TWI376038B - - Google Patents
Download PDFInfo
- Publication number
- TWI376038B TWI376038B TW094102147A TW94102147A TWI376038B TW I376038 B TWI376038 B TW I376038B TW 094102147 A TW094102147 A TW 094102147A TW 94102147 A TW94102147 A TW 94102147A TW I376038 B TWI376038 B TW I376038B
- Authority
- TW
- Taiwan
- Prior art keywords
- photoelectric conversion
- conversion element
- substrate
- integrated circuit
- optical waveguide
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 176
- 230000003287 optical effect Effects 0.000 claims description 157
- 238000006243 chemical reaction Methods 0.000 claims description 91
- 230000005693 optoelectronics Effects 0.000 claims description 48
- 239000013307 optical fiber Substances 0.000 claims description 18
- 239000000835 fiber Substances 0.000 claims description 5
- 230000003321 amplification Effects 0.000 claims description 4
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims 3
- 239000000126 substance Substances 0.000 claims 2
- 210000004508 polar body Anatomy 0.000 claims 1
- 239000010410 layer Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 230000010354 integration Effects 0.000 description 8
- 238000005452 bending Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000009429 electrical wiring Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2004/014226 WO2006035499A1 (ja) | 2004-09-29 | 2004-09-29 | 光電気集積回路素子およびそれを用いた伝送装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200611434A TW200611434A (en) | 2006-04-01 |
| TWI376038B true TWI376038B (enExample) | 2012-11-01 |
Family
ID=36118651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094102147A TW200611434A (en) | 2004-09-29 | 2005-01-25 | Photoelectric integrated circuit element and transmission apparatus using the same |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7657136B2 (enExample) |
| JP (1) | JP4462269B2 (enExample) |
| KR (1) | KR100911508B1 (enExample) |
| CN (1) | CN1993639B (enExample) |
| TW (1) | TW200611434A (enExample) |
| WO (1) | WO2006035499A1 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4462269B2 (ja) * | 2004-09-29 | 2010-05-12 | 日立化成工業株式会社 | 光電気集積回路素子およびそれを用いた伝送装置 |
| US8000608B2 (en) * | 2005-03-23 | 2011-08-16 | Phyworks Limited | Integrated circuit for communications modules |
| US7991248B2 (en) * | 2006-09-21 | 2011-08-02 | Hitachi Chemical Co., Ltd. | Optical waveguide substrate and substrate mounting photoelectric hybrid circuit |
| JP5107679B2 (ja) * | 2007-11-13 | 2012-12-26 | 日本特殊陶業株式会社 | 光電気混載パッケージ及び光コネクタ並びにこれらを備えた光電気混載モジュール |
| US8639067B2 (en) * | 2008-02-08 | 2014-01-28 | Hitachi Chemical Company, Ltd. | Fabrication method of optical wiring board and optical printed circuit board |
| US8989531B2 (en) | 2009-03-30 | 2015-03-24 | Kyocera Corporation | Optical-electrical wiring board and optical module |
| CN104115044A (zh) * | 2009-09-17 | 2014-10-22 | 太阳能冷却生产贸易工业有限公司 | 连接器和系统 |
| JP2011158666A (ja) * | 2010-01-29 | 2011-08-18 | Toshiba Corp | 光電気フレキシブル配線モジュール及びその製造方法 |
| JP2011227371A (ja) * | 2010-04-22 | 2011-11-10 | Nec Corp | 半導体パッケージ |
| FR2963101B1 (fr) * | 2010-07-22 | 2013-02-15 | Commissariat Energie Atomique | Detecteur de particules et procede de realisation d'un tel detecteur |
| EP2598967A4 (en) * | 2010-07-26 | 2017-12-06 | Hewlett-Packard Enterprise Development LP | A system including a module |
| JP5734709B2 (ja) * | 2011-03-17 | 2015-06-17 | 富士通株式会社 | 光コネクタ及び電子情報機器 |
| CN102809784B (zh) | 2011-06-02 | 2014-08-27 | 富士康(昆山)电脑接插件有限公司 | 光背板组件 |
| US8781267B2 (en) * | 2012-01-27 | 2014-07-15 | Telefonaktiebolaget L M Ericsson | Optical physical interface module |
| JP2015121565A (ja) * | 2012-03-02 | 2015-07-02 | 株式会社日立製作所 | 多チャンネル光モジュール及びそれを用いた情報処理装置 |
| CN104103725B (zh) * | 2013-04-12 | 2018-07-27 | 台州市航杰灯具有限公司 | 二极管模组和其制作方法及光互连装置 |
| US9551845B1 (en) | 2013-10-01 | 2017-01-24 | Microsemi Storage Solutions (U.S.), Inc. | Method for manufacturing optical engine packages and apparatus from which optical engine packages are manufactured |
| JP2015106099A (ja) * | 2013-12-02 | 2015-06-08 | 住友ベークライト株式会社 | 光配線部品、光モジュール、光電気混載基板および電子機器 |
| JP6664897B2 (ja) * | 2015-07-22 | 2020-03-13 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP6231608B2 (ja) * | 2016-04-21 | 2017-11-15 | 日本電信電話株式会社 | 光電子集積回路の実装方法 |
| CN105807367B (zh) * | 2016-05-27 | 2019-06-14 | 湖南大学 | 一种基于石墨烯光电器件的光电集成电路 |
| JP6660820B2 (ja) * | 2016-06-13 | 2020-03-11 | 日本電信電話株式会社 | 光デバイス |
| US10025044B1 (en) * | 2017-01-17 | 2018-07-17 | International Business Machines Corporation | Optical structure |
| US10359565B2 (en) * | 2017-02-07 | 2019-07-23 | Nokia Of America Corporation | Optoelectronic circuit having one or more double-sided substrates |
| EP3732520B1 (en) * | 2017-12-30 | 2024-01-24 | Telescent Inc. | Automated installation and reconfiguration of fiber optic and copper cables in large scale data centers |
| US10598860B2 (en) * | 2018-03-14 | 2020-03-24 | Globalfoundries Inc. | Photonic die fan out package with edge fiber coupling interface and related methods |
| CN114114528B (zh) | 2020-08-28 | 2023-06-02 | 深南电路股份有限公司 | 光纤线路板组件以及光电混合线路板 |
| JP2023546194A (ja) * | 2020-10-20 | 2023-11-01 | スリーエム イノベイティブ プロパティズ カンパニー | 縁部結合のための光相互接続 |
| US20230090863A1 (en) * | 2021-09-22 | 2023-03-23 | Intel Corporation | Optical waveguide edge coupling within a substrate |
| CN113949949A (zh) * | 2021-09-30 | 2022-01-18 | 中航光电科技股份有限公司 | 一种基于转向设计的光波导路由交换设计方法 |
| US20240264368A1 (en) * | 2023-02-03 | 2024-08-08 | Advanced Semiconductor Engineering, Inc. | Optoelectronic device and method of transmitting optical signal |
| CN119045131B (zh) * | 2024-10-29 | 2025-02-07 | 武汉钧恒科技有限公司 | 一种800g qsfp-dd dr8硅光模块 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0215679A (ja) * | 1988-07-04 | 1990-01-19 | Ricoh Co Ltd | 実装方法 |
| US5757989A (en) * | 1992-09-10 | 1998-05-26 | Fujitsu Limited | Optical circuit system capable of producing optical signal having a small fluctuation and components of same |
| US5345527A (en) * | 1993-09-03 | 1994-09-06 | Motorola, Inc. | Intelligent opto-bus with display |
| JPH08110435A (ja) * | 1994-10-12 | 1996-04-30 | Hitachi Ltd | 半導体光結合装置 |
| KR19990018425A (ko) * | 1997-08-27 | 1999-03-15 | 윤종용 | 동일 평면기판상에 입출력 광섬유 어레이가 위치하는 광섬유 어레이 모듈 |
| JP2002101051A (ja) * | 2000-09-21 | 2002-04-05 | Hitachi Ltd | 波長多重光インタコネクション装置 |
| JP3803596B2 (ja) * | 2002-03-14 | 2006-08-02 | 日本電気株式会社 | パッケージ型半導体装置 |
| JP2003344695A (ja) * | 2002-05-22 | 2003-12-03 | Sumitomo Electric Ind Ltd | 光導波路モジュール |
| JP4462269B2 (ja) * | 2004-09-29 | 2010-05-12 | 日立化成工業株式会社 | 光電気集積回路素子およびそれを用いた伝送装置 |
-
2004
- 2004-09-29 JP JP2006537601A patent/JP4462269B2/ja not_active Expired - Fee Related
- 2004-09-29 CN CN2004800436797A patent/CN1993639B/zh not_active Expired - Fee Related
- 2004-09-29 KR KR1020077002128A patent/KR100911508B1/ko not_active Expired - Fee Related
- 2004-09-29 WO PCT/JP2004/014226 patent/WO2006035499A1/ja not_active Ceased
- 2004-09-29 US US11/658,587 patent/US7657136B2/en not_active Expired - Fee Related
-
2005
- 2005-01-25 TW TW094102147A patent/TW200611434A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2006035499A1 (ja) | 2008-05-15 |
| CN1993639B (zh) | 2013-01-16 |
| WO2006035499A1 (ja) | 2006-04-06 |
| KR20070030934A (ko) | 2007-03-16 |
| TW200611434A (en) | 2006-04-01 |
| US7657136B2 (en) | 2010-02-02 |
| US20090003761A1 (en) | 2009-01-01 |
| JP4462269B2 (ja) | 2010-05-12 |
| CN1993639A (zh) | 2007-07-04 |
| KR100911508B1 (ko) | 2009-08-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI376038B (enExample) | ||
| KR100460703B1 (ko) | 일체화된 광송수신 모듈과 광도파로를 구비하는 광백플레인 | |
| JP5445579B2 (ja) | 光導波路モジュール | |
| US8437584B2 (en) | Optical I/O array module and its fabrication method | |
| JP5532929B2 (ja) | 光配線プリント基板の製造方法 | |
| US20100215313A1 (en) | Optical interconnection assembled circuit | |
| JP6115067B2 (ja) | 光モジュール | |
| KR20070085080A (ko) | 전자-광 모듈 제조 시스템 및 방법 | |
| US9523830B2 (en) | Optical module and transmitting device | |
| JP2007004043A (ja) | 配線基板、配線基板を用いたモジュール、およびモジュール集合体 | |
| JP2012013726A (ja) | 光インターコネクションモジュールおよびそれを用いた光電気混載回路ボード | |
| TWI316617B (enExample) | ||
| JP6471229B2 (ja) | 光送受信モジュールおよびこれを用いた情報装置 | |
| WO2005067061A1 (ja) | 光素子一体型半導体集積回路 | |
| JP4999813B2 (ja) | 半導体装置 | |
| JP2006052992A (ja) | 光導波路配線基板又は光電気混載基板の検査方法 | |
| JP2011227371A (ja) | 半導体パッケージ | |
| TW202536480A (zh) | 光子互連晶片、電子/光子封裝及光子互連晶片的形成方法 | |
| JP4659082B2 (ja) | 光電気複合配線部品及びこれを用いた電子機器 | |
| JP2014225029A (ja) | 光モジュールの製造方法 | |
| JP2008134639A (ja) | 半導体装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |