TWI376174B - - Google Patents

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Publication number
TWI376174B
TWI376174B TW097134379A TW97134379A TWI376174B TW I376174 B TWI376174 B TW I376174B TW 097134379 A TW097134379 A TW 097134379A TW 97134379 A TW97134379 A TW 97134379A TW I376174 B TWI376174 B TW I376174B
Authority
TW
Taiwan
Prior art keywords
copper
surface treatment
copper foil
peel strength
treated
Prior art date
Application number
TW097134379A
Other languages
English (en)
Chinese (zh)
Other versions
TW200934330A (en
Inventor
Fujisawa Satoshi
Suzuki Yuuji
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of TW200934330A publication Critical patent/TW200934330A/zh
Application granted granted Critical
Publication of TWI376174B publication Critical patent/TWI376174B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/20—Zinc
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/22—Nickel or cobalt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
TW097134379A 2007-11-26 2008-09-08 Surface treated copper foil and method for surface treating the same, and stack circuit board TW200934330A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007304396 2007-11-26

Publications (2)

Publication Number Publication Date
TW200934330A TW200934330A (en) 2009-08-01
TWI376174B true TWI376174B (ko) 2012-11-01

Family

ID=40741818

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097134379A TW200934330A (en) 2007-11-26 2008-09-08 Surface treated copper foil and method for surface treating the same, and stack circuit board

Country Status (4)

Country Link
JP (1) JP5075099B2 (ko)
KR (1) KR101112979B1 (ko)
CN (1) CN101445947B (ko)
TW (1) TW200934330A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI666977B (zh) * 2015-02-12 2019-07-21 日商福田金屬箔粉工業股份有限公司 處理銅箔及使用該處理銅箔之覆銅層疊板、以及印刷佈線板

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5650023B2 (ja) * 2011-03-03 2015-01-07 Jx日鉱日石金属株式会社 プリント配線板用銅箔及びそれを用いた積層板
KR101315364B1 (ko) * 2011-03-11 2013-10-07 엘에스엠트론 주식회사 내열성이 개선된 표면 처리 동박 및 그 제조방법
JP6023367B1 (ja) * 2015-06-17 2016-11-09 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP7085394B2 (ja) * 2018-04-13 2022-06-16 東洋鋼鈑株式会社 積層電解箔
JP7014884B1 (ja) * 2020-12-23 2022-02-01 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758479A (en) * 1987-03-30 1988-07-19 General Motors Corporation Corrosion resistant nickel-zinc-phosphorus coating and method of electroplating said coating
JP3032514B1 (ja) 1998-12-14 2000-04-17 株式会社日鉱マテリアルズ 光沢面の耐酸化性に優れた銅箔及びその製造方法
JP2000269637A (ja) * 1999-03-18 2000-09-29 Furukawa Circuit Foil Kk 高密度超微細配線板用銅箔
JP4202840B2 (ja) * 2003-06-26 2008-12-24 日鉱金属株式会社 銅箔及びその製造方法
JP2005064110A (ja) * 2003-08-08 2005-03-10 Tdk Corp 電子部品用部材並びにこれを用いた電子部品
KR100852863B1 (ko) * 2004-02-17 2008-08-18 닛코킨조쿠 가부시키가이샤 흑화 처리 면 또는 층을 가지는 동박
JP2005344174A (ja) * 2004-06-03 2005-12-15 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔を用いて製造したフレキシブル銅張積層板並びにフィルムキャリアテープ
JP4652020B2 (ja) * 2004-11-16 2011-03-16 新日鐵化学株式会社 銅張り積層板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI666977B (zh) * 2015-02-12 2019-07-21 日商福田金屬箔粉工業股份有限公司 處理銅箔及使用該處理銅箔之覆銅層疊板、以及印刷佈線板

Also Published As

Publication number Publication date
TW200934330A (en) 2009-08-01
CN101445947B (zh) 2011-04-27
JP5075099B2 (ja) 2012-11-14
KR20090054368A (ko) 2009-05-29
JP2009149977A (ja) 2009-07-09
KR101112979B1 (ko) 2012-04-18
CN101445947A (zh) 2009-06-03

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