TWI375231B - - Google Patents

Download PDF

Info

Publication number
TWI375231B
TWI375231B TW094123992A TW94123992A TWI375231B TW I375231 B TWI375231 B TW I375231B TW 094123992 A TW094123992 A TW 094123992A TW 94123992 A TW94123992 A TW 94123992A TW I375231 B TWI375231 B TW I375231B
Authority
TW
Taiwan
Prior art keywords
alloy
film
conductive
weight
fine particles
Prior art date
Application number
TW094123992A
Other languages
English (en)
Other versions
TW200614271A (en
Inventor
Takashi Kubota
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200614271A publication Critical patent/TW200614271A/zh
Application granted granted Critical
Publication of TWI375231B publication Critical patent/TWI375231B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17Metallic particles coated with metal
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1651Two or more layers only obtained by electroless plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48Coating with alloys
    • C23C18/50Coating with alloys with alloys based on iron, cobalt or nickel
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54Contact plating, i.e. electroless electrochemical plating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/023Alloys based on aluminium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982Particulate matter [e.g., sphere, flake, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991Coated
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991Coated
    • Y10T428/2993Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991Coated
    • Y10T428/2993Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
    • Y10T428/2995Silane, siloxane or silicone coating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991Coated
    • Y10T428/2993Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
    • Y10T428/2996Glass particles or spheres

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemically Coating (AREA)
  • Conductive Materials (AREA)

