JP5270165B2 - 気化した有機材料の付着の制御 - Google Patents

気化した有機材料の付着の制御 Download PDF

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Publication number
JP5270165B2
JP5270165B2 JP2007540349A JP2007540349A JP5270165B2 JP 5270165 B2 JP5270165 B2 JP 5270165B2 JP 2007540349 A JP2007540349 A JP 2007540349A JP 2007540349 A JP2007540349 A JP 2007540349A JP 5270165 B2 JP5270165 B2 JP 5270165B2
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JP
Japan
Prior art keywords
organic material
manifold
temperature
vaporized
heating device
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Expired - Lifetime
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JP2007540349A
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English (en)
Japanese (ja)
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JP2008519905A (ja
JP2008519905A5 (enExample
Inventor
マシュー グレース，ジェレミー
ロング，マイケル
ルイス ボロソン，マイケル
チャン，ジンメイ
エドワード コッペ，ブルース
ウィリアム パロン，トーマス
ピーター レッデン，ニール
Original Assignee
グローバル オーエルイーディー テクノロジー リミティド ライアビリティ カンパニー
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Publication of JP2008519905A publication Critical patent/JP2008519905A/ja
Publication of JP2008519905A5 publication Critical patent/JP2008519905A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
JP2007540349A 2004-11-09 2005-10-26 気化した有機材料の付着の制御 Expired - Lifetime JP5270165B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/984,667 2004-11-09
US10/984,667 US7465475B2 (en) 2004-11-09 2004-11-09 Method for controlling the deposition of vaporized organic material
PCT/US2005/038767 WO2006052467A2 (en) 2004-11-09 2005-10-26 Controlling the application of vaporized organic material

Publications (3)

Publication Number Publication Date
JP2008519905A JP2008519905A (ja) 2008-06-12
JP2008519905A5 JP2008519905A5 (enExample) 2008-10-30
JP5270165B2 true JP5270165B2 (ja) 2013-08-21

Family

ID=35589528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007540349A Expired - Lifetime JP5270165B2 (ja) 2004-11-09 2005-10-26 気化した有機材料の付着の制御

Country Status (8)

Country Link
US (1) US7465475B2 (enExample)
EP (5) EP2278042B1 (enExample)
JP (1) JP5270165B2 (enExample)
KR (1) KR101212581B1 (enExample)
CN (1) CN101052738B (enExample)
DE (1) DE602005022765D1 (enExample)
TW (1) TWI382098B (enExample)
WO (1) WO2006052467A2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7465475B2 (en) 2004-11-09 2008-12-16 Eastman Kodak Company Method for controlling the deposition of vaporized organic material
US8986780B2 (en) * 2004-11-19 2015-03-24 Massachusetts Institute Of Technology Method and apparatus for depositing LED organic film
US7989021B2 (en) 2005-07-27 2011-08-02 Global Oled Technology Llc Vaporizing material at a uniform rate
JP4959961B2 (ja) * 2005-07-29 2012-06-27 株式会社ジャパンディスプレイセントラル 有機ｅｌ素子の製造方法
US7883583B2 (en) * 2008-01-08 2011-02-08 Global Oled Technology Llc Vaporization apparatus with precise powder metering
US8852347B2 (en) * 2010-06-11 2014-10-07 Tokyo Electron Limited Apparatus for chemical vapor deposition control
US9345573B2 (en) 2012-05-30 2016-05-24 Neovasc Tiara Inc. Methods and apparatus for loading a prosthesis onto a delivery system

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US3928659A (en) * 1970-02-12 1975-12-23 Alexander Samuel Baxter Methods of and means for vacuum deposition
JPS58167602A (ja) * 1982-03-29 1983-10-03 Futaba Corp 有機物薄膜の形成方法
US5860279A (en) * 1994-02-14 1999-01-19 Bronicki; Lucien Y. Method and apparatus for cooling hot fluids
US5900279A (en) * 1995-11-20 1999-05-04 Tri Chemical Laboratory Inc. Processes for the chemical vapor deposition and solvent used for the processes
JPH09219289A (ja) 1996-02-09 1997-08-19 Chisso Corp 有機薄膜電界発光素子とその製造方法
CN1104259C (zh) * 1996-02-09 2003-04-02 斯坦内尔公司 用于蒸发液体活性物质的装置
US6070551A (en) * 1996-05-13 2000-06-06 Applied Materials, Inc. Deposition chamber and method for depositing low dielectric constant films
JPH1027761A (ja) * 1996-07-09 1998-01-27 Sony Corp 化学反応装置
US5804259A (en) * 1996-11-07 1998-09-08 Applied Materials, Inc. Method and apparatus for depositing a multilayered low dielectric constant film
US5904961A (en) * 1997-01-24 1999-05-18 Eastman Kodak Company Method of depositing organic layers in organic light emitting devices
CN1144198C (zh) * 1997-05-08 2004-03-31 松下电器产业株式会社 光记录媒体制造装置和制造方法
EP0895206A1 (de) 1997-07-29 1999-02-03 Esselte Meto International GmbH Sicherungselement für die elektronische Artikelsicherung
US5869135A (en) * 1997-10-03 1999-02-09 Massachusetts Institute Of Technology Selective chemical vapor deposition of polymers
US6051321A (en) * 1997-10-24 2000-04-18 Quester Technology, Inc. Low dielectric constant materials and method
US6337102B1 (en) * 1997-11-17 2002-01-08 The Trustees Of Princeton University Low pressure vapor phase deposition of organic thin films
JP2000068055A (ja) 1998-08-26 2000-03-03 Tdk Corp 有機ｅｌ素子用蒸発源、この有機ｅｌ素子用蒸発源を用いた有機ｅｌ素子の製造装置および製造方法
US6237529B1 (en) * 2000-03-03 2001-05-29 Eastman Kodak Company Source for thermal physical vapor deposition of organic electroluminescent layers
JP2002030419A (ja) * 2000-07-18 2002-01-31 Canon Inc 成膜装置および方法
JP2002146516A (ja) * 2000-11-07 2002-05-22 Sony Corp 有機薄膜の蒸着方法
US20030129299A1 (en) 2000-11-16 2003-07-10 Swanson Leland S. Selective deposition of emissive layer in electroluminescent displays
JP4593008B2 (ja) * 2001-05-23 2010-12-08 キヤノンアネルバ株式会社 蒸着源並びにそれを用いた薄膜形成方法及び形成装置
US6749906B2 (en) * 2002-04-25 2004-06-15 Eastman Kodak Company Thermal physical vapor deposition apparatus with detachable vapor source(s) and method
US7056560B2 (en) * 2002-05-08 2006-06-06 Applies Materials Inc. Ultra low dielectric materials based on hybrid system of linear silicon precursor and organic porogen by plasma-enhanced chemical vapor deposition (PECVD)
JP3822135B2 (ja) * 2002-05-13 2006-09-13 日本パイオニクス株式会社 気化供給装置
JP2004010990A (ja) * 2002-06-10 2004-01-15 Sony Corp 薄膜形成装置
KR100490537B1 (ko) * 2002-07-23 2005-05-17 삼성에스디아이 주식회사 가열용기와 이를 이용한 증착장치
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JP4366226B2 (ja) * 2004-03-30 2009-11-18 東北パイオニア株式会社 有機ｅｌパネルの製造方法、有機ｅｌパネルの成膜装置
DE102004041854B4 (de) * 2004-04-27 2008-11-13 Von Ardenne Anlagentechnik Gmbh Verfahren und Vorrichtung zur thermischen Vakuumbeschichtung
US7465475B2 (en) 2004-11-09 2008-12-16 Eastman Kodak Company Method for controlling the deposition of vaporized organic material

Also Published As

Publication number Publication date
WO2006052467A2 (en) 2006-05-18
EP2278043A1 (en) 2011-01-26
EP2278042A1 (en) 2011-01-26
EP2278042B1 (en) 2017-02-08
JP2008519905A (ja) 2008-06-12
EP2216425A3 (en) 2010-11-10
US20060099345A1 (en) 2006-05-11
CN101052738B (zh) 2011-04-27
WO2006052467A3 (en) 2006-12-21
EP2278044B1 (en) 2017-02-08
TWI382098B (zh) 2013-01-11
KR20070084078A (ko) 2007-08-24
CN101052738A (zh) 2007-10-10
EP1831421A2 (en) 2007-09-12
TW200622014A (en) 2006-07-01
EP1831421B1 (en) 2010-08-04
DE602005022765D1 (de) 2010-09-16
EP2216425A2 (en) 2010-08-11
KR101212581B1 (ko) 2012-12-14
US7465475B2 (en) 2008-12-16
EP2278043B1 (en) 2016-08-17
EP2278044A1 (en) 2011-01-26

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