerant.

In this manner, the vapor phase sheet 301 having the return hole 308 and the vapor phase sheet 302 having the return hole 308 are provided as a pair. In the present embodiment, typically, the pair is made The stack of complex pairs. That is, in FIG. 4, the vapor phase sheets 301 and 303 are sheets which do not have the return holes 308, and the vapor phase sheets 302 and 304 are sheets provided with the return holes 308.

The width of the region in which the return hole 308 is formed is set to about 5 to 10 mm, but is not limited to this range, and can be appropriately changed.

Alternatively, only the gas phase sheet 301 having no plurality of return holes 308 may be laminated to form the vapor phase sheet group 310, or only a plurality of vapor phase sheets 302 having the return holes 308 may be provided. The layers are laminated to form a vapor phase sheet group 310. Alternatively, it may be configured such that the vapor phase plate 300 disposed on the side close to the heat release plate 200 does not have the return hole 308. The plurality of vapor phase plates 301; and the vapor phase plate 300 disposed on the side close to the capillary plate 400 are a plurality of vapor phase plates 302 having return holes 308. Alternatively, the plurality of vapor phase sheets 301 and the plurality of vapor phase sheets 302 may be randomly stacked in sequence.

For example, when each groove 305 of the vapor phase plate 302 functions as the first flow path layer, each groove 305 of the vapor phase plate 302 adjacent thereto functions as a second flow path layer.

As shown in FIG. 4, the heat radiating plate 200 is provided with a plurality of grooves 205 on the inner side similarly to the heat receiving plate 500. The plurality of grooves 205 are provided with the same function as the groove 305 of the vapor phase plate 300, and may be formed by the same size.

The column structure is formed in the Z direction by the respective ribs 506, 406, 306, and 206 of the heated plate 500, the capillary plate group 410, the vapor phase plate group 310, and the heat release plate 200 (enclosed by the broken line 630) In part, the heated plate 500, the capillary plate group 410, the vapor phase plate group 310, and the heat release plate 200 are laminated. In this manner, by forming the plurality of pillar structures 630, it is possible to ensure the strength enough to withstand the compressive stress applied to the phase change heat sink 100 from the outside.

Further, by joining the heat receiving plates 500, the capillary sheet group 410, the vapor phase sheet group 310, and the heat releasing plate 200 by diffusion bonding, it is possible to obtain the inside from the capillary sheet 100 as well as described later. The strength of the tensile stress produced.

The grooves 505, 405, 305, and 205, the opening 408, the injection path of the refrigerant, and the like, which are generally configured as described above, are typically by photolithography. It is formed by MEMS (Micro Electro Mechanical Systems) technology such as etching and etching. However, it can also be formed by other processing methods such as laser processing.

As shown in FIG. 3, FIG. 9, FIG. 11, and FIG. 12, the heat receiving plate 500, the flow path plate 600, and the heat releasing plate 200 are respectively provided with a frame portion 507 in which grooves 505, 405, 305, and 205 are not formed, 407, 307, and 207. The frame portions 507, 407, 307, and 207 of these are joined. That is, the container of the phase change type heat sink 100 is formed by the heat receiving plate 500, the heat releasing plate 200, and the frame portions 507, 407, 307, and 207.

For example, as shown in Fig. 9, the width f of the frame portions 507, 407, 307, and 207 is a few mm, but may be appropriately changed. The width f of the above is set to be appropriate depending on the strength of the container, the proportion of the flow path portion in the XY plane of the phase change type heat sink 100, or the heat of the heat source 50. The value.

The heat receiving plate 500, the heat releasing plate 200, and the flow path plate 600 are typically made of a metal material. Examples of the metal material include copper, stainless steel, and aluminum. However, the metal material is not limited thereto. In addition to metal, it may be a highly thermally conductive material such as carbon. All of the heat receiving plate 500, the heat releasing plate 200, and the flow path plate 600 may be formed of different materials, or two of them may be formed of the same material.

As the refrigerant, for example, pure water, ethanol, methanol, acetone, isopropyl alcohol, or fluorocarbon, ammonia, or the like is used. However, it is not limited to this.

As shown in FIG. 1, the length e of one side of the phase change type heat sink 100 is, for example, 30 to 50 mm, but is not limited to this range.

