WO2008047631A1 - Procédé pour produire un tampon à polir long - Google Patents

Procédé pour produire un tampon à polir long Download PDF

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Publication number
WO2008047631A1
WO2008047631A1 PCT/JP2007/069685 JP2007069685W WO2008047631A1 WO 2008047631 A1 WO2008047631 A1 WO 2008047631A1 JP 2007069685 W JP2007069685 W JP 2007069685W WO 2008047631 A1 WO2008047631 A1 WO 2008047631A1
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WO
WIPO (PCT)
Prior art keywords
long
region
light transmission
polishing
long polishing
Prior art date
Application number
PCT/JP2007/069685
Other languages
English (en)
Japanese (ja)
Inventor
Yoshiyuki Nakai
Tsuyoshi Kimura
Tetsuo Shimomura
Takeshi Fukuda
Kazuyuki Ogawa
Original Assignee
Toyo Tire & Rubber Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006284048A external-priority patent/JP5146927B2/ja
Priority claimed from JP2006286462A external-priority patent/JP2008100331A/ja
Priority claimed from JP2006286457A external-priority patent/JP4869017B2/ja
Application filed by Toyo Tire & Rubber Co., Ltd. filed Critical Toyo Tire & Rubber Co., Ltd.
Publication of WO2008047631A1 publication Critical patent/WO2008047631A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2793/00—Shaping techniques involving a cutting or machining operation
    • B29C2793/0009—Cutting out
    • B29C2793/0018—Cutting out for making a hole
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2793/00—Shaping techniques involving a cutting or machining operation
    • B29C2793/0027—Cutting off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5057—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like positioned between the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5092—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like characterised by the tape handling mechanisms, e.g. using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
    • B29C66/4722—Fixing strips to surfaces other than edge faces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2001/00—Use of cellulose, modified cellulose or cellulose derivatives, e.g. viscose, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
    • B29K2023/04—Polymers of ethylene
    • B29K2023/06—PE, i.e. polyethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
    • B29K2023/10—Polymers of propylene
    • B29K2023/12—PP, i.e. polypropylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2025/00—Use of polymers of vinyl-aromatic compounds or derivatives thereof as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2027/00—Use of polyvinylhalogenides or derivatives thereof as moulding material
    • B29K2027/06—PVC, i.e. polyvinylchloride
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2027/00—Use of polyvinylhalogenides or derivatives thereof as moulding material
    • B29K2027/12—Use of polyvinylhalogenides or derivatives thereof as moulding material containing fluorine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2029/00—Use of polyvinylalcohols, polyvinylethers, polyvinylaldehydes, polyvinylketones or polyvinylketals or derivatives thereof as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2069/00—Use of PC, i.e. polycarbonates or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2071/00—Use of polyethers, e.g. PEEK, i.e. polyether-etherketone or PEK, i.e. polyetherketone or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2075/00—Use of PU, i.e. polyureas or polyurethanes or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2077/00—Use of PA, i.e. polyamides, e.g. polyesteramides or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
    • B29K2079/08—PI, i.e. polyimides or derivatives thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
    • B29K2079/08—PI, i.e. polyimides or derivatives thereof
    • B29K2079/085—Thermoplastic polyimides, e.g. polyesterimides, PEI, i.e. polyetherimides, or polyamideimides; Derivatives thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2081/00—Use of polymers having sulfur, with or without nitrogen, oxygen or carbon only, in the main chain, as moulding material
    • B29K2081/06—PSU, i.e. polysulfones; PES, i.e. polyethersulfones or derivatives thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B29K2995/0026—Transparent

Definitions

  • the present invention relates to optical materials such as lenses and reflecting mirrors, silicon wafers, glass substrates for hard disks, aluminum substrates, and materials that require high surface flatness such as general metal polishing.
  • the present invention relates to a method for producing a long polishing pad that can be processed stably and at high and / or high polishing efficiency.
  • the long polishing pad obtained by the production method of the present invention is a silicon wafer and a device having an oxide layer, a metal layer, etc. formed thereon, and further laminating these oxide layers and metal layers. It is preferably used in the process of flattening before forming.
  • a conductive film is formed on the wafer surface and a wiring layer is formed by photolithography, etching, etc., and an interlayer insulating film is formed on the wiring layer. These steps cause irregularities made of a conductor such as metal or an insulator on the wafer surface.
  • the power of miniaturization of wiring and multilayer wiring for the purpose of increasing the density of semiconductor integrated circuits has been accompanied by the importance of a technique for flattening the unevenness of the wafer surface.
  • CMP chemical mechanical polishing
  • slurry a slurry-like abrasive
  • abrasive grains are dispersed with the surface to be polished of the wafer pressed against the polishing surface of the polishing pad.
  • a polishing apparatus generally used in CMP includes a polishing platen 2 that supports a polishing pad 1 and a support base (polishing) that supports a workpiece (semiconductor wafer) 4.
  • the polishing pad 1 is attached to the polishing surface plate 2 by attaching it with a double-sided tape, for example.
  • the polishing surface plate 2 and the support base 5 are arranged so that the polishing pad 1 and the material to be polished 4 that are supported respectively face each other, and are provided with rotating shafts 6 and 7, respectively. Also, press the workpiece 4 against the polishing pad 1 on the support 5 side.
  • a pressure mechanism is provided for this purpose.
  • such a polishing pad has 1) a method in which a resin material is poured into a mold to produce a resin block, and the resin block is sliced with a slicer. 2) a resin material is applied to the mold. 3) Manufactured by a notch method, such as a method of manufacturing into a thin sheet by pouring in and pressing, and 3) Dissolving the raw resin and extruding it from a T-die and directly manufacturing it into a sheet It had been.
  • Patent Document 1 manufactures a polishing pad by a reaction injection molding method.
  • Patent Document 3 a method of continuously producing a polyurethane / polyurea abrasive sheet material has been proposed in order to prevent variations in hardness, bubble size, and the like due to a batch-type production method.
  • a polyurethane raw material is mixed with a fine powder having a particle size of 300 ⁇ or less or an organic foaming agent, and the mixture is discharged between a pair of endless track belts and cast. Thereafter, a polymerization reaction of the mixture is performed by a heating means, and the formed sheet-like molded product is separated from the face belt to obtain an abrasive sheet material.
  • a polishing pad used for high-precision polishing a polyurethane foam sheet is generally used.
  • the polyurethane foam sheet is excellent in local flattening ability, but it is difficult to apply uniform pressure to the entire wafer surface due to insufficient cushioning.
  • a soft and strong cushion layer is separately provided on the back surface of the polyurethane foam sheet, and is used as a laminated polishing pad for polishing.
  • the following have been developed as laminated polishing nodes.
  • the first sheet-like member having elasticity and having irregularities formed on the surface thereof, and the surface of the first sheet-like member provided with the irregularities are opposed to the polished surface of the substrate to be processed.
  • Have a surface to do An abrasive cloth having a second sheet-like portion is disclosed! /, (Patent Document 5).
  • a polishing pad that includes a polishing layer and a support layer that is laminated on one surface of the polishing layer and is a foam having a higher compressibility than the polishing layer (Patent Document 6).
  • the optical detection means specifically means polishing by irradiating a wafer with a light beam through a window (light transmission region) through a polishing node and monitoring an interference signal generated by the reflection. This is a method of detecting the end point of.
  • He—Ne laser light having a wavelength of around 600 nm or 380 nm is used.
  • White light using a halogen lamp having a wavelength of ⁇ 800 nm is generally used.
