CN107748417B - 二极管模组的制作方法 - Google Patents
二极管模组的制作方法 Download PDFInfo
- Publication number
- CN107748417B CN107748417B CN201711122228.8A CN201711122228A CN107748417B CN 107748417 B CN107748417 B CN 107748417B CN 201711122228 A CN201711122228 A CN 201711122228A CN 107748417 B CN107748417 B CN 107748417B
- Authority
- CN
- China
- Prior art keywords
- layer
- optical waveguide
- optical fiber
- epitaxial
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 230000003287 optical effect Effects 0.000 claims abstract description 96
- 239000013307 optical fiber Substances 0.000 claims abstract description 70
- 239000004065 semiconductor Substances 0.000 claims abstract description 63
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims description 15
- 239000000835 fiber Substances 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 2
- 238000000407 epitaxy Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4295—Coupling light guides with opto-electronic elements coupling with semiconductor devices activated by light through the light guide, e.g. thyristors, phototransistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/12—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711122228.8A CN107748417B (zh) | 2013-04-12 | 2013-04-12 | 二极管模组的制作方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711122228.8A CN107748417B (zh) | 2013-04-12 | 2013-04-12 | 二极管模组的制作方法 |
CN201310126774.4A CN104103725B (zh) | 2013-04-12 | 2013-04-12 | 二极管模组和其制作方法及光互连装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310126774.4A Division CN104103725B (zh) | 2013-04-12 | 2013-04-12 | 二极管模组和其制作方法及光互连装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107748417A CN107748417A (zh) | 2018-03-02 |
CN107748417B true CN107748417B (zh) | 2020-04-21 |
Family
ID=51671702
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711122199.5A Pending CN107731976A (zh) | 2013-04-12 | 2013-04-12 | 二极管模组 |
CN201711122228.8A Active CN107748417B (zh) | 2013-04-12 | 2013-04-12 | 二极管模组的制作方法 |
CN201310126774.4A Expired - Fee Related CN104103725B (zh) | 2013-04-12 | 2013-04-12 | 二极管模组和其制作方法及光互连装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711122199.5A Pending CN107731976A (zh) | 2013-04-12 | 2013-04-12 | 二极管模组 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310126774.4A Expired - Fee Related CN104103725B (zh) | 2013-04-12 | 2013-04-12 | 二极管模组和其制作方法及光互连装置 |
Country Status (1)
Country | Link |
---|---|
CN (3) | CN107731976A (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109860354B (zh) * | 2018-12-28 | 2020-05-19 | 南京邮电大学 | 同质集成红外光子芯片及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5796118A (en) * | 1996-01-25 | 1998-08-18 | Nec Corporation | Photodetection semiconductor device |
JP2000347050A (ja) * | 1999-06-03 | 2000-12-15 | Nhk Spring Co Ltd | 光送受信モジュール |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2546506B2 (ja) * | 1993-07-27 | 1996-10-23 | 日本電気株式会社 | 光半導体素子と光導波路の結合構造およびその結合方法 |
JPH07218772A (ja) * | 1994-01-27 | 1995-08-18 | Hitachi Ltd | 半導体光モジュール |
JP3767156B2 (ja) * | 1998-02-23 | 2006-04-19 | 住友電気工業株式会社 | 光送受信モジュ−ル |
BR0012511A (pt) * | 1999-07-16 | 2002-04-02 | Hybrid Micro Technologies Aps | Integração hìbrida de componentes óticos ativos e passivos em uma placa de silìcio |
DE60132214T2 (de) * | 2000-08-17 | 2008-05-08 | Matsushita Electric Industrial Co., Ltd., Kadoma | Verfahren zur herstellung einer optischen montageplatte |
US6786651B2 (en) * | 2001-03-22 | 2004-09-07 | Primarion, Inc. | Optical interconnect structure, system and transceiver including the structure, and method of forming the same |
JP2003167175A (ja) * | 2001-12-04 | 2003-06-13 | Matsushita Electric Ind Co Ltd | 光実装基板及び光デバイス |
US7657136B2 (en) * | 2004-09-29 | 2010-02-02 | Hitachi Chemical Co., Ltd. | Optoelectronic integrated circuit device and communications equipment using same |
CN103376514A (zh) * | 2012-04-20 | 2013-10-30 | 鸿富锦精密工业(深圳)有限公司 | 光纤连接器 |
-
2013
- 2013-04-12 CN CN201711122199.5A patent/CN107731976A/zh active Pending
- 2013-04-12 CN CN201711122228.8A patent/CN107748417B/zh active Active
- 2013-04-12 CN CN201310126774.4A patent/CN104103725B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5796118A (en) * | 1996-01-25 | 1998-08-18 | Nec Corporation | Photodetection semiconductor device |
JP2000347050A (ja) * | 1999-06-03 | 2000-12-15 | Nhk Spring Co Ltd | 光送受信モジュール |
Also Published As
Publication number | Publication date |
---|---|
CN104103725A (zh) | 2014-10-15 |
CN107731976A (zh) | 2018-02-23 |
CN104103725B (zh) | 2018-07-27 |
CN107748417A (zh) | 2018-03-02 |
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Effective date of registration: 20200203 Address after: 224000 room 206, building 3, Fengming Tixiang apartment, no.270, South Jiefang Road, Chengnan New District, Yancheng City, Jiangsu Province Applicant after: Xia Tian Address before: 518000 Electronic Commerce Incubation Base of Tenglong Road Gold Rush, Longhua Street, Longhua New District, Shenzhen City, Guangdong Province Applicant before: CHAMP TECH OPTICAL (FOSHAN) Corp. |
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TR01 | Transfer of patent right |
Effective date of registration: 20201009 Address after: No. 201, Xinsheng street, Wangbao Town, Qidong City, Nantong City, Jiangsu Province, 226000 Patentee after: Qidong ouchang New Material Co., Ltd Address before: 224000 room 206, building 3, Fengming Tixiang apartment, no.270, South Jiefang Road, Chengnan New District, Yancheng City, Jiangsu Province Patentee before: Xia Tian |
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Effective date of registration: 20220307 Address after: 226000 Wang Bao Zhen Xin Gang Cun, Qidong City, Nantong City, Jiangsu Province Patentee after: Jiangsu Xintong new energy Co.,Ltd. Address before: 226000 No. 201, Xinsheng street, Wangbao Town, Qidong City, Nantong City, Jiangsu Province Patentee before: Qidong ouchang New Material Co.,Ltd. |
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