The heat receiving plate 500, the plurality of flow path plates 600, and the heat releasing plate 200 may be joined by welding materials, that is, by being dissolved, depending on the material, and may be joined by using an adhesive. Alternatively, the bonding may be performed by diffusion bonding as described above. Further, it is sufficient that the plurality of capillary sheets 400 are joined to each other or a plurality of vapor-phase sheets 300 are joined to each other as long as they are joined in the same manner.

The operation of the phase change type heat sink 100 generally configured as described above will be described. Figure 13 is a schematic diagram for explaining the operation.

If the heat source 50 generates heat, the heat receiving plate 500 receives the heat. As a result, in the groove 405 of the capillary sheet group 410, the liquid refrigerant concentrated by the capillary force boils and evaporates. Although a part of the vapor refrigerant flows through the groove 405, most of the vapor refrigerant flows through the opening 408 toward the heat radiating plate 200 side, and flows through the groove 305 of the vapor phase plate 310. . By the vapor refrigerant flowing through the grooves 305, the heat is diffused and the vapor refrigerant is condensed. Thereby, heat is mainly released from the heat release plate 200. The condensed vapor refrigerant is returned to the groove 405 of the capillary sheet group 410 via the return hole 308 by capillary force. By repeating such an operation, the heat of the heat source 50 is diffused by the phase change type heat sink 100.

The area of each action shown by the arrow in Fig. 13 is to show a certain degree of basis or benchmark, due to the heat of the heat source 50. The motion zones of these are somewhat offset. Therefore, it is not intended to clearly divide the zones of each action.

Further, in the surface of the heat radiation plate 200 of the phase change heat sink 100, a member for heat release such as a heat sink (not shown) may be thermally connected. In this case, the heat that is diffused by the phase change type heat sink 100 is transmitted to the heat sink and is radiated from the heat sink.

As described above, the phase change type heat sink 100 of the present embodiment is premised on the fact that the working fluids in the gas phase and the liquid phase are mixed, and the basic idea of controlling the flow directions is examined. Device.

That is, the liquid refrigerant flows through a plurality of grooves 405 provided in the XY plane. On the other hand, most of the vapor refrigerant passes through the opening 408 having a small flow path impedance in the Z direction. Circulation. Since the liquid refrigerant circulating in the groove 405 is mainly concentrated at the center of the side surface 431 of the wall surface 430, it is possible to prevent the vapor refrigerant from impeding the flow of the liquid refrigerant. Thereby, the thermal efficiency due to the phase change is improved, and the thermal impedance can be reduced.

Fig. 14 is a graph showing the results of simulating the cooling performance of the phase change type heat sink 100 of the present embodiment.

The horizontal axis represents the heat input to the heat source 50 at the phase change type heat sink 100, and the vertical axis represents the thermal impedance. In this simulation, as the size of the phase change type heat sink 100, in Fig. 7, it is set to b = 160 μm, c = 80 μm, d = 80 μm, and in Fig. 8, it is set to a = 20 μm, and the phase change is made. The thickness of the heat sink 100 in the Z direction is set to 2.6 mm. In Fig. 1, it is set to e = 40 mm (square). As the material of the heat receiving plate 500, the heat releasing plate 200, and the flow path plate 600, copper is used. As the refrigerant, pure water is used.

The device to be compared is a radiator having a thickness of 2.6 mm and a square of 40 mm on one side, and is a solid type of copper.

As can be seen from the graph, in the phase change type heat sink 100, for example, when the input heat is 70 W, the thermal resistance is reduced by 20% compared to the solid type copper, and it can be seen that Significant improvement.

Fig. 15 (A) and (B) are graphs and graphs showing the results of simulation of the thermal diffusion effect of the solid type heat sink used in the experiment of Fig. 14. (A) and (B) of FIG. 16 are graphs and graphs showing simulation results of the heat diffusion effect of the phase change type heat sink 100 used in the experiment of FIG. The size of the heat source 50 is a square IC having a side of about 20 mm, and the input heat is set to 100 W. In Figs. 15(A) and 16(A), the center point of the intersection is the center of the phase change type heat sink 100 and is the center of the heat source 50.

As can be seen from such graphs, the temperature gradient of thermal diffusion caused by the phase change heat sink 100 is gentle and the center temperature is low compared to the solid type heat sink. The thermal diffusion is high.

