TWI371683B - Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit - Google Patents
Method and system for real-time estimation and prediction of the thermal state of a microprocessor unitInfo
- Publication number
- TWI371683B TWI371683B TW094122560A TW94122560A TWI371683B TW I371683 B TWI371683 B TW I371683B TW 094122560 A TW094122560 A TW 094122560A TW 94122560 A TW94122560 A TW 94122560A TW I371683 B TWI371683 B TW I371683B
- Authority
- TW
- Taiwan
- Prior art keywords
- prediction
- real
- microprocessor unit
- time estimation
- thermal state
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
- G06F1/32—Means for saving power
- G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
- G06F1/32—Means for saving power
- G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
- G06F1/3234—Power saving characterised by the action undertaken
- G06F1/324—Power saving characterised by the action undertaken by lowering clock frequency
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/892,211 US7347621B2 (en) | 2004-07-16 | 2004-07-16 | Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200606623A TW200606623A (en) | 2006-02-16 |
TWI371683B true TWI371683B (en) | 2012-09-01 |
Family
ID=35058707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094122560A TWI371683B (en) | 2004-07-16 | 2005-07-04 | Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit |
Country Status (7)
Country | Link |
---|---|
US (5) | US7347621B2 (zh) |
EP (1) | EP1769310A2 (zh) |
JP (1) | JP2008507744A (zh) |
KR (2) | KR100985543B1 (zh) |
CN (1) | CN1981254A (zh) |
TW (1) | TWI371683B (zh) |
WO (1) | WO2006008215A2 (zh) |
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TWI646315B (zh) * | 2017-11-15 | 2019-01-01 | 財團法人工業技術研究院 | 溫度估算裝置及溫度估算方法 |
US10877530B2 (en) | 2014-12-23 | 2020-12-29 | Intel Corporation | Apparatus and method to provide a thermal parameter report for a multi-chip package |
TWI756295B (zh) * | 2017-01-26 | 2022-03-01 | 南韓商三星電子股份有限公司 | 熱管理的控制器及設備 |
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- 2005-06-15 EP EP05760923A patent/EP1769310A2/en not_active Withdrawn
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US10877530B2 (en) | 2014-12-23 | 2020-12-29 | Intel Corporation | Apparatus and method to provide a thermal parameter report for a multi-chip package |
US11543868B2 (en) | 2014-12-23 | 2023-01-03 | Intel Corporation | Apparatus and method to provide a thermal parameter report for a multi-chip package |
TWI756295B (zh) * | 2017-01-26 | 2022-03-01 | 南韓商三星電子股份有限公司 | 熱管理的控制器及設備 |
TWI646315B (zh) * | 2017-11-15 | 2019-01-01 | 財團法人工業技術研究院 | 溫度估算裝置及溫度估算方法 |
US10628627B2 (en) | 2017-11-15 | 2020-04-21 | Industrial Technology Research Institute | Thermal estimation device and thermal estimation method |
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WO2006008215A2 (en) | 2006-01-26 |
US8096705B2 (en) | 2012-01-17 |
US7347621B2 (en) | 2008-03-25 |
US7748895B2 (en) | 2010-07-06 |
EP1769310A2 (en) | 2007-04-04 |
KR100968176B1 (ko) | 2010-07-07 |
US20100274522A1 (en) | 2010-10-28 |
CN1981254A (zh) | 2007-06-13 |
KR20070039035A (ko) | 2007-04-11 |
TW200606623A (en) | 2006-02-16 |
US7695188B2 (en) | 2010-04-13 |
KR20100017948A (ko) | 2010-02-16 |
US8235593B2 (en) | 2012-08-07 |
US20080215283A1 (en) | 2008-09-04 |
US20060013281A1 (en) | 2006-01-19 |
JP2008507744A (ja) | 2008-03-13 |
KR100985543B1 (ko) | 2010-10-06 |
US20080059111A1 (en) | 2008-03-06 |
WO2006008215A3 (en) | 2006-06-08 |
US20100262399A1 (en) | 2010-10-14 |
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