JP5647416B2 - 発熱素子温度推定装置 - Google Patents
発熱素子温度推定装置 Download PDFInfo
- Publication number
- JP5647416B2 JP5647416B2 JP2010003903A JP2010003903A JP5647416B2 JP 5647416 B2 JP5647416 B2 JP 5647416B2 JP 2010003903 A JP2010003903 A JP 2010003903A JP 2010003903 A JP2010003903 A JP 2010003903A JP 5647416 B2 JP5647416 B2 JP 5647416B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- heating element
- cooling
- detecting means
- driven
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
Claims (2)
- 電子基板に搭載された発熱素子の近傍において前記電子基板表面に設けられた第1の温度検出手段と、前記第1の温度検出手段よりも前記発熱素子から離間した位置において前記電子基板表面に設けられた第2の温度検出手段と、前記第1、第2の温度検出手段によって検出された温度に基づいて前記発熱素子の温度を推定する発熱素子温度推定手段と、前記発熱素子に冷却風を送る送風機からなる冷却手段と、前記冷却手段が駆動されているか否か判断する冷却手段駆動判断手段とを備え、前記第1、第2の温度検出手段は、前記第1、第2の温度検出手段を結ぶ直線と前記冷却風の流れとが前記電子基板表面上で概ね直交するように配置されると共に、前記発熱素子温度推定手段は、前記冷却手段が駆動されていないと判断されるとき、第1の所定の式を用いて前記発熱素子の温度を推定する一方、前記冷却手段が駆動されていると判断されるとき、前記第1の所定の式と異なる第2の所定の式を用いて前記発熱素子の温度を推定することを特徴とする発熱素子温度推定装置。
- 前記冷却手段駆動判断手段は前記冷却風の流れにおいて前記発熱素子よりも上流側に設けられた第3の温度検出手段と、前記冷却風の流れにおいて前記発熱素子の下流側に設けられた第4の温度検出手段を備えると共に、前記第3、第4の温度検出手段によって検出された温度に基づいて前記冷却手段が駆動されているか否か判断することを特徴とする請求項1記載の発熱素子温度推定装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010003903A JP5647416B2 (ja) | 2010-01-12 | 2010-01-12 | 発熱素子温度推定装置 |
US12/972,960 US8483989B2 (en) | 2010-01-12 | 2010-12-20 | Heating element temperature estimation apparatus |
EP11150448.6A EP2343735B1 (en) | 2010-01-12 | 2011-01-10 | Heating element temperature estimation apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010003903A JP5647416B2 (ja) | 2010-01-12 | 2010-01-12 | 発熱素子温度推定装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011146425A JP2011146425A (ja) | 2011-07-28 |
JP5647416B2 true JP5647416B2 (ja) | 2014-12-24 |
Family
ID=43858069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010003903A Expired - Fee Related JP5647416B2 (ja) | 2010-01-12 | 2010-01-12 | 発熱素子温度推定装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8483989B2 (ja) |
EP (1) | EP2343735B1 (ja) |
JP (1) | JP5647416B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111413116B (zh) * | 2019-01-08 | 2021-02-09 | 广州汽车集团股份有限公司 | 电机控制器冷却故障检测系统及其方法 |
JP2021163328A (ja) * | 2020-04-01 | 2021-10-11 | レノボ・シンガポール・プライベート・リミテッド | 情報処理装置及び温度制御方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9032A (en) * | 1852-06-15 | mooee | ||
FR2580060B1 (ja) * | 1985-04-05 | 1989-06-09 | Nec Corp | |
US6672381B2 (en) * | 2001-04-30 | 2004-01-06 | Hewlett-Packard Development Company, L.P. | Multi-load thermal regulating system with multiple serial evaporators |
US20050216221A1 (en) * | 2004-03-29 | 2005-09-29 | Broyles Paul J Iii | Systems and methods for cooling storage devices |
JP3781758B2 (ja) * | 2004-06-04 | 2006-05-31 | 株式会社ソニー・コンピュータエンタテインメント | プロセッサ、プロセッサシステム、温度推定装置、情報処理装置および温度推定方法 |
US7347621B2 (en) * | 2004-07-16 | 2008-03-25 | International Business Machines Corporation | Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit |
US7484380B2 (en) * | 2004-08-13 | 2009-02-03 | Gateway Inc. | Determining maximum cooling for a component by retrieving an offset value |
JP4677756B2 (ja) | 2004-10-13 | 2011-04-27 | 富士電機システムズ株式会社 | パワーモジュール |
JP2007221908A (ja) * | 2006-02-16 | 2007-08-30 | Yaskawa Electric Corp | 電動機制御装置 |
JP4428423B2 (ja) * | 2007-08-17 | 2010-03-10 | セイコーエプソン株式会社 | プロジェクタ |
TWM331867U (en) * | 2007-10-24 | 2008-05-01 | Cooler Master Co Ltd | Heat dissipation device |
JP4679610B2 (ja) * | 2008-06-30 | 2011-04-27 | 株式会社東芝 | 情報処理装置 |
-
2010
- 2010-01-12 JP JP2010003903A patent/JP5647416B2/ja not_active Expired - Fee Related
- 2010-12-20 US US12/972,960 patent/US8483989B2/en active Active
-
2011
- 2011-01-10 EP EP11150448.6A patent/EP2343735B1/en not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
EP2343735B1 (en) | 2014-02-12 |
US20110172947A1 (en) | 2011-07-14 |
EP2343735A1 (en) | 2011-07-13 |
JP2011146425A (ja) | 2011-07-28 |
US8483989B2 (en) | 2013-07-09 |
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