Figure 17 is a graph showing the relationship between capillary force and flow path impedance caused by the groove 405 of the capillary sheet 400. In this example, the material of the capillary sheet 400 is copper, and the refrigerant is pure water. There is a trade off relationship between capillary force and flow path impedance. Therefore, it is necessary to make a balance adjustment between the two. The horizontal axis of the chart, representing the capillary The height (the depth of the groove 405), and the horizontal axis represents the pressure applied to the refrigerant via the capillary force or the fluid impedance.

It is desirable to reduce the impedance of the flow path as much as possible and to increase the capillary force as much as possible. Therefore, the capillary height at which the pressure difference is the greatest is the optimum value. In this case, it is about 20 μm.

If the height of the capillary is lower than 10 μm, the flow rate of the liquid refrigerant is lowered, and the thermal efficiency is lowered. If the height of the capillary is higher than 50 μm, the desired capillary force does not act at the working fluid, and the thermal efficiency is lowered.

FIG. 24 is a view showing an experimental example in which the inventors of the present invention use the phase change type heat sink 100 of the present embodiment as a general heat pipe type (for example, a flat heat pipe). The phase change type heat sink 100 and the heat pipe are, in principle, common to the portion utilizing the capillary force and the latent heat of the phase change. The difference is that the phase change type heat sink 100 is mainly connected to a heat source at the center, and the heat is diffused in the direction of the main surface of the phase change type heat sink 100. In contrast, the heat pipe The heat source and the heat release side are physically separated, and the heat is transported from the heat source to the heat release side.

Therefore, the inventors believe that the phase change type heat sink 100 should also function as a heat pipe type because the phase change type heat sink 100 is reinforced in the gas phase and the liquid phase, or in the capillary force. To use, therefore, this experiment was carried out.

The phase change type heat sink used in this experiment is a square phase change type heat sink 100 having a square of 40 mm as described above. . Further, on the heat release side, a water jacket 11 is used.

Fig. 24 (A) is an experimental example showing heating at the bottom of the phase change type heat sink 100 where the heat source 50 is mounted. Fig. 24 (B) is an experimental example showing heating at the top of the phase change type heat sink 100 where the heat source 50 is mounted. That is, in Figs. 24(A) and 24(B), the upper and lower systems are reversed, and the influence of the gravity applied to the working fluid is considered. Since the actuating flow system is easily concentrated in the lower portion by its own weight, in general, it is preferable to heat the bottom portion to have a tendency to lower the temperature of the heat source 50 as compared with the top heating.

As shown in the figures, the phase change type heat sink 100 is connected to the water jacket base 12 via a heat transfer grease 13 on the side opposite to the side on which the heat source 50 is disposed. The distance from the end of the heat source 50 to the portion to which the water jacket base 12 is connected is set to 10 mm.

Fig. 25 is a view showing the heat input in the case of the phase change type heat sink 100 and the case where the solid type copper plate is used instead of the phase change type heat sink 100 in the experiment shown in Fig. 24. A graph of the relationship with the temperature of the heat source 50. The copper plate is the same size as the phase change heat sink (the thickness is also the same and is 2.6 mm).

As can be seen from the graph, the distance (10 mm) of the phase change type heat sink 100 from the end of the heat source 50 to the portion to which the cooling jacket base 12 is connected is short, but There is no dryness, and it can function as a heat pipe. In the case of the phase change type heat sink 100, 50 W in both the top heating and the bottom heating The temperature of the heat source 50 at the input heat is lower than that of the copper plate by about 10 °C.

Figure 18 is a schematic cross-sectional view showing a phase change heat sink according to another embodiment of the present invention. Figure 19 is a plan view of the phase change type heat sink 150 shown in Figure 18. In the following description, the components or functions included in the phase change type heat sink 150 in the embodiment shown in FIG. 1 and the like are the same, and the description will be simplified or omitted. The difference is centered and explained.

At the heat receiving plate 500, for example, two injection ports 526 in which two refrigerants are formed, and two injection paths 527 which are connected to each other are formed. Further, after forming a groove (a groove used in the injection path 527) and an opening (an opening used in the injection port 526) in one of the two sheets, the two sheets are joined to form a heat. The plate 500 is used to form the injection path 527 or the injection port 526. The injection path 527 is connected to the groove 405 of the capillary sheet 400. The injection port 526 and the injection path 527 may each be one. In addition, the hatched portion of Fig. 19 shows a portion of the flow path of the refrigerant formed by the flow path sheet 600.

