TW200831236A - Method for producing long polishing pad - Google Patents

Abstract

Disclosed is a method for producing a long polishing pad, which is capable of preventing slurry leakage and excellent in optical detection accuracy, with high productivity. Specifically disclosed is a method for producing a long polishing pad, which comprises a step for forming a long polishing unit (9) made of a polyurethane foam, a step for forming an opening, which is composed of a through hole (12) and a shelf portion (13), in the long polishing unit (9), a step for forming a convex-shaped long light-transmitting unit (10) which is thinner than the long polishing unit (9), a step for arranging the long light-transmitting unit (10) in the opening of the long polishing unit, and a step for bonding a transparent supporting film (11) on the rear surface of the long polishing unit.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a long polishing pad which can be stabilized and which is made of an optical material such as a lens or a mirror with high polishing efficiency. Or flattening processing of materials requiring high surface flatness such as Shihwa wafer, glass substrate for hard disk, aluminum substrate, and general metal polishing. The long polishing pad obtained by the manufacturing method of the present invention is particularly suitably used for forming an oxide layer, a metal layer or the like on a germanium wafer and a germanium wafer, and further layering the oxide to form the oxide. The process of planarization before the layer or metal layer. BACKGROUND OF THE INVENTION In the manufacture of a semiconductor device, a process of forming a conductive film on a surface of a wafer and forming a wiring layer by lithography, etching, or the like, or a process of forming an interlayer insulating film on the wiring 15 layer is performed by the method. In the program, irregularities made of a conductor or an insulator such as metal are generated on the surface of the wafer. In recent years, in order to increase the density of semiconductor integrated circuits, it is important to make wiring finer or multilayer wiring, and to flatten the unevenness on the surface of the wafer. 20 The method of flattening the unevenness on the surface of the wafer is generally a chemical mechanical polishing (hereinafter referred to as CMP), and the CMP is used in a state in which the polished surface of the wafer is pressed against the polishing surface of the polishing pad. Abrasive slurry abrasive (hereinafter referred to as slurry) is a technique for grinding. For example, as shown in FIG. 1 , the polishing apparatus generally used in CMP includes: a polishing plate 5 200831236 2 for supporting a polishing pad i; and a support table (buffing head) 5 for Supporting the material to be polished (semiconductor wafer); the spacer material is used to uniformly press the wafer; and the supply mechanism of the abrasive. Further, by way of example, the polishing pad 1 is attached to the polishing platen 2 by being adhered by a double-sided tape, and further, the polishing pad 2 and the support table 5 are arranged to be respectively supported by the polishing pad 1 and the quilt. The abrasive materials 4 are in a state of being opposed to each other and have rotation shafts 6 and 7, respectively, and a pressurizing mechanism for pressing the workpiece 4 against the polishing pad is not provided on the support table 5 side. Conventionally, such a polishing pad is manufactured by a batch method such as the following method: 1) a resin material is poured into a mold to form a resin block, and the resin block is sliced by a slicing machine; 2) The resin material is poured into a mold and pressed to form a sheet, and 3) is produced by dissolving a resin constituting the raw material, molding it from a T-die, and directly forming a sheet. For example, Patent Document 1 manufactures a polishing pad by a reaction injection molding method. Further, when the polishing pad is laminated, it is produced by bonding a plurality of resin sheets such as a polishing layer or a buffer layer obtained by the above method with an adhesive or a double-sided tape 15, so that there are many manufacturing processes and poor productivity. . In order to solve this problem, in Patent Document 2, an extruder is used to manufacture the integrated polishing 0, and in order to prevent errors due to the hardness of the batch method or the bubble size caused by the batch method, a continuous method is disclosed. A method for producing a polyamino phthalate-polyurea abrasive sheet (Patent Document 3), in detail, a mixed polyurethane material and a fine powder or organic having a particle diameter of 300 μm or less a foaming agent, and the mixture is spouted between a pair of crawler belts, and then cast, and then the mixture is reacted by a heating mechanism, and the sheet-like formed product is separated from the work surface belt. A method of obtaining a polished sheet is obtained. On the other hand, the polishing pad used in high-precision polishing generally uses a polyurethane foam sheet, however, although the polyurethane foam 5 body sheet has excellent localization ability, Since the cushioning property is insufficient, it is difficult to impart a uniform pressure to the wafer. Therefore, a soft buffer layer is usually provided on the back surface of the polyurethane foam sheet, and a laminated polishing pad is used for the polishing. In processing, for example, a laminated polishing pad has been developed as described below. 