Description

1375231 九、發明說明: 【發明所屬之技術領域】 本發明係關於導電性微粒子、該導電性微粒子之製造 方法、以及使用該導電性微粒子之異向性導電材料。 【先前技術】 以往’-直使用金、銀、錦等之作成粒狀之金屬粒子 作為導電性微粒子,但由於比重大、形狀非固$,故有盔 法均句地分散於結合劑樹脂中之情形,而成為異向性導電 材料之導電性產生偏差之原因。 相對於此,有報告提出,於作為 仏1下馮心材粒子之玻璃珠、 玻璃纖維、歸料非導電性粒子之表面,以錄等金屬實 施化學鑛敷之導電性微粒子,例如,於專利讀】,揭示 -種將實質上㈣狀之樹脂粉末粒子,藉由化學鑛錄法形 成金屬被膜之導電性化學鍍敷粉體。 然而,以該等化學錢錦法形成之金屬被膜,由於錄被 膜中含有碳,故與純鋅金屬相 _ _ 忒释隻屬相比,不僅導電性變差,若鎳 被膜中之磷含量高時,則钽访描—.s _ ” 叶則鎳被膜之導電性會有更差之傾 向。 又’該等化學鍍鎳法,由於 田&心材拉子本身表面積大、 凝集力大,故於一定之ηΗ τ _ P下,將構成鎳鍍敷液之鎳鹽溶 液與次璘酸鈉等少量少署e + i 1 菫乂里添加之方法中,難以精密地控制 鑛敷反應速度,而益法^八4 …、沄充刀地抑制導電性微粒子之凝集 性。 一 5 1375231 另一方面,專利文獻 ^ _ 中揭不一種導電性微粒子,甘 係於樹脂微粒子之表面今^』 '、 衣囱-有由鎳或鈷構成、且1 i舌 量%之磷之金屬被敷層。 重 再者,專利文獻3 Φ姐- ^ 中揭不一種鍍鎳粒子,其為 害導電性’使鎳二膜中之磷含量於鎳被膜厚度方向之分二 不同’即使其由芯材粒子側朝鎳被膜表面側遞減。 專利文獻1:日本特開平8_3 1 1655號公報。 專利文獻2:日本特開帛250738 1號公報。 專利文獻3 :日本特開2003-34879號公報。 【發明内容】 專利文獻2之導電性微粒子雖導電性優異, 覆層之可撓性並不充分,使盆盥* 1史〃興心材粒子之密合性並不充 分’故無法因應近年來伴隨電子機器急速進展而對 接之可靠性更提昇之要求,是其問題。 ’、 又’專利文獻3之鍍鎳粒子之製造方法中,由於減低 破濃度’而使反應速度猶稍增加,故容易弓}起浴分解,而 有浴管理困難之問題…由於錄被膜表面之磷含量低, 故鍍敷被膜帶有磁性性質,而使鎳被膜表面附近之反應容 易發生凝集,是其問題。 合 曲再者,專利文獻3之鍵鎳粒子,由於録被膜表面側之 磷濃度低而導電性增加,但即使如此其導 /、导電性仍比純鎳金 屬差’而無法獲得全面性之改善效果。 本發明,有鐾於上述現狀,以提供一種具有優異導電 1375231 金被膜之形成方法,可舉例如,置換鐘金法或還原鑛 金法等化學鍍金法、電鍍金法、濺鍍法等。其中,以化學 鐘金法為佳。 化學鐘金法,例如,於施行上述置換鑛金時,合金錐 敷被膜之敎純度愈高置換反應愈容易進行,而於本發明 之導電性微粗子,由於合金鍍敷被膜表面側之磷含量非常 低,故可形成緻密之金被膜。
用以製得本發明之導電性微粒子之製造方法,以上述 之後期反應銅鹽添加法為佳,具體而言,較佳為下述方法/ 於載持有金屬觸媒之芯材粒子的水性懸浮液中,添加含鎳 鹽、碟系遇原劑、〗pH調整劑之錢敷液以進行初期化學 鍍敷反應,之後’添加含鎳鹽、銅鹽、磷系還原劑 Η 调整劑之鍍敷液以進行後期化學鍍敷反應。 於載持有金屬觸媒之芯材粒子的水性懸浮液中,添加 含錄鹽、麟系還原劑、& ρΗ調整劑之鐘敷液以進行= 化學鑛敷反應’之後’添加含錄鹽、銅鹽、鱗系還原劑、 ^ ΡΗ調整劑之鑛敷液以進行後期化學鍵敷反應之本發 導電性微粒子之製造方法,亦為本發明之一。 以下,進一步說明本發明之導電性微粒子之製造方法。 本發明之導電性微粒子之製造方法,於初期反應中, 踏載持有金屬觸媒之芯材粒子的水性懸浮液中,添加含 磷系還原劑 '及pH調整劑之鍍敷液,藉此古二 之安定性。 円冷 本發明之導電性微粒子之具體之製造方法 例如 於 13 1375231 芯材粒子表面,载持鈀篝音厶厘 ,^ 料貝金屬觸媒,將該載持有纪之芯 妓“ 作成水性懸吁液’滴下含有鎳鹽、 斛糸還原劑、及pH調整劑之錢敷液 滴下含有錦鹽、銅鹽、射/Λί 應結束後, · %糸還原劑、及PH調整劑之鍍敷 液’使後期反應結束。Μ此,玎制, 微粒子。 纟以可製-經化學鍍敷之導電性 上述之製造方法中,為了得到載持有 之芯材粒子,較佳為,準備、 ,,屬觸媒 來捕㈣料等責㈣料 ’^方式 屬離子捕捉能力之芯材粒子,以其二具有貴金 使用適當的還原劑,藉此,使貴金屬離子,接著 表面。 《胃㈣觸料㈣芯材粒子 於表面能以f合物或鹽的方式 離寻之〇奴4%工 + 〜20雕于等貴金屬 離子之‘。㈣子,以表面具有胺 姑物j_ 兑胺基專B能基之芯 材粒子為佳,而以具有胺基之官能基 又,即使是沒有上述官能基之芯材粒子,‘ ”、,佳。 以陽離子系界面活性劑進行表面處理,亦藉由 捉鈀離子等貴金屬離子之芯材粒子。 于到表面能捕 於表面載持有貴金屬觸媒之芯材粒子, 般之分散方法懸浮於水中者 /、要為能以- 疋’例如,可為具有球狀、纖維狀、 一寺别限 形狀之粒子,亦可為不定形狀之粒子。:、針狀等特定 好之電氣連接,芯材粒子以球狀為佳/、’為了得到良 上述芯材粒子之粒徑’並無特別限定 仁 u 1〜ΙΟΟμηΊ 14 1375231 為佳,以2〜20μηι為更佳。 彈批t述〜材粒子之材質只要為具有適度的彈性係數' ‘ ^料及復輕料可,可為有㈣
糸材料’並無特職定,㈣樹難子等有㈣材料為為·佳機 上述有機系材料,無特別限制可舉例㈣樹脂 .月曰、聚酯樹脂、尿素樹脂' 三聚氰胺樹脂 二乙稀苯聚合物,·二乙婦苯-苯乙烯共聚物、二乙乳^日 曱基丙烯酸雖共聚物等二乙烯苯 臂人妝笙, 个宁承σ物,T基丙烯酸酯 “物專。上述甲基丙烯酸醋聚合物, f…,亦可混合其等使用。其中,較佳為使用二 乙·本聚合物、f基丙烯酸醋聚合物。此處,甲 醋聚合物,係指甲基丙稀酸醋或丙稀酸醋〇 " 氧化材料’可舉例如金屬、玻璃、陶究、金屬 氧化物、金屬石夕酸鹽、金屬碳化物、金屬氣化物、 金屬硫酸鹽、金屬魏鹽、金屬硫化物、金屬酸鹽、 金屬鹵化物、碳等。 該等芯材粒子,可單獨使用亦可併用2種以上。 作為上述使芯材粒子捕捉貴金屬離子之方法可 如’將芯材粒子分散於貴金屬鹽之稀薄之酸性水溶液中, 以使4材粒子捕捉貴金屬離子之方法等。 士上述方法中,使用氣化鈀作為酸性水溶液中之責金屬 鹽時,濃度以_〜0.8重量%為佳,使用硫酸把時,以 0.005〜0.2重量%為佳。 又’為了使芯材粒子所捕捉之貴金屬離子作為貴金屬 15 y75231 於捕捉貴金屬離子後 之磷系或侧系還原劑 觸媒,較佳為, 用例如鍍鎳所用 作為貴金屬觸媒 之酸性水溶液中 ,使責金屬離子
還原 本發明之導電性微粒子之製造 貴金屬觸媒之芯材粒子之水性懸浮液了 =液中發线集,水性詩液中之芯㈣子 重量%為佳。 又乂 0.5〜1.5 上返水性懸洋液中
夕苻庙> v v啊尤艰斅反應開始時 之反應液之pH,例如,以添佳銨、藍 等為 飞氧化鈉、硫酸、鹽酸 本發明之導電性微粒子之製造方法中之碟系還原劑, 可舉例如,次磷酸鈉、次磷酸鉀、次磷酸等。 上述磷系還原劑之濃度,以3〜3〇重量%為佳。 本發明之導電性微粒子之製造方法中,較佳於鍍敷液 中含有錯合劑。 上述錯合劑,只要為對金屬離子具有錯合作用之化合 物即可,並無特別限定,可舉例如,韻果酸、乳酸、酒石 酸、檸檬酸、葡萄糖酸、羥基乙酸等羧酸或其鹼金屬鹽; 敍鹽等缓酸鹽;甘胺酸等氣基酸;乙二胺;烷基胺等胺類; 銨、EDTA、焦磷酸鹽等。 上述錯合劑的漠度以0 · 1〜8重量%為佳。 本發明之導電性微粒子之製造方法中,係分別調製於 初期反應所使用之鍍敷液、與後期反應所使用之鍍敷液。 上述初期反應,即於磷含量多之芯材粒子側之被膜形 ^75231 鍍敷溫度之方法;依序增高鍍敷液中還原劑濃度之方法 荨。玄專方法可單獨使用,亦可组合兩種以上使用。其中 較佳為藉由依序提高pH之方法以減少鎳含量。如此可作 成磷含量於合金鍍敷被膜表面側較少,且銅含量於合金鍍 敷被膜表面側較多者。
—又,於後期反應,為了抑制粒子的凝集及得到浴之安 疋性,以極力降低鑛敷溫度為佳。更具體地說,較佳為將 鍍敷液以將添加之鍍敷液溫度控制為20〜4〇t。 因此,較佳為於初期反應極力降低鑛敷溫纟,藉此, 於後期反應之溫度調節較容易而易於提昇作業性。 又’於表面形成含有鎳及銅而磷澧 丄Α 忪/辰度低之合金鍍敷被 膜時’由於鐘敷申之粒子容易各♦士 易心速地凝集,故較佳為當伴 遺s金鑛敷反應所產生之氫益法墟% 口主 ^ _ 虱無法確5忍時,於粒子的凝集發 生别結束合金錢敷反應。 ’、 合金鍍敷反應結束後’繼續攪拌1〇至2〇分鐘使兑孰 成,之後,將粒子過濾,以酒精、溫水等洗淨 焯 藉此製得導電性微粒子。 、乾煤’ 本發明之異向性導電材料,伤 _ ^ 係將上述本發明之遙# μ 螆粒子分散於樹脂結合劑中所形成者。 上述異向性導電材料,只要Α ^ χ 要為將本發明之導電性微粒 子分散於樹脂結合劑中者即可,並盔 ^ e ω ?寻別限疋’可舉例如, 一向性導電糊、異向性導電油墨、異向 ^ 異向性導電臈、異向性導電片等。 ” -M妾著劑、 本發明之異向性導電材料之 忐並無特別限定, ]8 1375231 可舉例如,添加本發明之導 合劑令,並均勻地還合分散,粒子於絕緣性之樹脂結 性導電油墨、異向性 :形成異向性導電糊'異向 之樹脂結合劑中六力& #料之方法;或於絕緣性 口 J中添加本發明之導 分散製作成導電性組成物 i微拉子,均句地混合 勾地洛解(分散)於有機 U成物均 Μ Μ ^ ^ 或加熱使之溶解,於剝 離紙或剝離骐等剝離材之剝 …解於釗
