JP4462269B2 - 光電気集積回路素子およびそれを用いた伝送装置 - Google Patents

光電気集積回路素子およびそれを用いた伝送装置 Download PDF

Info

Publication number
JP4462269B2
JP4462269B2 JP2006537601A JP2006537601A JP4462269B2 JP 4462269 B2 JP4462269 B2 JP 4462269B2 JP 2006537601 A JP2006537601 A JP 2006537601A JP 2006537601 A JP2006537601 A JP 2006537601A JP 4462269 B2 JP4462269 B2 JP 4462269B2
Authority
JP
Japan
Prior art keywords
integrated circuit
photoelectric conversion
substrate
conversion element
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006537601A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2006035499A1 (ja
Inventor
康信 松岡
正人 宍倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2006035499A1 publication Critical patent/JPWO2006035499A1/ja
Application granted granted Critical
Publication of JP4462269B2 publication Critical patent/JP4462269B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
JP2006537601A 2004-09-29 2004-09-29 光電気集積回路素子およびそれを用いた伝送装置 Expired - Fee Related JP4462269B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2004/014226 WO2006035499A1 (ja) 2004-09-29 2004-09-29 光電気集積回路素子およびそれを用いた伝送装置

Publications (2)

Publication Number Publication Date
JPWO2006035499A1 JPWO2006035499A1 (ja) 2008-05-15
JP4462269B2 true JP4462269B2 (ja) 2010-05-12

Family

ID=36118651

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006537601A Expired - Fee Related JP4462269B2 (ja) 2004-09-29 2004-09-29 光電気集積回路素子およびそれを用いた伝送装置

Country Status (6)

Country Link
US (1) US7657136B2 (enExample)
JP (1) JP4462269B2 (enExample)
KR (1) KR100911508B1 (enExample)
CN (1) CN1993639B (enExample)
TW (1) TW200611434A (enExample)
WO (1) WO2006035499A1 (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4462269B2 (ja) * 2004-09-29 2010-05-12 日立化成工業株式会社 光電気集積回路素子およびそれを用いた伝送装置
US8000608B2 (en) * 2005-03-23 2011-08-16 Phyworks Limited Integrated circuit for communications modules
US7991248B2 (en) * 2006-09-21 2011-08-02 Hitachi Chemical Co., Ltd. Optical waveguide substrate and substrate mounting photoelectric hybrid circuit
JP5107679B2 (ja) * 2007-11-13 2012-12-26 日本特殊陶業株式会社 光電気混載パッケージ及び光コネクタ並びにこれらを備えた光電気混載モジュール
US8639067B2 (en) * 2008-02-08 2014-01-28 Hitachi Chemical Company, Ltd. Fabrication method of optical wiring board and optical printed circuit board
US8989531B2 (en) 2009-03-30 2015-03-24 Kyocera Corporation Optical-electrical wiring board and optical module
CN104115044A (zh) * 2009-09-17 2014-10-22 太阳能冷却生产贸易工业有限公司 连接器和系统
JP2011158666A (ja) * 2010-01-29 2011-08-18 Toshiba Corp 光電気フレキシブル配線モジュール及びその製造方法
JP2011227371A (ja) * 2010-04-22 2011-11-10 Nec Corp 半導体パッケージ
FR2963101B1 (fr) * 2010-07-22 2013-02-15 Commissariat Energie Atomique Detecteur de particules et procede de realisation d'un tel detecteur
EP2598967A4 (en) * 2010-07-26 2017-12-06 Hewlett-Packard Enterprise Development LP A system including a module
JP5734709B2 (ja) * 2011-03-17 2015-06-17 富士通株式会社 光コネクタ及び電子情報機器
CN102809784B (zh) 2011-06-02 2014-08-27 富士康(昆山)电脑接插件有限公司 光背板组件
US8781267B2 (en) * 2012-01-27 2014-07-15 Telefonaktiebolaget L M Ericsson Optical physical interface module
JP2015121565A (ja) * 2012-03-02 2015-07-02 株式会社日立製作所 多チャンネル光モジュール及びそれを用いた情報処理装置
CN104103725B (zh) * 2013-04-12 2018-07-27 台州市航杰灯具有限公司 二极管模组和其制作方法及光互连装置
US9551845B1 (en) 2013-10-01 2017-01-24 Microsemi Storage Solutions (U.S.), Inc. Method for manufacturing optical engine packages and apparatus from which optical engine packages are manufactured
JP2015106099A (ja) * 2013-12-02 2015-06-08 住友ベークライト株式会社 光配線部品、光モジュール、光電気混載基板および電子機器
JP6664897B2 (ja) * 2015-07-22 2020-03-13 ルネサスエレクトロニクス株式会社 半導体装置
JP6231608B2 (ja) * 2016-04-21 2017-11-15 日本電信電話株式会社 光電子集積回路の実装方法
CN105807367B (zh) * 2016-05-27 2019-06-14 湖南大学 一种基于石墨烯光电器件的光电集成电路
JP6660820B2 (ja) * 2016-06-13 2020-03-11 日本電信電話株式会社 光デバイス
US10025044B1 (en) * 2017-01-17 2018-07-17 International Business Machines Corporation Optical structure
US10359565B2 (en) * 2017-02-07 2019-07-23 Nokia Of America Corporation Optoelectronic circuit having one or more double-sided substrates
EP3732520B1 (en) * 2017-12-30 2024-01-24 Telescent Inc. Automated installation and reconfiguration of fiber optic and copper cables in large scale data centers
US10598860B2 (en) * 2018-03-14 2020-03-24 Globalfoundries Inc. Photonic die fan out package with edge fiber coupling interface and related methods
CN114114528B (zh) 2020-08-28 2023-06-02 深南电路股份有限公司 光纤线路板组件以及光电混合线路板
JP2023546194A (ja) * 2020-10-20 2023-11-01 スリーエム イノベイティブ プロパティズ カンパニー 縁部結合のための光相互接続
US20230090863A1 (en) * 2021-09-22 2023-03-23 Intel Corporation Optical waveguide edge coupling within a substrate
CN113949949A (zh) * 2021-09-30 2022-01-18 中航光电科技股份有限公司 一种基于转向设计的光波导路由交换设计方法
US20240264368A1 (en) * 2023-02-03 2024-08-08 Advanced Semiconductor Engineering, Inc. Optoelectronic device and method of transmitting optical signal
CN119045131B (zh) * 2024-10-29 2025-02-07 武汉钧恒科技有限公司 一种800g qsfp-dd dr8硅光模块

