TWI382098B - 汽化有機材料應用之控制 - Google Patents

汽化有機材料應用之控制 Download PDF

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Publication number
TWI382098B
TWI382098B TW094139064A TW94139064A TWI382098B TW I382098 B TWI382098 B TW I382098B TW 094139064 A TW094139064 A TW 094139064A TW 94139064 A TW94139064 A TW 94139064A TW I382098 B TWI382098 B TW I382098B
Authority
TW
Taiwan
Prior art keywords
organic material
manifold
vaporization
heating device
temperature
Prior art date
Application number
TW094139064A
Other languages
English (en)
Chinese (zh)
Other versions
TW200622014A (en
Inventor
Jeremy Matthew Grace
Michael Long
Michael Louis Boroson
Jinmei Zhang
Bruce Edward Koppe
Thomas William Palone
Neil Peter Redden
Original Assignee
Global Oled Technology Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Global Oled Technology Llc filed Critical Global Oled Technology Llc
Publication of TW200622014A publication Critical patent/TW200622014A/zh
Application granted granted Critical
Publication of TWI382098B publication Critical patent/TWI382098B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
TW094139064A 2004-11-09 2005-11-08 汽化有機材料應用之控制 TWI382098B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/984,667 US7465475B2 (en) 2004-11-09 2004-11-09 Method for controlling the deposition of vaporized organic material

Publications (2)

Publication Number Publication Date
TW200622014A TW200622014A (en) 2006-07-01
TWI382098B true TWI382098B (zh) 2013-01-11

Family

ID=35589528

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094139064A TWI382098B (zh) 2004-11-09 2005-11-08 汽化有機材料應用之控制

Country Status (8)

Country Link
US (1) US7465475B2 (enExample)
EP (5) EP2278042B1 (enExample)
JP (1) JP5270165B2 (enExample)
KR (1) KR101212581B1 (enExample)
CN (1) CN101052738B (enExample)
DE (1) DE602005022765D1 (enExample)
TW (1) TWI382098B (enExample)
WO (1) WO2006052467A2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7465475B2 (en) 2004-11-09 2008-12-16 Eastman Kodak Company Method for controlling the deposition of vaporized organic material
US8986780B2 (en) * 2004-11-19 2015-03-24 Massachusetts Institute Of Technology Method and apparatus for depositing LED organic film
US7989021B2 (en) 2005-07-27 2011-08-02 Global Oled Technology Llc Vaporizing material at a uniform rate
JP4959961B2 (ja) * 2005-07-29 2012-06-27 株式会社ジャパンディスプレイセントラル 有機ｅｌ素子の製造方法
US7883583B2 (en) * 2008-01-08 2011-02-08 Global Oled Technology Llc Vaporization apparatus with precise powder metering
US8852347B2 (en) * 2010-06-11 2014-10-07 Tokyo Electron Limited Apparatus for chemical vapor deposition control
US9345573B2 (en) 2012-05-30 2016-05-24 Neovasc Tiara Inc. Methods and apparatus for loading a prosthesis onto a delivery system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1357200A1 (en) * 2002-04-25 2003-10-29 Eastman Kodak Company Thermal PVD apparatus with detachable vapor source(s)
TW575699B (en) * 1997-11-17 2004-02-11 Univ Princeton Low pressure vapor phase deposition of organic thin films

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US5860279A (en) * 1994-02-14 1999-01-19 Bronicki; Lucien Y. Method and apparatus for cooling hot fluids
US5900279A (en) * 1995-11-20 1999-05-04 Tri Chemical Laboratory Inc. Processes for the chemical vapor deposition and solvent used for the processes
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US6070551A (en) * 1996-05-13 2000-06-06 Applied Materials, Inc. Deposition chamber and method for depositing low dielectric constant films
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US5904961A (en) * 1997-01-24 1999-05-18 Eastman Kodak Company Method of depositing organic layers in organic light emitting devices
CN1144198C (zh) * 1997-05-08 2004-03-31 松下电器产业株式会社 光记录媒体制造装置和制造方法
EP0895206A1 (de) 1997-07-29 1999-02-03 Esselte Meto International GmbH Sicherungselement für die elektronische Artikelsicherung
US5869135A (en) * 1997-10-03 1999-02-09 Massachusetts Institute Of Technology Selective chemical vapor deposition of polymers
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Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW575699B (en) * 1997-11-17 2004-02-11 Univ Princeton Low pressure vapor phase deposition of organic thin films
EP1357200A1 (en) * 2002-04-25 2003-10-29 Eastman Kodak Company Thermal PVD apparatus with detachable vapor source(s)

Also Published As

Publication number Publication date
WO2006052467A2 (en) 2006-05-18
EP2278043A1 (en) 2011-01-26
EP2278042A1 (en) 2011-01-26
EP2278042B1 (en) 2017-02-08
JP2008519905A (ja) 2008-06-12
EP2216425A3 (en) 2010-11-10
US20060099345A1 (en) 2006-05-11
CN101052738B (zh) 2011-04-27
WO2006052467A3 (en) 2006-12-21
EP2278044B1 (en) 2017-02-08
JP5270165B2 (ja) 2013-08-21
KR20070084078A (ko) 2007-08-24
CN101052738A (zh) 2007-10-10
EP1831421A2 (en) 2007-09-12
TW200622014A (en) 2006-07-01
EP1831421B1 (en) 2010-08-04
DE602005022765D1 (de) 2010-09-16
EP2216425A2 (en) 2010-08-11
KR101212581B1 (ko) 2012-12-14
US7465475B2 (en) 2008-12-16
EP2278043B1 (en) 2016-08-17
EP2278044A1 (en) 2011-01-26

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