的方式it —洽士 上,以形成既定膜厚 大進仃塗布,視需要進行乾 性導電臈、異向性導電片等之方I成如異向 性導雷心 片4之方法,可因應欲製作之異向 挫導電材枓之種類選擇適當之 络岵+山 衣邛万法。又,亦可不將絕 緣性之樹脂結合劑、與本發明之導電性微粒子混合,而分 別使用作為異向性導電材料。 上述絕緣性之樹脂結合劑之樹脂,並無特別限定,可 舉例如’ 6醆乙㈣樹脂、氣化乙稀系樹脂、丙稀酸系樹 脂 '笨乙豨系樹脂等乙烯系樹脂;聚烯烴系樹脂、乙稀— 乙酸乙烯共聚物、聚醯胺系樹脂等熱塑性樹脂;環氧樹脂、 氨基曱酸酯樹脂、聚醯亞胺系樹脂' 不飽和聚酯系樹脂及 該等之硬化劑所構成硬化性樹脂;苯乙烯_ 丁二稀—苯乙 烯肷·!又共聚物、笨乙稀一異戊二稀—苯乙烤嵌段共聚物、 其等之氫添加物等之熱塑性嵌段共聚物;笨乙稀_ 丁二稀 共1合橡膠、氯丁二烯橡膠、丙稀猜一苯乙稀嵌段共聚物 橡膠等彈性體類(橡膠類)等。該等樹脂,可單獨使用亦 可並用2種以上。又,上述硬化性樹脂,可為常溫硬化型、 熱硬化型、.光硬化型、漁氣硬化型等任一硬化型態。 19 本發明之異向性導電材料 合劑、及本發明之導電性微粒 發明之課題的範圍内,例如, 劑)、増黏劑、抗氧化劑(抗 定劑、紫外線吸收劑、著色劑 添加劑之1種或2種以上。 中,除添加絕緣性之樹脂結 子外,亦可於不妨礙達成本 併用增量劑、軟化劑(可塑 老化劑)、熱安定劑、光安 、難燃劑 '有機溶劑等各種
本發明之導電性微粒子,例如,由於控制合金鐘敷液 之PH’於初減應降低pH以減緩反應速度,而於怎材粒 :側’金屬之沉澱速度t曼’而副產物磷之生成快,故有很 夕磷會進入合金鍍敷被帛中而形成磷含量多之合金鍍敷被 膜。形成如此之合金鍍敷被膜之粒子,不僅由於磷含量多 使合金鍍敷被膜非磁性化,而使粒子變成凝集性小者,且 由於可幵> 成無凹凸均勻而緻密之合金錄敷被膜故與芯材 粒子之密合性優異。 又,初期反應後,轉換成後期反應時,由於在後期反 ^應中使用銅鹽,故可抑制副產物磷之生成,並取而代之使 銅析出’因此析出至合金鍍敷被膜之磷變少。再者,例如 藉由依序提高合金鍍敷液之pH使合金鍍敷被膜表面側之 碟含置變少’而使合金鍍敷被膜表面側之銅含量變得更 南0 因此’製得之導電微粒子,由於合金鐘敷被膜中含有 導電性佳之鋼故具有優異之導電性,再者,由於合金鍍敷 被膜表面側導電阻礙物質磷之含量少而銅含量高故具.優異 之導電性。 20 一 於合金鍍敷被臈表面側之磷濃度非常低,故 實施鏟金時,可促進與金之置換反應,而容易製得敏密之 置換鏟金’得到非常優異之導電性微粒子。 本發月之導電性微粒子,由於與芯材粒子之鍵敷密合 故作為異向性導電材料時,即使與樹脂結合劑混 .2刀散:鍍敷被膜亦難以剝落。又’由於合金鍍敷被膜中 有導電!生佳之銅’故使用本發明之導電性微粒子之本發 •明異向性導電材料,具有優異之導電性。 本务明之導電性微粒子,由於為上述構成故可具有 優八之導屯性、並且與芯材粒子之密合性高且凝集性小。 〇 ’本發明之導電性微粒子之製造方法,係鍍敷浴安定性 ^且所製得之導電性微粒子,具有優異之導電性、並且 與芯材粒子之密合性高且凝集性小。再者,及使用本發明 之導電性微粒子之異向性導電材料,具有優異之導電性。 ~ 【實施方式】 以下,舉實施例詳細說明本發明。但本發明並不限於 以下之貫施例。 . (實施例1 ) 將粒徑之二苯乙烯系聚合物樹脂粒子(積水化學 工業製,「SP-204」),以離子吸附劑之1〇重量%溶液處 理5分鐘,之後,以硫酸鈀之〇 〇1重量%溶液處理5分鐘, 再添加二曱基胺硼烷施以還原處理,過濾、洗淨,並浸潰 於鎳鍍敷液中使其反應,藉此製得已載(^^)之芯材粒子。 21 1375231 其次,調製含琥珀酸鈉!重量%與離子交換水5〇〇mL 之溶液,將製得之芯材粒子10g與其混合,調製水性懸浮 液’並添加硫酸調製成pH為5之水性懸浮液。 另一方面,調製含硫酸鎳20重量%、次磷酸鈉.2〇重 量%、及氫氧化鈉8重量%之合金鍍敷液作為初期反應用 合金鑛敷液。
將製得之水性懸浮液升溫至80〇c,將其連續滴入至上 述製得之初期反應用合金鍍敷液,攪拌2〇分鐘,藉此進 行初期化學鍍敷反應。於該鍍敷反應中,確認無顯著之凝 集、氫之產生結束時,結束初期反應。 其次,調製含硫酸鎳1 〇重量。/。、硫酸銅丨〇重量% ' 次磷酸鈉5重量%、及氫氧化鈉5重量%之合金鍍敷液作 為後期反應用合金鐘敷液。 之後於初期反應結束後之溶液中,連續滴入製得之 後期反應用合金鍍敷液,攪拌1小時,藉此進行後期化學 鐘敷反應’而製得形成合金鍍敷被膜之導電性微粒子(導 電性微粒子1 )。 對所製得之形成合金鍍敷被膜之導電性微粒子,進一 步進行置換鍍金’而製得於合金鍍敷被膜上形成金被膜之 導電性微粒子(導電性微粒子2 )。 (導電性微粒子之評價) 將製得之導電性微粒子1與導電性微粒子2,以會聚 離子束切出截面,用20萬倍之穿透型電子顯微鏡觀察, 以調查鍍敷被膜之狀態及膜厚。該等導電性微粒子,係附 22 1375231 著著均質且細緻之合金鍍敷被膜。 又對製得之導電性微粒子1與導電性微粒子2,以 下述之導電性微粒子之電阻值測定方法,調查導電性(電 阻值)。 再者,對導電性微粒子2,以下述之EDX之成分測定 方法,測定合金鍍敷被膜中之鎳、鋼、及磷之含量。 此等結果示於表1。 (導電性微粒子之電阻值測定方法) 將微小I缩試驗機(「DUH_2〇〇」,島津製作所公司 製)調整成可測定電阻值後使用,一邊壓縮導電性微粒子 一邊測定電阻,藉此測定導電性微粒子之電阻值。 (EDX之成分測定方法) 使用EDX (「能量分散型χ線分光機」,日本電子資 料公司製),以會聚離子束切出導電性微粒子之截面,對 合金鍍敷被膜中之各部位進行成分分析,藉此敎錄、銅' 及鱗之檢測值。由測得之敎值計算出合金銀敷組成中之 鎳、鋼、及磷之含量。 (實施例2 ) 於實施例i t,不使用含硫酸錄1()重量%、硫酸銅ι〇 重量%、次磷酸納5重量%、及氫氧化納5重量%之合金鍍 敷液作為後期反應用合錢敷液,而以含硫酸錄5重量%、 硫酸銅15重量%、次磷酸鈉5重量% '及氫氧化鈉5重量 %之合金錢液取代之外,卩同樣方法製得導電性微粒子 1與導電性微粒子2。 23 1375231 與實施例同樣地進行導電性微粒子之評價。其等結果 示於表1。該等導電性微粒子,係附著著均質真細緻之合 金鐘敷被膜。 (實施例3 )
於實施例1中,不使用含硫酸鎳1 〇重量%、硫酸銅1 〇 重量%、次磷酸鈉5重量%、及氫氧化鈉5重量%之合金鍍 敷液作為後期反應用合金鍍敷液,而以含硫酸鎳15重量 % '硫酸銅5重量%、次填酸鈉5重量❻/〇、及氫氧化鈉5重 量%之合金鍍敷液取代之外’以同樣方法製得導電性微粒 子1與導電性微粒子2。 與實施例同樣地進行導電性微粒子之評價。其等結果 示於表1。該等導電性微粒子,係附著著均質且細緻之合 金鐘敷被膜。 (比較例1 ) 於實施例1中,不使用含硫酸鎳1 〇重量0/〇、硫酸銅i 〇 重ϊ %、次磷酸鈉5重量%、及氫氧化鈉5重量%之合金鍍 敷液作為後期反應用合金鍍敷液,而以含硫酸鎳2〇重量 %、次磷酸鈉5重量%、及氫氧化鈉5重量%之合金鍍敷液 取代之外’以同樣方法製得導電性微粒子1與導電性微粒 子2 〇 與實施例同樣地進行導電性微粒子之評價.其等結果 表1。該等導電性微粒子,係附著著均質且細緻之合 金鍍敷‘被膜。 24 1375231 重量份、三(二甲基氨基甲基)紛2重量份、及甲苯㈣重 量份所構成之樹脂結合劑中,添加實施例1所,得之導電 性微粒子2,使用行星式㈣機充分混合後,以、使乾燥後 之厚度為7μηι的方式塗布於剥離膜上,使甲笨蒸發後得到 ^有導電性微粒子之接著薄膜β χ,導電性微粗子之配合 里’係作成薄膜中之含量為5萬個/cm2。
之後,將含有導電性微粒子之接著薄膜,與沒有含有 導電性微粒子之接著薄膜以常溫貼合,製得厚纟口_之 二層構造之異向性導電薄膜。 (實施例5 ) 除了添加實施例2所製得之導電性微粒子2外,以與 實施例4相同之方法製得異向性導電薄膜。 ^ (實施例6 ) 除了添加實施例3所製得之導電性微粒子2外,以與 實施例4相同之方法製得異向性導電薄膜。 (異向性導電材料之導電性評價) 將所製得之異向性導電薄膜,裁切成5x5mm之大小。 又,準備於一方具有電阻測定用之線路、且形成有寬 2〇〇μιη、長lmm、高〇 2μπι、l/s 2〇μιη之鋁電極之玻璃基 板2片。將異向性導電薄膜,貼付於一片玻璃基板之大致 中央後,將另一片玻璃基板,以重疊於貼付有異向性導電 薄膜之玻璃基板之電極圖案的方式對準貼合。 將2片破璃基板,以壓力丨〇ν、溫度1 8〇〇c之條件熱 壓接後,測定電極間之電阻值。分別測定實施例4、實施 26 ^'231 例5、實施例6、及比較例2所製得之異向性導電薄膜。 又’對製得之試驗片進行PCT試驗(8〇t、95%rh 2溫高濕環境下保持麵小時)後,敎電極間之電 評價結果示於表2
之電阻值(Γ2) (平常) 阻值(ω1 (PCT試驗後) (80 C、95%RH、1〇〇〇 小時後) 評價
性由表2可知,使用實施例製得之導電性微粒子之異向 電薄膜,與使用比較例製得之導電性微粒子之異向性 ^ 電薄膜相比,前者電阻值較低而具有優異之導電性。 根據本發明,可提供具有優異導電性、與芯材粒子之 :生兩、且凝集性小之導電性微粒子;鍍敷浴安定性高 •之。亥導電性微粒子之製造方法;以及使用該導電性微粒子 之異向性導電材料。 【圖式簡單說明】 圖1 ’係本發明之導電性微粒子之一樣態中,導電性 微粒子中合金鍍敷被膜中之磷含有量之測定部位之說明 27

