JPS6267843A - Semiconductor cooling device - Google Patents

Abstract

PURPOSE:To improve the cooling efficiency by a method wherein thin plates, each having a plurality of long holes and a good heat conductivity, are laminated in such a way that the long holes are not continuously superposed at the same position, furthermore thin plates, each having numerous small holes smaller than the long holes, are laminated between the forgoing thin plates in such a way that the positions of the long holes and the small holes are superposed and these thin plates are coupled together. CONSTITUTION:The heat to generate in a semiconductor is radiated to a coolant from a surface 2 and the surfaces of thin plates 3, 4 and 6 bonded to the surface 2. A plurality of plates 3 and 4 are respectively provided with long holes with a width B and a length A and are laminated. Moreover, the directions of the long holes of the thin plates 3 and 4 orthogonally intersect. Furthermore, thin plates 6, each having numerous small holes 7 smaller than the long holes, are laminated between the thin plates 3 and 4 and on the outermost layer. The long holes of the thin plates 3 and 4 and the small holes of the thin plates 6 are mutually interpenetrated; as this laminated body is seen from the E side, the surface 2 of a cooling piece 1 can be seen from the small holes 7 of the thin plates 6 through the long holes 5 of the thin plates 3 and 4.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a semiconductor cooling device, and particularly to a semiconductor cooling device suitable for mass production.

[Background of the invention]

In the conventional semiconductor cooling device, as described in Japanese Patent Application No. 57-178407, a plurality of layers of cavity groups are provided on a heat transfer wall surface (heat radiation surface), and furthermore, a plurality of layers are provided between the cavity groups in each layer and between the cavity groups and the outside. The semiconductor is cooled using a cooling piece communicated through the opening. However, in this structure, since the shape of the hollow molded member of the cooling piece is complicated, inexpensive mass production has been desired.

A conventional example is shown in FIG. 1 indicates a semiconductor or a part of a semiconductor cooling piece (hereinafter referred to as a cooling piece), and heat generated in the semiconductor is transferred to a surface 2 and a partition wall 31 attached to the surface 2.
Heat is radiated through 31'.

These partition walls constitute a cavity group 32, 32', and the partition walls 31, 31' are provided with openings 33, 33', and the openings 33 provide a space between the cavity groups 32, 33', and The cavity group 32' communicates with the outside through the opening 33'.

When cooling a semiconductor, boiling of the refrigerant is promoted by setting the dimensions of the cavity group and the opening to appropriate values (0.1 to 1 m) depending on the amount of heat radiation, and excellent cooling performance can be obtained.

For the cavity 32.32' of the partition wall 31.31', methods such as mechanical cutting, plastic working using a grooved roll, and chemical corrosion processing have been proposed.

However, the minute groove corresponding to the cavity group 32°32' of the partition wall 31.31' does not penetrate through the partition wall 31.31'.
Because the depth is halfway between the thin plates, the manufacturing process is complicated and management is difficult, resulting in an expensive product. Furthermore, there are minute openings 3 in the partition wall.
3.33' processing was added to the above, which caused further increase in costs.

[Purpose of the invention]

An object of the present invention is to provide a semiconductor cooling device with excellent cooling performance.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 1, 3 to 6. Reference numeral 1 indicates a part of the cooling piece, in which heat generated in the semiconductor is radiated to the coolant from the surfaces of the thin plates 3, 4 and 6 joined to the surface 21 and the surface 2.

The thin plates 3 and 4 have elongated holes with a width B and a length A, and a plurality of thin plates are laminated. In FIG. 1, the directions of the elongated holes in the thin plates 3 and 4 are perpendicular to each other. Furthermore, thin plates 6 having a large number of small holes 7 smaller than elongated holes are laminated on these thin plates 3 and 4 and on the outermost layer. Therefore, the part corresponding to the cavity group 32, 32' shown in FIG. 2 corresponds to part A in FIG. This corresponds to the small hole 7 provided in the thin plate 6. The long holes in the thin plates 3 and 4 and the small holes in the thin plate 6 are in communication with each other, and when looking at this laminate from the E side in FIG.
The surface 2 of the cooling piece 1 can be seen through the elongated hole 5.

Although the present invention differs in shape from the conventional example, there are a plurality of cavity groups. The communication between the cavity groups in each layer and between the cavity groups and the outside through the small holes in the thin plate 6 is exactly the same in the present invention, and almost the same cooling performance as the conventional example can be obtained.

Specific examples of the structure are shown in FIGS. 3 to 6.

21 in Figure 3 is a large number of long holes 22 in a thin plate with good thermal conductivity.
FIG. 4 also shows a thin plate 23 provided with elongated holes 24. (Fig. 4 may be obtained by rotating Fig. 3 by 90') 25 in Fig. 5 shows a thin plate with good thermal conductivity in which a large number of small holes 26 are provided. The position of this small hole 26 is determined by the elongated hole 2 when the thin plates 21 and 23 are stacked.
It is assumed that 2 and 24 are in the overlapped position.

FIG. 6 shows a state in which thin plates 25, 21.degree. 23 are laminated on the heat dissipating portion 1 of the cooling piece. For implementation, these 1, 25,
21 and 23 are metallically bonded by a method such as diffusion bonding to improve heat conduction.

Thin plate 25; Since all of the holes 21 and 23 are formed into through-holes as shown in FIGS. 3 to 5, there is no need to cut the thin plate, which takes time, and short-time processing using cutting dies, etc. is possible. . Furthermore, since there is no need to control the machining depth during chemical corrosion machining, etc., it can be manufactured at low cost. Also, if the width B of the long hole shown in Figure 1 becomes narrower than the plate thickness, it becomes difficult to process with a cutting die. If necessary, thin plates can be laminated as needed, making processing even easier.

Although it has been explained that the directions of the long holes provided in the thin plates 21 and 23 are alternately orthogonal, this does not necessarily have to be orthogonal, and it is important to manufacture the necessary cavity layers and openings at a lower cost. be.

According to this embodiment, the cavity layer and the opening can be easily formed, and a semiconductor cooling device that can be mass-produced at low cost can be provided.

〔Effect of the invention〕

According to the present invention, in a boiling cooling device for semiconductor cooling, a cavity layer and an opening for promoting boiling can be manufactured in a short time, so that the device is suitable for mass production and can be provided at a low cost.

[Brief explanation of drawings]

FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a perspective view of a conventional device, and FIGS. 3 to 6 are views showing some of the components of the present invention. 1... Semiconductor or part of cooling piece for semiconductor, 3,4゜6
．． 21, 23.25... Thin plate, 5... Long hole, 7...
・Small hole.

Claims (1)

[Claims] 1. A semiconductor cooling device that cools the semiconductor by bringing a refrigerant into contact with the heat dissipation surface of a semiconductor or a semiconductor cooling piece and utilizing the boiling and condensing action of the refrigerant, which has a plurality of long holes. A plurality of thin plates with good thermal conductivity are laminated so that the elongated holes do not overlap in succession at the same position, and a thin plate having a large number of small holes smaller than the elongated holes between the thin plates is arranged between the elongated holes and the small holes. A semiconductor cooling device characterized in that the above-mentioned semiconductor or the above-mentioned cooling piece for a semiconductor is laminated so that their positions overlap, and these are bonded together to serve as a heat dissipation surface of the semiconductor or the semiconductor cooling piece. 2. A semiconductor cooling device according to claim 1, characterized in that a heat dissipation surface is provided in which the directions of the elongated holes are alternately orthogonal to one or more elongated holes.