The injection path 527 is formed, for example, in a linear shape, and a specific region on the straight line is a pressing region 540 for applying pressure to the injection path 527 to block the injection path 527. The push area 540, which is the so-called buttonhole area. The inside of the phase change type heat sink 150, that is, the area where the flow path plate 600 is disposed, at a position corresponding to the buttonhole area, passes from the heat receiving plate 500 across the heat releasing plate 200 in the Z direction. A column portion 603 is formed.

The column portion 603 may be formed by laminating cylindrical ribs respectively formed on the heat receiving plate 500, the capillary plate 400, the vapor phase plate 300, and the heat radiating plate 200. The width (or diameter) of the column portion 603 is such that the flow path formed by the flow path plate 600 (hereinafter referred to as the internal flow path) is not blocked by the pressing force at the time of the buttonhole. And suitable for setting.

Fig. 20 is a schematic view showing the injection method of the refrigerant for the phase change type heat sink 150 in order.

For example, as shown in FIG. 20(A), the internal flow path is depressurized via the injection port 526 and the injection path 527, and the refrigerant is passed through the injection port 526 and the injection path 527 by a dispenser (not shown). Inject into the internal flow path.

As shown in Fig. 20(B), generally, the pressing region 540 is pushed, and the injection path 527 is blocked (false seal). Then, the internal flow path is decompressed via the other injection path 527 and the injection port 526, and when the target pressure is reached in the internal flow path, as shown in FIG. 20(B), the pressing is performed as shown in FIG. 20(B). Region 540 is pushed and injection path 527 is blocked (false seal).

Then, as shown in Fig. 20(C), generally, at the side closer to the injection port 526 than the pressing region 540, the injection path 527 is blocked (formally sealed) by, for example, laser welding. Thereby, the inside of the phase change type heat sink 150 is sealed.

In this way, the phase change type heat sink 150 is attached to the push Since the column portion 603 is provided at the position of the pressing region 540, it is possible to prevent the internal flow path from being crushed and blocked by the pressing force at the time of the buttonhole.

It is also conceivable that a phase change type heat sink 150 having a position corresponding to the injection path 527 and not having an internal flow path is formed. That is, a dedicated pressing region 540 may be provided at a position that does not correspond to the internal flow path. However, at the position corresponding to such a dedicated pressing region, since there is no internal flow path, the position corresponding to the dedicated pressing region 540 is a region where the function of thermal diffusion is low. .

According to the phase change type heat sink 150 of the present embodiment, since the internal flow path is disposed around the column portion 603, substantially the entire phase change type heat sink 150 can be Improve the efficiency of heat diffusion.

In addition, the injection path 527 and the injection port 528 may also be formed at the heat release plate 200.

Next, one embodiment of the above-described method of manufacturing the phase change type heat sink 150 (or the phase change type heat sink 150) will be described. Figure 21 is a flow chart showing the manufacturing method.

A plurality of sheets are prepared, and at the sheets, grooves 505, 405, 305, 205, openings 408, and the like are formed (step 101). Thereby, the heat receiving plate 500, the plurality of flow path sheets 600, and the heat releasing plate 200 are formed.

The plurality of heat-receiving plates 500, the plurality of flow-path plates 600, and the heat-dissipating plate 200 are laminated and diffusion-bonded in a manner of holding a plurality of flow path sheets 600 between the heat receiving plate 500 and the heat releasing plate 200. 102). In the case of stratification, the precise alignment of the plates is performed. Diffusion bonding, Since it is a metal bond, the strength or rigidity of the phase change type heat sink 150 can be improved.

As shown in Figs. 20(A) to 20(C), the refrigerant is generally injected into the internal flow path and sealed (step 103). Thereby, the phase change type heat sink 150 is completed.

Then, at the heat receiving plate 500, the heat source 50 is installed (step 104). When the heat source 50 is an IC, the process may be carried out, for example, by a reflow process such as welding. In the reflow process, the entire heat receiving plate 500 or the phase change type heat sink 150 has a high temperature of 230 to 240 ° C due to welding or the like. In such an environment, although the internal pressure is increased by the evaporation of the refrigerant, in step 102, since the diffusion bonding is performed, it is possible to ensure sufficient tensile stress due to the internal pressure. Strength or rigidity.

The reflow engineering and the manufacturing process of the phase change radiator 150 are also carried out in different places (for example, in other factories). Therefore, when the operating fluid is injected after the reflow, for example, the phase change type radiator 150 is necessary to make a round trip between the factories, and there is a cost due to the operator, labor of the operator, Time, or the problem of particles generated during the round trip between factories.

According to the manufacturing method shown in FIG. 21, it is possible to perform the reflow after the completion of the phase change type heat sink 150, and the above problem can be solved.

Fig. 22 is a schematic view showing another embodiment of the above-described phase change type heat sink 100 or 150 rib. In this Figure 22, for example, complex The ribs 416 of the capillary plate 400 are provided with a plurality of cylindrical portions 417. The pitch, the number, the size of the cylindrical portion 417, and the like of the plurality of cylindrical portions 417 can be appropriately set. Moreover, it is not limited to a cylindrical shape, but may be an ellipse, an angle, or another shape.

The plurality of cylindrical plates 417 of the capillary sheet 400 are rejoined and joined in the Z direction, and the plurality of capillary sheets 400 are joined to each other. In this case, the joining of the heated plate 500 to the capillary plate 400, the joining of the capillary plate 400 to the vapor phase plate 300, or the joining between the vapor phase plate 300 and the heat releasing plate 200 is also the same.

According to this configuration, the internal flow path is not affected, and the joint area is increased, and the compressive stress from the outside of the phase change type heat sink 150 or the tensile stress from the inside can be obtained. The strength or stiffness is increased.

Fig. 23 is a perspective view showing a desktop PC as an electronic device including the phase change type heat sink 100. The circuit board 22 is placed in the casing 21 of the PC 20, and the CPU 23 is mounted on the circuit board 22, for example. The CPU 23 is thermally connected to the phase change heat sink 100 (or 150), and a heat sink (not shown) is thermally connected to the phase change heat sink 100.

The embodiments of the present invention are not limited to the embodiments described above, and various other embodiments are conceivable.

The planar shape of the phase change type heat sink 150 is set to a quadrangle or a square. However, the planar shape may be a circle, an ellipse, a polygon, or any other shape.

The shapes of the grooves 505, 405, 305, and 205, the wall surface 430, the ribs 506, 406, 306, and 206, and the frame portions 507, 407, 307, and 207 can be appropriately changed.

As an example of the electronic machine of Fig. 23, a series of PCs is mentioned. However, the electronic device is not limited thereto, and examples thereof include a PDA (Personal Digital Assistance), an electronic dictionary, a video camera, a display device, an audio/video device, a projector, a mobile phone, a game console, and an onboard navigation. Machines, robotic machines, laser generating devices, other electrochemical products, etc.

50‧‧‧heat source

100, 150‧‧‧ phase change radiator

150‧‧‧ phase change radiator

200‧‧‧heating plate

205, 305, 405, 505 ‧ ‧ ditch

300, 301, 302, 303, 304‧‧‧ gas phase sheet

206, 306, 406, 416, 506‧ ‧ rib

308‧‧‧Return hole

400, 401, 402, 403, 404‧‧‧ capillary plates

401‧‧‧Capillary sheet

408‧‧‧ openings

430‧‧‧ wall

500‧‧‧heated plate

526‧‧‧Injection

527‧‧‧Injection path

540‧‧‧Pushing area

603‧‧‧ Column Department

Fig. 1 is a plan view showing a phase change type heat sink of one embodiment of the present invention.

2] A side view showing the phase change type heat sink in a state where a heat source is connected to the phase change type heat sink.

[Fig. 3] An exploded perspective view of a phase change type heat sink.

Fig. 4 is a cross-sectional view showing a portion of the A-A line cross section shown in Fig. 1.

[Fig. 5] A perspective view showing a part of the inner side of the heat receiving plate.

Fig. 6 is a perspective view showing a part of a capillary sheet which has been laminated.

[Fig. 7] A plan view showing a part of a capillary sheet group.

Fig. 8 is a sectional view taken along line B-B of Fig. 7.

Fig. 9 is a plan view showing the entirety of a capillary sheet.

[Fig. 10] A perspective view showing a part of a vapor phase plate which has been laminated.

Fig. 11 is a plan view showing the entirety of a vapor phase plate.

Fig. 12 is a plan view showing the entirety of a vapor phase plate paired with the vapor phase plate shown in Fig. 11.

Fig. 13 is a schematic view for explaining the operation of the phase change type heat sink.

Fig. 14 is a graph showing the results of simulating the cooling performance of the phase change type heat sink of the present embodiment.

Fig. 15 is a graph showing a simulation result of thermal diffusion of a solid-type heat sink used in the experiment of Fig. 14 and a graph.

[Fig. 16] A graph showing simulation results of thermal diffusion effects of the phase change type heat sink used in the experiment of Fig. 14.

Fig. 17 is a graph showing the relationship between the capillary force and the flow path impedance caused by the groove of the capillary plate.

Fig. 18 is a schematic cross-sectional view showing a phase change heat sink according to another embodiment of the present invention.

[Fig. 19] A plan view of the phase change type heat sink shown in Fig. 18.

Fig. 20 is a schematic view showing a method of injecting a refrigerant for the phase change type heat sink described above.

Fig. 21 is a flow chart showing one embodiment of a method of manufacturing a phase change type heat sink.

Fig. 22 is a schematic view showing another embodiment of the rib of the phase change type heat sink.

Fig. 23 is a perspective view showing a desktop PC as an electronic device including a phase change type heat sink.

[Fig. 24] Fig. 24 is a view showing an experimental example in which the phase change type heat sink of the present embodiment is generally used as a known heat pipe type (for example, a flat heat pipe). (A) is an experimental example showing the heating of the bottom, and (B) is an experimental example showing the heating of the top.

[Fig. 25] shows the input heat and heat source in the case of the phase change type heat sink in the case of the phase change type heat sink and the solid type copper plate in place of the phase change type heat sink. A chart of the relationship between temperatures.

401, 402‧‧‧Capillary sheet

405‧‧‧ditch

406‧‧‧ rib

408‧‧‧ openings

Claims (19)