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0215679A (ja) * 1988-07-04 1990-01-19 Ricoh Co Ltd 実装方法
US5757989A (en) * 1992-09-10 1998-05-26 Fujitsu Limited Optical circuit system capable of producing optical signal having a small fluctuation and components of same
US5345527A (en) * 1993-09-03 1994-09-06 Motorola, Inc. Intelligent opto-bus with display
JPH08110435A (ja) * 1994-10-12 1996-04-30 Hitachi Ltd 半導体光結合装置
KR19990018425A (ko) * 1997-08-27 1999-03-15 윤종용 동일 평면기판상에 입출력 광섬유 어레이가 위치하는 광섬유 어레이 모듈
JP2002101051A (ja) * 2000-09-21 2002-04-05 Hitachi Ltd 波長多重光インタコネクション装置
JP3803596B2 (ja) * 2002-03-14 2006-08-02 日本電気株式会社 パッケージ型半導体装置
JP2003344695A (ja) * 2002-05-22 2003-12-03 Sumitomo Electric Ind Ltd 光導波路モジュール
JP4462269B2 (ja) * 2004-09-29 2010-05-12 日立化成工業株式会社 光電気集積回路素子およびそれを用いた伝送装置

Also Published As

Publication number Publication date
JPWO2006035499A1 (ja) 2008-05-15
CN1993639B (zh) 2013-01-16
WO2006035499A1 (ja) 2006-04-06
KR20070030934A (ko) 2007-03-16
TW200611434A (en) 2006-04-01
TWI376038B (enExample) 2012-11-01
US7657136B2 (en) 2010-02-02
US20090003761A1 (en) 2009-01-01
CN1993639A (zh) 2007-07-04
KR100911508B1 (ko) 2009-08-10

Similar Documents

Publication Publication Date Title
JP4462269B2 (ja) 光電気集積回路素子およびそれを用いた伝送装置
JP5445579B2 (ja) 光導波路モジュール
US11424837B2 (en) Method and system for large silicon photonic interposers by stitching
JP5568044B2 (ja) 光インターコネクトモジュールおよび光電気ハイブリッド混載ボード
JP5439080B2 (ja) 光ｉ／ｏアレイモジュール
US20100215313A1 (en) Optical interconnection assembled circuit
JP5532929B2 (ja) 光配線プリント基板の製造方法
KR100460703B1 (ko) 일체화된 광송수신 모듈과 광도파로를 구비하는 광백플레인
US7876984B2 (en) Planar optical waveguide array module and method of fabricating the same
KR20070085080A (ko) 전자-광 모듈 제조 시스템 및 방법
US6879423B2 (en) Printed circuit board assembly with multi-channel block-type optical devices packaged therein
JP2012013726A (ja) 光インターコネクションモジュールおよびそれを用いた光電気混載回路ボード
JP6471229B2 (ja) 光送受信モジュールおよびこれを用いた情報装置
Shen et al. Flexible electronic-optical local bus modules to the board-to-board, board-to-chip, and chip-to-chip optical interconnection
JP5898732B2 (ja) 光モジュールの製造方法

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20091027

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091228

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100126

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100208

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130226

Year of fee payment: 3

R151 Written notification of patent or utility model registration

Ref document number: 4462269

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130226

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140226

Year of fee payment: 4

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140226

Year of fee payment: 4

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees