US20130014919A1 - Heat pipe - Google Patents

Heat pipe Download PDF

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Publication number
US20130014919A1
US20130014919A1 US13/220,642 US201113220642A US2013014919A1 US 20130014919 A1 US20130014919 A1 US 20130014919A1 US 201113220642 A US201113220642 A US 201113220642A US 2013014919 A1 US2013014919 A1 US 2013014919A1
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US
United States
Prior art keywords
wick
layers
heat pipe
casing
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/220,642
Inventor
Sheng-Liang Dai
Yue Liu
Hai-Ping Shen
Wen-Hu Chen
Jia-Hong Wu
Yu-Liang Lo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furui Precise Component Kunshan Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Furui Precise Component Kunshan Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furui Precise Component Kunshan Co Ltd, Foxconn Technology Co Ltd filed Critical Furui Precise Component Kunshan Co Ltd
Assigned to FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD. reassignment FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, WEN-HU, DAI, Sheng-liang, LIU, YUE, LO, YU-LIANG, SHEN, Hai-ping, WU, Jia-hong
Publication of US20130014919A1 publication Critical patent/US20130014919A1/en
Abandoned legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Definitions

  • the present disclosure relates to heat transfer/dissipating device, and more particularly to a heat pipe.
  • Heat pipes have excellent heat transfer performance due to their low thermal resistance, and therefore are an effective means for heat transfer from heat sources.
  • a heat pipe is usually a vacuum casing containing therein a working fluid, and a wick structure.
  • FIG. 1 is a longitudinally cross-sectional view of a middle part of a heat pipe, in accordance with a first embodiment of the present disclosure.
  • FIG. 2 is a transversely cross-sectional view of the heat pipe, in accordance with the first embodiment of the present disclosure.
  • FIG. 3 is a transversely cross-sectional view of a heat pipe, in accordance with a second embodiment of the present disclosure.
  • FIG. 4 is a transversely cross-sectional view of a heat pipe, in accordance with a third embodiment of the present disclosure.
  • the casing 10 is sealed and has a cylindrical shape.
  • the casing 10 is typically made of high thermally conductive materials such as copper or copper alloys.
  • the casing 10 defines a vacuum sealed chamber 50 , which is employed to carry, under phase transitions between liquid state and vapor state, thermal energy from the evaporating section to the condensing section.
  • the wick structure assembly 30 has a multiple layer structure consisting of a plurality of wick layers 32 along a radial direction of the heat pipe 100 .
  • the wick structure assembly 30 includes eight wick layers 32 stacked at an inner surface of the casing 10 in sequence, and the wick layers 32 communicate with each other.
  • the wick layers 32 respectively define a plurality of pores 320 therein. In the present embodiment, diameters of the pores 320 of the wick layers 32 gradually decrease from the inner wall to center of the casing 10 .
  • the wick layers 32 include a first wick layer 32 a adjacent to and connect to the inner wall of the casing 10 , and a second wick layer 32 b near the center of the casing 10 and away from the inner wall of the casing 10 .
  • the heat pipe 100 has a relatively large capillary force and a relatively low flow resistance, so as to effectively and timely bring the condensed working liquid back from the condensing section to the evaporating section.
  • the working liquid 20 is received in the casing 10 , and can flow from the condensing section to the evaporating section via capillary force provided by the wick structure assembly 30 .
  • the working liquid 20 at the evaporating section is heated and vaporized to the condensing section.
  • the vaporized working fluid 20 exchanges heat at the condensing section and is condensed to liquid.
  • the condensed working fluid 20 returns to the evaporating section via the wick structure assembly 30 .
  • the working liquid 20 can be selected from a group consisting of water, alcohol, ammonia and combination thereof.
  • an amount of wick layers 32 can be three, four, five, six or seven, and the second wick layer 32 b is sintered powder wick layer, and the other wick layer 32 are fine-mesh wick layers.
  • a heat pipe 600 according to a second embodiment of the present disclosure is shown.
  • a wick structure assembly 60 of the heat pipe 600 includes a plurality of wick layers 62 , and the wick layers 62 are groove-type wick layers and fine-mesh wick layers alternately stacked together.
  • the wick layers 62 are communicated with each other, and diameters of the pores 620 of each of the wick layers 62 gradually decrease from the inner wall to center of the casing 10 .
  • the wick layers 62 include a first wick layer 621 , a second wick layer 622 , a third wick layer 623 , a fourth wick layer 624 , a fifth wick layer 625 , a sixth wick layer 626 , a seventh wick layer 627 and an eighth wick layer 628 stacked at an inner surface of the casing 10 in sequence, and along directions from the inner wall to center of the casing 10 .
  • the first, third, fifth and seventh wick layers 621 , 623 , 625 , 627 are fine-mesh wick layers
  • the second, fourth, sixth, and eighth wick layers 622 , 624 , 626 , 628 are groove-type wick layers.
  • the wick layer assembly 70 includes a plurality of wick layers 72 , and the wick layers 72 are fine-mesh wick layers and sintered powder wick layers alternately stacked together.
