TWI370522B - Semiconductor memory device - Google Patents

Semiconductor memory device

Info

Publication number
TWI370522B
TWI370522B TW093132589A TW93132589A TWI370522B TW I370522 B TWI370522 B TW I370522B TW 093132589 A TW093132589 A TW 093132589A TW 93132589 A TW93132589 A TW 93132589A TW I370522 B TWI370522 B TW I370522B
Authority
TW
Taiwan
Prior art keywords
memory device
semiconductor memory
semiconductor
memory
Prior art date
Application number
TW093132589A
Other languages
English (en)
Other versions
TW200527611A (en
Inventor
Digh Hisamoto
Kan Yasui
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of TW200527611A publication Critical patent/TW200527611A/zh
Application granted granted Critical
Publication of TWI370522B publication Critical patent/TWI370522B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66825—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a floating gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401—Multistep manufacturing processes
    • H01L29/4011—Multistep manufacturing processes for data storage electrodes
    • H01L29/40114—Multistep manufacturing processes for data storage electrodes the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/40—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/40—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
    • H10B41/42—Simultaneous manufacture of periphery and memory cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
TW093132589A 2004-02-10 2004-10-27 Semiconductor memory device TWI370522B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004033297A JP4521597B2 (ja) 2004-02-10 2004-02-10 半導体記憶装置およびその製造方法

Publications (2)

Publication Number Publication Date
TW200527611A TW200527611A (en) 2005-08-16
TWI370522B true TWI370522B (en) 2012-08-11

Family

ID=34824252

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093132589A TWI370522B (en) 2004-02-10 2004-10-27 Semiconductor memory device

Country Status (5)

Country Link
US (1) US7268042B2 (zh)
JP (1) JP4521597B2 (zh)
KR (1) KR101117857B1 (zh)
CN (1) CN100472758C (zh)
TW (1) TWI370522B (zh)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100471188B1 (ko) * 2003-01-24 2005-03-10 삼성전자주식회사 듀얼 게이트를 갖는 비휘발성 기억 소자 및 그 형성방법
JP4601316B2 (ja) * 2004-03-31 2010-12-22 ルネサスエレクトロニクス株式会社 不揮発性半導体記憶装置
US7276433B2 (en) * 2004-12-03 2007-10-02 Micron Technology, Inc. Methods of forming integrated circuitry, methods of forming memory circuitry, and methods of forming field effect transistors
KR100646085B1 (ko) * 2005-03-08 2006-11-14 매그나칩 반도체 유한회사 비휘발성 메모리 소자, 그 제조방법, 및 이를 이용한 반도체 소자의 제조방법
TWI282150B (en) * 2005-08-09 2007-06-01 Powerchip Semiconductor Corp Method of fabricating a non-volatile memory
JP4906329B2 (ja) * 2005-12-02 2012-03-28 ラピスセミコンダクタ株式会社 不揮発性半導体記憶装置及びその製造方法
US7700439B2 (en) * 2006-03-15 2010-04-20 Freescale Semiconductor, Inc. Silicided nonvolatile memory and method of making same
US7341914B2 (en) * 2006-03-15 2008-03-11 Freescale Semiconductor, Inc. Method for forming a non-volatile memory and a peripheral device on a semiconductor substrate
JP5086558B2 (ja) * 2006-04-04 2012-11-28 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US7524719B2 (en) 2006-08-31 2009-04-28 Freescale Semiconductor, Inc. Method of making self-aligned split gate memory cell
US7416945B1 (en) * 2007-02-19 2008-08-26 Freescale Semiconductor, Inc. Method for forming a split gate memory device
JP5357401B2 (ja) * 2007-03-22 2013-12-04 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP2009010281A (ja) * 2007-06-29 2009-01-15 Renesas Technology Corp 半導体装置およびその製造方法
US7838363B2 (en) * 2007-10-31 2010-11-23 Freescale Semiconductor, Inc. Method of forming a split gate non-volatile memory cell
JP2010087046A (ja) * 2008-09-29 2010-04-15 Nec Electronics Corp 不揮発性半導体装置及び不揮発性半導体装置の製造方法
US8470670B2 (en) * 2009-09-23 2013-06-25 Infineon Technologies Ag Method for making semiconductor device
KR101147523B1 (ko) * 2010-06-15 2012-05-21 서울대학교산학협력단 스플릿게이트 구조를 갖는 1ｔ 디램 소자 및 이를 이용한 디램 어레이
CN102544094B (zh) * 2010-12-15 2015-06-17 北京大学 分裂栅结构的纳米线场效应晶体管
FR2985593B1 (fr) * 2012-01-09 2014-02-21 Commissariat Energie Atomique Procede de fabrication d'une cellule memoire non volatile a double grille
US9966477B2 (en) * 2012-12-14 2018-05-08 Cypress Semiconductor Corporation Charge trapping split gate device and method of fabricating same
US8822289B2 (en) * 2012-12-14 2014-09-02 Spansion Llc High voltage gate formation
JP6026914B2 (ja) 2013-02-12 2016-11-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR102008738B1 (ko) * 2013-03-15 2019-08-08 삼성전자주식회사 반도체 장치 및 그 제조 방법
US9590058B2 (en) * 2013-06-28 2017-03-07 Nxp Usa, Inc. Methods and structures for a split gate memory cell structure
US8895397B1 (en) * 2013-10-15 2014-11-25 Globalfoundries Singapore Pte. Ltd. Methods for forming thin film storage memory cells
CN105206611B (zh) * 2014-06-16 2018-09-07 中芯国际集成电路制造(上海)有限公司 一种Flash器件及其制备方法
US9397176B2 (en) * 2014-07-30 2016-07-19 Freescale Semiconductor, Inc. Method of forming split gate memory with improved reliability
JP2016051745A (ja) * 2014-08-29 2016-04-11 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US9570592B2 (en) * 2015-06-08 2017-02-14 Silicon Storage Technology, Inc. Method of forming split gate memory cells with 5 volt logic devices
US10199386B2 (en) * 2015-07-23 2019-02-05 Toshiba Memory Corporation Semiconductor memory device and method for manufacturing same
CN107660112B (zh) * 2016-07-25 2019-12-27 鹏鼎控股(深圳)股份有限公司 电磁屏蔽罩及其制造方法
US10204917B2 (en) * 2016-12-08 2019-02-12 Taiwan Semiconductor Manufacturing Co., Ltd. Method for manufacturing embedded non-volatile memory
KR20210086342A (ko) 2019-12-31 2021-07-08 엘지디스플레이 주식회사 산화물 반도체 패턴을 포함하는 디스플레이 장치

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5879999A (en) * 1996-09-30 1999-03-09 Motorola, Inc. Method of manufacturing an insulated gate semiconductor device having a spacer extension
US5969383A (en) * 1997-06-16 1999-10-19 Motorola, Inc. Split-gate memory device and method for accessing the same
FR2776830B1 (fr) * 1998-03-26 2001-11-23 Sgs Thomson Microelectronics Cellule memoire electriquement programmable
US6194272B1 (en) * 1998-05-19 2001-02-27 Mosel Vitelic, Inc. Split gate flash cell with extremely small cell size
US6284596B1 (en) * 1998-12-17 2001-09-04 Taiwan Semiconductor Manufacturing Company Method of forming split-gate flash cell for salicide and self-align contact
JP2000252462A (ja) * 1999-03-01 2000-09-14 Toshiba Corp Ｍｉｓ型半導体装置及びその製造方法
JP3973819B2 (ja) * 1999-03-08 2007-09-12 株式会社東芝 半導体記憶装置およびその製造方法
US6228695B1 (en) * 1999-05-27 2001-05-08 Taiwan Semiconductor Manufacturing Company Method to fabricate split-gate with self-aligned source and self-aligned floating gate to control gate
JP2001085544A (ja) * 1999-09-14 2001-03-30 Sanyo Electric Co Ltd スプリットゲート型メモリセル
US6248633B1 (en) * 1999-10-25 2001-06-19 Halo Lsi Design & Device Technology, Inc. Process for making and programming and operating a dual-bit multi-level ballistic MONOS memory
US6479351B1 (en) * 2000-11-30 2002-11-12 Atmel Corporation Method of fabricating a self-aligned non-volatile memory cell
JP2002231829A (ja) 2001-01-22 2002-08-16 Halo Lsi Design & Device Technol Inc 不揮発性半導体メモリおよびその製造方法
JP3452056B2 (ja) * 2001-09-14 2003-09-29 セイコーエプソン株式会社 半導体装置の製造方法
JP3840994B2 (ja) * 2002-03-18 2006-11-01 セイコーエプソン株式会社 不揮発性半導体記憶装置
JP4647175B2 (ja) * 2002-04-18 2011-03-09 ルネサスエレクトロニクス株式会社 半導体集積回路装置
US6599831B1 (en) * 2002-04-30 2003-07-29 Advanced Micro Devices, Inc. Metal gate electrode using silicidation and method of formation thereof
JP2004186452A (ja) * 2002-12-04 2004-07-02 Renesas Technology Corp 不揮発性半導体記憶装置およびその製造方法
US7015126B2 (en) * 2004-06-03 2006-03-21 Taiwan Semiconductor Manufacturing Co., Ltd. Method of forming silicided gate structure

Also Published As

Publication number Publication date
JP2005228786A (ja) 2005-08-25
KR101117857B1 (ko) 2012-03-21
KR20050080728A (ko) 2005-08-17
JP4521597B2 (ja) 2010-08-11
CN1655340A (zh) 2005-08-17
TW200527611A (en) 2005-08-16
CN100472758C (zh) 2009-03-25
US20050176202A1 (en) 2005-08-11
US7268042B2 (en) 2007-09-11

Similar Documents

Publication Publication Date Title
TWI370522B (en) Semiconductor memory device
TWI346954B (en) Nonvolatile semiconductor memory device
TWI366860B (en) Semiconductor device
EP1748488A4 (en) SEMICONDUCTOR MEMORY
GB2417131B (en) Integrated memory devices
EP1829102A4 (en) SEMICONDUCTOR DEVICE
EP1760790A4 (en) SEMICONDUCTOR COMPONENT
EP1710831A4 (en) SEMICONDUCTOR DEVICE
EP1709688A4 (en) SEMICONDUCTOR COMPONENT
EP1755165A4 (en) SEMICONDUCTOR DEVICE
TWI350964B (en) Semiconductor device
TWI373098B (en) Semiconductor device
EP1801871A4 (en) SEMICONDUCTOR COMPONENT
DE602005009411D1 (de) Halbleiterspeichervorrichtung
EP1927138A4 (en) SEMICONDUCTOR DEVICE
TWI340486B (en) Semiconductor memory device
TWI319877B (en) Semiconductor memory device
DE602005006197D1 (de) Halbleiterspeicherbaustein
EP1709573A4 (en) SEMICONDUCTOR APPARATUS
EP1787242A4 (en) SEMICONDUCTOR DEVICE
EP1840784A4 (en) SEMICONDUCTOR MEMORY MODULE
EP1906440A4 (en) SEMICONDUCTOR DEVICE
EP1886377A4 (en) SEMICONDUCTOR COMPONENT
HK1094050A1 (en) Semiconductor device having flash memory
EP1830405A4 (en) SEMICONDUCTOR COMPONENT

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees