TWI378947B - - Google Patents

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Publication number
TWI378947B
TWI378947B TW094133813A TW94133813A TWI378947B TW I378947 B TWI378947 B TW I378947B TW 094133813 A TW094133813 A TW 094133813A TW 94133813 A TW94133813 A TW 94133813A TW I378947 B TWI378947 B TW I378947B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
compound
epoxypropyl
group
resin composition
Prior art date
Application number
TW094133813A
Other languages
English (en)
Chinese (zh)
Other versions
TW200619260A (en
Inventor
Yasuhiro Gunji
Toshiaki Takeyama
Original Assignee
Nissan Chemical Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Ind Ltd filed Critical Nissan Chemical Ind Ltd
Publication of TW200619260A publication Critical patent/TW200619260A/zh
Application granted granted Critical
Publication of TWI378947B publication Critical patent/TWI378947B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/50—Polyethers having heteroatoms other than oxygen
    • C08G18/5021—Polyethers having heteroatoms other than oxygen having nitrogen
    • C08G18/5024—Polyethers having heteroatoms other than oxygen having nitrogen containing primary and/or secondary amino groups
    • C08G18/5027—Polyethers having heteroatoms other than oxygen having nitrogen containing primary and/or secondary amino groups directly linked to carbocyclic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/06—Triglycidylisocyanurates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2110/00—Foam properties
    • C08G2110/0025—Foam properties rigid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2110/00—Foam properties
    • C08G2110/0041—Foam properties having specified density
    • C08G2110/005—< 50kg/m3
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2110/00—Foam properties
    • C08G2110/0083—Foam properties prepared using water as the sole blowing agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2330/00—Thermal insulation material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
TW094133813A 2004-09-29 2005-09-28 Modified epoxy resin composition TW200619260A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004283094 2004-09-29

Publications (2)

Publication Number Publication Date
TW200619260A TW200619260A (en) 2006-06-16
TWI378947B true TWI378947B (enExample) 2012-12-11

Family

ID=36118790

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094133813A TW200619260A (en) 2004-09-29 2005-09-28 Modified epoxy resin composition

Country Status (8)

Country Link
US (1) US9598528B2 (enExample)
EP (1) EP1795558B1 (enExample)
JP (1) JP5082445B2 (enExample)
KR (1) KR101162134B1 (enExample)
CN (1) CN100575413C (enExample)
DE (1) DE602005018079D1 (enExample)
TW (1) TW200619260A (enExample)
WO (1) WO2006035641A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9598528B2 (en) 2004-09-29 2017-03-21 Nissan Chemical Industries, Ltd. Modified epoxy resin composition
JP5298411B2 (ja) * 2006-08-14 2013-09-25 三菱化学株式会社 エポキシ樹脂組成物およびその用途
CN101688051B (zh) * 2007-07-11 2013-03-13 日产化学工业株式会社 含有无机粒子的液体环氧树脂形成用制剂
JP2009144066A (ja) * 2007-12-14 2009-07-02 Nitto Denko Corp 光半導体素子封止用熱硬化性樹脂組成物およびそれを用いた光半導体装置
KR101668301B1 (ko) 2009-02-10 2016-10-21 닛산 가가쿠 고교 가부시키 가이샤 장쇄 알킬렌기 함유 에폭시 화합물
US8778597B2 (en) 2010-01-26 2014-07-15 Nissan Chemical Industries, Ltd. Long-chain alkylene-containing curable epoxy resin composition
JP6045774B2 (ja) * 2010-03-16 2016-12-14 日立化成株式会社 半導体封止充てん用エポキシ樹脂組成物、半導体装置、及びその製造方法
KR101821574B1 (ko) 2010-08-05 2018-01-25 닛산 가가쿠 고교 가부시키 가이샤 질소 함유 고리를 갖는 에폭시 화합물
CN103068823A (zh) 2010-08-05 2013-04-24 日产化学工业株式会社 具有氰脲酸骨架的环氧化合物的制造方法
KR101262588B1 (ko) 2011-07-28 2013-05-08 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 방열회로기판
WO2013086004A1 (en) * 2011-12-07 2013-06-13 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Pressure sensitive adhesives based on carboxylic acids and epoxides
US10174153B2 (en) 2013-12-17 2019-01-08 Nissan Chemical Industries, Ltd. Highly soluble modified epoxy resin composition
JP6541585B2 (ja) * 2016-01-22 2019-07-10 四国化成工業株式会社 （メタ）アクリルエポキシイソシアヌレート化合物、その合成方法および該イソシアヌレート化合物の利用
JP7004181B2 (ja) * 2016-10-18 2022-01-21 日産化学株式会社 プリント配線板形成用エポキシ樹脂組成物
CN111825627B (zh) * 2020-07-28 2023-04-25 清远高新华园科技协同创新研究院有限公司 一种高固体份羟基树脂的制备方法
KR102454213B1 (ko) * 2021-03-19 2022-10-14 한국화학연구원 산 무수물기반 에폭시 화합물, 이를 포함하는 에폭시 접착제 조성물 및 이로부터 제조된 경화물

