TWI379375B - - Google Patents
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- Publication number
- TWI379375B TWI379375B TW97133742A TW97133742A TWI379375B TW I379375 B TWI379375 B TW I379375B TW 97133742 A TW97133742 A TW 97133742A TW 97133742 A TW97133742 A TW 97133742A TW I379375 B TWI379375 B TW I379375B
- Authority
- TW
- Taiwan
- Prior art keywords
- air
- opening
- floating
- closed
- air blowing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Fluid Mechanics (AREA)
- Mechanical Engineering (AREA)
- Ventilation (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007230382A JP5233212B2 (ja) | 2007-09-05 | 2007-09-05 | クリーン搬送システム |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200931575A TW200931575A (en) | 2009-07-16 |
TWI379375B true TWI379375B (fr) | 2012-12-11 |
Family
ID=40428736
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW97133742A TW200931575A (en) | 2007-09-05 | 2008-09-03 | Clean conveyance system |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5233212B2 (fr) |
KR (1) | KR101130154B1 (fr) |
CN (2) | CN101796625A (fr) |
TW (1) | TW200931575A (fr) |
WO (1) | WO2009031416A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5446403B2 (ja) * | 2009-04-07 | 2014-03-19 | 株式会社Ihi | 搬送方向転換装置及び浮上搬送システム |
JP5088591B2 (ja) * | 2010-04-15 | 2012-12-05 | 株式会社ダイフク | 板状体搬送装置 |
CN112079049B (zh) * | 2020-09-03 | 2022-07-12 | 广州小鹏汽车科技有限公司 | 一种运输方法和装置、介质 |
CN114671217A (zh) * | 2020-12-24 | 2022-06-28 | 志圣工业股份有限公司 | 自体清洁的输送装置及包含输送装置的加热设备 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06298360A (ja) * | 1993-04-12 | 1994-10-25 | Hitachi Ltd | 気流式搬送装置 |
JP2001315960A (ja) * | 2000-05-09 | 2001-11-13 | Meidensha Corp | 基板搬送装置 |
JP4214468B2 (ja) * | 2003-07-03 | 2009-01-28 | 株式会社ダイフク | 搬送装置 |
TWI327985B (en) * | 2003-04-14 | 2010-08-01 | Daifuku Kk | Apparatus for transporting plate-shaped work piece |
TWI295659B (en) * | 2003-08-29 | 2008-04-11 | Daifuku Kk | Transporting apparatus |
JP2005167083A (ja) * | 2003-12-04 | 2005-06-23 | Daifuku Co Ltd | ガラス基板用の搬送設備 |
-
2007
- 2007-09-05 JP JP2007230382A patent/JP5233212B2/ja not_active Expired - Fee Related
-
2008
- 2008-08-22 KR KR1020107007057A patent/KR101130154B1/ko active IP Right Grant
- 2008-08-22 CN CN200880105255A patent/CN101796625A/zh active Pending
- 2008-08-22 CN CN2013101428074A patent/CN103247561A/zh active Pending
- 2008-08-22 WO PCT/JP2008/064986 patent/WO2009031416A1/fr active Application Filing
- 2008-09-03 TW TW97133742A patent/TW200931575A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR101130154B1 (ko) | 2012-03-28 |
CN101796625A (zh) | 2010-08-04 |
WO2009031416A1 (fr) | 2009-03-12 |
JP5233212B2 (ja) | 2013-07-10 |
JP2009064900A (ja) | 2009-03-26 |
TW200931575A (en) | 2009-07-16 |
KR20100053674A (ko) | 2010-05-20 |
CN103247561A (zh) | 2013-08-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |