CN110044194A - It is a kind of to reduce the heat pipe that heat transfer hinders - Google Patents
It is a kind of to reduce the heat pipe that heat transfer hinders Download PDFInfo
- Publication number
- CN110044194A CN110044194A CN201910354668.9A CN201910354668A CN110044194A CN 110044194 A CN110044194 A CN 110044194A CN 201910354668 A CN201910354668 A CN 201910354668A CN 110044194 A CN110044194 A CN 110044194A
- Authority
- CN
- China
- Prior art keywords
- capillary structure
- heat transfer
- heat pipe
- reduce
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001704 evaporation Methods 0.000 claims abstract description 24
- 239000000843 powder Substances 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 6
- 238000003486 chemical etching Methods 0.000 claims description 5
- 239000011148 porous material Substances 0.000 claims description 3
- 230000015271 coagulation Effects 0.000 claims 3
- 238000005345 coagulation Methods 0.000 claims 3
- 239000007788 liquid Substances 0.000 abstract description 14
- 239000012530 fluid Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
Abstract
The present invention relates to heat transfer element technical fields, disclose a kind of heat pipe that can reduce heat transfer obstruction, including shell, porous capillary structure, sinter layer capillary structure, evaporating area and condensing zone, the shell seal and internal there is cavity, the evaporating area and the condensing zone are located at the both ends that can reduce the heat pipe that heat transfer hinders, the porous capillary structure includes several holes on the inner wall of the shell, and the sinter layer capillary structure includes the powder sintered layer for being covered in the surface of the porous capillary structure.The capillary structure of heat pipe in the present invention can reduce radial heat transfer and hinder, and increase capillary attraction, the heat transfer of evaporating area can be gone out as early as possible, and the liquid in shell can smoothly flow back.
Description
Technical field
The present invention relates to heat transfer element technical field more particularly to a kind of heat pipes that can reduce heat transfer and hinder.
Background technique
Requirement with consumer to each electronic product is higher and higher, trend of the electronic product progressively towards miniature portable
Development.However after small product size reduces, inner space is also restricted, and internal element arrangement is compact, is unfavorable for radiating, and is held
Easily there is the problem of element over-temperature.In order to solve this problem, it will usually which heat pipe is set at easy heater element to cool down.Heat
Pipe is generally made of shell, liquid-sucking core and end cap, and inside heat pipe is pumped into negative pressure state, is filled with the lower liquid of appropriate boiling point,
Its is readily volatilized.Liquid-sucking core is located at tube wall, with capillary structure.One end of heat pipe is evaporation ends, and the other end is condensation end.
When the evaporation ends of heat pipe are heated, the liquid in pipe evaporates rapidly, and steam flows to condensation end under small pressure difference, is condensing
End releases heat regelation into liquid to the cold, and liquid flows back to evaporator section along liquid-sucking core again, loops back and forth like this, and makes heat can
Come with continuously being conducted.In the process, liquid needs are returned by the capillary attraction of liquid-sucking core capillary structure
Stream.Traditional capillary structure has sinter layer capillary structure, still, sinter layer capillary structure radially conduct heat hinder it is larger, therefore,
It is badly in need of a kind of heat pipe that can reduce heat transfer obstruction.
Summary of the invention
For overcome the deficiencies in the prior art, the present invention provides a kind of heat pipe that can reduce heat transfer obstruction, the hair of the heat pipe
Fine texture can reduce radial heat transfer and hinder, and increase capillary attraction, the heat transfer of evaporating area can be gone out as early as possible, and in shell
Liquid can smoothly flow back.
The technical solution adopted by the present invention to solve the technical problems is:
Provide it is a kind of can reduce heat transfer hinder heat pipe, including shell, porous capillary structure, sinter layer capillary structure,
Evaporating area and condensing zone, the shell seal and inside have cavity, and the evaporating area and the condensing zone are located at described
The both ends for the heat pipe that heat transfer hinders can be reduced, the porous capillary structure includes the several holes on the inner wall of the shell
Hole, the sinter layer capillary structure include the powder sintered layer for being covered in the surface of the porous capillary structure.
As an improvement of the above technical solution, the surface of the side of inner sidewall of the sinter layer far from the shell is equipped with
Several protrusions and/or groove.
As a further improvement of the above technical scheme, the sinter layer capillary from the evaporating area to the condensing zone
The thickness of structure is gradually reduced.
As a further improvement of the above technical scheme, the powder sintered layer from the evaporating area to the condensing zone
Powder diameter be gradually increased.
As a further improvement of the above technical scheme, the porous capillary structure passes through chemical etching or chemical etching
Method be made.
As a further improvement of the above technical scheme, the porosity ranges of the porous capillary structure are 20%-60%,
The pore diameter range of described hole is 0.01mm-0.2mm, and the depth bounds of described hole are 0.05mm-0.8mm.
As a further improvement of the above technical scheme, the porous capillary knot from the evaporating area to the condensing zone
The aperture of the described hole of structure is gradually increased, and porosity is gradually reduced.
As a further improvement of the above technical scheme, several support columns are additionally provided in the cavity.
As a further improvement of the above technical scheme, support plate is additionally provided in the cavity, and in the support plate
Equipped with several through-holes.
It hinders, and increases the beneficial effects of the present invention are: the capillary structure of the heat pipe in the present invention can reduce radial heat transfer
Capillary attraction can as early as possible go out the heat transfer of evaporating area, and the liquid in shell can smoothly flow back.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples:
Fig. 1 is the cross-sectional view (not including support column/plate) of heat pipe in first embodiment of the invention；
Fig. 2 is the partial enlarged view in Fig. 1 at A；
Fig. 3 is the cross-sectional view of heat pipe in first embodiment of the invention；
Fig. 4 is the cross-sectional view of heat pipe in second embodiment of the invention.
Specific embodiment
It is carried out below with reference to technical effect of the embodiment and attached drawing to design of the invention, specific structure and generation clear
Chu, complete description, to be completely understood by the purpose of the present invention, scheme and effect.It should be noted that the case where not conflicting
Under, the features in the embodiments and the embodiments of the present application can be combined with each other.
It should be noted that unless otherwise specified, when a certain feature referred to as " fixation ", " connection " are in another feature,
It can directly fix, be connected to another feature, and can also fix, be connected to another feature indirectly.In addition, this
The descriptions such as up, down, left, right, before and after used in invention are only relative to the mutual of each component part of the invention in attached drawing
For positional relationship.
In addition, unless otherwise defined, the technology of all technical and scientific terms used herein and the art
The normally understood meaning of personnel is identical.Term used in the description is intended merely to description specific embodiment herein, without
It is to limit the present invention.Term " and or " used herein includes the arbitrary of one or more relevant listed items
Combination.
Referring to figs. 1 to Fig. 3, cross-sectional view (not including support column/plate), the office of heat pipe in first embodiment of the invention are shown
The cross-sectional view of portion's enlarged drawing and heat pipe.Heat pipe includes shell 1 and capillary structure 2.Capillary structure 2 is located at the interior of shell 1
Side-walls.1 inner hollow of shell and end-enclosed of heat pipe, inside be formed with cavity 3.It is placed in cavity 3 suitable low
The working fluid of fusing point, such as water, ethyl alcohol or acetone.Capillary structure 2 is by porous capillary structure 21 and sinter layer capillary structure 22
It is combined.Porous capillary structure 21 includes several small holes 211 on 1 inner sidewall of shell, sinter layer capillary structure
22 include the powder sintered layer for being attached to 21 surface of porous capillary structure.
Many small holes 211 are made by chemical etching or electrochemical etching process on the inner sidewall of shell 1, with shape
At porous capillary structure 21.If hole 211 is oversized, porosity is too small, may be inadequate to the capillary attraction of liquid, if
The undersized of hole 211, porosity is excessive, although its capillary attraction is larger, the flow resistance of liquid also therefore and
Increase, therefore, porosity and bore hole size need in the range of a relative equilibrium.It is common, porous capillary structure 21
Porosity ranges be 20%-60%, the pore diameter range of hole 211 is 0.01mm-0.2mm, and the depth bounds of hole 211 are
0.05mm-0.8mm。
The material of heat pipe can according to etching solution or etching power parameter be adjusted, in general, can be selected copper, aluminium, stainless steel,
The materials such as titanium or titanium alloy.Above-mentioned each parameter of porous capillary structure is selected according to the needs of use, it is suitable further according to parameter selection
Etchant concentration and power parameter.Hole is made in metal surface by etching method and belongs to the prior art, herein no longer
It repeats.
After porous capillary structure 21 is made on the inner sidewall of shell 1, metal is carried out on the surface of porous capillary structure 21
It is powder sintered, to form one layer of sinter layer capillary structure 22 at the surface of porous capillary structure 21.If sinter layer capillary
The thickness of structure 22 is too small, then may be inadequate for the capillary attraction of working fluid, if the thickness of sinter layer capillary structure 22
Excessive, then its radial heat-transfer capability is bad.It is common, 0.05mm- is set by the thickness range of sinter layer capillary structure 22
0.8mm。
In the present embodiment, the surface of sinter layer 22 is smooth curved surface, can also be in sinter layer 22 far from outer casing inner wall
Several protrusions of surface setting and/or groove of side, to increase the surface area of sinter layer 22, to improve heat transfer efficiency.
Heat pipe is equipped with evaporating area 11 and condensing zone 12, and evaporating area 11 and condensing zone 12 are located at two end regions of heat pipe,
Region between evaporating area 11 and condensing zone 12 is adiabatic region.Shell at evaporating area 11 is contacted with heat source, and heat source to steam
Working fluid inside at hair area 11 flashes to gas.Gas flows to condensing zone 12 in cavity 3, outer at condensing zone 12
It is equipped with radiating fin (not shown) at shell, and is equipped with fan, to accelerate the heat transfer in the region.Gas is in the area
Liquid will be liquefied as in domain to the cold, the inner sidewall that liquid is close to shell 1 under the capillary attraction effect of capillary structure 2 is back to steaming
Send out area 11.
In order to realize the reflux as early as possible of working fluid, the parameter of capillary structure 2 can be made along heat pipe Axial changes.Make to evaporate
The bore hole size of porous capillary structure of area 11 to condensing zone 12 is gradually increased, and hole depth is gradually reduced, and porosity gradually subtracts
It is small.It is gradually reduced evaporating area 11 to the thickness of the sinter layer capillary structure 22 of condensing zone 12, and makes the powder of powder sintered layer
Partial size is gradually increased.By above-mentioned means, capillary structure 2 can be made to the capillary attraction of liquid from evaporating area 11 to condensing zone 12
It is gradually reduced, the liquid for being conducive to condensing zone 12 is back to evaporating area 11 as early as possible.
In addition, can also place support column 4 in the cavity of heat pipe in order to enhance the pipe walls support of opposite heat tube and be carried out to it
Support, prevents it to be deformed when in use since intensity is too low.The both ends of support column 4 are both secured to the inner wall of heat pipe.For
Support column 4 is avoided to stop the flow channel in cavity 3, what can not support column 4 be arranged is excessively intensive.Alternatively, may also set up
Support plate matches the shape of support plate with the cross-sectional shape size of heat pipe, and several through-holes is arranged on the supporting plate to make
For gas flow channel.
In the present embodiment, by combining porous capillary structure with sinter layer capillary structure, make the performance of heat pipe more
It is excellent.Not only radial direction thermal resistance is reduced, but also increases the capillary attraction to working fluid, to make heat pipe that there is preferable heat transfer energy
Power.
Referring to Fig. 4, the cross-sectional view of heat pipe in second embodiment of the invention is shown.The present embodiment and first is implemented
The difference of example is only that the shell shape of heat pipe is different.Shell can change shape, the not unique selection of tubulose as needed.
It is to be illustrated to what preferable implementation of the invention carried out, but the invention is not limited to the implementation above
Example, those skilled in the art can also make various equivalent variations on the premise of without prejudice to spirit of the invention or replace
It changes, these equivalent deformations or replacement are all included in the scope defined by the claims of the present application.
Claims (9)
1. a kind of can reduce the heat pipe that heat transfer hinders, which is characterized in that including shell, porous capillary structure, sinter layer capillary knot
Structure, evaporating area and condensing zone, the shell seal and inside have cavity, and the evaporating area and the condensing zone are located at institute
The both ends that can reduce the heat pipe that heat transfer hinders are stated, the porous capillary structure includes the several holes on the inner wall of the shell
Hole, the sinter layer capillary structure include the powder sintered layer for being covered in the surface of the porous capillary structure.
2. according to claim 1 can reduce the heat pipe that heat transfer hinders, which is characterized in that the sinter layer is far from described outer
The surface of the side of the inner sidewall of shell is equipped with several protrusions and/or groove.
3. according to claim 1 can reduce the heat pipe that heat transfer hinders, which is characterized in that from the evaporating area to described cold
The thickness of the sinter layer capillary structure of coagulation zone is gradually reduced.
4. according to claim 1 can reduce the heat pipe that heat transfer hinders, which is characterized in that from the evaporating area to described cold
The powder diameter of the powder sintered layer of coagulation zone is gradually increased.
5. according to claim 1 can reduce the heat pipe that heat transfer hinders, which is characterized in that the porous capillary structure passes through
The method of chemical etching or chemical etching is made.
6. according to claim 1 can reduce the heat pipe that heat transfer hinders, which is characterized in that the hole of the porous capillary structure
Gap rate range is 20%-60%, and the pore diameter range of described hole is 0.01mm-0.2mm, and the depth bounds of described hole are
0.05mm-0.8mm。
7. according to claim 1 can reduce the heat pipe that heat transfer hinders, which is characterized in that from the evaporating area to described cold
The aperture of the described hole of the porous capillary structure of coagulation zone is gradually increased, and porosity is gradually reduced.
8. according to claim 1 can reduce the heat pipe that heat transfer hinders, which is characterized in that if being additionally provided in the cavity
Heavenly Stems and Earthly Branches dagger.
9. according to claim 1 can reduce the heat pipe that heat transfer hinders, which is characterized in that be additionally provided with branch in the cavity
Fagging, and the support plate is equipped with several through-holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910354668.9A CN110044194A (en) | 2019-04-29 | 2019-04-29 | It is a kind of to reduce the heat pipe that heat transfer hinders |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910354668.9A CN110044194A (en) | 2019-04-29 | 2019-04-29 | It is a kind of to reduce the heat pipe that heat transfer hinders |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110044194A true CN110044194A (en) | 2019-07-23 |
Family
ID=67280147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910354668.9A Pending CN110044194A (en) | 2019-04-29 | 2019-04-29 | It is a kind of to reduce the heat pipe that heat transfer hinders |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110044194A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230098773A1 (en) * | 2021-09-30 | 2023-03-30 | Amulaire Thermal Technology, Inc. | Immersion-type porous heat dissipation substrate structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101839660A (en) * | 2010-03-31 | 2010-09-22 | 华南理工大学 | Flat heat tube with hole-groove combined mandrel and manufacturing method thereof |
| CN102168931A (en) * | 2010-02-26 | 2011-08-31 | 昆山德泰新金属粉末有限公司 | Flat type radiating pipe and manufacturing method thereof |
| CN102818466A (en) * | 2012-08-15 | 2012-12-12 | 中山伟强科技有限公司 | Heat pipe |
| CN102878843A (en) * | 2011-07-15 | 2013-01-16 | 富瑞精密组件（昆山）有限公司 | Heat pipe |
| US20130175008A1 (en) * | 2012-01-10 | 2013-07-11 | Chien-Chih Yeh | Thin heat pipe |
| US20160091258A1 (en) * | 2014-09-30 | 2016-03-31 | Fujikura Ltd. | Heat pipe |
| CN106323061A (en) * | 2015-06-30 | 2017-01-11 | 极致科技股份有限公司 | Micro heat pipe and manufacturing method of micro heat pipe |
| CN209978683U (en) * | 2019-04-29 | 2020-01-21 | 深圳市尚翼实业有限公司 | Heat pipe capable of reducing heat transfer obstruction |
-
2019
- 2019-04-29 CN CN201910354668.9A patent/CN110044194A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102168931A (en) * | 2010-02-26 | 2011-08-31 | 昆山德泰新金属粉末有限公司 | Flat type radiating pipe and manufacturing method thereof |
| CN101839660A (en) * | 2010-03-31 | 2010-09-22 | 华南理工大学 | Flat heat tube with hole-groove combined mandrel and manufacturing method thereof |
| CN102878843A (en) * | 2011-07-15 | 2013-01-16 | 富瑞精密组件（昆山）有限公司 | Heat pipe |
| US20130175008A1 (en) * | 2012-01-10 | 2013-07-11 | Chien-Chih Yeh | Thin heat pipe |
| CN102818466A (en) * | 2012-08-15 | 2012-12-12 | 中山伟强科技有限公司 | Heat pipe |
| US20160091258A1 (en) * | 2014-09-30 | 2016-03-31 | Fujikura Ltd. | Heat pipe |
| CN106323061A (en) * | 2015-06-30 | 2017-01-11 | 极致科技股份有限公司 | Micro heat pipe and manufacturing method of micro heat pipe |
| CN209978683U (en) * | 2019-04-29 | 2020-01-21 | 深圳市尚翼实业有限公司 | Heat pipe capable of reducing heat transfer obstruction |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230098773A1 (en) * | 2021-09-30 | 2023-03-30 | Amulaire Thermal Technology, Inc. | Immersion-type porous heat dissipation substrate structure |
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