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1546882A (fr) * 1966-11-30 1968-11-22 Henkel & Cie Gmbh Procédé de préparation de résines époxydes plastifiées intérieurement
DE1595812B2 (de) * 1966-11-30 1976-09-23 Henkel & Cie GmbH, 4000 Düsseldorf Verfahren zur herstellung von innerlich weichgemachten epoxidharzen
DE1695171C3 (de) * 1966-11-30 1981-07-09 Henkel KGaA, 4000 Düsseldorf Verfahren zur Herstellung von Formkörpern auf der Basis von Glycidylisocyanurat
US3496122A (en) * 1967-07-14 1970-02-17 Ciba Ltd Modified triglycidylisocyanurate resins
DE1921139A1 (de) * 1968-05-10 1969-11-27 Plasta Kunstharz U Pressmassef Verfahren zur Herstellung von loeslichen Epoxid-Formstoff-Vorprodukten aus Triglycidylisocyanurat
JPS58134049A (ja) * 1982-02-03 1983-08-10 Kao Corp グリセリルエ−テルの製造法
NL8402868A (nl) * 1984-09-19 1986-04-16 Stamicarbon Preparaat van triglycidylisocyanuraat met verminderde kleefneiging.
JPS61271318A (ja) * 1985-05-24 1986-12-01 Matsushita Electric Works Ltd エポキシ樹脂組成物
JP2876678B2 (ja) * 1989-01-31 1999-03-31 日産化学工業株式会社 イソシアヌレート誘導体の製造方法
JPH02279684A (ja) * 1989-04-19 1990-11-15 Nissan Chem Ind Ltd イソシアヌル酸誘導体の製造方法
JP2763388B2 (ja) * 1990-07-24 1998-06-11 三菱電機株式会社 結晶化防止方法
JPH04264123A (ja) 1991-02-19 1992-09-18 Nissan Chem Ind Ltd トリグリシジルイソシアヌレート組成物
JPH0668014A (ja) 1992-08-17 1994-03-11 Fujitsu Ltd 入出力制御装置
JPH06192396A (ja) 1992-12-25 1994-07-12 Nissan Chem Ind Ltd 一液型エポキシ樹脂組成物
JP3428695B2 (ja) 1993-08-20 2003-07-22 ジャパンエポキシレジン株式会社 変性液状エポキシ樹脂組成物
US5623086A (en) 1995-12-29 1997-04-22 Eastman Chemical Company Process for the production of 1,2-bis (acyloxylates)
US5663422A (en) * 1996-03-01 1997-09-02 Eastman Chemical Company Process for the production of 1,2-diacetoxy esters
US6177541B1 (en) * 1998-08-20 2001-01-23 Nissan Chemical Industries, Ltd. Process for producing an isocyanurate derivative
US6072079A (en) * 1999-03-03 2000-06-06 Eastman Chemical Company Continuous process for the production of diacetoxybutene
US9598528B2 (en) 2004-09-29 2017-03-21 Nissan Chemical Industries, Ltd. Modified epoxy resin composition

Also Published As

Publication number Publication date
US9598528B2 (en) 2017-03-21
CN101027359A (zh) 2007-08-29
JPWO2006035641A1 (ja) 2008-05-15
CN100575413C (zh) 2009-12-30
WO2006035641A1 (ja) 2006-04-06
KR20070072861A (ko) 2007-07-06
EP1795558A1 (en) 2007-06-13
JP5082445B2 (ja) 2012-11-28
EP1795558A4 (en) 2009-05-06
DE602005018079D1 (de) 2010-01-14
EP1795558B1 (en) 2009-12-02
US20070249760A1 (en) 2007-10-25
TW200619260A (en) 2006-06-16
KR101162134B1 (ko) 2012-07-03

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