US20130014919A1 - Heat pipe - Google Patents
Heat pipe Download PDFInfo
- Publication number
- US20130014919A1 US20130014919A1 US13/220,642 US201113220642A US2013014919A1 US 20130014919 A1 US20130014919 A1 US 20130014919A1 US 201113220642 A US201113220642 A US 201113220642A US 2013014919 A1 US2013014919 A1 US 2013014919A1
- Authority
- US
- United States
- Prior art keywords
- wick
- layers
- heat pipe
- casing
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000011148 porous material Substances 0.000 claims abstract description 15
- 239000000843 powder Substances 0.000 claims description 13
- 230000003247 decreasing effect Effects 0.000 claims 2
- 239000007788 liquid Substances 0.000 description 12
- 238000001704 evaporation Methods 0.000 description 10
- 239000012530 fluid Substances 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Definitions
- the present disclosure relates to heat transfer/dissipating device, and more particularly to a heat pipe.
- Heat pipes have excellent heat transfer performance due to their low thermal resistance, and therefore are an effective means for heat transfer from heat sources.
- a heat pipe is usually a vacuum casing containing therein a working fluid, and a wick structure.
- FIG. 1 is a longitudinally cross-sectional view of a middle part of a heat pipe, in accordance with a first embodiment of the present disclosure.
- FIG. 2 is a transversely cross-sectional view of the heat pipe, in accordance with the first embodiment of the present disclosure.
- FIG. 3 is a transversely cross-sectional view of a heat pipe, in accordance with a second embodiment of the present disclosure.
- FIG. 4 is a transversely cross-sectional view of a heat pipe, in accordance with a third embodiment of the present disclosure.
- the casing 10 is sealed and has a cylindrical shape.
- the casing 10 is typically made of high thermally conductive materials such as copper or copper alloys.
- the casing 10 defines a vacuum sealed chamber 50 , which is employed to carry, under phase transitions between liquid state and vapor state, thermal energy from the evaporating section to the condensing section.
- the wick structure assembly 30 has a multiple layer structure consisting of a plurality of wick layers 32 along a radial direction of the heat pipe 100 .
- the wick structure assembly 30 includes eight wick layers 32 stacked at an inner surface of the casing 10 in sequence, and the wick layers 32 communicate with each other.
- the wick layers 32 respectively define a plurality of pores 320 therein. In the present embodiment, diameters of the pores 320 of the wick layers 32 gradually decrease from the inner wall to center of the casing 10 .
- the wick layers 32 include a first wick layer 32 a adjacent to and connect to the inner wall of the casing 10 , and a second wick layer 32 b near the center of the casing 10 and away from the inner wall of the casing 10 .
- the heat pipe 100 has a relatively large capillary force and a relatively low flow resistance, so as to effectively and timely bring the condensed working liquid back from the condensing section to the evaporating section.
- the working liquid 20 is received in the casing 10 , and can flow from the condensing section to the evaporating section via capillary force provided by the wick structure assembly 30 .
- the working liquid 20 at the evaporating section is heated and vaporized to the condensing section.
- the vaporized working fluid 20 exchanges heat at the condensing section and is condensed to liquid.
- the condensed working fluid 20 returns to the evaporating section via the wick structure assembly 30 .
- the working liquid 20 can be selected from a group consisting of water, alcohol, ammonia and combination thereof.
- an amount of wick layers 32 can be three, four, five, six or seven, and the second wick layer 32 b is sintered powder wick layer, and the other wick layer 32 are fine-mesh wick layers.
- a heat pipe 600 according to a second embodiment of the present disclosure is shown.
- a wick structure assembly 60 of the heat pipe 600 includes a plurality of wick layers 62 , and the wick layers 62 are groove-type wick layers and fine-mesh wick layers alternately stacked together.
- the wick layers 62 are communicated with each other, and diameters of the pores 620 of each of the wick layers 62 gradually decrease from the inner wall to center of the casing 10 .
- the wick layers 62 include a first wick layer 621 , a second wick layer 622 , a third wick layer 623 , a fourth wick layer 624 , a fifth wick layer 625 , a sixth wick layer 626 , a seventh wick layer 627 and an eighth wick layer 628 stacked at an inner surface of the casing 10 in sequence, and along directions from the inner wall to center of the casing 10 .
- the first, third, fifth and seventh wick layers 621 , 623 , 625 , 627 are fine-mesh wick layers
- the second, fourth, sixth, and eighth wick layers 622 , 624 , 626 , 628 are groove-type wick layers.
- the wick layer assembly 70 includes a plurality of wick layers 72 , and the wick layers 72 are fine-mesh wick layers and sintered powder wick layers alternately stacked together.
- the wick layers 72 are communicated with each other, and diameters of the pores 720 of each of the wick layers 72 gradually decrease from the inner wall to center of the casing 10 .
- the wick layers 72 include a first wick layer 721 , a second wick layer 722 , a third wick layer 723 , a fourth wick layer 724 , a fifth wick layer 725 , and a sixth wick layer 726 stacked at an inner surface of the casing 10 in turn, and along directions from the inner wall to center of the casing 10 .
- the first, third, and fifth wick layers 721 , 723 , 7257 are fine-mesh wick layers
- the second, fourth, and sixth wick layers 722 , 724 , 726 , 728 are sintered powder wick layers.
- the wick layer assembly 70 can be consist of four wick layers 72 , and the four wick layers 72 are fine-mesh wick layers and sintered powder wick layers alternating with each other.
- the heat pipe 700 has a smaller liquid resistance and greater capillary force than the conventional sintered heat pipe.
- the heat pipes 100 , 600 , 700 can be elongated plate heat pipe, and the casing 10 can be rectangle shape, and an amount of the wick layers 32 , 62 , 72 can be three, four, five, six, seven or eight.
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
- 1. Technical Field
- The present disclosure relates to heat transfer/dissipating device, and more particularly to a heat pipe.
- 2. Description of Related Art
- Heat pipes have excellent heat transfer performance due to their low thermal resistance, and therefore are an effective means for heat transfer from heat sources. A heat pipe is usually a vacuum casing containing therein a working fluid, and a wick structure.
- The primary function of a wick is to draw condensed liquid back to an evaporating section of a heat pipe under the capillary pressure developed thereby. Therefore, the capillary pressure is an important parameter affecting the performance of the wick. Since it is well recognized that the capillary pressure of a wick increases due to a decrease in pore size of the wick, the sintered powder wick generally has a capillary pressure larger than that of the other wicks due to its very dense structure of small particles. However, it is not always the best way to choose a dense wick with small-sized pores, because the flow resistance to the condensed liquid also increases due to a decrease in pore size of the wick. The increased flow resistance reduces the speed of the condensed liquid in returning to the evaporating section. As a result, a heat pipe with a wick that has too large or too small pore size often suffers dry-out problem at the evaporating section as the condensed liquid cannot be timely sent back to the evaporating section of the heat pipe.
- Therefore, what is needed is a heat pipe which can overcome the above described shortcomings.
-
FIG. 1 is a longitudinally cross-sectional view of a middle part of a heat pipe, in accordance with a first embodiment of the present disclosure. -
FIG. 2 is a transversely cross-sectional view of the heat pipe, in accordance with the first embodiment of the present disclosure. -
FIG. 3 is a transversely cross-sectional view of a heat pipe, in accordance with a second embodiment of the present disclosure. -
FIG. 4 is a transversely cross-sectional view of a heat pipe, in accordance with a third embodiment of the present disclosure. - Referring to
FIGS. 1 to 2 , aheat pipe 100 according to a first embodiment of the present disclosure is shown. Theheat pipe 100 includes acasing 10, a workingliquid 20 received in thecasing 10, and awick structure assembly 30 arranged at an inner surface of thecasing 10 and saturated with the workingfluid 20. Thecasing 10 includes an evaporating section (not labeled) and a condensing section (not labeled) at respective opposite ends thereof. - The
casing 10 is sealed and has a cylindrical shape. Thecasing 10 is typically made of high thermally conductive materials such as copper or copper alloys. Thecasing 10 defines a vacuum sealedchamber 50, which is employed to carry, under phase transitions between liquid state and vapor state, thermal energy from the evaporating section to the condensing section. - The
wick structure assembly 30 has a multiple layer structure consisting of a plurality ofwick layers 32 along a radial direction of theheat pipe 100. In the present embodiment, thewick structure assembly 30 includes eightwick layers 32 stacked at an inner surface of thecasing 10 in sequence, and thewick layers 32 communicate with each other. Thewick layers 32 respectively define a plurality ofpores 320 therein. In the present embodiment, diameters of thepores 320 of thewick layers 32 gradually decrease from the inner wall to center of thecasing 10. Thewick layers 32 include afirst wick layer 32 a adjacent to and connect to the inner wall of thecasing 10, and asecond wick layer 32 b near the center of thecasing 10 and away from the inner wall of thecasing 10. Thefirst wick layer 32 a can be selected from one of groove-type wick layer, fine-mesh wick layer or sintered powder wick layer, and the other sixwick layers 32 can be selected from sintered powder wick layer, or fine-mesh wick layer. In the present embodiment, thesecond wick layer 32 b is sintered powder wick layer, and the other sixwick layers 32 are fine-mesh wick layer, and a porosity of all thewick layers 32 ranges from 40 to 65 percents. - In the present embodiment, diameters of the pores of the
wick layers 32 gradually decrease from the inner wall to center of thecasing 10, therefore, theheat pipe 100 has a relatively large capillary force and a relatively low flow resistance, so as to effectively and timely bring the condensed working liquid back from the condensing section to the evaporating section. - The working
liquid 20 is received in thecasing 10, and can flow from the condensing section to the evaporating section via capillary force provided by thewick structure assembly 30. The workingliquid 20 at the evaporating section is heated and vaporized to the condensing section. The vaporized workingfluid 20 exchanges heat at the condensing section and is condensed to liquid. The condensed workingfluid 20 returns to the evaporating section via thewick structure assembly 30. The workingliquid 20 can be selected from a group consisting of water, alcohol, ammonia and combination thereof. - It can be understood that an amount of
wick layers 32 can be three, four, five, six or seven, and thesecond wick layer 32 b is sintered powder wick layer, and theother wick layer 32 are fine-mesh wick layers. - Referring to
FIG. 3 , aheat pipe 600 according to a second embodiment of the present disclosure is shown. Differing from theheat pipe 100 of the first embodiment, awick structure assembly 60 of theheat pipe 600 includes a plurality ofwick layers 62, and thewick layers 62 are groove-type wick layers and fine-mesh wick layers alternately stacked together. Thewick layers 62 are communicated with each other, and diameters of thepores 620 of each of thewick layers 62 gradually decrease from the inner wall to center of thecasing 10. In the present embodiment, thewick layers 62 include afirst wick layer 621, asecond wick layer 622, athird wick layer 623, afourth wick layer 624, a fifth wick layer 625, a sixth wick layer 626, a seventh wick layer 627 and an eighth wick layer 628 stacked at an inner surface of thecasing 10 in sequence, and along directions from the inner wall to center of thecasing 10. The first, third, fifth andseventh wick layers eighth wick layers - Referring to
FIG. 4 , aheat pipe 700 according to a third embodiment of the present disclosure is shown. Differing from theheat pipe 100, thewick layer assembly 70 includes a plurality ofwick layers 72, and thewick layers 72 are fine-mesh wick layers and sintered powder wick layers alternately stacked together. Thewick layers 72 are communicated with each other, and diameters of thepores 720 of each of thewick layers 72 gradually decrease from the inner wall to center of thecasing 10. In the present embodiment, thewick layers 72 include afirst wick layer 721, asecond wick layer 722, athird wick layer 723, afourth wick layer 724, afifth wick layer 725, and asixth wick layer 726 stacked at an inner surface of thecasing 10 in turn, and along directions from the inner wall to center of thecasing 10. The first, third, andfifth wick layers sixth wick layers wick layer assembly 70 can be consist of fourwick layers 72, and the fourwick layers 72 are fine-mesh wick layers and sintered powder wick layers alternating with each other. - Following tables shows heat transfer performance of the
wick layers 72 of theheat pipe 700 compared with that of the conventional heat pipe. -
Average of the max load of heat Average of thermal Type Number transfer (W) resistance (° C./W) Conventional sintered 30 39.5 0.08 heat pipe The heat pipe of the 30 57.5 0.07 third embodiment (four wick layers) The heat pipe of the 30 58.9 0.08 third embodiment (six wick layers) Remark: 1: A height of the conventional sintered heat pipe when pressed is equal to that of the heat pipe of the third embodiment, both are 3.5 mm. 2: The working temperature is 50 Celsius degrees. -
Average of the max load of heat Average of thermal Type Number transfer (W) resistance (° C./W) Conventional sintered 30 35.5 0.1 heat pipe The heat pipe of the 30 55.0 0.08 third embodiment (four wick layers) The heat pipe of the 30 54.3 0.1 third embodiment (six wick layers) Remark: 1, A height of the conventional sintered heat pipe when pressed is equal to that of the heat pipe of the third embodiment, both are 3.0 mm. 2, The working temperature is 50 Celsius degrees. - It can be concluded from the above tables, the
heat pipe 700 has a smaller liquid resistance and greater capillary force than the conventional sintered heat pipe. In alternative embodiment, theheat pipes casing 10 can be rectangle shape, and an amount of thewick layers - It is to be further understood that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only; and that changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011101983340A CN102878843A (en) | 2011-07-15 | 2011-07-15 | Heat pipe |
CN201110198334.0 | 2011-07-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20130014919A1 true US20130014919A1 (en) | 2013-01-17 |
Family
ID=47480267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/220,642 Abandoned US20130014919A1 (en) | 2011-07-15 | 2011-08-29 | Heat pipe |
Country Status (3)
Country | Link |
---|---|
US (1) | US20130014919A1 (en) |
CN (1) | CN102878843A (en) |
TW (1) | TW201303250A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150013943A1 (en) * | 2012-04-16 | 2015-01-15 | Furukawa Electric Co., Ltd. | Heat pipe |
US20150311879A1 (en) * | 2014-04-25 | 2015-10-29 | Rohm Co., Ltd. | Microphone bias circuit |
US20190354147A1 (en) * | 2014-06-04 | 2019-11-21 | Huawei Technologies Co., Ltd. | Electronic Device |
US20210293488A1 (en) * | 2020-03-18 | 2021-09-23 | Kelvin Thermal Technologies, Inc. | Deformed Mesh Thermal Ground Plane |
CN113597194A (en) * | 2019-06-28 | 2021-11-02 | 河南烯力新材料科技有限公司 | Heat conduction structure, manufacturing method thereof and mobile device |
US11445636B2 (en) * | 2019-10-31 | 2022-09-13 | Murata Manufacturing Co., Ltd. | Vapor chamber, heatsink device, and electronic device |
WO2023089858A1 (en) * | 2021-11-17 | 2023-05-25 | 株式会社フジクラ | Heat pipe and method for manufacturing heat pipe |
US11988453B2 (en) | 2014-09-17 | 2024-05-21 | Kelvin Thermal Technologies, Inc. | Thermal management planes |
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CN103925819A (en) * | 2013-02-17 | 2014-07-16 | 上海交通大学 | Through-hole metal foam heat pipe heat exchanger with gradually-changed appearance characteristics |
CN104422320B (en) * | 2013-08-21 | 2016-04-20 | 英业达科技有限公司 | Heat pipe |
CN104251631A (en) * | 2014-09-24 | 2014-12-31 | 中国科学院工程热物理研究所 | Heat tube with self-adaptation tube core |
CN104776742A (en) * | 2015-04-17 | 2015-07-15 | 广东新创意科技有限公司 | Composite liquid sucking core for ultrathin heat pipe and manufacturing method of composite liquid sucking core |
CN105170982B (en) * | 2015-10-09 | 2017-05-10 | 昆山捷桥电子科技有限公司 | Machining device and process for heat-pipe capillary structure |
CN110044192A (en) * | 2019-04-29 | 2019-07-23 | 深圳市尚翼实业有限公司 | A kind of heat pipe that can enhance capillary attraction |
CN110044193A (en) * | 2019-04-29 | 2019-07-23 | 深圳市尚翼实业有限公司 | A kind of heat pipe |
CN110044194A (en) * | 2019-04-29 | 2019-07-23 | 深圳市尚翼实业有限公司 | It is a kind of to reduce the heat pipe that heat transfer hinders |
CN113739607A (en) * | 2020-09-29 | 2021-12-03 | 中国科学院长春光学精密机械与物理研究所 | Manufacturing method of heat pipe and heat pipe |
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CN101706165A (en) * | 2009-11-10 | 2010-05-12 | 南京赫特节能环保有限公司 | Transverse internal thread heat pipe of solar water heater |
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2011
- 2011-07-15 CN CN2011101983340A patent/CN102878843A/en active Pending
- 2011-07-19 TW TW100125382A patent/TW201303250A/en unknown
- 2011-08-29 US US13/220,642 patent/US20130014919A1/en not_active Abandoned
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US3786861A (en) * | 1971-04-12 | 1974-01-22 | Battelle Memorial Institute | Heat pipes |
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US20050051305A1 (en) * | 2002-12-06 | 2005-03-10 | Hsu Hul Chun | Heat pipe |
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Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150013943A1 (en) * | 2012-04-16 | 2015-01-15 | Furukawa Electric Co., Ltd. | Heat pipe |
US10107561B2 (en) * | 2012-04-16 | 2018-10-23 | Furukawa Electric Co., Ltd. | Heat pipe |
US20150311879A1 (en) * | 2014-04-25 | 2015-10-29 | Rohm Co., Ltd. | Microphone bias circuit |
US9710000B2 (en) * | 2014-04-25 | 2017-07-18 | Rohm Co., Ltd. | Microphone bias circuit |
US20190354147A1 (en) * | 2014-06-04 | 2019-11-21 | Huawei Technologies Co., Ltd. | Electronic Device |
US11144101B2 (en) * | 2014-06-04 | 2021-10-12 | Huawei Technologies Co., Ltd. | Electronic device |
US11789504B2 (en) | 2014-06-04 | 2023-10-17 | Huawei Technologies Co., Ltd. | Electronic device |
US11988453B2 (en) | 2014-09-17 | 2024-05-21 | Kelvin Thermal Technologies, Inc. | Thermal management planes |
CN113597194A (en) * | 2019-06-28 | 2021-11-02 | 河南烯力新材料科技有限公司 | Heat conduction structure, manufacturing method thereof and mobile device |
US11445636B2 (en) * | 2019-10-31 | 2022-09-13 | Murata Manufacturing Co., Ltd. | Vapor chamber, heatsink device, and electronic device |
US20210293488A1 (en) * | 2020-03-18 | 2021-09-23 | Kelvin Thermal Technologies, Inc. | Deformed Mesh Thermal Ground Plane |
WO2023089858A1 (en) * | 2021-11-17 | 2023-05-25 | 株式会社フジクラ | Heat pipe and method for manufacturing heat pipe |
Also Published As
Publication number | Publication date |
---|---|
TW201303250A (en) | 2013-01-16 |
CN102878843A (en) | 2013-01-16 |
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Owner name: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:DAI, SHENG-LIANG;LIU, YUE;SHEN, HAI-PING;AND OTHERS;REEL/FRAME:026824/0631 Effective date: 20110824 Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:DAI, SHENG-LIANG;LIU, YUE;SHEN, HAI-PING;AND OTHERS;REEL/FRAME:026824/0631 Effective date: 20110824 |
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