  • the end point is determined by monitoring the change in the thickness of the surface layer of the wafer and knowing the approximate depth of the surface irregularities. This change in thickness is the depth of the unevenness. When it becomes equal to, the CMP process is terminated.
  • Various methods have been proposed for detecting the end point of polishing using such optical means and for the polishing pad used in the method.
  • a polishing pad having at least a part of a transparent polymer sheet that transmits solid, homogeneous light having a wavelength of 190 nm to 3500 nm Patent Document 9
  • a polishing pad in which a stepped transparent plug is inserted is disclosed (Patent Document 10).
  • a polishing pad having a transparent plug that is flush with the polishing surface is disclosed (Patent Document 11).
  • Patent Documents 12 and 13 proposals for preventing the slurry from leaking from the boundary (seam) between the polishing region and the light transmission region have also been made.
  • the slurry leaks out from the boundary (seam) between the polishing region and the light transmission region to the lower part of the polishing layer, and the slurry accumulates on this leakage prevention sheet, resulting in an optical end point. There is a problem with detection.
  • a rod or plug of the first resin is disposed in the liquid second resin, the second resin is cured to produce a molded product, and the molded product is sliced to transmit light.
  • a method of manufacturing a polishing pad in which a region and a polishing region are integrated is disclosed (Patent Document 14).
  • stress due to the difference in thermal shrinkage between the two materials remains at the bonding interface between the two materials at the time of molding, and slurry leakage may occur due to easy peeling at the bonding interface.
  • a polishing pad material is supplied to the outer periphery of the primary-annealed window, and the window and the polishing pad material are connected to each other.
  • a method of manufacturing a polishing pad by annealing and then slicing the molded product is disclosed (Patent Document 15).
  • Patent Document 15 A method of manufacturing a polishing pad by annealing and then slicing the molded product.
  • the polishing pad material is hardened and contracted, excessive stress is applied to the window, and there is a possibility that residual stress deformation or swelling occurs in the window. Thereby, the flatness of the window is impaired, the optical detection accuracy is a fear force s decreases.
  • Patent Document 1 JP 2004-42189 A
  • Patent Document 2 Japanese Patent Laid-Open No. 2003-220550
  • Patent Document 3 Japanese Patent Application Laid-Open No. 2004-169038
  • Patent Document 4 JP 2003 53657 A
  • Patent Document 5 Japanese Patent Laid-Open No. 10-329005
  • Patent Document 6 Japanese Unexamined Patent Application Publication No. 2004-25407
  • Patent Document 8 US Patent No. 5081421
  • Patent Document 9 Japanese Patent Publication No. 11 512977
  • Patent Document 10 JP-A-9 7985
  • Patent Document 11 Japanese Patent Laid-Open No. 10-83977
  • Patent Document 12 JP 2001-291686 A
  • Patent Document 13 Special Table 2003-510826
  • Patent Document 14 Japanese Unexamined Patent Application Publication No. 2005-210143
  • Patent Document 15 Japanese Unexamined Patent Publication No. 2005-354077
  • Patent Document 16 Japanese Patent Laid-Open No. 2003-68686
  • An object of the present invention is to provide a method for producing a long polishing pad that can prevent slurry leakage and is excellent in optical detection accuracy with high productivity.
  • the manufacturing method of a long polishing pad of the first A of the present invention includes a step of producing a long polishing region having a polyurethane foam force, and an opening composed of a through hole and a shelf is formed in the long length.
  • the above manufacturing method it is possible to easily manufacture a long polishing pad having a long light transmission region. Further, since the light transmission region and the polishing region are formed on the transparent support film, the slurry does not leak below the transparent support film during polishing. In addition, since the long polishing pad of the present invention has a space between the long light transmission region and the transparent support film, the light transmission region and the support film are bonded using an adhesive. Compared to the above, the optical detection accuracy is excellent. In the long polishing pad of the present invention, a cushion layer may be laminated on one side of the transparent support film.
  • the thickness of the thickest portion of the long light transmission region is preferably 50 to 90% of the thickness of the long polishing region. If it is less than 50%, the long light transmission area disappears or becomes too thin due to wear due to long use of the long polishing pad, optical detection becomes impossible, or optical detection due to slurry leakage. The accuracy tends to decrease. On the other hand, if it exceeds 90%, the back surface of the long light transmission region may come into contact with the adhesive layer for laminating the transparent support film during production, which is not preferable for production.
  • the obtained long polishing layer can be used as a long polishing pad of a laminated type by laminating a cushion layer on one side of a transparent support film which can be used alone as a long polishing pad.
  • the light transmission region is made of a thermosetting resin, and it is particularly preferable that the light transmitting region is a thermosetting polyurethane resin. In that case, since the light transmission region forming material and the cell dispersed urethane composition can be thermally cured simultaneously, the production process becomes simple.
  • the thickness of the injection wall of the light transmission region forming mold is preferably lmm or less! /.
  • the method for producing a long polishing pad according to the third aspect of the present invention includes a step of preparing a cell-dispersed urethane composition by a mechanical foaming method, and a spacer and a light transmission region in a long mold. The step of arranging in a laminated state, the spacer and the light transmitting region are arranged.
  • the above manufacturing method it is possible to easily manufacture a long polishing pad having a light transmission region. Further, since the long polishing region is self-adhering to the light transmission region, the slurry does not enter the interface between the two regions. In addition, since the long polishing pad of the present invention has a space between the light transmission region and the transparent support film, the light transmission region and the support film are bonded together using an adhesive. Compared with the optical detection accuracy.
  • the width of the spacer is preferably equal to or less than the width of the light transmission region in order to prevent deformation of the light transmission region due to pressurization during polishing.
  • the thickness of the light transmission region is preferably 50 to 90% of the thickness of the long polishing region. If it is less than 50%, the light transmission area disappears or becomes too thin due to wear due to long use of the long polishing pad, optical detection becomes impossible, and optical detection accuracy decreases due to slurry leakage. Tend to. On the other hand, if it exceeds 90%, the back surface of the light-transmitting region may come into contact with the adhesive layer for laminating the transparent support film during production, which is not preferable for production.
  • the light transmission region is preferably a long type for the same reason as described above.
  • the depth of the recess is preferably 10 to 50% of the thickness of the light transmission region. If it is less than 10%, the bottom surface of the recess may come into contact with the adhesive layer for laminating the transparent support film during production, which is not preferable for production. On the other hand, if it exceeds 50%, the light transmission area disappears or becomes too thin due to wear due to long use of the long polishing pad, optical detection becomes impossible, or optical detection accuracy due to slurry leakage It is in the direction when it declines.
  • a method for producing a 3-C long polishing pad according to the present invention includes a step of preparing a cell-dispersed urethane composition by a mechanical floss method, and a spacer is fed into the surface material while feeding the surface material.
  • the spacer and the light transmission region are preferably long types for the same reason as described above.
  • the width of the spacer is equal to or less than the width of the light transmission region for the same reason as described above. It is preferable that In addition, the thickness of the light transmission region is preferably 50 to 90% of the thickness of the long polishing region for the same reason as described above.
  • a method for producing a 3-D long polishing pad according to the present invention includes a step of preparing a cell-dispersed urethane composition by a mechanical floss method, and a concave light is provided inside the face material while feeding the face material.
  • a method for producing a 3-E long polishing pad of the present invention includes a step of preparing a cell-dispersed urethane composition by a mechanical floss method, a concave mold inside the transparent support film while feeding out the transparent support film. A step of disposing the light transmission region of the hollow so that the depression is on the lower side, the light transmission region is disposed, and the bubble-dispersed urethane composition is continuously formed on the transparent support film. A step of laminating a face material on the discharged cell-dispersed urethane composition, a long polishing region comprising a polyurethane foam by curing the cell-dispersed urethane composition while uniformly adjusting the thickness. Forming a long polishing layer having a space between the light transmission region and the transparent support film, and peeling the face material from the long polishing region.
  • FIG. 1 is a schematic configuration diagram showing an example of a polishing apparatus used in CMP polishing.
  • FIG. 2 is a schematic view showing an example of a cross section of the long polishing pad of the first invention.
  • FIG. 3 is a schematic view showing an example of a resin sheet in which a large number of grooves are formed at predetermined intervals.
  • FIG. 4 is a schematic view showing an example of a cross section when a resin sheet is cut in the width direction.
  • FIG. 5 is a schematic view showing an example of a cross section of the long polishing pad of the second invention.
  • FIG. 6 is a schematic view showing an example of the production process of the long polishing pad of the second invention.
  • FIG. 7 is a schematic diagram showing an example of the structure of a mold for forming a light transmission region
  • FIG. 8 is a schematic view showing an example of a cross section of the long polishing pad of the third invention.
  • FIG. 9 is a schematic view showing an example of a cross section of the long polishing pad of the third invention.
  • FIG. 11 is a schematic view showing an example of a cross section when a resin sheet is cut in the width direction.
  • FIG. 12 is a schematic view showing the production process of the long polishing pad of the third invention.
  • FIG. 13 is a schematic view showing a production process of the long polishing pad of the third invention.
  • FIG. 14 is a schematic view showing a method for polishing a semiconductor wafer using a web-type polishing apparatus.
  • FIG. 15 is a schematic diagram showing a method for polishing a semiconductor wafer using a linear polishing apparatus.
  • FIG. 16 is a schematic diagram showing a method for polishing a semiconductor wafer using a reciprocating polishing apparatus.
  • the polyurethane comprises an isocyanate component, a polyol component (high molecular weight polyol, low molecular weight polyol), and a chain extender.
  • isocyanate component a compound known in the field of polyurethane can be used without particular limitation.
  • Isocyanate components include 2,4-toluene diisocyanate, 2, 6
  • Aromatic diisocyanates such as tarendene isocyanate, p-phenylene diisocyanate, m-phenylene diisocyanate, p-xylylene diisocyanate, m-xylylene diisocyanate, ethylene diisocyanate 2, 2, 4-trimethylhexamethylene diisocyanate, aliphatic diisocyanates such as 1,6-hexamethylene diisocyanate, 1,4-cyclohexane diisocyanate, 4,4,1 dicyclo Hexylmethane diisocyanate, Toka S. These may be used alone or in combination of two or more.
  • the isocyanate component in addition to the diisocyanate compound, a polyfunctional polyisocyanate compound having three or more functions can be used.
  • a polyfunctional polyisocyanate compound a series of diisocyanate adduct compounds are commercially available as Desmodur-N (manufactured by Bayer) and trade name Deuranate (manufactured by Asahi Kasei Kogyo).
  • isocyanate components it is preferable to use an aromatic diisocyanate and an alicyclic diisocyanate in combination, and particularly preferable to use toluene diisocyanate and dicyclohexylmethane diisocyanate in combination!
  • Examples of the high molecular weight polyol include a polyether polyol typified by polytetramethylene ether glycol, a polyester polyol typified by polybutylene adipate, and a polyester polycarbonate polyol exemplified by a reaction product with xylene carbonate.
  • a polyester polycarbonate polyol obtained by reacting ethylene carbonate with a polyhydric alcohol and then reacting the resulting reaction mixture with an organic dicarboxylic acid, and a polyol.
  • Examples thereof include polycarbonate-polyol obtained by a transesterification reaction between a lithium compound and aryl carbonate. These may be used alone or in combination of two or more.
  • the ratio of the high molecular weight polyol to the low molecular weight polyol in the polyol component is determined by the characteristics required for the polishing region produced from these.
  • a chain extender is used for curing the prepolymer.
  • the chain extender is an organic compound having at least two or more active hydrogen groups. Examples of the active hydrogen group include a hydroxyl group, a primary or secondary amino group, and a thiol group (SH).
  • the ratio of the isocyanate component, the polyol component, and the chain extender can be variously changed depending on the molecular weight of each, the desired physical properties of the polishing region, and the like.
  • the number of isocyanate groups of the isocyanate component relative to the total number of active hydrogen groups (hydroxyl group + amino group) of the polyol component and the chain extender is 0.80-1.20. It is preferable that there is, more preferably from 0.99 to 1.15. When the number of isocyanate groups is out of the above range, curing failure occurs and the required specific gravity and hardness cannot be obtained, so that the polishing characteristics are deteriorated.
  • the polyurethane foam can be produced by either the pre-polymer method or the one-shot method.
  • An isocyanate-terminated prepolymer is synthesized beforehand from an isocyanate component and a polyol component, and chain extension is performed on this.
  • the prebolimer method in which the agent is reacted is preferable because the resulting polyurethane has excellent physical properties.
  • Examples of the method for producing a polyurethane foam include a method of adding hollow beads, a mechanical foaming method (including a mechanical froth method), and a chemical foaming method.
  • a mechanical foaming method using a silicone surfactant which is a copolymer of a polyalkylsiloxane and a polyether and does not have an active hydrogen group.
  • suitable silicon surfactants include SH-192 and L-5340 (manufactured by Toray Dow Coung Silicon).
  • a chain extender (second component) is added to the above bubble dispersion, mixed and stirred to obtain a foaming reaction solution.
  • the foaming reaction solution is poured into a long mold.
  • the foaming reaction liquid poured into the long mold is heated and cured by reaction.
  • the non-reactive gas used to form the fine bubbles is preferably a non-flammable gas, specifically nitrogen, oxygen, carbon dioxide gas, a rare gas such as helium or argon, or a mixture thereof. Gas is exemplified, and the use of air that has been dried to remove moisture is most preferable in terms of cost.
  • stirrer for dispersing non-reactive gas in the form of fine bubbles and dispersing in the first component containing the silicon-based surfactant a known stirrer can be used without particular limitation, and specifically, a homogenizer. Examples include dissolvers, two-axis planetary mixers (planetary mixers), etc.
  • the shape of the stirring blade of the stirring device is not particularly limited, but it is preferable to use a Whisper type stirring blade to obtain fine bubbles!
  • stirring devices are used for the stirring for creating the cell dispersion in the foaming step and the stirring for adding and mixing the chain extender in the mixing step.
  • a stirring device that does not entrain large bubbles even if the stirring in the mixing step is not stirring that forms bubbles.
  • a planetary mixer is preferable. It is also suitable to adjust the stirring conditions, such as adjusting the rotation speed of the stirring blades as necessary, even if the same stirring device is used as the stirring device for the foaming step and the mixing step.
  • the average cell diameter of the polyurethane foam is a force S of 30 to 80 m, preferably S, and more preferably 30 to 60 111.
  • the polishing rate tends to decrease or the planarity (flatness) of the polished material (Weno) after polishing tends to decrease.
  • the specific gravity of the polyurethane foam is preferably 0.5 to 1.3.
  • the specific gravity is less than 0.5, the surface strength of the polishing region decreases and the planarity of the material to be polished tends to decrease.
  • the ratio is larger than 1.3, the number of bubbles on the surface of the polishing region decreases, and the smoothness is good, but the polishing rate tends to decrease.
  • the polishing surface in contact with the material to be polished in the long polishing region preferably has a concavo-convex structure for holding and renewing the slurry.
  • the polishing area made of foam has many openings on the polishing surface and holds and renews the slurry.
  • the slurry is held and renewed by forming an uneven structure on the polishing surface. Further, it can be carried out more efficiently, and the destruction of the material to be polished due to adsorption with the material to be polished can be prevented.
  • the concavo-convex structure is not particularly limited as long as it holds and renews the slurry.
  • the thickness of the long polishing region is not particularly limited, but is usually about 0.8 to 4 mm, preferably! To 2.5 mm.
  • a method for producing the polishing region of the thickness a method of making the foam block a predetermined thickness using a band saw type or canna type slicer, pouring a resin into a long mold having a predetermined thickness of the cavity, and curing the resin. And a method using a coating technique or a sheet forming technique.
  • the thickness variation of the long polishing region is preferably 100 m or less.
  • the long polishing area has a large undulation, and there are parts with different contact conditions with the material to be polished, which adversely affects the polishing characteristics.
  • the ability to dress the polished surface with a dresser in which diamond abrasive grains are electrodeposited and fused in the initial stage of polishing exceeds the above range. As a result, the dressing time becomes longer and the production efficiency is lowered.
  • the length and width of the long polishing region can be appropriately adjusted according to the polishing apparatus used.
  • the length is usually about 5 to 15 m, and the width is usually about 60 to 250 cm.
  • An opening 14 consisting of 12 and a shelf 13 is formed.
  • the formation position and the number of openings are not particularly limited, but it is preferable to form one at the center in the width direction of the long polishing region and continuously in the length direction.
  • the width of the through-hole 12 is not particularly limited, but is usually about 5 to 15 mm.
  • the width and height of the shelf 13 are not particularly limited, but the width is usually about 2 to 5 mm and the height is about 0.3 to 0 • 5 mm.
  • a shelf is continuously formed in one side of the long polishing region in the length direction, and the long polishing region having the shelf is divided into two.
  • Make one For example, 1) a polyurethane foam at a predetermined position is cut at a depth of the shelf 13 and twice as wide as the shelf 13 to form continuous grooves in the length direction; A method of cutting the polyurethane foam into two along the central part of the groove, 2) Continuously cutting one side of two individually produced polyurethane foams in the length direction to form each shelf 13 3)
  • One polyurethane foam is cut into two in the length direction, and one side of each polyurethane foam is continuously cut in the length direction to form a shelf 13 respectively.
  • the width of each long polishing region 9 is not particularly limited, but is usually about 30 to about 125 cm.
  • the width and height of the shelf 13 are the same as described above.
  • thermosetting resins such as polyurethane resins, polyester resins, phenol resins, urea resins, melamine resins, epoxy resins, and acrylic resins
  • polyurethane resins polyester resins, polyamide resins, cellulose resins
  • Thermoplastic resins such as acrylic resin, polycarbonate resin, halogen resin (polyvinyl chloride, polytetrafluoroethylene, polyvinylidene fluoride, etc.), polystyrene, and olefin resin (polyethylene, polypropylene, etc.); for light such as ultraviolet rays and electron beams
  • examples thereof include a photo-curable resin and a photosensitive resin that are more cured.
  • thermosetting resin is hardened at a relatively low temperature.
  • photocurable resin it is preferable to use a photopolymerization initiator in combination.
  • thermosetting resin it is preferable to use a thermosetting resin, and it is particularly preferable to use a thermosetting polyurethane resin.
  • the thickness of the transparent support film is not particularly limited, but is preferably about 20 to 200111 from the viewpoints of strength, winding and the like. Further, the width of the transparent support film is not particularly limited, but is preferably about 60 to 250 cm in consideration of the required size of the polishing layer. In addition, the length of the transparent support film can be set appropriately according to the required length of the polishing layer. Since a lead part (about 2m each in front and back) is required, it is usually about 9-20m, preferably 10 ⁇ ; 15m.
  • the long light transmission region 10 is provided in front of the long light transmission region 10.
  • the opening 14 is formed so that the shelf and the shelf face each other and the long light transmission region 10 is inserted.
  • Step A for arranging the two long polishing regions 9 in parallel, Step B for installing the long light transmission region 10 in the opening 14, and transparent on the polishing back side of the long polishing region 9 It includes the process C for attaching the support film 1 1.
  • Step C may be performed after performing steps A and B, or step B may be performed after performing steps A and C.
  • the distance between the two long polishing regions 9 corresponds to the width of the head portion 18 of the long light transmission region 10.
  • the adhesive that is the raw material of the adhesive layer 20 is a known adhesive with no particular limitation.
  • the power that can be used S The hot melt adhesive is preferably used from the viewpoint of automation of the work process, speedup, and labor saving. In particular, it is preferable to use an EVA-based or synthetic rubber-based hot melt adhesive having excellent adhesiveness and a low softening point.
  • the bonding method is not particularly limited.
  • the hot-melt adhesive is applied on the shelf 13 while moving the long polishing region 9 on the conveyor belt, and the long light in the opening 14 is applied.
  • the transmission region 10 After the transmission region 10 is installed, it can be applied by heating and pressing the long light transmission region using a nip roll with a heater. The heating temperature is appropriately adjusted in consideration of the softening point of the hot melt adhesive.
  • the hot melt adhesive may be applied to the shoulder portion of the long light transmission region.
  • the polishing region of the polishing layer in the second aspect of the present invention is made of a polyurethane foam having fine bubbles.
  • the raw material of the polyurethane is the same as described above.
  • the polyurethane foam is produced by curing a cell-dispersed urethane composition obtained by mixing a first component containing an isocyanate group-containing compound and a second component containing an active hydrogen group-containing compound.
  • the isocyanate-terminated polymer is an isocyanate group-containing compound
  • the chain extender is an active hydrogen group-containing compound.
  • the isocyanate component becomes an isocyanate group-containing compound
  • the chain extender and the polyol component become active hydrogen group-containing compounds.
  • the cell-dispersed urethane composition is prepared by a mechanical foaming method (including a mechanical calfloss method). Particularly preferred is a mechanical foaming method using a silicone surfactant, which is a copolymer of polyalkylsiloxane and polyether and does not have an active hydrogen group.
  • a silicone surfactant which is a copolymer of polyalkylsiloxane and polyether and does not have an active hydrogen group.
  • suitable silicon-based surfactants include SH-192, L-5340 (manufactured by Toray Dow Coung Silicon) and the like.
  • the addition amount of the silicone-based surfactant is preferably 0.05 to 5% by weight in the polyurethane foam. When the amount of the silicon-based surfactant is less than 0.05% by weight, a fine-bubble foam tends to be not obtained. On the other hand, when it exceeds 5% by weight, it tends to be difficult to obtain a high-hardness polyurethane foam due to the
  • stabilizers such as antioxidants, lubricants, pigments, fillers, antistatic agents, and other additives may be added! /.
  • a catalyst that promotes a known polyurethane reaction such as a tertiary amine compound
  • the type and amount of catalyst to be selected are selected in consideration of the flow time for pouring into a mold having a predetermined shape after the mixing step.
  • the transparent support film used in the second aspect of the present invention is not particularly limited.
  • the light transmitting region forming material used in the second present invention is not particularly limited, and the same thing as mentioned above can be cited by the force S.
  • FIG. 5 is a cross-sectional view of the long polishing pad of the second invention.
  • FIG. 6 is a schematic view showing an example of the production process of the long polishing pad of the second invention.
  • the long mold 24 includes a bottom plate and a long formwork. First, the transparent support film 11 is placed on the bottom board, and a long form frame is placed on the transparent support film 11. Then, the bottom plate and the long mold are clamped so that the cast material does not leak from the gap between the transparent support film and the long mold.
  • the transparent support film is preferably provided about 2 m larger than the long frame.
  • the length of the long frame is a force that can be set as appropriate in consideration of the required length of the polishing layer. Usually 5 to 15 m, preferably 7 to 10 m.
  • the width of the long form is not particularly limited, but it is preferably about 60 to 250 cm in consideration of the required size of the polishing layer.
  • the height of the long form is not particularly limited, but is preferably about 10 to 60 mm from the viewpoint of the required thickness of the polishing area and prevention of overflow during casting.
  • a light transmission region forming mold 25 is arranged at a predetermined position on the transparent support film 11.
  • FIG. 7 (a) is a schematic diagram showing a cross-sectional structure in the X direction of the light transmission region forming mold.
  • FIG. 7- (b) is a schematic view showing the top structure of the light transmission region forming mold.
  • FIG. 7 (c) is a schematic diagram showing the bottom structure of the light transmission region forming mold.
  • the mold 25 for forming a light transmission region can be produced by a casting molding method using, for example, metal or plastic as a raw material.
  • the length of the light transmission region forming form is not particularly limited as long as it can be set on the long mold as shown in FIG.
  • the mold for forming a light transmission region has an injection hole 26 and an injection wall 27.
  • the injection hole is a hole for injecting the light transmission region forming material 28 to form the light transmission region 10.
  • the injection wall is a wall for preventing the light transmission region forming material 28 and the cell dispersed urethane composition 23 from being mixed, and for forming a certain gap between the light transmission region 10 and the polishing region 9. The wall.
  • the length of the injection hole 26 is appropriately adjusted according to the inner wall length of the long mold. Further, the width of the injection hole 26 can be appropriately set according to the required width of the light transmission region, but is preferably about 0.5 to 2 cm. In addition, one injection hole 26 may be provided continuously as shown in FIG. 7- (b)! /, Or a plurality of injection holes may be provided intermittently at predetermined intervals! /, May! / .
  • the light transmission region forming material 28 is discharged into the injection hole 26, and the light transmission region forming material 28 is cured to form the light transmission region 10.
  • the cell-dispersed urethane composition 23 is discharged onto the transparent support film 11 outside the injection hole 26, and the cell-dispersed urethane composition 23 is cured to form a polishing region 9. Either of the above two steps may be performed first or simultaneously. Considering the work efficiency, it is preferable to perform the above two processes simultaneously!
  • the discharge amount of the light transmission region forming material 28 and the cell dispersed urethane composition 23 is appropriately adjusted in consideration of the thickness and area of the light transmission region and the thickness and area of the polishing region.
  • the light transmissive region forming material 28 and the cell dispersed urethane composition 23 are cured by, for example, adjusting the thickness uniformly and then passing through a heating oven provided on a conveyor.
  • the heating temperature is about 40 to 100 ° C, and the heating time is about 5 to 10 minutes.
  • Heating and post-curing the foam-dispersed urethane composition that has reacted until it stops flowing Has the effect of improving the physical properties of the polyurethane foam.
  • the light transmitting region forming material is a thermoplastic resin
  • the light transmitting region forming material is cured by cooling after the cell-dispersed urethane composition is thermally cured.
  • the light transmission region forming material is a photocurable resin, it is cured by irradiation with light such as ultraviolet rays or electron beams.
  • the light transmission region preferably contains as few bubbles as possible from the viewpoint of increasing the light transmittance.
  • the light transmission region forming mold and the long mold are released to produce a long polishing layer having a gap between the light transmission region and the polishing region.
  • the obtained long polishing layer may be post-cured, or the length may be appropriately adjusted according to the polishing apparatus to be used. Further, the long polishing layer becomes a long polishing pad through a step of forming a concavo-convex structure on the polishing surface.
  • the average bubble diameter in the polishing region is preferably 30 to 80 111, more preferably 30 to 60 111.
  • the polishing rate tends to decrease or the planarity (flatness) of the polished material (Weno) after polishing tends to decrease.
  • the thickness of the polishing region is not particularly limited, but is usually about 0.8 to 4 mm, and preferably 1.2 to 2.5 mm.
  • the specific gravity of the polishing region is preferably 0.5 to 1.3.
  • the specific gravity is less than 0.5, the strength of the polished surface decreases, and the planarity of the material to be polished tends to deteriorate.
  • the ratio is larger than 1.3, the number of fine bubbles on the polishing surface decreases, and the planarization characteristics are good, but the polishing rate tends to deteriorate.
  • the hardness of the polishing region is preferably 45 to 70 degrees as measured by an Asker D hardness meter.
  • D hardness is less than 45 degrees, the planarity of the material to be polished tends to deteriorate.
  • it is greater than 70 degrees planarity is good, but the uniformity (uniformity) of the material to be polished tends to deteriorate.
  • the thickness variation in the polishing region is preferably 100 m or less for the same reason as described above.
  • the thickness of the light transmission region is not particularly limited, but is preferably equal to or less than the thickness of the polishing region. If the light transmission region is thicker than the polishing region, the object to be polished may be damaged by the protruding portion during polishing. [0119]
  • the polishing surface that comes into contact with the material to be polished (wafer) preferably has a concavo-convex structure for holding and renewing the slurry in the same manner as described above.
  • FIGS. 8 and 9 are cross-sectional views of the long polishing pad 8 of the third aspect of the present invention.
  • the long polishing region 9 is made of a polyurethane foam having fine bubbles.
  • the raw materials for polyurethane are the same as described above.
  • the polyurethane foam is produced by curing a cell-dispersed urethane composition obtained by mixing a first component containing an isocyanate group-containing compound and a second component containing an active hydrogen group-containing compound. .
  • the cell-dispersed urethane composition can be prepared by the same method as described above.
  • the raw material of the spacer used in the third aspect of the present invention is not particularly limited.
  • the shape of the spacer is not particularly limited, but the cross section is preferably rectangular. In that case, considering the shape stability, the width is preferably about 5 to 15 mm, more preferably less than the width of the light transmission region. Further, the height is preferably 10 to 50% of the thickness of the long polishing region. S is preferably 15 to 40%.
  • the length of the spacer is not particularly limited, and may be a long type (several meters) or a short type (several centimeters to several tens of centimeters).
  • Spacers are, for example, a method of forming by extrusion molding, a method of cutting a resin block extruded into a cylindrical shape into a strip shape by spirally cutting, a method of cutting a resin sheet with a predetermined width and length, etc. Can be manufactured.
  • the material for forming the light transmission regions 10a and 10b is not particularly limited, and examples thereof are the same as described above. Can. When a resin having an aromatic hydrocarbon group is used, the light transmittance on the short wavelength side tends to be lowered. Therefore, it is preferable not to use such a resin. In addition, it is preferable to use a thermoplastic resin, and it is particularly preferable to use a thermoplastic polyurethane resin.
  • the length of the light transmission region 10a is not particularly limited, and may be a long type (several meters) or a short type (several centimeters to several tens of centimeters)! / ,. Moreover, it is preferable to match the length of the spacer.
  • the concave light transmission region 10b can be produced by, for example, an extrusion molding method or a casting molding method.
  • the resin sheet 29 is subjected to a number of groove processing at predetermined intervals, and then the center of the convex portion is cut in the length direction, whereby a long (about several m) light having the depression 30 is obtained.
  • the transmissive region 10b can be efficiently produced.
  • FIG. 11 is a cross-sectional view of the resin sheet 29 cut in the width direction.
  • the width (W) of the light transmission region 10b is preferably about 10 to 15 mm in consideration of shape stability and ensuring a wide polishing region.
  • the thickness (H) of the light transmission region 10b can be appropriately adjusted in consideration of the thickness of the long polishing region 9.
  • the width (w) of the recess 30 is preferably about 5 to 10 mm in consideration of shape stability and the incident region of the laser beam.
  • the depth (h) of the indentation 30 is preferably 10 to 50% of the thickness (H) of the light transmission region S, more preferably 15 to 40%.
  • a large number of depressions 30 are formed in the resin sheet 29 at a predetermined interval, and then the center of the convex portion is cut into a lattice shape so that light of a short length (several centimeters to several tens of centimeters) having the depression 30 is obtained.
  • the transmissive region 10b can be efficiently produced.
  • the width (W) and thickness (H) of the short light transmission region 10b and the width (w) and depth (h) of the recess 30 are the same as described above.
  • FIG. 12 is a schematic view showing an example of the production process of the long polishing pad of the third invention.
  • the length of the long mold 24 is usually about 5 to 15 m, preferably 7 to 10 m in consideration of the length of the required long polishing region.
  • the width is preferably about 60 to 250 cm in consideration of the required size of the long polishing region.
  • the height is preferably about 10 to 60 mm from the viewpoint of the required thickness of the long polishing region and the prevention of overflow during casting.
  • the spacer 1 and the light transmission region 10a are disposed and fixed at predetermined positions of the long mold 24 in a laminated state.
  • the spacer may be first arranged in the mold, and the light transmission region 10a may be laminated thereon, or vice versa.
  • the long type spacer and the light transmission region 10a may be provided in the mold, or a plurality of them may be provided.
  • the polishing area is increased by increasing the area of the polishing region. Therefore, it is preferable to provide only one at the center in the width direction of the mold.
  • the concave light transmission region 10b when used, it is disposed and fixed at a predetermined position of the mold so that the recess 30 is on the lower side. As above, it is preferable to provide only one at the center in the width direction of the mold. In addition, when using a short-type concave light transmitting region 10b, it is preferable to provide a plurality at the center in the width direction of the mold and at predetermined intervals in the length direction.
  • the fixing method is not particularly limited, and examples thereof include a method of bonding using a double-sided tape, and a method of applying pressure to the spacer and the light transmission region to press against the mold bottom.
  • a spacer and a light transmissive region 10a or a concave light transmissive region 10b are provided, and the cell dispersed urethane composition 23 is discharged to the V, Na!
  • the object is cured to produce a long polishing region 9 made of polyurethane foam.
  • the discharge amount of the bubble-dispersed urethane composition 23 is appropriately adjusted in consideration of the thickness and area of the long polishing region.
  • Curing of the cell-dispersed urethane composition 23 is performed, for example, by allowing the thickness to be uniformly adjusted and then passing through a heating oven provided on the competitor.
  • the heating temperature is 40 to about 100 ° C, and the heating time is about 5 to 10 minutes. Heating and post-curing the cell-dispersed urethane composition that has reacted until it no longer flows has the effect of improving the physical properties of the polyurethane foam.
  • FIG. 13 is a schematic view showing another production example of the long polishing pad of the third invention.
  • the cell-dispersed urethane composition 23 is prepared by a mechanical calf loss method.
  • the mechanical Carlos method raw material components are put into the mixing chamber of the mixing head 32, the non-reactive gas is mixed, and mixed and stirred with a mixer such as an Oaks mixer to make the non-reactive gas into a fine bubble state. This is a method of dispersing in the raw material mixture.
  • the mechanical Carlos method is a preferable method because the density of the polyurethane foam can be easily adjusted by adjusting the mixing amount of the non-reactive gas.
  • the face material 33 fed from the roll is moving on the conveyor 34.
  • the spacer and the light transmission region 10a are arranged and fixed at predetermined positions inside the face member 33 by feeding them from a roll or the like in a laminated state.
  • the spacer may be first disposed on the face member 33, and the light transmission region 10a may be laminated thereon, or vice versa.
  • only one or a plurality of long-type spacers and light transmission regions 10a may be provided on the face material 33.
  • the width direction of the face material 33 may be provided. It is preferable to install only one in the center. Further, in the case of using a short type spacer and the light transmission region 10a, it is preferable to provide a plurality of spacers at the center in the width direction of the face member 33 and at predetermined intervals in the length direction.
  • the concave light transmission region 10b when used, it is disposed and fixed at a predetermined position of the face member 33 or the transparent support film 11 so that the recess 30 is on the lower side. Face material as above 3 3 or only one is preferably provided at the center of the transparent support film 11 in the width direction. Further, in the case of using the short-type concave light transmission region 10b, it is preferable to provide a plurality at the center in the width direction of the face member 33 or the transparent support fin 11 and at predetermined intervals in the length direction. By using the transparent support film 11 instead of the face material 33, it is possible to omit the step of laminating the transparent support film on the surface side having the recess 30 after the production of the long polishing region. Preferred from a viewpoint!
  • the face material to be used is not particularly limited, and examples thereof include paper, cloth, nonwoven fabric, and a resin film.
  • a resin film having heat resistance and flexibility is particularly preferable.
  • Examples of the resin for forming the face material include polyethylene terephthalate, polyester, polyethylene, polypropylene, polystyrene, polyimide, polybulal alcohol, polychlorinated butyl, and fluororesin such as polyfluoroethylene, nylon, and cellulose. Use the power S to lift up.
  • the thickness of the face material is not particularly limited, but is preferably about 20 to 200 111 from the viewpoints of strength and winding.
  • the width of the face material is not particularly limited, but is preferably about 60 to 250 cm in consideration of the required size of the long polishing region.
  • the surface of the face material is preferably subjected to a mold release treatment.
  • the face material can be easily peeled off after the long polishing region is produced.
  • the spacer and the light transmissive region 10a or the concave light transmissive region 10b are disposed, and the cell dispersed urethane composition 23 is placed on the V, Na! /, Face material 33 or the transparent support film 11. Discharge continuously from the discharge nozzle of the mixing head 32.
  • the moving speed of the face material 33 or the transparent support film 11 and the discharge amount of the cell dispersed urethane composition 23 are appropriately adjusted in consideration of the thickness and area of the long polishing region.
  • a face material 33 is laminated on the discharged cell-dispersed urethane composition 23, and the cell-dispersed urethane composition 23 is cured while uniformly adjusting the thickness, thereby forming a long length of polyurethane foam.
  • a polishing region 9 is produced.
  • means for uniformly adjusting the thickness include a roll 35 such as a nip roll and a coater roll, a doctor blade, and the like.
  • the curing of the cell dispersed urethane composition 23 is, for example, after the thickness is uniformly adjusted, This is done by passing through a heating oven (not shown) provided on the conveyor. The heating temperature is about 40 to 100 ° C, and the heating time is about 5 to 10 minutes.
  • the face material is peeled off from the integrally formed light transmission region and the long polishing region, and in the case of the third-A and third-C production methods of the present invention, the long polishing region force, Remove the spacer.
  • the obtained light transmission region and the long polishing region are cut into, for example, a several meter parabolic shape by a cutting machine.
  • the length is appropriately adjusted according to the polishing apparatus used, but is usually about 5 to 15 m, preferably 7 to 10 m.
  • post-curing may be performed before the face material is peeled off or post-curing may be performed after the face material is peeled off. From the viewpoint of prevention, it is preferable to boss cut after peeling off the face material.
  • the end of the long polishing area may be cut and removed to adjust the length and make the thickness uniform! /.
  • the polishing surface in contact with the material to be polished has a concavo-convex structure for holding and renewing the slurry as described above.
  • the thickness of the long polishing region is not particularly limited, but is usually about 0.8 to 4 mm, preferably! To 2.5 mm.
  • the thickness variation in the long polishing region is preferably 100 m or less for the same reason as described above.
  • a transparent support film is laminated on the surface side where the spacer of the long polishing region is peeled off or the surface side having a dent in the light transmission region, and a gap is formed between the light transmission region and the transparent support film.
  • a long polishing layer having an interspace 36 is produced.
  • the long polishing region 9 As a means for laminating the transparent support film 11 on the long polishing region 9, for example, a method of sandwiching and pressing the long polishing region 9 and the transparent support film 11 with a double-sided tape 37, the long polishing region 9 Examples include a method of applying an adhesive on the surface side and bonding the transparent support film 11 together. However, it is necessary not to provide the double-sided tape 37 or the adhesive on the portion corresponding to the space 36 on the transparent support film 11.
  • the length and width of the long polishing layer can be appropriately adjusted according to the polishing apparatus to be used.
  • the length is usually 5 to about 15 m, and the width is usually about 60 to 250 cm.
  • the cushion sheet supplements the characteristics of the polishing layer. Cushion seats are necessary in order to achieve both planarity and unity that have a trade-off relationship in CMP.
  • Planarity refers to the flatness of the pattern area when a wafer with minute irregularities that occurs during pattern formation is polished. Uniformity refers to the uniformity of the entire wafer. Planarity is improved by the characteristics of the foam sheet, and uniformity is improved by the characteristics of the cushion sheet. For the long polishing pad of the present invention, it is preferable to use a cushion sheet that is softer than the polishing area.
  • the cushion sheet examples include fiber nonwoven fabrics such as polyester nonwoven fabrics, nylon nonwoven fabrics, and talil nonwoven fabrics, and resin-impregnated nonwoven fabrics such as polyester nonwoven fabrics impregnated with polyurethane, and polymer resin foams such as polyurethane foams and polyethylene foams. Body, butadiene rubber, rubber resin such as isoprene rubber, photosensitive resin, etc.
  • Examples of means for attaching the long polishing layer and the cushion sheet include a method in which the long polishing layer and the cushion sheet are sandwiched with a double-sided tape and pressed.
  • a double-sided tape is provided on the side of the long polishing layer or the cushion layer that contacts the platen!
  • the semiconductor device is manufactured through a step of polishing the surface of the semiconductor wafer using the long polishing pad.
  • a semiconductor wafer is generally a laminate of a wiring metal and an oxide film on a silicon wafer.
  • the semiconductor wafer polishing method and polishing apparatus are not particularly limited.
  • the semiconductor wafer is polished by the following method.
  • the above polishing apparatus usually has a polishing surface plate (platen) for supporting a long polishing pad, a support base (polishing head) for supporting a semiconductor wafer, and uniform to the wafer. It is equipped with a backing material for pressurization and an abrasive (slurry) supply mechanism.
  • the polishing surface plate and the support table are disposed so that the long polishing pad and the semiconductor wafer supported by each of the polishing table and the support table face each other, and the support table includes a rotation shaft.
  • the semiconductor wafer is pressed against a long polishing pad while rotating the support base, and polishing is performed while supplying slurry.
  • the flow rate of the slurry, the polishing load, the number of rotations of the wafer, etc. are not particularly limited, and are appropriately adjusted.
  • semiconductor devices are manufactured by dicing, bonding, packaging, and the like.
  • the semiconductor device is used for an arithmetic processing device, a memory, and the like.
  • each sheet surface is subjected to X-groove processing for slurry with groove width lmm, groove pitch 6mm, groove depth 0.4mm and long polishing with shelf Two regions were created.
  • the surface of the sheet was buffed to a thickness of 0.9 mm using a puffing machine (Amitech Co., Ltd.) to obtain a sheet with an adjusted thickness accuracy.
  • a groove having a groove width of 6 mm, a groove length of 500 cm, a groove pitch of 12 mm, and a groove depth of 0.2 mm was formed on the entire surface of the non-foamed sheet using a groove processing machine (manufactured by Techno). After that, cut all the grooves along the central part of the groove and height (h) 0.9mm, length 500cm long light transmission area (shoulder part: width 3mm, height 0.7mm, head part : A width of 6 mm).
  • a hot melt adhesive (Okamoto Chusho Co., Ltd., SUNO ITEC 1942, EVA type, soft base point 88. C, 4000cps atl 77. C) was applied to the shoulder of the manufactured long light transmission region. It was applied and left at room temperature for about 1 hour.
  • the two long polishing areas thus produced had a through hole between the shelves. It was placed on a belt conveyor and fixed so as to be formed with a constant width (about 6 mm). Thereafter, the long light transmission region was disposed in the opening of the long polishing region, and the long light transmission region was temporarily fixed with a tape so that the long light transmission region was not displaced, thereby obtaining a long sheet. Then, while moving the long sheet, the long light transmission region is heated and pressed using a nip roll whose temperature is adjusted to 100 ° C., and the long light transmission region and the long polishing region are bonded to each other. Got.
  • the temporary fixing tape was peeled off, and a double-sided tape (manufactured by Sekisui Chemical Co., Ltd., # 5782W) was attached to the surface of the polishing sheet opposite to the grooved surface using a laminator. Then, the double-sided tape at a position corresponding to the long light transmission region was cut off with an NT cutter.
  • a laminating machine was used to attach a transparent support film (E5001, PET vinylom, thickness 75 m) to the double-sided tape to produce a long polishing pad.
  • a transparent support film (PET, manufactured by Toyobo Co., Ltd., E5001, thickness: 75 m) is laid on the bottom plate made of aluminum coated with Teflon (registered trademark) on the surface, and the surface of Teflon is coated on the transparent support film.
  • a long mold frame made of (registered trademark) coated aluminum (internal length: 520 cm, internal width: 80 cm, internal height: 30 mm) was placed. Thereafter, the bottom plate and the long formwork were clamped. The transparent support film was placed about 2m longer than the long formwork. Then long type At the center in the width direction of the frame, a mold for forming a light transmission region having a mold shape as shown in FIG. 7 (manufactured by SUS, injection hole length: 520 cm, injection hole width: 12 mm, injection wall height: 30 mm, injection wall thickness: lmm).
  • the cell-dispersed urethane composition was discharged onto the transparent support film outside the injection hole, and the light transmission region forming material was discharged onto the transparent support film inside the injection hole.
  • the long mold was placed in an oven adjusted to a temperature of 80 to 85 ° C. for 10 hours to cure the cell-dispersed urethane composition and the light transmission region forming material, thereby forming a polishing region and a light transmission region.
  • the mold for forming a light transmission region and the long mold were released to prepare a long polishing layer (thickness: about 2 mm) having a gap (lmm) between the light transmission region and the polishing region.
  • a long polishing pad was prepared by performing groove processing on the surface of the polishing region of the long polishing layer using a groove processing machine (manufactured by Toho Koki Co.).
  • Teflon (registered trademark) long spacer (length 520 cm, width 10 mm, thickness 0.5 mm) at the center of the width direction of the long mold (internal width 80 cm, internal length 520 cm, internal height 30 mm) ) And fixed with double-sided tape. Then, the long light transmission region was disposed on the spacer 1 and fixed with double-sided tape.
  • the cell-dispersed urethane composition was discharged onto a long mold in which the long spacer and the long light transmission region were not provided, and left for about 10 minutes. Thereafter, the long mold was placed in an oven adjusted to 80 to 85 ° C. for 12 hours to cure the cell-dispersed urethane composition to form a long polishing region. Thereafter, the long mold was released, and the long spacer made of Teflon (registered trademark) and the double-sided tape were peeled from the long polishing region. Next, the surface of the long polishing region was puffed using a puffing machine (Amitec) to adjust the thickness to 1.1 mm.
  • a puffing machine Amitec
  • the long light transmitting region was arranged at the center in the width direction of a long mold (internal width 80 cm, internal length 520 cm, internal height 30 mm) and fixed with double-sided tape.
  • the long light transmission region was arranged,! /, NA! /,
  • the bubble-dispersed urethane composition was discharged onto the long mold, and allowed to stand for about 10 minutes. Thereafter, the long mold was placed in an oven whose temperature was adjusted to 80 to 85 ° C. for 12 hours to cure the cell-dispersed urethane composition to form a long polishing region. Thereafter, the long mold was released, and the double-sided tape was peeled from the long polishing region. Next, the surface of the long polishing area was buffed using a knoff machine (Amitech) to adjust the thickness to 1.1 mm.
  • X-groove processing was performed on the surface of the long polishing region using a groove processing machine (manufactured by Toho Koki Co., Ltd.). Thereafter, a double-sided tape (manufactured by Sekisui Chemical Co., Ltd., # 5782W) was attached to the surface of the long polishing region opposite to the grooved surface using a laminator. Then, the double-sided tape at the position corresponding to the indentation was cut off with an NT cutter. Then, a laminating machine was used to bond a transparent support film (E5 001 PET vinylom, thickness 75 Hm) to the double-sided tape to produce a long polishing pad.
  • a groove processing machine manufactured by Toho Koki Co., Ltd.
  • a double-sided tape manufactured by Sekisui Chemical Co., Ltd., # 5782W
  • the double-sided tape at the position corresponding to the indentation was cut off with an NT cutter.
  • Isocyanate-terminated prepolymer manufactured by Uniroyal, Adiprene L-325) 100 parts by weight, silicone surfactant (manufactured by Toray Dow Cowing Silicone, SF2938F) 3 parts by weight, and a mixture adjusted to a temperature of 80 ° C 2,4'-methylenebis (o-chloroaniline) (Ihara Chemical Co., Ltd., Iharacuamine MT) melted at 120 ° C and mixed with 26.2 parts by weight in a mixing chamber before discharging, and air is simultaneously mixed into the mixture.
  • a cell-dispersed urethane composition was prepared by dispersing the mixture by mechanical stirring.
  • Face material made of polyethylene terephthalate (PET)
  • PET polyethylene terephthalate
  • the laminated member was continuously bonded to the center of the face material, and the long spacer and the long light transmission region were continuously arranged in a laminated state.
  • the cell-dispersed urethane composition was continuously discharged from the mixing head onto the face material on which the laminated member was not provided.
  • the cell-dispersed urethane composition was covered with another face material made of PET (thickness 50 m, width 100 cm), and the thickness was uniformly adjusted using a nip roll. Thereafter, the composition was cured by heating to 80 to 85 ° C. to produce a long polishing region made of polyurethane foam.
  • a double-sided tape manufactured by Sekisui Chemical Co., Ltd., # 5782W
  • a laminator was attached to the surface of the long polishing area opposite to the grooved surface using a laminator.
  • the double-sided tape at a position corresponding to the long light transmission region was cut off with an NT cutter.
  • a transparent support film Toyobo Co., Ltd., E5001, PET film, thickness 75 ⁇ m

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

L'invention concerne un procédé pour produire un long tampon à polir, qui est capable d'empêcher une fuite de bouillie et qui est excellent en termes de précision de détection optique, avec une productivité élevée. L'invention concerne en particulier un procédé pour produire un long tampon à polir, lequel procédé comprend une étape consistant à former une longue unité de polissage (9) faite à partir d'une mousse de polyuréthane, une étape consistant à former une ouverture, qui est composée d'un trou traversant (12) et d'une partie de plateau (13), dans la longue unité de polissage (9), une étape consistant à former une longue unité (10) de transmission de lumière, de forme convexe, plus mince que la longue unité de polissage (9), une étape consistant à disposer la longue unité (10) de transmission la lumière dans l'ouverture de la longue unité de polissage, et une étape consistant à lier un film de support transparent (11) sur la surface arrière de la longue unité de polissage.
PCT/JP2007/069685 2006-10-18 2007-10-09 Procédé pour produire un tampon à polir long WO2008047631A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2006284048A JP5146927B2 (ja) 2006-10-18 2006-10-18 長尺研磨パッドの製造方法
JP2006-284048 2006-10-18
JP2006286462A JP2008100331A (ja) 2006-10-20 2006-10-20 長尺研磨パッドの製造方法
JP2006-286457 2006-10-20
JP2006286457A JP4869017B2 (ja) 2006-10-20 2006-10-20 長尺研磨パッドの製造方法
JP2006-286462 2006-10-20

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WO2008047631A1 true WO2008047631A1 (fr) 2008-04-24

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WO (1) WO2008047631A1 (fr)

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US8409308B2 (en) * 2007-05-31 2013-04-02 Toyo Tire & Rubber Co., Ltd. Process for manufacturing polishing pad
US8500932B2 (en) 2006-04-19 2013-08-06 Toyo Tire & Rubber Co., Ltd. Method for manufacturing polishing pad
CN105144349A (zh) * 2013-03-15 2015-12-09 应用材料公司 具有二次窗密封的抛光垫
CN112157857A (zh) * 2020-08-06 2021-01-01 河南平高电气股份有限公司 一种三支柱绝缘子模具的合模装置及合模方法

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US8585790B2 (en) * 2009-04-23 2013-11-19 Applied Materials, Inc. Treatment of polishing pad window

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JP2004327974A (ja) * 2003-04-09 2004-11-18 Jsr Corp 研磨パッド、その製造法と製造用金型および半導体ウエハの研磨方法
JP2004343090A (ja) * 2003-04-22 2004-12-02 Jsr Corp 研磨パッドおよび半導体ウェハの研磨方法
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JP2003133270A (ja) * 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
JP2004327974A (ja) * 2003-04-09 2004-11-18 Jsr Corp 研磨パッド、その製造法と製造用金型および半導体ウエハの研磨方法
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US8500932B2 (en) 2006-04-19 2013-08-06 Toyo Tire & Rubber Co., Ltd. Method for manufacturing polishing pad
US9050707B2 (en) 2006-04-19 2015-06-09 Toyo Tire & Rubber Co., Ltd. Method for manufacturing polishing pad
US8409308B2 (en) * 2007-05-31 2013-04-02 Toyo Tire & Rubber Co., Ltd. Process for manufacturing polishing pad
CN105144349A (zh) * 2013-03-15 2015-12-09 应用材料公司 具有二次窗密封的抛光垫
US9731397B2 (en) 2013-03-15 2017-08-15 Applied Materials, Inc. Polishing pad with secondary window seal
US10744618B2 (en) 2013-03-15 2020-08-18 Applied Materials, Inc. Polishing pad with secondary window seal
US11618124B2 (en) 2013-03-15 2023-04-04 Applied Materials, Inc. Polishing pad with secondary window seal
CN112157857A (zh) * 2020-08-06 2021-01-01 河南平高电气股份有限公司 一种三支柱绝缘子模具的合模装置及合模方法

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