TWI373626B - - Google Patents

Download PDF

Info

Publication number
TWI373626B
TWI373626B TW097113779A TW97113779A TWI373626B TW I373626 B TWI373626 B TW I373626B TW 097113779 A TW097113779 A TW 097113779A TW 97113779 A TW97113779 A TW 97113779A TW I373626 B TWI373626 B TW I373626B
Authority
TW
Taiwan
Prior art keywords
electronic component
tested
test
contact
contact arm
Prior art date
Application number
TW097113779A
Other languages
English (en)
Chinese (zh)
Other versions
TW200900711A (en
Inventor
Ikeda Hiroki
Kogure Yoshinari
Yamashita Tsuyoshi
Takahashi Hiroyuki
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200900711A publication Critical patent/TW200900711A/zh
Application granted granted Critical
Publication of TWI373626B publication Critical patent/TWI373626B/zh

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW097113779A 2007-05-18 2008-04-16 Electronic component testing device and electronic component testing method TW200900711A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/060212 WO2008142754A1 (ja) 2007-05-18 2007-05-18 電子部品試験装置及び電子部品試験方法

Publications (2)

Publication Number Publication Date
TW200900711A TW200900711A (en) 2009-01-01
TWI373626B true TWI373626B (ja) 2012-10-01

Family

ID=40031481

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097113779A TW200900711A (en) 2007-05-18 2008-04-16 Electronic component testing device and electronic component testing method

Country Status (3)

Country Link
JP (1) JPWO2008142754A1 (ja)
TW (1) TW200900711A (ja)
WO (1) WO2008142754A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI401766B (zh) * 2009-03-23 2013-07-11 Evertechno Co Ltd 試驗處理機及其零件移送方法
TWI414798B (zh) * 2010-05-21 2013-11-11 Hon Tech Inc 可執行冷測/熱測之電子元件測試分類機
JP2013024829A (ja) * 2011-07-26 2013-02-04 Seiko Epson Corp 電子部品搬送装置及び電子部品搬送方法
JP5942459B2 (ja) * 2012-02-14 2016-06-29 セイコーエプソン株式会社 ハンドラー、及び部品検査装置
KR102270760B1 (ko) * 2019-11-29 2021-06-30 에이엠티 주식회사 미세 피치를 갖는 디바이스의 테스트장치
TWI769664B (zh) * 2021-01-15 2022-07-01 鴻勁精密股份有限公司 測試裝置及其應用之測試設備
CN113326167B (zh) * 2021-05-13 2022-07-08 山东英信计算机技术有限公司 基于基板管理控制器通信的定温可调测试器和测试方法
TWI787919B (zh) * 2021-07-23 2022-12-21 致茂電子股份有限公司 多層架構之供料和分料裝置及具備該裝置之電子元件檢測設備
US11740283B2 (en) 2021-07-23 2023-08-29 Chroma Ate Inc. Multistory electronic device testing apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62127677A (ja) * 1985-11-29 1987-06-09 Ando Electric Co Ltd 部品の温度試験装置
JPH0333023Y2 (ja) * 1986-01-24 1991-07-12
JPH1164437A (ja) * 1997-08-22 1999-03-05 Ando Electric Co Ltd Ic加熱装置
JP4458447B2 (ja) * 2000-11-10 2010-04-28 株式会社アドバンテスト 電子部品試験用保持装置、電子部品試験装置および電子部品試験方法

Also Published As

Publication number Publication date
WO2008142754A1 (ja) 2008-11-27
JPWO2008142754A1 (ja) 2010-08-05
TW200900711A (en) 2009-01-01

Similar Documents

Publication Publication Date Title
TWI373626B (ja)
TWI394960B (zh) Electronic component test methods, inserts, trays and electronic component test devices
TWI264549B (en) Pusher with heater, electronic component handling device, and method of controlling temperature of the electronic component
TWI249217B (en) System and method for testing semiconductor devices
KR100815490B1 (ko) 전자부품 시험장치
TWI337167B (ja)
KR19980081510A (ko) 반도체 디바이스용 트레이 꺼내기장치 및 반도체 디바이스용 트레이 수납장치
WO2004106953A1 (ja) 電子部品試験装置
WO2002046781A1 (fr) Douille d'essai pour composants electroniques, et appareil d'essai pour composants electroniques utilisant cette douille
TWI284740B (en) Insert and electronic component handling apparatus comprising the same
JP4279413B2 (ja) 電子部品試験装置用インサート
TW200824032A (en) Customer tray and electronic component testing apparatus
TW522232B (en) Sorting control method of tested electric device
TWI396847B (zh) Embedded devices, trays and electronic parts test equipment
JP2001033519A (ja) 電子部品試験装置用インサート
TW200911653A (en) Tray storage device and electronic part test apparatus
JPH09152466A (ja) Ic試験方法及び装置
TW200911658A (en) Means for storing trays, electronic part tester and tray-storing method
KR100781336B1 (ko) 반도체 소자 테스트 핸들러 및 그의 제어방법
TWI490970B (zh) A pallet handling device, and an electronic component testing device provided with the device
WO2008050442A1 (fr) Appareil de test de composants électroniques
TWI385750B (zh) An electronic component shifting device and an electronic component testing device having the same
TWI423370B (zh) A test tray and an electronic component testing device having the tray
JP2000206194A (ja) 電子部品基板試験用トレイおよび電子部品基板の試験装置
JPH0943311A (ja) Ic試験装置