TWI365688B - Wiring substrate and method of manufacturing the same - Google Patents
Wiring substrate and method of manufacturing the sameInfo
- Publication number
- TWI365688B TWI365688B TW097108923A TW97108923A TWI365688B TW I365688 B TWI365688 B TW I365688B TW 097108923 A TW097108923 A TW 097108923A TW 97108923 A TW97108923 A TW 97108923A TW I365688 B TWI365688 B TW I365688B
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing
- same
- wiring substrate
- wiring
- substrate
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09718—Clearance holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10712—Via grid array, e.g. via grid array capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US98096907P | 2007-10-18 | 2007-10-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200920196A TW200920196A (en) | 2009-05-01 |
TWI365688B true TWI365688B (en) | 2012-06-01 |
Family
ID=40567120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097108923A TWI365688B (en) | 2007-10-18 | 2008-03-13 | Wiring substrate and method of manufacturing the same |
Country Status (7)
Country | Link |
---|---|
US (1) | US8148645B2 (zh) |
EP (2) | EP2091311B1 (zh) |
JP (1) | JP4773531B2 (zh) |
KR (1) | KR101085322B1 (zh) |
CN (1) | CN101502191B (zh) |
TW (1) | TWI365688B (zh) |
WO (1) | WO2009050829A1 (zh) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090296310A1 (en) * | 2008-06-03 | 2009-12-03 | Azuma Chikara | Chip capacitor precursors, packaged semiconductors, and assembly method for converting the precursors to capacitors |
JP4711026B2 (ja) * | 2008-10-08 | 2011-06-29 | 株式会社村田製作所 | 複合モジュール |
JP5333577B2 (ja) * | 2009-03-19 | 2013-11-06 | 株式会社村田製作所 | 回路基板及びマザー積層体 |
JP5589314B2 (ja) * | 2009-06-25 | 2014-09-17 | 株式会社リコー | 電子部品モジュールの製造方法 |
EP2519089B1 (en) | 2009-12-24 | 2017-09-13 | Murata Manufacturing Co., Ltd. | Circuit module |
IN2014CN01994A (zh) * | 2011-08-15 | 2015-05-29 | Sma Solar Technology Ag | |
CN103096646B (zh) * | 2011-10-31 | 2016-01-20 | 健鼎(无锡)电子有限公司 | 内埋元件的多层基板的制造方法 |
US20140070404A1 (en) * | 2012-09-12 | 2014-03-13 | Shing-Ren Sheu | Semiconductor package structure and interposer therefor |
US9035194B2 (en) * | 2012-10-30 | 2015-05-19 | Intel Corporation | Circuit board with integrated passive devices |
KR101420526B1 (ko) * | 2012-11-29 | 2014-07-17 | 삼성전기주식회사 | 전자부품 내장기판 및 그 제조방법 |
US20140167900A1 (en) | 2012-12-14 | 2014-06-19 | Gregorio R. Murtagian | Surface-mount inductor structures for forming one or more inductors with substrate traces |
JP6649770B2 (ja) * | 2014-02-21 | 2020-02-19 | 三井金属鉱業株式会社 | 内蔵キャパシタ層形成用銅張積層板、多層プリント配線板及び多層プリント配線板の製造方法 |
US20190045620A1 (en) * | 2014-07-09 | 2019-02-07 | Schreiner Group Gmbh & Co. Kg | Sensor device with a flexible electrical conductor structure |
US20160055976A1 (en) * | 2014-08-25 | 2016-02-25 | Qualcomm Incorporated | Package substrates including embedded capacitors |
US9659850B2 (en) * | 2014-12-08 | 2017-05-23 | Qualcomm Incorporated | Package substrate comprising capacitor, redistribution layer and discrete coaxial connection |
CN104900406B (zh) * | 2015-06-01 | 2017-10-10 | 中国科学院上海硅酸盐研究所 | 可键合多层陶瓷电容器及其制备方法 |
JP6741419B2 (ja) * | 2015-12-11 | 2020-08-19 | 株式会社アムコー・テクノロジー・ジャパン | 半導体パッケージおよびその製造方法 |
US10373904B2 (en) | 2017-08-28 | 2019-08-06 | Micron Technology, Inc. | Semiconductor devices including capacitors, related electronic systems, and related methods |
CN111128993A (zh) | 2019-12-18 | 2020-05-08 | 台达电子企业管理(上海)有限公司 | 基板及其所适用的制造方法及功率模块 |
CN117560860A (zh) * | 2022-08-04 | 2024-02-13 | 辉达公司 | 堆叠多个印刷电路板的方法和配置 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5818734B2 (ja) * | 1981-01-19 | 1983-04-14 | 松下電子工業株式会社 | カラ−受像管用シャドウマスク構体の製造方法 |
US4555746A (en) * | 1983-01-12 | 1985-11-26 | Matsushita Electric Industrial Co., Ltd. | Organic chip capacitor |
JPS59127829A (ja) * | 1983-01-12 | 1984-07-23 | 松下電器産業株式会社 | チツプ状フイルムコンデンサ− |
EP2265101B1 (en) * | 1999-09-02 | 2012-08-29 | Ibiden Co., Ltd. | Printed circuit board and method of manufacturing printed circuit board |
JP3853565B2 (ja) | 2000-04-14 | 2006-12-06 | 松下電器産業株式会社 | 薄膜積層体とコンデンサ及びこれらの製造方法と製造装置 |
WO2002101769A1 (en) * | 2001-06-08 | 2002-12-19 | Matsushita Electric Industrial Co., Ltd. | Multilayer film capacitor and production method thereof |
JP2003298232A (ja) * | 2002-04-02 | 2003-10-17 | Sony Corp | 多層配線基板の製造方法および多層配線基板 |
JP3956851B2 (ja) | 2003-01-21 | 2007-08-08 | 凸版印刷株式会社 | 受動素子内蔵基板及びその製造方法 |
JP2005039243A (ja) * | 2003-06-24 | 2005-02-10 | Ngk Spark Plug Co Ltd | 中間基板 |
JP4700332B2 (ja) | 2003-12-05 | 2011-06-15 | イビデン株式会社 | 多層プリント配線板 |
JP2005286233A (ja) * | 2004-03-30 | 2005-10-13 | Tdk Corp | 薄膜コンデンサ及びその製造方法 |
CN100367491C (zh) * | 2004-05-28 | 2008-02-06 | 日本特殊陶业株式会社 | 中间基板 |
JP4339781B2 (ja) * | 2004-12-09 | 2009-10-07 | 日本特殊陶業株式会社 | 配線基板 |
JP4584700B2 (ja) * | 2004-12-17 | 2010-11-24 | 新光電気工業株式会社 | 配線基板の製造方法 |
JP4591100B2 (ja) * | 2005-02-03 | 2010-12-01 | ソニー株式会社 | 半導体装置およびその製造方法 |
CN1925720B (zh) * | 2005-09-01 | 2010-04-14 | 日本特殊陶业株式会社 | 布线基板、电容器 |
JP4671829B2 (ja) * | 2005-09-30 | 2011-04-20 | 富士通株式会社 | インターポーザ及び電子装置の製造方法 |
JP5089880B2 (ja) * | 2005-11-30 | 2012-12-05 | 日本特殊陶業株式会社 | 配線基板内蔵用キャパシタ、キャパシタ内蔵配線基板及びその製造方法 |
JP4964481B2 (ja) * | 2006-03-24 | 2012-06-27 | 日本特殊陶業株式会社 | 配線基板 |
TWI407870B (zh) * | 2006-04-25 | 2013-09-01 | Ngk Spark Plug Co | 配線基板之製造方法 |
-
2007
- 2007-11-02 WO PCT/JP2007/071423 patent/WO2009050829A1/ja active Application Filing
- 2007-11-02 CN CN2007800300409A patent/CN101502191B/zh not_active Expired - Fee Related
- 2007-11-02 EP EP07831157A patent/EP2091311B1/en active Active
- 2007-11-02 JP JP2008550579A patent/JP4773531B2/ja active Active
- 2007-11-02 EP EP10162269A patent/EP2217045A1/en not_active Withdrawn
- 2007-11-02 KR KR1020087028270A patent/KR101085322B1/ko active IP Right Grant
-
2008
- 2008-03-13 TW TW097108923A patent/TWI365688B/zh active
- 2008-08-12 US US12/189,852 patent/US8148645B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP2091311A4 (en) | 2010-01-20 |
KR20090086023A (ko) | 2009-08-10 |
KR101085322B1 (ko) | 2011-11-23 |
CN101502191A (zh) | 2009-08-05 |
JPWO2009050829A1 (ja) | 2011-02-24 |
US8148645B2 (en) | 2012-04-03 |
CN101502191B (zh) | 2012-02-08 |
JP4773531B2 (ja) | 2011-09-14 |
US20090266594A1 (en) | 2009-10-29 |
WO2009050829A1 (ja) | 2009-04-23 |
EP2217045A1 (en) | 2010-08-11 |
EP2091311A1 (en) | 2009-08-19 |
EP2091311B1 (en) | 2013-03-06 |
TW200920196A (en) | 2009-05-01 |
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