TWI382040B - And a method for producing a polyimide film having high adhesion - Google Patents

And a method for producing a polyimide film having high adhesion Download PDF

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Publication number
TWI382040B
TWI382040B TW94132872A TW94132872A TWI382040B TW I382040 B TWI382040 B TW I382040B TW 94132872 A TW94132872 A TW 94132872A TW 94132872 A TW94132872 A TW 94132872A TW I382040 B TWI382040 B TW I382040B
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TW
Taiwan
Prior art keywords
component
thermoplastic
polyimine
film
producing
Prior art date
Application number
TW94132872A
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English (en)
Chinese (zh)
Other versions
TW200619270A (en
Inventor
金城永泰
菊池剛
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鐘化股份有限公司
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Application filed by 鐘化股份有限公司 filed Critical 鐘化股份有限公司
Publication of TW200619270A publication Critical patent/TW200619270A/zh
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Publication of TWI382040B publication Critical patent/TWI382040B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable
    • Y10T428/2826—Synthetic resin or polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Moulding By Coating Moulds (AREA)
  • Laminated Bodies (AREA)
TW94132872A 2004-09-24 2005-09-22 And a method for producing a polyimide film having high adhesion TWI382040B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004276766 2004-09-24

Publications (2)

Publication Number Publication Date
TW200619270A TW200619270A (en) 2006-06-16
TWI382040B true TWI382040B (zh) 2013-01-11

Family

ID=36090083

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94132872A TWI382040B (zh) 2004-09-24 2005-09-22 And a method for producing a polyimide film having high adhesion

Country Status (6)

Country Link
US (1) US8513373B2 (OSRAM)
JP (2) JP5054976B2 (OSRAM)
KR (2) KR100981852B1 (OSRAM)
CN (2) CN101027341B (OSRAM)
TW (1) TWI382040B (OSRAM)
WO (1) WO2006033324A1 (OSRAM)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070292701A1 (en) * 2004-09-24 2007-12-20 Takashi Kikuchi Novel Polyimide Film Improved in Adhesion
US20080097073A1 (en) * 2005-01-18 2008-04-24 Kaneka Corporation Novel Polyimide Film With Improved Adhesiveness
JP4957487B2 (ja) * 2007-09-28 2012-06-20 東レ株式会社 ポリアミック酸の製造方法
CN103772704A (zh) * 2013-11-12 2014-05-07 天津市天缘电工材料有限责任公司 一种低摩擦系数高粘结力聚酰亚胺薄膜的制备方法
KR101668059B1 (ko) * 2014-12-30 2016-10-20 에스케이씨코오롱피아이 주식회사 가교형 수용성 열가소성 폴리아믹산 및 이의 제조방법
CN105175722B (zh) * 2015-09-02 2017-05-10 无锡高拓新材料股份有限公司 一种芳香族高相对分子质量和分子量分布窄的聚酰胺酸的制备方法
JP2019093548A (ja) * 2016-03-30 2019-06-20 株式会社カネカ 長尺ポリイミド積層体およびその製造方法
WO2018181496A1 (ja) * 2017-03-30 2018-10-04 日産化学株式会社 剥離層形成用組成物及び剥離層
KR102347633B1 (ko) * 2019-11-07 2022-01-10 피아이첨단소재 주식회사 유전특성이 개선된 폴리이미드 필름 및 그 제조방법
KR102347588B1 (ko) * 2019-11-07 2022-01-10 피아이첨단소재 주식회사 고내열 저유전 폴리이미드 필름 및 이의 제조방법
KR102345722B1 (ko) * 2019-11-07 2022-01-03 피아이첨단소재 주식회사 고내열 저유전 폴리이미드 필름 및 이의 제조방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6461428A (en) * 1987-08-28 1989-03-08 Ajinomoto Kk Preventing agent against arrhythmia
JPH04161437A (ja) * 1990-10-24 1992-06-04 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルム
JPH04325562A (ja) * 1991-04-24 1992-11-13 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルムの製造方法
JPH11116674A (ja) * 1997-10-20 1999-04-27 Hitachi Cable Ltd ブロックポリイミド樹脂及びその製造方法

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EP0276405B1 (en) * 1986-11-29 1994-03-09 Kanegafuchi Chemical Industry Co., Ltd. Polyimide having a thermal dimensional stability
JPH04161428A (ja) * 1990-10-24 1992-06-04 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルム
JP2910796B2 (ja) * 1991-04-19 1999-06-23 鐘淵化学工業株式会社 ポリアミック酸共重合体及びそれからなるポリイミドフィルム並びにそれらの製造方法
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JP3048702B2 (ja) * 1991-09-13 2000-06-05 鐘淵化学工業株式会社 ポリアミック酸共重合体、ポリイミド共重合体、ポリイミドフィルム及びそれらの製造方法
JP2889976B2 (ja) 1992-02-10 1999-05-10 鐘淵化学工業株式会社 ポリイミドフィルム及びその製造方法
JPH0632926A (ja) 1992-07-16 1994-02-08 Shin Etsu Chem Co Ltd ポリイミドフィルムの表面改質方法
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JP3438556B2 (ja) 1997-11-28 2003-08-18 宇部興産株式会社 接着性の改良されたポリイミドフィルム、その製法およびその積層体
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JP2000119521A (ja) 1998-10-16 2000-04-25 Du Pont Toray Co Ltd 共重合ポリイミドフィルム、その製造方法およびこれを基材とした金属配線回路板
KR20000035259A (ko) * 1998-11-05 2000-06-26 다케다 마사토시 폴리이미드 필름 및 이를 사용한 전기/전자 기기용 기판
WO2002034509A1 (en) * 2000-10-27 2002-05-02 Kaneka Corporation Laminate
JP2002180044A (ja) * 2000-12-07 2002-06-26 Toray Eng Co Ltd 熱可塑性ポリイミド樹脂用エッチング液
CN1307260C (zh) * 2002-01-15 2007-03-28 株式会社Pi技术研究所 溶剂可溶的嵌段共聚聚酰亚胺组合物及其制造方法
JPWO2003097725A1 (ja) 2002-05-21 2005-09-15 株式会社カネカ ポリイミドフィルムおよびその製造方法、並びにポリイミドフィルムを用いたポリイミド／金属積層体
US7267883B2 (en) * 2002-09-25 2007-09-11 Kaneka Corporation Polyimide film and laminate having metal layer and same
US20060048963A1 (en) * 2002-12-05 2006-03-09 Masaru Nishinaka Laminate, printed circuit board, and preparing method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6461428A (en) * 1987-08-28 1989-03-08 Ajinomoto Kk Preventing agent against arrhythmia
JPH04161437A (ja) * 1990-10-24 1992-06-04 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルム
JPH04325562A (ja) * 1991-04-24 1992-11-13 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルムの製造方法
JPH11116674A (ja) * 1997-10-20 1999-04-27 Hitachi Cable Ltd ブロックポリイミド樹脂及びその製造方法

Also Published As

Publication number Publication date
CN102675634A (zh) 2012-09-19
KR100981852B1 (ko) 2010-09-13
KR20070056128A (ko) 2007-05-31
JP5054976B2 (ja) 2012-10-24
JP5514861B2 (ja) 2014-06-04
TW200619270A (en) 2006-06-16
US8513373B2 (en) 2013-08-20
CN102675634B (zh) 2015-06-17
US20080287642A1 (en) 2008-11-20
JPWO2006033324A1 (ja) 2008-05-15
KR20100017883A (ko) 2010-02-16
CN101027341B (zh) 2012-06-06
CN101027341A (zh) 2007-08-29
JP2012214807A (ja) 2012-11-08
WO2006033324A1 (ja) 2006-03-30

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