  • the wick layers 72 are communicated with each other, and diameters of the pores 720 of each of the wick layers 72 gradually decrease from the inner wall to center of the casing 10 .
  • the wick layers 72 include a first wick layer 721 , a second wick layer 722 , a third wick layer 723 , a fourth wick layer 724 , a fifth wick layer 725 , and a sixth wick layer 726 stacked at an inner surface of the casing 10 in turn, and along directions from the inner wall to center of the casing 10 .
  • the first, third, and fifth wick layers 721 , 723 , 7257 are fine-mesh wick layers
  • the second, fourth, and sixth wick layers 722 , 724 , 726 , 728 are sintered powder wick layers.
  • the wick layer assembly 70 can be consist of four wick layers 72 , and the four wick layers 72 are fine-mesh wick layers and sintered powder wick layers alternating with each other.
  • the heat pipe 700 has a smaller liquid resistance and greater capillary force than the conventional sintered heat pipe.
  • the heat pipes 100 , 600 , 700 can be elongated plate heat pipe, and the casing 10 can be rectangle shape, and an amount of the wick layers 32 , 62 , 72 can be three, four, five, six, seven or eight.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat pipe includes a casing and a plurality of wick layers. The casing has an inner wall. The wick layers stack at an inner surface of the casing in turn. The wick layers respectively define a plurality of pores therein. Diameters of the pores of each of the wick layers gradually decrease from the inner wall to center of the casing.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to heat transfer/dissipating device, and more particularly to a heat pipe.
  • 2. Description of Related Art
  • Heat pipes have excellent heat transfer performance due to their low thermal resistance, and therefore are an effective means for heat transfer from heat sources. A heat pipe is usually a vacuum casing containing therein a working fluid, and a wick structure.
  • The primary function of a wick is to draw condensed liquid back to an evaporating section of a heat pipe under the capillary pressure developed thereby. Therefore, the capillary pressure is an important parameter affecting the performance of the wick. Since it is well recognized that the capillary pressure of a wick increases due to a decrease in pore size of the wick, the sintered powder wick generally has a capillary pressure larger than that of the other wicks due to its very dense structure of small particles. However, it is not always the best way to choose a dense wick with small-sized pores, because the flow resistance to the condensed liquid also increases due to a decrease in pore size of the wick. The increased flow resistance reduces the speed of the condensed liquid in returning to the evaporating section. As a result, a heat pipe with a wick that has too large or too small pore size often suffers dry-out problem at the evaporating section as the condensed liquid cannot be timely sent back to the evaporating section of the heat pipe.
  • Therefore, what is needed is a heat pipe which can overcome the above described shortcomings.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a longitudinally cross-sectional view of a middle part of a heat pipe, in accordance with a first embodiment of the present disclosure.
  • FIG. 2 is a transversely cross-sectional view of the heat pipe, in accordance with the first embodiment of the present disclosure.
  • FIG. 3 is a transversely cross-sectional view of a heat pipe, in accordance with a second embodiment of the present disclosure.
  • FIG. 4 is a transversely cross-sectional view of a heat pipe, in accordance with a third embodiment of the present disclosure.
  • DETAILED DESCRIPTION
  • Referring to FIGS. 1 to 2, a heat pipe 100 according to a first embodiment of the present disclosure is shown. The heat pipe 100 includes a casing 10, a working liquid 20 received in the casing 10, and a wick structure assembly 30 arranged at an inner surface of the casing 10 and saturated with the working fluid 20. The casing 10 includes an evaporating section (not labeled) and a condensing section (not labeled) at respective opposite ends thereof.
  • The casing 10 is sealed and has a cylindrical shape. The casing 10 is typically made of high thermally conductive materials such as copper or copper alloys. The casing 10 defines a vacuum sealed chamber 50, which is employed to carry, under phase transitions between liquid state and vapor state, thermal energy from the evaporating section to the condensing section.
  • The wick structure assembly 30 has a multiple layer structure consisting of a plurality of wick layers 32 along a radial direction of the heat pipe 100. In the present embodiment, the wick structure assembly 30 includes eight wick layers 32 stacked at an inner surface of the casing 10 in sequence, and the wick layers 32 communicate with each other. The wick layers 32 respectively define a plurality of pores 320 therein. In the present embodiment, diameters of the pores 320 of the wick layers 32 gradually decrease from the inner wall to center of the casing 10. The wick layers 32 include a first wick layer 32 a adjacent to and connect to the inner wall of the casing 10, and a second wick layer 32 b near the center of the casing 10 and away from the inner wall of the casing 10. The first wick layer 32 a can be selected from one of groove-type wick layer, fine-mesh wick layer or sintered powder wick layer, and the other six wick layers 32 can be selected from sintered powder wick layer, or fine-mesh wick layer. In the present embodiment, the second wick layer 32 b is sintered powder wick layer, and the other six wick layers 32 are fine-mesh wick layer, and a porosity of all the wick layers 32 ranges from 40 to 65 percents.
  • In the present embodiment, diameters of the pores of the wick layers 32 gradually decrease from the inner wall to center of the casing 10, therefore, the heat pipe 100 has a relatively large capillary force and a relatively low flow resistance, so as to effectively and timely bring the condensed working liquid back from the condensing section to the evaporating section.
  • The working liquid 20 is received in the casing 10, and can flow from the condensing section to the evaporating section via capillary force provided by the wick structure assembly 30. The working liquid 20 at the evaporating section is heated and vaporized to the condensing section. The vaporized working fluid 20 exchanges heat at the condensing section and is condensed to liquid. The condensed working fluid 20 returns to the evaporating section via the wick structure assembly 30. The working liquid 20 can be selected from a group consisting of water, alcohol, ammonia and combination thereof.
  • It can be understood that an amount of wick layers 32 can be three, four, five, six or seven, and the second wick layer 32 b is sintered powder wick layer, and the other wick layer 32 are fine-mesh wick layers.
  • Referring to FIG. 3, a heat pipe 600 according to a second embodiment of the present disclosure is shown. Differing from the heat pipe 100 of the first embodiment, a wick structure assembly 60 of the heat pipe 600 includes a plurality of wick layers 62, and the wick layers 62 are groove-type wick layers and fine-mesh wick layers alternately stacked together. The wick layers 62 are communicated with each other, and diameters of the pores 620 of each of the wick layers 62 gradually decrease from the inner wall to center of the casing 10. In the present embodiment, the wick layers 62 include a first wick layer 621, a second wick layer 622, a third wick layer 623, a fourth wick layer 624, a fifth wick layer 625, a sixth wick layer 626, a seventh wick layer 627 and an eighth wick layer 628 stacked at an inner surface of the casing 10 in sequence, and along directions from the inner wall to center of the casing 10. The first, third, fifth and seventh wick layers 621, 623, 625, 627 are fine-mesh wick layers, and the second, fourth, sixth, and eighth wick layers 622, 624, 626, 628 are groove-type wick layers.
  • Referring to FIG. 4, a heat pipe 700 according to a third embodiment of the present disclosure is shown. Differing from the heat pipe 100, the wick layer assembly 70 includes a plurality of wick layers 72, and the wick layers 72 are fine-mesh wick layers and sintered powder wick layers alternately stacked together. The wick layers 72 are communicated with each other, and diameters of the pores 720 of each of the wick layers 72 gradually decrease from the inner wall to center of the casing 10. In the present embodiment, the wick layers 72 include a first wick layer 721, a second wick layer 722, a third wick layer 723, a fourth wick layer 724, a fifth wick layer 725, and a sixth wick layer 726 stacked at an inner surface of the casing 10 in turn, and along directions from the inner wall to center of the casing 10. The first, third, and fifth wick layers 721, 723, 7257 are fine-mesh wick layers, and the second, fourth, and sixth wick layers 722, 724, 726, 728 are sintered powder wick layers. It can be understood that the wick layer assembly 70 can be consist of four wick layers 72, and the four wick layers 72 are fine-mesh wick layers and sintered powder wick layers alternating with each other.
  • Following tables shows heat transfer performance of the wick layers 72 of the heat pipe 700 compared with that of the conventional heat pipe.
  • Average of the
    max load of heat Average of thermal
    Type Number transfer (W) resistance (° C./W)
    Conventional sintered 30 39.5 0.08
    heat pipe
    The heat pipe of the 30 57.5 0.07
    third embodiment
    (four wick layers)
    The heat pipe of the 30 58.9 0.08
    third embodiment (six
    wick layers)
    Remark:
    1: A height of the conventional sintered heat pipe when pressed is equal to that of the heat pipe of the third embodiment, both are 3.5 mm.
    2: The working temperature is 50 Celsius degrees.
  • Average of the
    max load of heat Average of thermal
    Type Number transfer (W) resistance (° C./W)
    Conventional sintered 30 35.5 0.1
    heat pipe
    The heat pipe of the 30 55.0 0.08
    third embodiment
    (four wick layers)
    The heat pipe of the 30 54.3 0.1
    third embodiment (six
    wick layers)
    Remark:
    1, A height of the conventional sintered heat pipe when pressed is equal to that of the heat pipe of the third embodiment, both are 3.0 mm.
    2, The working temperature is 50 Celsius degrees.
  • It can be concluded from the above tables, the heat pipe 700 has a smaller liquid resistance and greater capillary force than the conventional sintered heat pipe. In alternative embodiment, the heat pipes 100, 600, 700 can be elongated plate heat pipe, and the casing 10 can be rectangle shape, and an amount of the wick layers 32, 62, 72 can be three, four, five, six, seven or eight.
  • It is to be further understood that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only; and that changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (14)

1. A heat pipe comprising:
a casing, the casing having an inner wall; and
a plurality of wick layers stacked at an inner surface of the casing in turn, the wick layers respectively defining a plurality of pores therein, diameters of the pores of the wick layers gradually decreasing from the inner wall to a center of the casing.
2. The heat pipe of claim 1, wherein the wick layers are more than three and less than eight.
3. The heat pipe of claim 1, wherein the wick layers comprises a first wick layer adjacent to and connect to the inner wall of the casing, the first wick can be selected from groove-type wick layer, fine-mesh wick layer or sintered powder wick layer.
4. The heat pipe of claim 1, wherein the wick layers comprises a second wick layer near a center of the casing and away from the inner wall of the casing, the inner wick being a sintered powder wick layer, and the others being a fine-mesh wick layer.
5. The heat pipe of claim 1, wherein the wick layers are groove-type wick layers and fine-mesh wick layers alternating stacked together each other.
6. The heat pipe of claim 5, wherein the wick layers comprise a first wick layer adjacent to and connect to the inner wall of the casing, the first wick layer being a fine-mesh wick layer.
7. The heat pipe of claim 1, wherein the wick layers are fine-mesh wick layers and sintered powder wick layers alternating stacked together.
8. The heat pipe of claim 7, wherein the wick layers comprise a first wick layer adjacent to and connect to the inner wall of the casing, the first wick layer being a fine-mesh wick layer.
9. The heat pipe of claim 1, wherein a porosity of all the wick layers ranges from 40 to 65 percents.
10. The heat pipe of claim 1, wherein wick layers are communicated with each other.
11. A heat pipe comprising:
a sealed cylindrical casing, the casing having an inner wall; and
more than three wick layers stacked at an inner surface of the casing in turn, the wick layers respectively defining a plurality of pores therein, diameters of the pores of the wick layers gradually decreasing from the inner wall to center of the casing, and a porosity of all the wick layers ranging from 40 to 65 percents.
12. The heat pipe of claim 11, wherein the wick layers comprises a second wick layer near a center of the casing and away from the inner wall of the casing, the inner wick being a sintered powder wick layer, and the others being a fine-mesh wick layer.
13. The heat pipe of claim 11, wherein the wick layers are groove-type wick layers and fine-mesh wick layers alternating stacked together.
14. The heat pipe of claim 11, wherein the wick layers are fine-mesh wick layers and sintered powder wick layers alternating stacked together.
US13/220,642 2011-07-15 2011-08-29 Heat pipe Abandoned US20130014919A1 (en)