A phase change type heat sink is a phase change type heat sink that diffuses heat by a phase change of a working fluid, and is characterized in that: a container having a heat receiving side and a heat receiving side And a plurality of flow paths provided with a wall surface through which the working fluid of the liquid phase flows by capillary force, and layered in a direction from the heat receiving side toward the heat releasing side The gas phase flow path is provided in the container, and the gas phase flow path is provided with an opening penetrating the wall surface so as to be in communication with the plurality of flow paths, so as to be received by the heat receiving side The operating fluid in the hot and vaporized gas phase flows through the opening and faces the heat releasing side to circulate the working fluid in the gas phase, and the gas phase flow path is provided on the heat releasing side. Between the plurality of flow paths, the condensed region in which the working fluid in the gas phase is condensed is connected to the plurality of flow paths via the opening. The phase change type heat sink according to claim 1, further comprising: a return flow of the liquid phase fluid that has been condensed in the condensation region to the plurality of flow paths road. For example, the phase change type heat sink described in the first item of the patent scope, The condensed region includes a first flow path layer including a plurality of first condensing flow paths that flow the working fluid toward the first direction, and a second flow path layer that includes the aforementioned The working fluid flows in a second direction different from the first direction, and a plurality of second condensing channels that are in communication with the first condensing flow path are in a direction from the heat receiving side toward the heat releasing side The layer is different from the first flow channel layer. The phase change type heat sink according to the first aspect of the invention, wherein the plurality of flow paths include a first flow path layer including a plurality of the flow of the working fluid in a first direction. a first flow path; and a second flow path layer including a second flow path that causes the working fluid to flow in a second direction that is different from the first direction, and that faces the heat radiation side from the heat receiving side In the direction, it is a layer different from the first flow path layer. The phase change type heat sink according to the first aspect of the invention, wherein the gas phase flow path is provided such that the openings are arranged side by side in a direction in which the plurality of flow paths are stacked. The aforementioned openings of the plural. The phase change type heat sink according to the first aspect of the invention, wherein the heat receiving side of the container includes: an injection port of the working fluid; and a flow path of at least one of the plurality of flow paths An injection path in communication with the injection port, and the injection of the aforementioned working fluid via the aforementioned injection After the injection port and the injection path are injected into the plurality of flow paths, the phase change type heat sink is further provided with a pressing region for clogging the injection path by applying pressure to the heat receiving side. At the position of the pressing region, the column portion is erected in the stacking direction of the plurality of flow paths. The phase change type heat sink according to the first aspect of the invention, wherein the heat release side of the container includes: an injection port of the working fluid; and a flow path for at least one of the plurality of flow paths An injection path that is connected to the injection port, and after the injection of the working fluid into the plurality of flow paths through the injection port and the injection path, is used to block the injection path by applying pressure to the heat release side. In the pressing region, the phase change type heat sink further includes a column portion that is erected in a stacking direction of the plurality of flow paths at a position corresponding to the pressing region. The phase change heat sink according to claim 1, wherein in the plurality of flow paths, the height of the plurality of flow paths in the stacking direction is 10 to 50 μm. The phase change type heat sink according to the first aspect of the invention, further comprising: a first constituent member constituting the plurality of flow paths; and a second constituent member constituting the gas phase flow passage; At least one of the container, the first constituent member, and the second constituent member is copper. A phase change type heat sink is a phase change type heat sink that diffuses heat by a phase change of a working fluid, and is characterized in that: a heat receiving plate; and a heat releasing plate that faces the heat receiving plate And a plurality of first plate members, which are a plurality of first plate materials laminated in a direction from the heat receiving plate toward the heat radiation plate, and each of the working fluids in the liquid phase is provided by a capillary tube a first groove that flows through the force, and a working fluid that penetrates the opening of the first plate material so that the first groove is connected to each other, and vaporizes the gas phase by the heat received by the heat receiving plate And the second plate material is provided with a second groove for circulating the working fluid in the gas phase through which the opening flows, and is provided on the heat radiation plate and the plurality of first plates between. The phase change type heat sink according to claim 10, wherein the second groove penetrates the second plate material in a stacking direction of the plurality of first plate members. The phase change heat sink according to claim 10, wherein the second plate member is provided with a working fluid that is condensed in the second groove and is condensed, and is sent back to the plural The return hole at the flow path. Phase change radiator as described in claim 10 In the second plate material, at least one of the plurality of second plate materials is provided with the liquid phase fluid that is condensed after flowing through the second groove. , return to the return hole at the above-mentioned plural flow path. The phase change heat sink according to claim 10, wherein the depth of the first groove is 10 to 50 μm. The phase change type heat sink according to claim 10, wherein the first plate material is made of copper. The phase change type heat sink according to claim 15, wherein at least one of the heat receiving plate, the heat radiation plate, and the second plate material is made of copper. A flow path structure for use in a heat-receiving plate, a heat-dissipating plate provided to face the heat-receiving plate, and a working fluid having a gas phase which evaporates by heat received at the heat-receiving plate a plate material of a groove that is circulated, and a flow path structure that is laminated between the heat receiving plate and the plate material by a phase change heat sink that diffuses heat received by the heat receiving plate by a phase change of the working fluid The body is characterized in that: a plurality of ribs are provided to extend in a plane between the heat receiving plate and the heat radiating plate; and a wall surface is provided for The working fluid of the gas phase flows toward the heat radiating plate, and flows through the opening of the flow path structure, and is provided between the plurality of ribs, thereby allowing the operating fluid of the liquid phase to be borrowed Circulating by capillary force. An electronic device comprising: a heat source; and a phase change type heat sink, comprising: a container having a working fluid, a heat receiving side that receives heat of the heat source, and a heat receiving side And a plurality of flow paths provided with a wall surface through which the working fluid of the liquid phase flows by capillary force, and layered in a direction from the heat receiving side toward the heat releasing side The gas phase flow path is provided in the container, and the gas phase flow path is provided with an opening penetrating the wall surface so as to be in communication with the plurality of flow paths, so as to be received by the heat receiving side The operating fluid in the hot and vaporized gas phase flows through the opening and faces the heat releasing side to circulate the working fluid in the gas phase, and the gas phase flow path is provided on the heat releasing side. Between the plurality of flow paths, the condensed region in which the working fluid in the gas phase is condensed is connected to the plurality of flow paths via the opening. A method of manufacturing a phase change type heat sink, characterized in that the heat receiving plate and the plurality of layers are stacked such that a plurality of sheets having a groove through which a working fluid flows are held between a heat receiving plate and a heat radiating plate The plate material and the heat radiation plate are formed by the heat transfer plate, the plurality of plate materials, and the heat radiation plate that are laminated, thereby forming a flow path corresponding to the working fluid of the groove. The plate or the injection path of the action fluid connected to the flow path at the heat release plate, and the injection in the groove After the injection of the working fluid, the inside of the flow path is sealed by clogging the injection path before the heat transfer plate is connected to the heat source by reflow.