Claims (1)

1375231 十、申請專利範圍: 1. 一種導電性微粒子,苴 面,藉由化學鍍敷法形成含有鋅政在於’於芯材粒子之表 膜,該合金鍍敷被膜中厚度方二、銅、及磷之合金鍍敷被 臈表面側較芯材粒子側低, 《土锻敷被 於該合金鑛敷被膜中之屋 ^ 度方向’於芯材粒子側算起 200/◦以下之區域含有鎳及磷 入 於s金鍍敷被膜表面側算起 80%以下之區域含有鎳、鋼、及磷, 异起 於β亥合金錢敷被膜中之展库士人 年度方向’於芯材粒子側算起 20/ί(以下之區域之合金鍍數έ日士、士 成中’含有磷8〜15重量% ; 於合金鍍敷被膜表面側算起8 疫80/〇以下區域之合金鍍敷組成 中,含有磷0.05〜5重量%。 2. 如申5青專利範圍第1項夕道# ^ 項之導電性微粒子,其中,於該 合金鑛敷被膜中之厚唐方6 . Α 方向,於合金鍍敷被膜表面側算起 8〇%以下區域之合金鍍敷組成中,含有鋼0.5〜90重量%。 3. 如申請專利範圍第1或2項之導電性微粒子,其中’ 於該合金鐘敷被膜令之厘痒士人 ^ 联Τ之;予度方向,於芯材粒子側算起20% 以下之區域之合金鍍敷組成中,含有85〜92重量%之錄;於 合金錢敷被膜表面側算# 8〇%以下區域之合金鍍敷組成 中’含有5〜99.45重量。/〇之鎳。 4. 如申。月專利範圍第1或2項之導電性微粒子,其進-步於合金鍍敷被膜之表面形成金被膜。 5. 如申請專利範圍第3項之導電性微粒子,其進一步於 合金鐘敷被膜之表面形成金被膜。 29 丄丄 101年7月4日替換頁 6. 利範圍第種二電性微粒子之製造方法,其係用以製造申請專 於載^二任—項之導電性微粒子,其特徵在於, 於戰待有金屬觸媒 4 鹽、填㈣^ 料液卜添加含錦 及PH調整劑之鍍敷液以進行初期化學鍍 敷反應,之後’添加含鎮鹽、銅鹽、磷系還原劑、及pH “ 整劑之鍍敷液以進行後期化學鍍敷反應。 調 7·-種異向性導電材料,其特徵在於,係將中請專利範 圍第1〜5項中任一項之導電性微粒子分散於樹脂結合劑中 所形成。 十一、圖式: 如次頁
30 1375231 署 七 ( » _ 101年7月Θ日替換頁 、指定代表圖: (一) 本案指定代表圖為:第(1 )圖。 (二) 本代表圖之元件符號簡單說明: 1 導電性微粒子 2 芯材粒子 3 合金鐘敷被膜 4 合金鍍敷被膜表面 a合金鐘敷被膜中之厚度方向中芯材粒子 側算起20%以下之區域 b合金鐘敷被膜中之厚度方向中合金鍵敷 被膜表面側算起80%以下區域 八、本案若有化學式時,請揭示最能顯示發明特徵的化學式:
TW094123992A 2004-07-15 2005-07-15 Conductive microparticle, process for producing the same, and anisotropic conductive material TW200614271A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004208913 2004-07-15

Publications (2)

Publication Number Publication Date
TW200614271A TW200614271A (en) 2006-05-01
TWI375231B true TWI375231B (zh) 2012-10-21

Family

ID=35784024

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094123992A TW200614271A (en) 2004-07-15 2005-07-15 Conductive microparticle, process for producing the same, and anisotropic conductive material

Country Status (6)

Country Link
US (1) US7507477B2 (zh)
EP (1) EP1788584A1 (zh)
KR (1) KR101178745B1 (zh)
CN (1) CN1981348A (zh)
TW (1) TW200614271A (zh)
WO (1) WO2006006688A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI616897B (zh) * 2013-01-21 2018-03-01 Toray Industries 導電性微粒子

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
US7723279B2 (en) 2006-08-23 2010-05-25 The Clorox Company Foamable compositions containing alcohol
JP4364928B2 (ja) * 2007-04-13 2009-11-18 積水化学工業株式会社 導電性微粒子、異方性導電材料及び導電接続構造体
JP5327582B2 (ja) * 2007-10-18 2013-10-30 日立金属株式会社 還元析出型球状NiP微小粒子およびその製造方法
JP4352097B2 (ja) * 2007-10-24 2009-10-28 積水化学工業株式会社 導電性微粒子、異方性導電材料、接続構造体及び導電性微粒子の製造方法
JP5422921B2 (ja) * 2008-05-28 2014-02-19 デクセリアルズ株式会社 接着フィルム
JP5358328B2 (ja) 2009-07-16 2013-12-04 デクセリアルズ株式会社 導電性粒子、並びに異方性導電フィルム、接合体、及び接続方法
KR101205041B1 (ko) * 2009-08-06 2012-11-27 히다치 가세고교 가부시끼가이샤 도전 입자
JP4957838B2 (ja) * 2009-08-06 2012-06-20 日立化成工業株式会社 導電性微粒子及び異方性導電材料
US20110119992A1 (en) * 2009-11-24 2011-05-26 Exxonmobil Research And Engineering Company Oxidation resistant interstitial metal hydride catalysts and associated processes
US20110119993A1 (en) * 2009-11-24 2011-05-26 Exxonmobil Research And Engineering Company High severity hydroprocessing interstitial metal hydride catalysts and associated processes
US8618010B2 (en) * 2009-11-24 2013-12-31 Exxonmobil Research And Engineering Company Interstitial metal hydride catalyst activity regeneration process
US20110119990A1 (en) * 2009-11-24 2011-05-26 Exxonmobil Research And Engineering Companhy Group 13-15 interstitial metal hydride catalysts and associated processes
GB201018379D0 (en) 2010-10-29 2010-12-15 Conpart As Conductive rf particles
GB201018380D0 (en) 2010-10-29 2010-12-15 Conpart As Process
US8765628B2 (en) 2010-11-09 2014-07-01 Exxonmobil Research And Engineering Company Poison resistant catalyst systems and associated processes
US8637424B2 (en) 2010-11-09 2014-01-28 Exxonmobil Research And Engineering Company Integrated interstitial metal hydride catalyst support systems and associated processes
US8598067B2 (en) 2010-11-09 2013-12-03 Exxonmobil Research And Engineering Company Interstitial metal hydride catalyst systems and associated processes
CN103890960A (zh) * 2011-07-25 2014-06-25 日立化成株式会社 元件及太阳能电池
KR101308159B1 (ko) * 2011-11-01 2013-10-15 성균관대학교산학협력단 고표면적 분말의 형성 방법
TWI602198B (zh) * 2012-01-11 2017-10-11 日立化成股份有限公司 導電粒子、絕緣被覆導電粒子以及異向導電性接著劑
JP6047711B2 (ja) * 2012-02-08 2016-12-21 石原ケミカル株式会社 無電解ニッケル及びニッケル合金メッキ方法、並びに当該メッキ用の前処理液
JP5872440B2 (ja) * 2012-02-13 2016-03-01 Dowaエレクトロニクス株式会社 球状銀粉およびその製造方法
JP5941328B2 (ja) * 2012-04-10 2016-06-29 日本化学工業株式会社 導電性粒子及びそれを含む導電性材料
GB2560969A (en) * 2017-03-30 2018-10-03 Ajt Eng Ltd Electroless plating
CN106920673B (zh) * 2017-04-13 2018-10-12 电子科技大学 一种制备集成电感多元复合磁芯层的方法
KR101917834B1 (ko) * 2017-11-24 2018-11-12 마이크로컴퍼지트 주식회사 다중 금속층을 포함하는 다이아몬드ㆍ니켈 복합 구조 입자 및 그 제조방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2507381B2 (ja) 1987-01-30 1996-06-12 積水フアインケミカル株式会社 導電性微球体
JPH0762254B2 (ja) 1991-09-06 1995-07-05 住友金属鉱山株式会社 無電解銅ニッケル合金めっき方法およびこれに用いるめっき液
JPH06104902B2 (ja) 1991-09-06 1994-12-21 住友金属鉱山株式会社 無電解銅ニッケル合金めっき方法
JP3436327B2 (ja) 1995-05-16 2003-08-11 日本化学工業株式会社 導電性無電解めっき粉体
KR100537130B1 (ko) 1999-05-13 2005-12-16 신에쓰 가가꾸 고교 가부시끼가이샤 도전성 분체 및 그의 제조 방법
JP3716903B2 (ja) * 1999-11-29 2005-11-16 信越化学工業株式会社 金メッキシリカ及びその製造方法
JP2003034879A (ja) 2001-07-26 2003-02-07 Sony Chem Corp Niメッキ粒子及びその製造方法
JP4052832B2 (ja) * 2001-12-26 2008-02-27 積水化学工業株式会社 導電性微粒子、導電性微粒子の製造方法及び異方性導電材料
JP2003306701A (ja) * 2002-04-19 2003-10-31 Mitsui Mining & Smelting Co Ltd 耐熱金属層付銀粉及びその耐熱金属層付銀粉を用いた銀ペースト並びにその銀ペーストを用いて得られた配線板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI616897B (zh) * 2013-01-21 2018-03-01 Toray Industries 導電性微粒子