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CN2011101983340A CN102878843A (en) 2011-07-15 2011-07-15 Heat pipe
CN201110198334.0 2011-07-15

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Cited By (8)

* Cited by examiner, † Cited by third party
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US20150013943A1 (en) * 2012-04-16 2015-01-15 Furukawa Electric Co., Ltd. Heat pipe
US20150311879A1 (en) * 2014-04-25 2015-10-29 Rohm Co., Ltd. Microphone bias circuit
US20190354147A1 (en) * 2014-06-04 2019-11-21 Huawei Technologies Co., Ltd. Electronic Device
US20210293488A1 (en) * 2020-03-18 2021-09-23 Kelvin Thermal Technologies, Inc. Deformed Mesh Thermal Ground Plane
CN113597194A (en) * 2019-06-28 2021-11-02 河南烯力新材料科技有限公司 Heat conduction structure, manufacturing method thereof and mobile device
US11445636B2 (en) * 2019-10-31 2022-09-13 Murata Manufacturing Co., Ltd. Vapor chamber, heatsink device, and electronic device
WO2023089858A1 (en) * 2021-11-17 2023-05-25 株式会社フジクラ Heat pipe and method for manufacturing heat pipe
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes

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CN103925819A (en) * 2013-02-17 2014-07-16 上海交通大学 Through-hole metal foam heat pipe heat exchanger with gradually-changed appearance characteristics
CN104422320B (en) * 2013-08-21 2016-04-20 英业达科技有限公司 Heat pipe
CN104251631A (en) * 2014-09-24 2014-12-31 中国科学院工程热物理研究所 Heat tube with self-adaptation tube core
CN104776742A (en) * 2015-04-17 2015-07-15 广东新创意科技有限公司 Composite liquid sucking core for ultrathin heat pipe and manufacturing method of composite liquid sucking core
CN105170982B (en) * 2015-10-09 2017-05-10 昆山捷桥电子科技有限公司 Machining device and process for heat-pipe capillary structure
CN110044192A (en) * 2019-04-29 2019-07-23 深圳市尚翼实业有限公司 A kind of heat pipe that can enhance capillary attraction
CN110044193A (en) * 2019-04-29 2019-07-23 深圳市尚翼实业有限公司 A kind of heat pipe
CN110044194A (en) * 2019-04-29 2019-07-23 深圳市尚翼实业有限公司 It is a kind of to reduce the heat pipe that heat transfer hinders
CN113739607A (en) * 2020-09-29 2021-12-03 中国科学院长春光学精密机械与物理研究所 Manufacturing method of heat pipe and heat pipe

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US3786861A (en) * 1971-04-12 1974-01-22 Battelle Memorial Institute Heat pipes
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US20060201655A1 (en) * 2005-03-11 2006-09-14 Chu-Wan Hong Heat pipe suitable for application in electronic device with limited mounting space
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US20070240855A1 (en) * 2006-04-14 2007-10-18 Foxconn Technology Co., Ltd. Heat pipe with composite capillary wick structure
US20070277963A1 (en) * 2006-06-02 2007-12-06 Foxconn Technology Co., Ltd. Heat pipe
US20100254090A1 (en) * 2009-04-01 2010-10-07 Harris Corporation Multi-layer mesh wicks for heat pipes

Cited By (12)

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Publication number Priority date Publication date Assignee Title
US20150013943A1 (en) * 2012-04-16 2015-01-15 Furukawa Electric Co., Ltd. Heat pipe
US10107561B2 (en) * 2012-04-16 2018-10-23 Furukawa Electric Co., Ltd. Heat pipe
US20150311879A1 (en) * 2014-04-25 2015-10-29 Rohm Co., Ltd. Microphone bias circuit
US9710000B2 (en) * 2014-04-25 2017-07-18 Rohm Co., Ltd. Microphone bias circuit
US20190354147A1 (en) * 2014-06-04 2019-11-21 Huawei Technologies Co., Ltd. Electronic Device
US11144101B2 (en) * 2014-06-04 2021-10-12 Huawei Technologies Co., Ltd. Electronic device
US11789504B2 (en) 2014-06-04 2023-10-17 Huawei Technologies Co., Ltd. Electronic device
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes
CN113597194A (en) * 2019-06-28 2021-11-02 河南烯力新材料科技有限公司 Heat conduction structure, manufacturing method thereof and mobile device
US11445636B2 (en) * 2019-10-31 2022-09-13 Murata Manufacturing Co., Ltd. Vapor chamber, heatsink device, and electronic device
US20210293488A1 (en) * 2020-03-18 2021-09-23 Kelvin Thermal Technologies, Inc. Deformed Mesh Thermal Ground Plane
WO2023089858A1 (en) * 2021-11-17 2023-05-25 株式会社フジクラ Heat pipe and method for manufacturing heat pipe

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Publication number Publication date
TW201303250A (en) 2013-01-16
CN102878843A (en) 2013-01-16

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