JPS6218056A - Semiconductor cooling device - Google Patents

Abstract

PURPOSE:To obtain an inexpensive cooling device superior in a cooling characteristic, by unitedly piling plural thin plates superior in heat conductivity, having plural long rectangular holes, so that the rectangular holes are not overlapped continuously at the same position, to form heat-radiation surfaces of a semiconductor or semiconductor-cooling piece. CONSTITUTION:Heat generated in a semiconductor is radiated through a plane 2 from the surfaces of thin plates 3 and 4. The thin plates 3 and 4, having long rectangular holes of B in width and A in length, are piled in plural numbers so that the respective rectangular holes are arranged perpendicular to each other of the thin plates 3 and 4. In view of the piled unit from the upper part E, the parts overlapped by rectangular holes 5 of the thin plates 3 and those 5 of the plates 4 become square holes straightened through the thin plates 3 and 4, and a surface 2 of the cooling piece 1 can be seen. In case that the width 13 of the rectangular holes is made narrower than the thickness of the plate, a process by cutting dies becomes difficult, however, the plates thinner than the width B of the rectangular holes are used and piled in plural numbers as needed so that their rectangular holes are arranged in the same direction, with their respective neighboring plates piled perpendicular to each other.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a semiconductor cooling device, and particularly to a semiconductor cooling device suitable for mass production.

[Background of the invention]

As described in the equity publication, conventional semiconductor cooling devices have multiple layers of cavity groups on the heat transfer wall surface (heat radiation surface), and also communicate between the cavity groups in each layer and between the cavity groups and the outside. The structure used cooling chips to cool the semiconductor. However, in this structure, the shape of the hollow molded member of the cooling piece is complicated, and improvements have been desired to enable mass production at low cost.

A conventional example is shown in FIG. Heat generated in the semiconductor 1 is radiated through the surface 2. There is a partition wall 31 on this surface 2, and further partition walls 31' are attached above the partition wall 31, and each partition wall constitutes a group of cavities 32.degree. 32'.

Further, the partition wall 31.31' is provided with an opening 33.33', and the opening 33 separates the cavities 32.32' from each other.
The cavity group 32' communicates with the outside through the opening 33'.

When cooling the semiconductor, the dimensions of this cavity group and the opening are set to appropriate values (0.1 to 1 m) according to the amount of heat dissipation.
Promotes boiling of refrigerant and exhibits excellent cooling performance.

Methods such as mechanical cutting, plastic processing using a grooved roll, chemical corrosion processing, laser beam processing, and electron beam processing have been proposed for forming the cavity 32.32' of the partition wall 31.31'.

However, the minute groove corresponding to the cavity group 32°32' of the partition wall 31.31' does not penetrate through the partition wall 31.31'.
Because the depth is halfway between the thin plates, the manufacturing process is complicated and management is difficult, resulting in an expensive product.

[Purpose of the invention]

An object of the present invention is to provide a semiconductor cooling device with excellent cooling performance at a low cost.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 1, 3 to 6. Reference numeral 1 in FIG. 1 indicates a semiconductor or a part of a semiconductor cooling piece, and heat generated in the semiconductor is radiated from the surfaces of thin plates 3 and 4 via a surface 2. The thin plates 3 and 4 have a width B,
There is a long hole of length A, and multiple sheets are laminated. In FIG. 1, the directions of the elongated holes in the thin plates 3 and 4 are perpendicular to each other. When this laminate is viewed from the top E in the figure, the overlapped portion of the long hole 5 of the thin plate 3 and the long hole 5 of the thin plate 4 becomes a square hole through which the thin plates 3 and 4 pass, and when looking at the surface 2 of the cooling piece 1, I can do things. Also, the second conventional example
The part corresponding to the cavity group seen in the figure corresponds to part F (same as part A), and the part corresponding to the opening is the long hole 8 dimension of thin plate 3 and the long hole 0 dimension of thin plate 4 (same as part B). ) will be in the heavier part.

Although the present invention differs in shape from the conventional example, the fact that there are multiple layers of cavity groups and that the cavity groups in each layer and the cavity groups communicate with the outside is completely the same in the present invention, and is appropriate. It has been confirmed that almost the same cooling performance as the conventional example can be obtained by selecting appropriate dimensions.

Specific examples of the structure are shown in FIGS. 3 to 6. 3 shows a thin plate 21 with good thermal conductivity in which a large number of elongated holes 22 are provided, and FIG. 4 similarly shows a thin plate 23 in which elongated holes 24 are provided. (FIG. 4 may be obtained by rotating FIG. 3 by 90') FIG. 5 shows the thin plate 23 of FIG. 4 superimposed on the back side of the thin plate 21 of FIG. 3. The areas where the long holes 22, 24 of the thin plates 21, 23 overlap will be penetrated by square holes.

FIG. 6 shows a state in which thin plates 21 and 23 are laminated on a semiconductor or a part 1 of a semiconductor cooling piece. In actual practice, it is a matter of course that these 1, 21, and 23 are joined metallically by a method such as diffusion bonding to improve heat conduction.

As shown in FIGS. 3 and 4, the thin plates 21 and 23 are all formed into through-holes, so cutting, which takes time, is not necessary, and processing can be performed in a short time using a cutting die. In addition, even in chemical corrosion processing, there is no need to control the processing depth, so it can be manufactured at a low cost. In addition, if the width B of the long hole shown in Fig. 1 is narrower than the plate thickness, processing with a cutting die becomes difficult, but in such a case, a plate thinner than the width B of the long hole is used, If necessary, there is also a method of stacking multiple plates so that the long holes are in the same direction, and then stacking the next plate so that they are perpendicular to this. FIG. 1 shows a case in which two of these thin plates are stacked in the same direction, and then the next two are stacked at an angle of 90 degrees from the previous elongated hole.

Note that the directions of the long holes provided in the thin plate were alternately perpendicular to one or more holes, but this does not necessarily have to be perpendicular;
It is necessary to provide the necessary multiple cavity layers and openings, and orthogonality is secondary.

According to this embodiment, the cavity layer and the opening can be easily formed, and a semiconductor cooling device that can be mass-produced at low cost can be provided.

〔Effect of the invention〕

According to the present invention, a semiconductor cooling device suitable for mass production can be provided at low cost.

[Brief explanation of the drawing]

Claims (1)

[Scope of Claims] 1. A semiconductor cooling device that cools the semiconductor by bringing a refrigerant into contact with the heat dissipation surface of a semiconductor or a semiconductor cooling piece and utilizing the boiling and condensing action of the refrigerant, in which a plurality of long holes are provided. A plurality of thin plates having good thermal conductivity are laminated and bonded together so that the elongated holes are not continuously overlapped at the same position, and this is used as the heat dissipation surface of the semiconductor or the semiconductor cooling piece. Features of semiconductor cooling equipment. 2. A semiconductor cooling device according to claim 1, characterized in that a heat dissipation surface is provided by laminating one or more elongated holes such that the directions of the elongated holes are alternately orthogonal to each other.