Also Published As

Publication number Publication date
TW200614271A (en) 2006-05-01
US20070202335A1 (en) 2007-08-30
CN1981348A (zh) 2007-06-13
EP1788584A1 (en) 2007-05-23
US7507477B2 (en) 2009-03-24
WO2006006688A1 (ja) 2006-01-19
KR20070038046A (ko) 2007-04-09
KR101178745B1 (ko) 2012-09-07

Similar Documents

Publication Publication Date Title
TWI375231B (zh)
JP4674096B2 (ja) 導電性微粒子及び異方性導電材料
JP4860163B2 (ja) 導電性微粒子の製造方法
JP4728665B2 (ja) 導電性微粒子、導電性微粒子の製造方法、及び異方性導電材料
TWI375232B (zh)
JP4638341B2 (ja) 導電性微粒子及び異方性導電材料
TWI322437B (zh)
JP4052832B2 (ja) 導電性微粒子、導電性微粒子の製造方法及び異方性導電材料
KR101937734B1 (ko) 도전성 입자, 도전성 재료 및 도전성 입자의 제조방법
TW201115591A (en) Conductive particle, anisotropic conductive film, joined structure, and connecting method
JP5650611B2 (ja) 異方性導電フィルム、異方性導電フィルムの製造方法、接続方法、及び接合体
JP2007242307A (ja) 導電性微粒子及び異方性導電材料
JP5719483B1 (ja) 導電性粒子、導電材料及び接続構造体
JP5941328B2 (ja) 導電性粒子及びそれを含む導電性材料
JP5476221B2 (ja) 導電性粒子、異方性導電材料及び接続構造体
JP4593302B2 (ja) 導電性微粒子及び異方性導電材料
JP4217271B2 (ja) 導電性微粒子及び異方性導電材料
JP2020109765A (ja) 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP2012004033A (ja) 導電性粒子、異方性導電材料及び接続構造体
JP5323147B2 (ja) 導電性微粒子及び異方性導電材料
JP4714719B2 (ja) 導電性微粒子の製造方法
JP5368611B1 (ja) 導電性微粒子
JP5796232B2 (ja) 導電性粒子、異方性導電材料及び接続構造体
JP2006086104A (ja) 導電性微粒子及び異方性導電材料

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees