TWI365581B - Semiconductor laser - Google Patents

Semiconductor laser

Info

Publication number
TWI365581B
TWI365581B TW093129817A TW93129817A TWI365581B TW I365581 B TWI365581 B TW I365581B TW 093129817 A TW093129817 A TW 093129817A TW 93129817 A TW93129817 A TW 93129817A TW I365581 B TWI365581 B TW I365581B
Authority
TW
Taiwan
Prior art keywords
semiconductor laser
laser
semiconductor
Prior art date
Application number
TW093129817A
Other languages
English (en)
Other versions
TW200516816A (en
Inventor
Takeshi Yamamoto
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of TW200516816A publication Critical patent/TW200516816A/zh
Application granted granted Critical
Publication of TWI365581B publication Critical patent/TWI365581B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0232—Lead-frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0231—Stems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Head (AREA)
TW093129817A 2003-10-06 2004-10-01 Semiconductor laser TWI365581B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003347333A JP3802896B2 (ja) 2003-10-06 2003-10-06 半導体レーザ

Publications (2)

Publication Number Publication Date
TW200516816A TW200516816A (en) 2005-05-16
TWI365581B true TWI365581B (en) 2012-06-01

Family

ID=34386404

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093129817A TWI365581B (en) 2003-10-06 2004-10-01 Semiconductor laser

Country Status (5)

Country Link
US (1) US7075178B2 (zh)
JP (1) JP3802896B2 (zh)
KR (1) KR101020146B1 (zh)
CN (1) CN100367585C (zh)
TW (1) TWI365581B (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7501011B2 (en) 2004-11-09 2009-03-10 Multisorb Technologies, Inc. Humidity control device
KR100576881B1 (ko) * 2005-01-03 2006-05-10 삼성전기주식회사 반도체 레이저 다이오드장치 및 그 제조방법
US20070096132A1 (en) * 2005-11-01 2007-05-03 Jiahn-Chang Wu Coaxial LED lighting board
JP4786350B2 (ja) * 2006-01-19 2011-10-05 シャープ株式会社 半導体レーザ装置および光ピックアップ装置
JP4970924B2 (ja) * 2006-03-28 2012-07-11 三菱電機株式会社 光素子用パッケージとこれを用いた光半導体装置
JP4816397B2 (ja) * 2006-10-12 2011-11-16 住友電気工業株式会社 光電変換モジュール
TW200832851A (en) * 2007-01-29 2008-08-01 Truelight Corp Package structure for horizontal cavity surface-emitting laser diode with light monitoring function
JP2009152330A (ja) * 2007-12-20 2009-07-09 Panasonic Corp 半導体装置、半導体装置の製造方法、半導体装置の製造装置および光ピックアップ装置ならびに光ディスクドライブ装置
JP2009200463A (ja) * 2008-01-23 2009-09-03 Panasonic Corp 半導体装置
US8057586B2 (en) 2008-07-28 2011-11-15 Multisorb Technologies, Inc. Humidity control for product in a refrigerator
JP2010074142A (ja) * 2008-08-20 2010-04-02 Panasonic Corp 半導体装置及びそれを用いた電子機器
JP5244515B2 (ja) 2008-09-17 2013-07-24 ローム株式会社 半導体レーザ装置
JP5391753B2 (ja) * 2009-03-16 2014-01-15 株式会社リコー 光源ユニット・光源装置・光走査装置および画像形成装置
DE102010046090A1 (de) * 2010-09-20 2012-03-22 Osram Opto Semiconductors Gmbh Gehäuse für ein optoelektronisches Halbleiterbauelement und Halbleiterbauelement
DE102010046088A1 (de) 2010-09-20 2012-03-22 Osram Opto Semiconductors Gmbh Gehäuse und Verfahren zum Herstellen eines Gehäuses
CN102117792A (zh) * 2011-01-05 2011-07-06 无锡市玉祁红光电子有限公司 三端稳压器框架镀层结构
WO2013080396A1 (ja) * 2011-11-30 2013-06-06 パナソニック株式会社 窒化物半導体発光装置
JP2014138046A (ja) * 2013-01-16 2014-07-28 Stanley Electric Co Ltd 半導体発光素子パッケージ固定構造
US9300112B2 (en) * 2013-12-18 2016-03-29 Lumentum Operations Llc Packaged laser diode and method of packaging a laser diode
US20210336410A1 (en) * 2018-10-01 2021-10-28 Rohm Co., Ltd. Semiconductor laser device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3082695B2 (ja) * 1997-01-16 2000-08-28 日本電気株式会社 半導体レーザ装置、その製造方法
JP3385238B2 (ja) 1999-01-12 2003-03-10 シャープ株式会社 光送受信モジュール
JP2000357839A (ja) * 1999-06-16 2000-12-26 Sanyo Electric Co Ltd レーザ装置
JP3698243B2 (ja) 1999-10-06 2005-09-21 シャープ株式会社 半導体レーザ装置
JP2001111152A (ja) 1999-10-06 2001-04-20 Rohm Co Ltd 半導体レーザ
JP3735033B2 (ja) 2000-12-07 2006-01-11 シャープ株式会社 半導体レーザ装置
JP3607220B2 (ja) 2001-06-06 2005-01-05 松下電器産業株式会社 半導体レーザ装置
JP3987716B2 (ja) * 2001-12-10 2007-10-10 シャープ株式会社 半導体レーザ装置およびその製造方法

Also Published As

Publication number Publication date
TW200516816A (en) 2005-05-16
JP3802896B2 (ja) 2006-07-26
KR20050033497A (ko) 2005-04-12
CN100367585C (zh) 2008-02-06
CN1619901A (zh) 2005-05-25
US20050072985A1 (en) 2005-04-07
JP2005116700A (ja) 2005-04-28
US7075178B2 (en) 2006-07-11
KR101020146B1 (ko) 2011-03-08

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees