TWI357843B - - Google Patents

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Publication number
TWI357843B
TWI357843B TW097118661A TW97118661A TWI357843B TW I357843 B TWI357843 B TW I357843B TW 097118661 A TW097118661 A TW 097118661A TW 97118661 A TW97118661 A TW 97118661A TW I357843 B TWI357843 B TW I357843B
Authority
TW
Taiwan
Prior art keywords
polishing
bubble
thickness
dispersed
resin
Prior art date
Application number
TW097118661A
Other languages
English (en)
Chinese (zh)
Other versions
TW200932431A (en
Inventor
Akinori Sato
Junji Hirose
Kenji Nakamura
Takeshi Fukuda
Masato Doura
Original Assignee
Toyo Tire & Rubber Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Tire & Rubber Co filed Critical Toyo Tire & Rubber Co
Publication of TW200932431A publication Critical patent/TW200932431A/zh
Application granted granted Critical
Publication of TWI357843B publication Critical patent/TWI357843B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24364—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] with transparent or protective coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW097118661A 2007-05-31 2008-05-21 Process for manufacturing polishing pad TW200932431A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007145583A JP4943233B2 (ja) 2007-05-31 2007-05-31 研磨パッドの製造方法

Publications (2)

Publication Number Publication Date
TW200932431A TW200932431A (en) 2009-08-01
TWI357843B true TWI357843B (https=) 2012-02-11

Family

ID=40093475

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097118661A TW200932431A (en) 2007-05-31 2008-05-21 Process for manufacturing polishing pad

Country Status (6)

Country Link
US (1) US8409308B2 (https=)
JP (1) JP4943233B2 (https=)
KR (1) KR101475252B1 (https=)
CN (1) CN101663132B (https=)
TW (1) TW200932431A (https=)
WO (1) WO2008149650A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI804493B (zh) * 2017-04-19 2023-06-11 美商羅門哈斯電子材料Ｃｍｐ控股公司 脂族聚胺基甲酸酯光學終點偵測窗口及含其之cmp拋光墊

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US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US7927452B2 (en) * 2005-07-15 2011-04-19 Toyo Tire & Rubber Co., Ltd. Layered sheets and processes for producing the same
JP4884726B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
WO2007119875A1 (ja) 2006-04-19 2007-10-25 Toyo Tire & Rubber Co., Ltd. 研磨パッドの製造方法
US20100009611A1 (en) * 2006-09-08 2010-01-14 Toyo Tire & Rubber Co., Ltd. Method for manufacturing a polishing pad
WO2008087797A1 (ja) 2007-01-15 2008-07-24 Toyo Tire & Rubber Co., Ltd. 研磨パッド及びその製造方法
JP4593643B2 (ja) * 2008-03-12 2010-12-08 東洋ゴム工業株式会社 研磨パッド
TWI404596B (zh) * 2009-09-22 2013-08-11 San Fang Chemical Industry Co 製造研磨墊之方法及研磨墊
TWI402147B (zh) * 2010-07-27 2013-07-21 Li Chang Wei Ti 墊體的加工方法
JP5687118B2 (ja) * 2011-04-15 2015-03-18 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP5759888B2 (ja) * 2011-12-28 2015-08-05 東洋ゴム工業株式会社 研磨パッド
US9156125B2 (en) * 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
TW201509610A (zh) * 2013-09-06 2015-03-16 Ming-Fan Liu 具編織面板的工具定位墊及其製法
JP2015059199A (ja) * 2013-09-20 2015-03-30 Dic株式会社 ウレタン組成物及び研磨材
US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
KR102398130B1 (ko) * 2014-10-31 2022-05-13 주식회사 쿠라레 연마층용 비다공성 성형체, 연마 패드 및 연마 방법
CN105922126B (zh) * 2016-06-03 2018-05-11 湖北鼎龙控股股份有限公司 化学机械抛光垫的检测窗及其制备方法
US10207388B2 (en) * 2017-04-19 2019-02-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them
JP7220130B2 (ja) * 2019-07-11 2023-02-09 株式会社クラレ 研磨パッド及び研磨パッドの製造方法
JP7624858B2 (ja) * 2021-03-25 2025-01-31 富士紡ホールディングス株式会社 研磨パッドの製造方法
CN116693913B (zh) * 2023-06-26 2026-01-20 陕西科技大学 一种无溶剂刮涂法制备聚氨酯研磨垫的方法

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US5069002A (en) 1991-04-17 1991-12-03 Micron Technology, Inc. Apparatus for endpoint detection during mechanical planarization of semiconductor wafers
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US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
JP3431115B2 (ja) 1995-03-28 2003-07-28 アプライド マテリアルズ インコーポレイテッド ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法
US5964643A (en) 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
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US6439968B1 (en) * 1999-06-30 2002-08-27 Agere Systems Guardian Corp. Polishing pad having a water-repellant film theron and a method of manufacture therefor
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KR20050052513A (ko) * 2002-09-25 2005-06-02 피피지 인더스트리즈 오하이오 인코포레이티드 평탄화를 위한 윈도를 가진 연마 패드
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EP1466699A1 (en) * 2003-04-09 2004-10-13 JSR Corporation Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
US20040224611A1 (en) * 2003-04-22 2004-11-11 Jsr Corporation Polishing pad and method of polishing a semiconductor wafer
JP2004343090A (ja) * 2003-04-22 2004-12-02 Jsr Corp 研磨パッドおよび半導体ウェハの研磨方法
TWI280175B (en) * 2004-02-17 2007-05-01 Skc Co Ltd Base pad of polishing pad and multi-layer pad comprising the same
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US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
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JP4775881B2 (ja) * 2004-12-10 2011-09-21 東洋ゴム工業株式会社 研磨パッド
JP4726108B2 (ja) * 2005-01-06 2011-07-20 東洋ゴム工業株式会社 研磨パッド及び半導体デバイスの製造方法
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JP5044802B2 (ja) * 2006-04-19 2012-10-10 東洋ゴム工業株式会社 溝付き研磨パッドの製造方法
WO2007119875A1 (ja) * 2006-04-19 2007-10-25 Toyo Tire & Rubber Co., Ltd. 研磨パッドの製造方法
US20080063856A1 (en) * 2006-09-11 2008-03-13 Duong Chau H Water-based polishing pads having improved contact area
WO2008047631A1 (fr) * 2006-10-18 2008-04-24 Toyo Tire & Rubber Co., Ltd. Procédé pour produire un tampon à polir long
JP5146927B2 (ja) * 2006-10-18 2013-02-20 東洋ゴム工業株式会社 長尺研磨パッドの製造方法
JP2008100331A (ja) * 2006-10-20 2008-05-01 Toyo Tire & Rubber Co Ltd 長尺研磨パッドの製造方法
JP4869017B2 (ja) * 2006-10-20 2012-02-01 東洋ゴム工業株式会社 長尺研磨パッドの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI804493B (zh) * 2017-04-19 2023-06-11 美商羅門哈斯電子材料Ｃｍｐ控股公司 脂族聚胺基甲酸酯光學終點偵測窗口及含其之cmp拋光墊

Also Published As

Publication number Publication date
KR20100015303A (ko) 2010-02-12
WO2008149650A1 (ja) 2008-12-11
CN101663132B (zh) 2011-06-01
JP4943233B2 (ja) 2012-05-30
US20100162631A1 (en) 2010-07-01
CN101663132A (zh) 2010-03-03
US8409308B2 (en) 2013-04-02
TW200932431A (en) 2009-08-01
KR101475252B1 (ko) 2014-12-22
JP2008296333A (ja) 2008-12-11

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MM4A Annulment or lapse of patent due to non-payment of fees