US20120048518A1 - Flat heat pipe with internal supporting element - Google Patents
Flat heat pipe with internal supporting element Download PDFInfo
- Publication number
- US20120048518A1 US20120048518A1 US12/885,571 US88557110A US2012048518A1 US 20120048518 A1 US20120048518 A1 US 20120048518A1 US 88557110 A US88557110 A US 88557110A US 2012048518 A1 US2012048518 A1 US 2012048518A1
- Authority
- US
- United States
- Prior art keywords
- heat pipe
- supporting element
- housing
- flat heat
- wick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000012530 fluid Substances 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 5
- 239000011148 porous material Substances 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2240/00—Spacing means
Definitions
- the present disclosure relates to heat dissipation, and more particularly to a flat heat pipe.
- a commonly used flat heat pipe includes a flat housing, a wick attached to an inner surface of the housing, and a working fluid contained in the housing.
- the housing is thin and prone to sustain deformation from external force. When this happens, the normal functions and capabilities of the flat heat pipe are liable to be adversely affected.
- FIG. 1 is an assembled view of a flat heat pipe of an embodiment of the present disclosure.
- FIG. 2 is a cross section of the flat heat pipe of FIG. 1 , taken along line II-II thereof.
- FIG. 3 is an isometric view of a supporting element of the heat pipe of FIG. 2 .
- a flat heat pipe of the present embodiment includes a flat housing 10 , a wick 20 attached to an inner surface of the housing 10 , a supporting element 30 enclosed by the wick 20 and biasing the wick 20 against the housing 10 , and a working fluid (not shown) contained in the housing 10 .
- the working fluid is water, alcohol or other material having a relatively low boiling point, which can easily change to vapor when absorbing heat from the housing 10 .
- the housing 10 has both ends thereof hermetically sealed, and maintains a substantial vacuum therein.
- the housing 10 is made from a single body of material which is hermetically crimped at both ends thereof.
- the housing 10 is made of a high heat conductivity material such as copper.
- the housing 10 includes an elongated top plate 11 , an elongated bottom plate 13 , and two curved connecting plates 15 .
- the bottom plate 13 is spaced from and parallel to the top plate 11 .
- the two connecting plates 15 adjoin opposite lateral sides of the top and bottom plate 11 , 13 , respectively.
- the bottom plate 13 is an evaporating portion of the flat heat pipe, and is for thermally contacting a heat source (not shown) and absorbing heat therefrom.
- the top plate 11 is a condensing portion of the flat heat pipe, and is for dissipating heat transferred from the bottom plate 13 .
- the wick 20 is evenly distributed on the inner surface of the housing 10 .
- the wick 20 has the shape of a flattened ellipse.
- the wick 20 has a porous structure, which may be in the form of grooves, sintered powder, screen mesh, or bundles of fiber. The porous structure enables capillary force to act to absorb condensed working fluid at the top plate 11 of the flat heat pipe and convey the working fluid to the bottom plate 13 of the flat heat pipe.
- the supporting element 30 is a woven screen made of a multiplicity of metal wires 31 and a multiplicity of metal wires 33 .
- the wires 31 are spaced from and parallel to each other, and wires 33 are spaced from and parallel to each other.
- the wires 31 and the wires 33 are interwoven.
- material of the wires 31 , 33 is the same as that of the housing 10 .
- a plurality of holes 35 is defined in the supporting element 30 through which the working fluid flows. An average diameter of the holes 35 exceeds an average diameter of the pores of the wick 20 .
- a density of the holes 35 of the supporting element 30 is in the range from 5 ⁇ 50 mesh/inch.
- a width of the supporting element 30 is equal to that of the top plate 11 of the container 10 , as measured between the two connecting plates 15 .
- a length of the supporting element 30 is smaller than that of the top plate 11 , as measured in a direction perpendicular to the line II-II of FIG. 2 .
- the supporting element 30 is located at a middle of the housing 10 . Top and bottom sides of the supporting element 30 elastically bias top and bottom portions of the wick 20 against the top plate 11 and the bottom plate 13 of the housing 10 , to avoid deformation of the housing 10 when the top plate 11 or the bottom plate 13 is compressed. Thus, compressive resistance of the flat heat pipe is improved.
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- 1. Technical Field
- The present disclosure relates to heat dissipation, and more particularly to a flat heat pipe.
- 2. Description of Related Art
- A commonly used flat heat pipe includes a flat housing, a wick attached to an inner surface of the housing, and a working fluid contained in the housing. However, the housing is thin and prone to sustain deformation from external force. When this happens, the normal functions and capabilities of the flat heat pipe are liable to be adversely affected.
- It is thus desirable to provide a flat heat pipe which can overcome the described limitations.
-
FIG. 1 is an assembled view of a flat heat pipe of an embodiment of the present disclosure. -
FIG. 2 is a cross section of the flat heat pipe ofFIG. 1 , taken along line II-II thereof. -
FIG. 3 is an isometric view of a supporting element of the heat pipe ofFIG. 2 . - Referring to
FIGS. 1-2 , a flat heat pipe of the present embodiment includes aflat housing 10, awick 20 attached to an inner surface of thehousing 10, a supportingelement 30 enclosed by thewick 20 and biasing thewick 20 against thehousing 10, and a working fluid (not shown) contained in thehousing 10. - The working fluid is water, alcohol or other material having a relatively low boiling point, which can easily change to vapor when absorbing heat from the
housing 10. - The
housing 10 has both ends thereof hermetically sealed, and maintains a substantial vacuum therein. In the present embodiment, thehousing 10 is made from a single body of material which is hermetically crimped at both ends thereof. Thehousing 10 is made of a high heat conductivity material such as copper. Thehousing 10 includes an elongatedtop plate 11, anelongated bottom plate 13, and twocurved connecting plates 15. Thebottom plate 13 is spaced from and parallel to thetop plate 11. The two connectingplates 15 adjoin opposite lateral sides of the top andbottom plate bottom plate 13 is an evaporating portion of the flat heat pipe, and is for thermally contacting a heat source (not shown) and absorbing heat therefrom. Thetop plate 11 is a condensing portion of the flat heat pipe, and is for dissipating heat transferred from thebottom plate 13. - The
wick 20 is evenly distributed on the inner surface of thehousing 10. In the cross-section ofFIG. 2 , thewick 20 has the shape of a flattened ellipse. Thewick 20 has a porous structure, which may be in the form of grooves, sintered powder, screen mesh, or bundles of fiber. The porous structure enables capillary force to act to absorb condensed working fluid at thetop plate 11 of the flat heat pipe and convey the working fluid to thebottom plate 13 of the flat heat pipe. - Referring also to
FIG. 3 , the supportingelement 30 is a woven screen made of a multiplicity ofmetal wires 31 and a multiplicity ofmetal wires 33. Thewires 31 are spaced from and parallel to each other, andwires 33 are spaced from and parallel to each other. Thewires 31 and thewires 33 are interwoven. Preferably, material of thewires housing 10. A plurality ofholes 35 is defined in the supportingelement 30 through which the working fluid flows. An average diameter of theholes 35 exceeds an average diameter of the pores of thewick 20. A density of theholes 35 of the supportingelement 30 is in the range from 5˜50 mesh/inch. A width of the supportingelement 30 is equal to that of thetop plate 11 of thecontainer 10, as measured between the two connectingplates 15. A length of the supportingelement 30 is smaller than that of thetop plate 11, as measured in a direction perpendicular to the line II-II ofFIG. 2 . The supportingelement 30 is located at a middle of thehousing 10. Top and bottom sides of the supportingelement 30 elastically bias top and bottom portions of thewick 20 against thetop plate 11 and thebottom plate 13 of thehousing 10, to avoid deformation of thehousing 10 when thetop plate 11 or thebottom plate 13 is compressed. Thus, compressive resistance of the flat heat pipe is improved. - It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010263680.8 | 2010-08-26 | ||
CN2010102636808A CN102374808A (en) | 2010-08-26 | 2010-08-26 | Flat-plate type vapor chamber |
Publications (1)
Publication Number | Publication Date |
---|---|
US20120048518A1 true US20120048518A1 (en) | 2012-03-01 |
Family
ID=45695583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/885,571 Abandoned US20120048518A1 (en) | 2010-08-26 | 2010-09-19 | Flat heat pipe with internal supporting element |
Country Status (2)
Country | Link |
---|---|
US (1) | US20120048518A1 (en) |
CN (1) | CN102374808A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110048341A1 (en) * | 2009-09-03 | 2011-03-03 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Vapor chamber and method for manufacturing the same |
US20130213611A1 (en) * | 2012-02-22 | 2013-08-22 | Chun-Ming Wu | Heat pipe heat dissipation structure |
US20140290913A1 (en) * | 2013-03-28 | 2014-10-02 | Quanta Computer Inc. | Heat transfer module, heat pipe, and manufacturing method of heat pipe |
US20150122460A1 (en) * | 2013-11-06 | 2015-05-07 | Asia Vital Components Co., Ltd. | Heat pipe structure |
US20170067696A1 (en) * | 2015-09-08 | 2017-03-09 | Acmecools Tech. Ltd. | Vapor chamber |
EP3330654A4 (en) * | 2015-07-27 | 2019-03-06 | Chi-Te Chin | Plate-like temperature uniforming device |
WO2022256629A1 (en) * | 2021-06-04 | 2022-12-08 | Kuprion, Inc. | Heat pipes featuring coefficient of thermal expansion matching and heat dissipation using same |
US20230030019A1 (en) * | 2021-07-27 | 2023-02-02 | Asia Vital Components Co., Ltd. | Heat pipe structure |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106403674B (en) * | 2015-07-27 | 2019-01-04 | 极致科技股份有限公司 | Plate temperature equalization system |
CN107333442A (en) * | 2017-07-24 | 2017-11-07 | 苏州天脉导热科技有限公司 | Ultra-thin soaking plate and preparation method thereof |
CN107388863A (en) * | 2017-08-22 | 2017-11-24 | 华南理工大学 | A kind of soaking plate structure |
CN110678042A (en) * | 2019-09-30 | 2020-01-10 | 华南理工大学 | Hot-pressing type flexible phase change soaking zone/board based on polymer film and manufacturing method thereof |
CN113571486A (en) * | 2020-08-04 | 2021-10-29 | 昆山同川铜业科技有限公司 | Phase-change latent heat type chip radiator |
CN113758330A (en) * | 2021-09-02 | 2021-12-07 | Oppo广东移动通信有限公司 | Heat transfer element and terminal |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3604504A (en) * | 1970-05-13 | 1971-09-14 | Rca Corp | Flexible heat pipe |
US20060157229A1 (en) * | 2005-01-14 | 2006-07-20 | Foxconn Technology Co., Ltd. | Heat pipe |
US20080210407A1 (en) * | 2005-01-06 | 2008-09-04 | Celsia Technologies Korea Inc. | Heat Transfer Device and Manufacturing Method Thereof Using Hydrophilic Wick |
US20100006268A1 (en) * | 2008-07-14 | 2010-01-14 | Meyer Iv George Anthony | Vapor chamber and supporting structure of the same |
US20100084113A1 (en) * | 2006-10-11 | 2010-04-08 | Jeong Hyun Lee | Method for heat transfer and device therefor |
US20100155031A1 (en) * | 2008-12-22 | 2010-06-24 | Furui Precise Component (Kunshan) Co., Ltd. | Heat pipe and method of making the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3834457A (en) * | 1971-01-18 | 1974-09-10 | Bendix Corp | Laminated heat pipe and method of manufacture |
JPS56146989A (en) * | 1980-04-15 | 1981-11-14 | Fujikura Ltd | Heat pipe |
JP3164518B2 (en) * | 1995-12-21 | 2001-05-08 | 古河電気工業株式会社 | Flat heat pipe |
KR20050032888A (en) * | 2003-10-02 | 2005-04-08 | 엘에스전선 주식회사 | Flat plate heat transfer device |
-
2010
- 2010-08-26 CN CN2010102636808A patent/CN102374808A/en active Pending
- 2010-09-19 US US12/885,571 patent/US20120048518A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3604504A (en) * | 1970-05-13 | 1971-09-14 | Rca Corp | Flexible heat pipe |
US20080210407A1 (en) * | 2005-01-06 | 2008-09-04 | Celsia Technologies Korea Inc. | Heat Transfer Device and Manufacturing Method Thereof Using Hydrophilic Wick |
US20060157229A1 (en) * | 2005-01-14 | 2006-07-20 | Foxconn Technology Co., Ltd. | Heat pipe |
US20100084113A1 (en) * | 2006-10-11 | 2010-04-08 | Jeong Hyun Lee | Method for heat transfer and device therefor |
US20100006268A1 (en) * | 2008-07-14 | 2010-01-14 | Meyer Iv George Anthony | Vapor chamber and supporting structure of the same |
US20100155031A1 (en) * | 2008-12-22 | 2010-06-24 | Furui Precise Component (Kunshan) Co., Ltd. | Heat pipe and method of making the same |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110048341A1 (en) * | 2009-09-03 | 2011-03-03 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Vapor chamber and method for manufacturing the same |
US20130213611A1 (en) * | 2012-02-22 | 2013-08-22 | Chun-Ming Wu | Heat pipe heat dissipation structure |
US9170058B2 (en) * | 2012-02-22 | 2015-10-27 | Asia Vital Components Co., Ltd. | Heat pipe heat dissipation structure |
US20140290913A1 (en) * | 2013-03-28 | 2014-10-02 | Quanta Computer Inc. | Heat transfer module, heat pipe, and manufacturing method of heat pipe |
US20150122460A1 (en) * | 2013-11-06 | 2015-05-07 | Asia Vital Components Co., Ltd. | Heat pipe structure |
EP3330654A4 (en) * | 2015-07-27 | 2019-03-06 | Chi-Te Chin | Plate-like temperature uniforming device |
US20170067696A1 (en) * | 2015-09-08 | 2017-03-09 | Acmecools Tech. Ltd. | Vapor chamber |
US10012446B2 (en) * | 2015-09-08 | 2018-07-03 | Acmecools Tech. Ltd. | Vapor chamber |
WO2022256629A1 (en) * | 2021-06-04 | 2022-12-08 | Kuprion, Inc. | Heat pipes featuring coefficient of thermal expansion matching and heat dissipation using same |
US20230030019A1 (en) * | 2021-07-27 | 2023-02-02 | Asia Vital Components Co., Ltd. | Heat pipe structure |
Also Published As
Publication number | Publication date |
---|---|
CN102374808A (en) | 2012-03-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHOU, ZHI-YONG;ZHANG, SHENG-CHAO;ZHANG, JUN;REEL/FRAME:025009/0951 Effective date: 20100916 Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHOU, ZHI-YONG;ZHANG, SHENG-CHAO;ZHANG, JUN;REEL/FRAME:025009/0951 Effective date: 20100916 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |