KR101475252B1 - 연마 패드의 제조 방법 - Google Patents

연마 패드의 제조 방법 Download PDF

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Publication number
KR101475252B1
KR101475252B1 KR1020097017475A KR20097017475A KR101475252B1 KR 101475252 B1 KR101475252 B1 KR 101475252B1 KR 1020097017475 A KR1020097017475 A KR 1020097017475A KR 20097017475 A KR20097017475 A KR 20097017475A KR 101475252 B1 KR101475252 B1 KR 101475252B1
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KR
South Korea
Prior art keywords
polishing
face material
polishing pad
bubble
urethane composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020097017475A
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English (en)
Korean (ko)
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KR20100015303A (ko
Inventor
아키노리 사토
준지 히로세
겐지 나카무라
다케시 후쿠다
마사토 도우라
Original Assignee
도요 고무 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 도요 고무 고교 가부시키가이샤 filed Critical 도요 고무 고교 가부시키가이샤
Publication of KR20100015303A publication Critical patent/KR20100015303A/ko
Application granted granted Critical
Publication of KR101475252B1 publication Critical patent/KR101475252B1/ko
Assigned to 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 reassignment 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 권리의 전부이전등록 Assignors: 도요 고무 고교 가부시키가이샤
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24364—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] with transparent or protective coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020097017475A 2007-05-31 2008-05-15 연마 패드의 제조 방법 Expired - Fee Related KR101475252B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-145583 2007-05-31
JP2007145583A JP4943233B2 (ja) 2007-05-31 2007-05-31 研磨パッドの製造方法

Publications (2)

Publication Number Publication Date
KR20100015303A KR20100015303A (ko) 2010-02-12
KR101475252B1 true KR101475252B1 (ko) 2014-12-22

Family

ID=40093475

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097017475A Expired - Fee Related KR101475252B1 (ko) 2007-05-31 2008-05-15 연마 패드의 제조 방법

Country Status (6)

Country Link
US (1) US8409308B2 (https=)
JP (1) JP4943233B2 (https=)
KR (1) KR101475252B1 (https=)
CN (1) CN101663132B (https=)
TW (1) TW200932431A (https=)
WO (1) WO2008149650A1 (https=)

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US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US7927452B2 (en) * 2005-07-15 2011-04-19 Toyo Tire & Rubber Co., Ltd. Layered sheets and processes for producing the same
JP4884726B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
WO2007119875A1 (ja) 2006-04-19 2007-10-25 Toyo Tire & Rubber Co., Ltd. 研磨パッドの製造方法
US20100009611A1 (en) * 2006-09-08 2010-01-14 Toyo Tire & Rubber Co., Ltd. Method for manufacturing a polishing pad
WO2008087797A1 (ja) 2007-01-15 2008-07-24 Toyo Tire & Rubber Co., Ltd. 研磨パッド及びその製造方法
JP4593643B2 (ja) * 2008-03-12 2010-12-08 東洋ゴム工業株式会社 研磨パッド
TWI404596B (zh) * 2009-09-22 2013-08-11 San Fang Chemical Industry Co 製造研磨墊之方法及研磨墊
TWI402147B (zh) * 2010-07-27 2013-07-21 Li Chang Wei Ti 墊體的加工方法
JP5687118B2 (ja) * 2011-04-15 2015-03-18 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP5759888B2 (ja) * 2011-12-28 2015-08-05 東洋ゴム工業株式会社 研磨パッド
US9156125B2 (en) * 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
TW201509610A (zh) * 2013-09-06 2015-03-16 Ming-Fan Liu 具編織面板的工具定位墊及其製法
JP2015059199A (ja) * 2013-09-20 2015-03-30 Dic株式会社 ウレタン組成物及び研磨材
US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
KR102398130B1 (ko) * 2014-10-31 2022-05-13 주식회사 쿠라레 연마층용 비다공성 성형체, 연마 패드 및 연마 방법
CN105922126B (zh) * 2016-06-03 2018-05-11 湖北鼎龙控股股份有限公司 化学机械抛光垫的检测窗及其制备方法
US10293456B2 (en) * 2017-04-19 2019-05-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them
US10207388B2 (en) * 2017-04-19 2019-02-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them
JP7220130B2 (ja) * 2019-07-11 2023-02-09 株式会社クラレ 研磨パッド及び研磨パッドの製造方法
JP7624858B2 (ja) * 2021-03-25 2025-01-31 富士紡ホールディングス株式会社 研磨パッドの製造方法
CN116693913B (zh) * 2023-06-26 2026-01-20 陕西科技大学 一种无溶剂刮涂法制备聚氨酯研磨垫的方法

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US20060062158A1 (en) * 1999-04-12 2006-03-23 Hattig Myron P Broadcast discovery in a network having one or more 1394 buses
US20070119875A1 (en) * 2005-01-27 2007-05-31 Vincent Ehret Volumetric displacement dispenser
US20090093202A1 (en) * 2006-04-19 2009-04-09 Toyo Tire & Rubber Co., Ltd. Method for manufacturing polishing pad
US20090253353A1 (en) * 2004-12-10 2009-10-08 Toyo Tire & Rubber Co., Ltd Polishing pad

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US5069002A (en) 1991-04-17 1991-12-03 Micron Technology, Inc. Apparatus for endpoint detection during mechanical planarization of semiconductor wafers
US6676717B1 (en) 1995-03-28 2004-01-13 Applied Materials Inc Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US5893796A (en) 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
JP3431115B2 (ja) 1995-03-28 2003-07-28 アプライド マテリアルズ インコーポレイテッド ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法
US5964643A (en) 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
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US6876454B1 (en) 1995-03-28 2005-04-05 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6537133B1 (en) 1995-03-28 2003-03-25 Applied Materials, Inc. Method for in-situ endpoint detection for chemical mechanical polishing operations
US5605760A (en) 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US6439968B1 (en) * 1999-06-30 2002-08-27 Agere Systems Guardian Corp. Polishing pad having a water-repellant film theron and a method of manufacture therefor
US6524164B1 (en) 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
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KR20050052513A (ko) * 2002-09-25 2005-06-02 피피지 인더스트리즈 오하이오 인코포레이티드 평탄화를 위한 윈도를 가진 연마 패드
JP2004169038A (ja) 2002-11-06 2004-06-17 Kimimasa Asano ポリウレタン・ポリウレア系均一研磨シート材
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US20040224611A1 (en) * 2003-04-22 2004-11-11 Jsr Corporation Polishing pad and method of polishing a semiconductor wafer
JP2004343090A (ja) * 2003-04-22 2004-12-02 Jsr Corp 研磨パッドおよび半導体ウェハの研磨方法
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EP1591201B1 (en) * 2004-04-28 2006-11-15 JSR Corporation Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
JP4775881B2 (ja) * 2004-12-10 2011-09-21 東洋ゴム工業株式会社 研磨パッド
JP4726108B2 (ja) * 2005-01-06 2011-07-20 東洋ゴム工業株式会社 研磨パッド及び半導体デバイスの製造方法
JP4884726B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
TW200720017A (en) * 2005-09-19 2007-06-01 Rohm & Haas Elect Mat Water-based polishing pads having improved adhesion properties and methods of manufacture
JP5044802B2 (ja) * 2006-04-19 2012-10-10 東洋ゴム工業株式会社 溝付き研磨パッドの製造方法
US20080063856A1 (en) * 2006-09-11 2008-03-13 Duong Chau H Water-based polishing pads having improved contact area
WO2008047631A1 (fr) * 2006-10-18 2008-04-24 Toyo Tire & Rubber Co., Ltd. Procédé pour produire un tampon à polir long
JP5146927B2 (ja) * 2006-10-18 2013-02-20 東洋ゴム工業株式会社 長尺研磨パッドの製造方法
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US20060062158A1 (en) * 1999-04-12 2006-03-23 Hattig Myron P Broadcast discovery in a network having one or more 1394 buses
US20090253353A1 (en) * 2004-12-10 2009-10-08 Toyo Tire & Rubber Co., Ltd Polishing pad
US20070119875A1 (en) * 2005-01-27 2007-05-31 Vincent Ehret Volumetric displacement dispenser
US20090093202A1 (en) * 2006-04-19 2009-04-09 Toyo Tire & Rubber Co., Ltd. Method for manufacturing polishing pad

Also Published As

Publication number Publication date
KR20100015303A (ko) 2010-02-12
WO2008149650A1 (ja) 2008-12-11
CN101663132B (zh) 2011-06-01
JP4943233B2 (ja) 2012-05-30
US20100162631A1 (en) 2010-07-01
CN101663132A (zh) 2010-03-03
US8409308B2 (en) 2013-04-02
TW200932431A (en) 2009-08-01
JP2008296333A (ja) 2008-12-11
TWI357843B (https=) 2012-02-11

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