10 There is disclosed a polishing pad which is a hard first layer and a softer second layer, and is provided with a predetermined pitch groove or a predetermined shape protrusion on the ground surface of the first layer (Patent Document 4). Another type of polishing cloth comprising: a first sheet-like member having elasticity and having irregularities formed on a surface thereof; and a second sheet-like member provided on a side surface of the 15-sided member having a concave-convex surface In addition, it has a surface facing the surface to be polished of the substrate to be processed (Patent Document 5). Further, there is a polishing pad comprising: a polishing layer; and a support layer which is laminated on one surface of the polishing layer and which is a foam having a compression ratio larger than that of the polishing layer (Patent Document 6). 20 However, since the conventional laminated polishing pad is manufactured by bonding a polishing layer and a buffer layer by a double-sided tape (adhesive layer), the slurry in the polishing penetrates between the polishing layer and the buffer layer to weaken the adhesion of the double-sided tape. As a result, there is a problem that the polishing layer and the buffer layer are peeled off. Moreover, there is a problem of determining the flatness of the wafer surface when performing CMP, 7 200831236, that is, the time to reach the desired surface characteristic or planar state must be detected. Conventionally, the film thickness of the oxide film, the polishing rate, and the like are periodically processed to test the wafer, and after the result of the verification, the wafer constituting the product is polished. However, this method wastes time and processing of the test wafer, and in the test wafer and the product wafer which are not pre-processed at all, the grinding result will be different due to the CMP-specific load effect. If the product wafer is not actually processed, it will be difficult to accurately predict the processing result. Therefore, in order to solve the aforementioned problems, a method for measuring the time point 10 at which a desired surface characteristic or thickness can be obtained at the time of CMP processing is required. Various methods can be used for such detection. However, from the viewpoint of measurement accuracy or spatial resolution in non-contact measurement, an optical pickup for a film thickness monitoring mechanism using laser light is incorporated in a rotating fixed plate. The measurement method (Patent Document 7 and Patent Document 8) is the mainstream. Specifically, the aforementioned optical method is such that the light beam is irradiated onto the wafer through the window through the window (transmission collar 15 field), and the polishing end point is detected by monitoring the interference signal generated by the reflection. The method. At present, it is generally used as a light beam using He-Ne laser light having a wavelength of light of approximately 6〇〇11111 or white light of a halogen lamp having a wavelength of light of 38〇~8〇〇11111. 20 This method determines the end point by monitoring the thickness variation of the surface layer of the wafer to determine the approximate depth of the surface relief, and terminates the CMP treatment when the change in thickness is equal to the depth of the relief, and also discloses various A polishing endpoint detection method using such an optical method and a polishing pad used in the method. 8 200831236 For example, the eye-sister-shovel reveals that there is no polishing pad that is at least 15 knives, a transparent χ κ compound # which is 111-body and homogeneous and can transmit light of wavelengths from 19Gnm to 35GGnm. Patent Document 9) has another type of insert-like transparent plug 2 (patent document 1), and has a polishing crucible having 5 transparent plugs having the same surface as the polishing surface (Patent Document U). Item 4 is also useful in order to prevent the slurry from leaking out from the boundary between the polishing field and the light transmission field (Patent Document 12, (9), however,

When k is turned over, the slurry will leak from the boundary between the grinding field and the light-transmitting field (seam) toward the lower part of the polishing layer, and the slurry will accumulate on the leakage preventing sheet 10 to cause problems in optical end point detection. . In one method, the first resin rod or the plug is placed in the second resin of the liquid 15 20 shape, and the second compact is cured to form a molded product, and the molded product is sliced to produce a light-transmitting field and polishing. Field-body-grinding grinding 塾 (Patent Reading 14), "In the above-mentioned manufacturing method towel, the stress of the difference in heat shrinkage between the two materials during the forming will remain at the interface of the two materials" and the interface It is easy _, so it will (4) leaking. There is still a method, which is to pass the industry--cooling to the predetermined temperature «in front of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The material of the material is simultaneously subjected to secondary annealing, and the molded article is sliced to produce a polishing pad (Patent Document (5). However, in the above manufacturing method, excessive stress is applied to the window hole when the polishing pad material hardens and shrinks, and There will be residual stress deformation in the window hole or the result that the flatness of the window hole will be impaired and the optical precision will be reduced. 9 200831236 Moreover, in order to prevent leakage of the slurry, a configuration between the upper layer and the lower layer is disclosed. above A method of applying a transparent film of an adhesive to a surface (Patent Document 16), however, if there is an adhesive layer between the light-transmitting field and the transparent film, since the light transmittance is lowered, the optical detection accuracy is also lowered. Patent Document 1: Japanese Laid-Open Patent Publication No. 2004-42189 (Patent Document 2) Japanese Patent Laid-Open Publication No. Hei No. Hei. No. Hei. No. Hei. Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. U.S. Patent No. 5,609,902, Patent Document 8: U.S. Patent No. 5,814,421, Patent Document 9: Japanese Patent Application Laid-Open Publication No. JP-A No. Hei 9-9985 Patent Document 11: Japanese Patent Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Gazette [Patent 15] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. It is an object of the present invention to provide a method for producing a long polishing pad which can prevent the leakage of 10 200831236 slurry and which is excellent in optical measurement accuracy. The means for solving the problem is the result of the intensive review by the present inventors in order to solve the above problems. The present invention can be achieved by the above-described method of manufacturing a long polishing pad as shown below. That is, the method for producing the long polishing pad of the first aspect of the present invention includes the following procedure: producing a long polishing = domain composed of a polyurethane foam, which is formed in the long-grinding field described above. a door and a portion formed by the through hole and the frame portion are formed in a convex long light transmission field which is thinner than the long polishing field; the 10 long light transmission region is disposed in the opening portion of the long polishing field; and the transparent film is supported; Adhesive to the inner side of the grinding in the long-grinding field. The method for producing a long polishing pad of the present invention according to the first to the sixth aspect includes the following steps: producing a long-grinding field composed of a polyurethane foam; = one side of the long-grinding field and continuous in the longitudinal direction Forming a frame portion; forming a convex long light-transmissive field thinner than the long-grinding field of 15; arranging two of the long-grinding fields in parallel so that the frame portion faces the frame portion, and forming an opening portion for inserting the long-length light transmission a field in which the long light transmission region is provided in the opening portion; and a transparent support film is bonded to the polishing inner side of the long polishing field. According to the above manufacturing method, the long polishing pad having the long light-transmitting collar can be easily manufactured, and since the light-transmitting field and the polishing field are formed on the transparent supporting film, the slurry is not transparent when ground. The support film leaks downward. Moreover, since the long polishing pad of the present invention has a space portion between the long light-transmitting field and the transparent support film, it can have excellent optical detection accuracy as compared with the use of an adhesive to bond the light-transmitting field and the support film. Further, the long polishing pad of the present invention 11 200831236 may also have a buffer layer laminated on one side of the transparent support film. The thickness of the thickest portion of the long light transmission field is preferably 5 〇 to 9 〇% of the thickness of the long abrasive field. If the right side is less than 5〇%, the long light transmission field will disappear or become too thin due to wear due to long-term use, and it is impossible to construct a 50% optical _ or „liquid leakage and optical side precision. The lowering of the tilt < mm if the large (four)%, is expected to be in contact with the adhesive layer of the transparent support film during the manufacture of the New Light field, and is less desirable in manufacturing. _ 2nd invention The pure manufacturing method comprises the following steps: the foam-dispersed urethane composition is prepared by mechanical foaming method; the transparent support film is disposed in the long mold, and the transparent field having the injection hole and the injection wall is provided. Forming a mold frame at a predetermined position on the support film; discharging a light-transmitting region forming material in the injection hole, and curing the light-transmitting region forming material to form a light-transmitting region; and the aforementioned outside the injection hole Dissolving the bubble-dispersed urethane composition on the transparent support 15 film, and curing the bubble-based urethane composition to form a polishing field; and forming a pattern and a long mold for forming the light-transmitting field Demoulding For the long-grinding layer with a gap between the light-transmitting field and the grinding collar--the field. • The wire (4) describes the manufacturing method, and the long-grinding layer having the light-transmitting field 20 can be manufactured, and the long-grinding boring can be manufactured with good productivity. Moreover, since the light-transmitting field and the grinding field are formed on the transparent support film, the slurry does not leak downward from the transparent support film during polishing. Moreover, since the light-transmitting field of the present invention is directly formed (self-adhesive) in the transparent Supporting the film, therefore, compared with the use of an adhesive to bond the light-transmitting field and the support film, it can have excellent optical detection 12 200831236. Further, since the manufacturing method of the present invention is formed in the field of light transmission and grinding There is a gap between the fields, so that the stress caused by the difference in heat shrinkage does not remain between the two materials, thereby solving the problem of the residual stress of the two components as in the conventional grinding process (4). At 5 o'clock, the obtained long polishing layer can be separately grown and polished, or a laminated buffer layer can be formed on one side of the transparent support film to form a laminated long-length polishing ^1 The light field is preferably composed of a thermosetting resin, in particular, a heat-reducing polyamine phthalic acid _lipid. In this case, since the light-transmitting material can be formed into a material and the bubble-dispersed amino carboxylic acid vinegar can be composed. The material is simultaneously thermally hardened, so the manufacturing process is simple. The thickness of the injection wall of the mold frame for forming the light-transmissive field is preferably less than 1 mm. When the thickness of the wall is greater than 1 mm, the gap between the light-transmitting field and the grinding field may become The slurry is easy to accumulate in the width and the gap, so there is a tendency to easily generate 15 marks. The manufacturing method of the long polishing pad of the present invention according to the third to third embodiments includes the following procedure: [Preparation of bubble-dispersed amine by mechanical foaming method] a urethane composition; the separator and the light-transmitting region are disposed in the long mold in a laminated state; and the bubble-dispersed urethane- 2 brewing composition is discharged in a field in which the separator and the light-transmitting region are not disposed 'The cell-dispersed urethane composition is cured to form a long-grinding field composed of a polyurethane foam; the separator is peeled off from the long-grinding field; and the long-grinding field has been stripped Side surface of the spacer member of the transparent support film is laminated, and produced a long film having a space between the portion of the polishing layer and the transparent support of the light-transmitting art. 13 200831236 By the above manufacturing method, a long polishing pad having a light-transmitting field can be easily manufactured, and since the long-polishing field is followed by the light-transmitting field, the slurry does not penetrate into the interface between the two fields. Further, since the long-grinding honing method of the present invention has a space portion between the light-transmitting field and the transparent supporting film, the phase 5 can have excellent optical detection accuracy as compared with the use of an adhesive for bonding the light-transmitting field and the supporting film. w The partition and the light-transmissive area should be long. By using the long-shaped partition and the light-transmissive field, not only the long polishing pad can be manufactured more easily, but also the light-transmitting field can be formed in the long-length direction of the long-grinding crucible. Therefore, it is also ideal from the point of view of optical detection. In order to prevent deformation of the light-transmitting field caused by pressurization during grinding, the visibility of the above-mentioned knife & parts should be below the width of the light-transmitting field. It should be noted that the thickness of the light-transmissive field should be 50~90/〇 if less than 50% of the thickness of the long-grinding field, and the surface of the 15-light field will disappear or become too thin due to wear for a long time. However, it is not possible to constitute an optical price measurement or a tendency to reduce the optical detection accuracy due to leakage of the slurry. On the other hand, if it is more than 90%, there is a possibility that the inside of the light-transmitting field at the time of manufacture is in contact with the adhesive layer for bonding the moon-supporting film, and it is not preferable in terms of manufacturing. The method for manufacturing the long polishing pad of the present invention according to the third to fourth invention includes the following steps: modulating the bubble-dispersed urethane composition by a mechanical foaming method; arranging the concave light-transmitting region in the long mold, and The concave portion is formed on the lower side; the bubble-dispersed urethane-based material is discharged in a region where the light-transmitting region is not disposed, and the bubble-dispersed aminocarboxylic acid 30 group is hardened to form a κ-aminoformic acid (IV). The long-grinding field; and the surface-side transparent support film having a concave portion in the field of the light transmission 14 200831236, and a long polishing layer having a space portion between the light-transmitting region and the transparent support film. According to the above manufacturing method, a long polishing pad having a light-transmitting field can be easily manufactured. Further, since the long-polishing field is followed by the light-transmitting field, 5 the slurry does not penetrate into the interface between the two fields, especially due to the 2 The manufacturing method of the present invention uses the concave light-transmitting field of the same thickness as the polishing field, thereby suppressing the deformation of the light-transmitting field during polishing, and not only improving the optical detection accuracy but also by the area of the long-grinding field. The increase further prevents the penetration of the slurry. Further, since the long polishing pad of the present invention has a space portion between the light-transmitting 10 field and the transparent support film, it can have excellent optical detection accuracy as compared with the use of an adhesive for bonding the light-transmitting field and the support film. According to the same reason as described in the above, the light-transmitting field is preferably elongated. The depth of the recessed portion is preferably 1〇~5〇% of the thickness of the light-transmitting field. If it is less than 10%, there is a contact between the bottom surface of the concave portion and the adhesive layer for bonding the transparent support 15 film during manufacture. On the other hand, if it is more than 50%, the long-term use of the long polishing pad will cause the light-transmissive field to be lost due to wear and tear (4), and it is impossible to construct the wire _ or The leakage of the slurry has a tendency to reduce the optical detection accuracy. The method for manufacturing the long polishing pad of the present invention according to the third to third embodiments includes the following procedure: modulating the bubble-dispersed urethane composition by a mechanical foam method丨 丨 丨 并 并 并 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨a composition; laminating other face materials on the gas/package-dispersed urethane composition discharged; uniformly adjusting the thickness of 15 200831236 degrees, and hardening the bubble-dispersed amino acid composition to prepare linoleic acid vinegar Long grinding field composed of foam; The long-grinding collar _ separating surface material and the separator; and the surface-side transparent support film in which the separator is peeled off in the long-grinding field, and a long-grinding layer having a space portion between the light-transmitting region and the transparent support film. For the same reason as described above, the partition member and the light-transmitting region are preferably elongated, and the width of the partition member is preferably less than the width of the light-transmitting region for the same reason as described above, and for the same reason as described above. The thickness of the light-transmissive field is preferably % of the thickness of the long-grinding field. The manufacturing method of the long-type polishing pad of the present invention includes the following procedure: modulating the bubble-dispersed amino carboxylic acid vinegar by the mechanical bubble method a composition; the surface material is disposed, and the concave light-transmissive region is disposed inside the surface material, and the concave portion is formed on the lower side, and the bubble-dispersed amine group is discharged continuously on the surface material not disposed in the light-transmitting region a formate composition; prior to the discharge = 15 bubble-dispersed urethane composition, another layer of material is laminated; uniformly, the thickness of the crucible, and the bubble-dispersed urethane composition is hardened a long-grinding field composed of a urethane foam; a surface material peeled off from the long-grinding field; and a transparent support film having a concave side on the surface of the light-transmitting field, and is formed in the light-transmitting field and The transparent support film has a length of 20 polishing layers in the space portion. The method for producing the long polishing pad of the present invention according to the third to sixth includes the following steps: modulating the bubble-dispersed amino phthalate composition by a mechanical foam method, Sending a transparent support film and disposing the concave light-transmissive field in the 0 portion of the transparent support film, and forming the concave portion on the lower side; and continuously discharging the bubble dispersion on the transparent support film before the light-transmissive field is not disposed 16 200831236 An amine carboxylic acid composition; a layered material on the bubble-dispersed urethane composition discharged; uniformly adjusting the thickness, and hardening the bubble-dispersed urethane composition to form a polyamine citric acid A long polishing field composed of an ester foam, and a long polishing layer having a space portion between the light transmitting region and the transparent supporting film; and a surface material peeled off from the long polishing region. For the same reason as described above, the light-transmitting field is preferably elongated, and the depth of the concave portion is preferably 10 to 50% of the thickness of the light-transmitting field for the same reason as described above. According to the above manufacturing method, the long polishing layer can be continuously produced, and the long polishing pad can be produced with good productivity, and the long polishing pad obtained has the same excellent functions as described above. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic structural view showing an example 15 of a polishing apparatus used for CMP polishing. Fig. 2 is a schematic view showing an example of a cross section of the long polishing pad of the present invention. Fig. 3 is a view showing an example of a resin sheet in which a plurality of grooves are formed at predetermined intervals. 2〇 Fig. 4 is a view showing an example of a cross section when the resin sheet is cut in the width direction. Fig. 5 is a schematic view showing an example of a cross section of the long polishing pad of the second invention. Fig. 6 is a view showing an example of a manufacturing procedure of the long polishing pad of the second invention. Fig. 7 is a view showing an example of a structure of a mold frame for forming a light-transmitting region. Fig. 8 is a schematic view showing an example of a section of the long polishing pad of the third invention. Fig. 9 is a schematic view showing an example of a section of the long polishing pad of the third invention. Fig. 10 is a view showing an example of a resin sheet in which a plurality of concave portions are formed at predetermined intervals. 10 Fig. 11 is a view showing an example of a cross section when the resin sheet is cut in the width direction. Fig. 12 is a view showing the manufacturing procedure of the long polishing pad of the third invention. Fig. 13 is a view showing the manufacturing procedure of the long polishing pad of the third invention. • Fig. 14 is a schematic view showing a method of grinding a semiconductor wafer using a web type polishing apparatus. Fig. 15 is a view showing a method of grinding a semiconductor wafer using a linear type polishing apparatus. 20 Fig. 16 is a schematic view showing a method of polishing a semiconductor wafer using a reciprocating type polishing apparatus. 1: Embodiment 3 BEST MODE FOR CARRYING OUT THE INVENTION Fig. 2 is a cross-sectional view showing a long polishing pad of the first invention. The long-grinding field 9 18 200831236 is composed of a polyurethane foam having fine bubbles, which is easily obtained by changing various raw material compositions because of the excellent abrasion resistance of polyamine phthalic acid vinegar. The polymer having the desired physical properties is ideal as a material for forming the polishing field. #余_5 The above heteroformic acid s is intended to be composed of an isocyanide-component, a polyol component (polymer direct reading, low molecular weight domestic alcohol) And a chain extender. The isocyanuric acid component is not particularly limited, and a compound known in the field of polyurethane vinegar can be used. Examples of the isocyanate-growing component include 2,4-toluene-isocyanate, 2,6-toluene diisocyanate, and 2 , 2,-diphenylnonane diisocyanate, 2,4'-di-methane methane diisocyanate, 4,4, diphenylmethane diisocyanate, 1,5-naphthalene diisocyanate, p-phenylene Aromatic diisocyanate such as diisocyanate, benzoyl diisocyanate, p-phthaldimethyl diisocyanate, benzodimethyl diisocyanate; ethyl diisocyanate, 2,2,4~trimethylhexamethylene diisocyanate , 1,6-hexamethylene diisocyanate, etc. 15 aliphatic diisocyanate; 丨, 4-cyclohexene diisocyanate, 4,4, dicyclohexylmethane diisocyanate, isophorone diisocyanate, norbornene An alicyclic diisocyanate such as a diisocyanate may be used alone or in combination of two or more. In addition to the aforementioned diisocyanate compound, the isocyanate component may be a compound having a trifunctional or higher polyfunctional polyisocyanate compound. The polyfunctional isocyanate compound is commercially available as DESMODUR - N (manufactured by Bayer) or trade name DURANATE (manufactured by Asahi Kasei Industrial Co., Ltd.). Adult compound. Among the above isocyanate components, it is preferred to use an aromatic diisocyanate together with an alicyclic 19 200831236 diisocyanate, particularly a methane diisocyanate. Examples of the toluene diisocyanate and the dicyclohexyl high molecular weight polyol include, for example, a water ether represented by polytetramethylene fine glycol, a 7L alcohol, a polybutylene adipate (10) represented by (iv) a polyhydric alcohol; a polyhydric alcohol; a polymer such as a polyacetic acid vinegar and a reaction product of a cigarette of propylene carbonate, etc., for example, a poly-alcohol; a reaction of a reaction of a sub-glycolic acid with a succinyl alcohol; and then obtaining the obtained a poly-polycarbonate-reactive polyol in which a reaction mixture is reacted with an organic dicarboxylic acid; and a polycarbonate polyol obtained by a displacement reaction of a poly-based compound and an aryl-based carbon These 10 molecular weight polyols may be used singly or in combination of two or more.

The number average molecular weight of the molecular weight polyol is not particularly limited, and τη' is preferably 500 to 2,000 from the viewpoint of the elastic properties of the obtained polyurethane resin. If the number average molecular weight is less than 5 Å, the polyurethane resin using the polyol does not have sufficient elastic properties and 15 becomes a weak polymer, and therefore, it is produced by the polyurethane resin. The field of grinding will become too hard, and brigade will be the cause of scratches on the surface of the wafer, and it will not be ideal from the viewpoint of the service life of the polishing pad because it is easily worn. On the other hand, if the number average molecular weight is more than 2,000, the polyurethane resin using the polyol may become too soft, and therefore, the grinding field produced by the polyurethane resin may There is a tendency to have poor flattening characteristics. In addition to the aforementioned high molecular weight multi-fermented yeast, the polyol component is preferably used in combination with a low molecular weight polyol such as ethylene glycol, 1,2-propylene glycol, 1,3 to propylene glycol, 1,4-butanediol, 1,6. —Hexyl alcohol, neopentyl glycol, 1,4—cyclohexene 20 200831236 alkane dimethanol, 3-methyl-1,5-pentanediol, diethylene glycol, triethylene glycol, 1 , 4 bis (2-hydroxyethoxy) benzene and the like. Further, a low molecular weight polyamine such as ethylenediamine, indolediamine, dimethanediamine or diamethylenetriamine may also be used. The ratio of the high molecular weight polyol to the low molecular weight polyol in the polyol component can be determined depending on the characteristics required in the field of polishing made of the polyol. When the polyurethane foam is produced by the prepolymer method, the prepolymerization is cured by using a chain extender, and the chain extender is an organic compound having at least two active 10-hydrogen groups, and is active. Examples of the hydrogen group include a hydroxyl group, a primary or secondary amine group, a thiol group (SH), and the like. Specifically, for example, 4,4'-methylenebis(indole-chloroaniline) (MOCA), 2,6-dichloro-p-phenylenediamine, 4,4'-methylene double (2) , 3-dichloroaniline), 3,5-bis(methylthio)- 2,4-toluenediamine, 3,5-bis(methylthio)- 2,6-toluenediamine, 3,5- Diethylsulfonyl-15 2,4-diamine, 3,5-diethyltoluene-2,6-diamine, propylene glycol-1-2 ρ-amino benzoate, 1,2-bis (2 -Aminophenylthio)ethane, 4,4'-diamine®-based 3,3'-diethyl-5,5'-dimethyldiphenylmethane, N,N'-1-2 sec-butyl Base 4,4'-diaminodiphenyl decane, 3,3'-diethyl- 4,4'-diaminodiphenylmethane, m-xylylenediamine, N,N'-1-2 sec —butyl ρ — 20 phenylenediamine, m-phenylenediamine, and p-xylylenediamine, etc., as an example of a polyamine; or the aforementioned low molecular weight polyol or low molecular weight polyamine, etc., and the chain extenders One type may be used, or two or more types may be mixed. The ratio of the isocyanate component, the polyol component, and the chain extender can be variously changed depending on the molecular weight of each molecule or the desired physical properties in the polishing field. 21 201131236 The field of grinding having the desired polishing characteristics is obtained. The number of isocyanate groups of the isocyanate component is preferably 0.80 to 1.2 Å with respect to the total active hydrogen group (base group + amine group) of the polyol component and the chain extender. Ideally it is 〇99~1 · 15. When the number of foreign gas feel S曰 is outside the range, hardening failure occurs, 5 the required specific gravity and hardness are not obtained, and the polishing property is lowered. 0 Polyurethane foam can be produced. Any of a prepolymer method and a primary formation method, however, a prepolymer method in which an isocyanate terminal prepolymer is synthesized from an isocyanate component and a polyol component in advance and a chain extender is reacted therewith, and the obtained polyamino group is obtained. The phthalic acid ester is excellent in physical properties and is suitable. The method for producing the polyurethane foam may, for example, be a method of adding hollow beads, a mechanical foaming method (including a mechanical foam method), a chemical foaming method, or the like. In particular, it is preferred to use a mechanical foaming method which is a copolymer of a polyorgano oxime and a polyether and which does not contain a reactive nitrogen group. Examples of the above-mentioned Shiyue surfactant include suitable compounds such as sh-192 and L-5340 (manufactured by TORAYDOW CORMNG Co., Ltd.). Hereinafter, an example of a method for producing a long-grinding field composed of a foam of a polyamino phthalic acid 6 will be described. The method for producing the long-grinding field includes the following procedure. 1) The foaming procedure for making the bubble residue of the isocyanide terminal compound is added to the isocyanate end prepolymer (the first component), and the agent is added in the presence of a non-anti-ship. The lining is carried out, and the non-reactive gas is dispersed in the fine bubbles to form a bubble dispersion. The foregoing prepolymerization 22 200831236 When the material is a solid at normal temperature, it can be preheated to a suitable temperature and used after melting. 2) Mixing agent of a curing agent (chain extender) A chain extender (second component) is added to the above-mentioned bubble dispersion, and the mixture is stirred and stirred to prepare a foaming reaction liquid. 5 3) Scaling procedure The aforementioned foaming reaction solution is allowed to flow into the long mold. 4) Hardening procedure The foaming reaction liquid which has flowed into the long mold is heated and the reaction is hardened. The non-reactive gas for forming the fine bubbles is preferably non-flammable, and specific examples thereof include a rare gas such as nitrogen, oxygen, carbon dioxide, nitrogen or nitrogen, or a mixed gas of the gases, and the cost is It is most desirable to use air that removes moisture after drying. The mixing device in which the non-reactive gas is formed into a fine bubble and dispersed in the first component containing the quinone 15-based surfactant is not particularly limited, and a known stirring device can be used. Specifically, for example, High-speed agitator, dissolver, twin-shaft planetary mixer (turnover mixer), etc. There is no particular limitation on the shape of the agitating wing of the agitating device. However, it is preferable to obtain fine bubbles when the wing is given by the beater type. 2 〇 Another mixing and mixing procedure for forming a bubble dispersion in a foaming process. It is also an ideal embodiment to use a mixing device in which a chain extender is added and mixed. In particular, the agitation in the mixing process may not be the agitation of the formation of the bubble, and it is preferable to use a stirring device which does not entrap large bubbles, and such a stirring device is preferably a planetary mixer. Searching for foaming and mixing procedures 23 200831236 The same mixing device is not a problem for the throwing device, and it is also suitable for adjusting the mixing conditions such as the rotation speed of the sandalwood wing as needed. (1) In the method for producing a polyaminomethyl-foam, the foam is heated in a foaming reaction in a human mold, and the foam is heated until it flows. The effect of the feature is extremely suitable. Further, it is also possible to form a condition in which the foaming reaction liquid is poured into a long mold and directly placed in a heating oven to perform post-cure. Since heat is not immediately transferred to the reaction component under such conditions, the bubble diameter is not When the hardening reaction is carried out at a normal pressure of 10, it is preferable because the shape of the bubble is stable. Further, the foaming reaction liquid can be prepared by a mechanical foaming method, and the surface material can be sent out, and the foaming reaction liquid can be continuously discharged onto the surface material, and the thickness can be uniformly adjusted, and the foaming reaction liquid can be continuously cured. A long-grinding field composed of a polyurethane foam is produced. When the poly 15 urethane foam is produced by the mechanical foaming method, the viscosity of the foaming reaction liquid at the time of discharge is preferably 5 to 0 l 〇 Pa · s °, and the polyurethane foam is The average bubble diameter is preferably from 3 Å to 80 μm, and more preferably from 3 Å to 60 μm. If it is out of this range, there is a tendency that the polishing rate is lowered or the flatness of the material to be polished (wafer) is lowered. The specific gravity of the polyurethane foam is preferably -3. If the specific gravity is less than 0.5, the surface strength of the polishing field is lowered, and the flatness of the material to be polished tends to be lowered. If it is more than 1 > 3, the number of bubbles on the surface of the polishing field is reduced, and although The flatness is good, but there is a tendency for the grinding 24 200831236 to decrease in speed. The hardness of the polyamine bismuth citrate pericardium is preferably 45 to 7 G degrees by & Asker D hardness meter. If the hardness of the sub-scott d is small _ degrees, the flatness of the material to be polished will be lowered, and if it is greater than 7 degrees, the flatness of the material 5 is good, but the consistency of the material to be polished (uniformity) Reduce the tendency. 'Wei Chunyu and the ground surface that is in contact with the research should have the structure to protect # and update the concave and convex structure of the liquid. Although the polishing field composed of the foam has a plurality of openings on the polishing surface and has the ability to hold and renew the liquid to be used 10, however, since the polishing surface forms the uneven structure, the slurry can be further effectively maintained and renewed. Moreover, the destruction of the material to be polished due to the adsorption between the material to be polished can be prevented. The concave-convex structure is not particularly limited as long as it can maintain and update the shape of the slurry. For example, X-channel, XY lattice groove, concentric circle (four), through-hole, non-through hole, and more than 15 angles are mentioned. , cylindrical, spiral groove, eccentric circular groove, radial groove and combination. Further, the uneven structure is generally regular. However, in order to constitute an ideal slurry retainability and renewability, the groove pitch, the groove width, and the groove depth may be changed every certain range. There is no particular limitation on the thickness of the π long abrasive field, but it is usually 0.8 to 1 and preferably 1 2.5 mm. The method of producing the above-mentioned polishing field of thickness can be exemplified by a method of using the ore-type or planer to make the above-mentioned foam block to have a predetermined thickness; the tree weaver has a long hole of a predetermined thickness of the die hole and It is made of hard branches; and (4) fabric tilting or sheet forming technology 25 200831236 Moreover, the thickness error of the long grinding field should be below ΙΟΟμιη, and the thickness error is greater than 100_, which will constitute a large fluctuation in the long grinding field, and will produce The part in which the contact state of the material to be polished differs, and causes a bad squeak to the grinding characteristics. Moreover, in order to eliminate the thickness error in the field of long grinding, generally, the trimming device which has been electrodeposited and fused with diamond abrasive is used to trim the grinding surface at the initial stage of grinding. However, if it is larger than the above range, the dressing time will increase and decrease. Productivity. A method of suppressing the thickness error in the field of long grinding can be exemplified by a method of polishing the surface by a light eliminator. Further, it is preferable to carry out the polishing stepwise by using a polishing material having a different particle size or the like. The length or width of a long abrasive field can be suitably adjusted depending on the grinding device used, however, the length is usually 5 to 15 m and the width is usually 6 to 250 cm. In the manufacturing method of the first aspect of the invention, an opening portion formed by the through hole 12 and the frame portion 13 is formed in the long polishing field 9 . The position or the number of the openings to be formed is not particularly limited. However, it is preferable to form one in the center in the width direction of the long polishing field and to form continuously in the longitudinal direction. In the method of forming the opening portion 14, a through-hole 12 is formed by punching a polyamine-based tantalum vinegar foam at a predetermined position by a Thomson knife or the like, and the through-hole 12 is cut by a cutter or the like. a method of forming the frame portion 13 on both sides, 2) cutting the polyurethane foam of a predetermined position to the depth of the frame portion 13 by the width of the opening portion 14 to form a groove, and then penetrating the groove with the width of the through hole 12 A method of forming the through hole 12 and the frame portion 13 by using the inside of the polycarbamic acid lysate foam; 3) a method of using a long mold having the shape of the opening portion 14 or the like. 26 200831236 In addition, when using the groove processing machine to form the opening portion 14, it is also possible to use the long-grinding field 9 to be wound around the money and the - surface to be sent out - the surface is I-cut, and then the processed long-grinding field is 9 rolls. The method of winding onto the roller. The width of the through hole 12 is not particularly limited, but is usually 5 to 5 15 positions. Further, the width and height of the frame portion 13 are not particularly limited. However, the width is usually 2 to 5 mm and the height is 0.3 to 〇. 5mm. On the other hand, in the manufacturing method of the first to the fourth aspect of the invention, the frame portion is continuously formed from one side of the long grinding field and continuously in the longitudinal direction, and two long grinding fields having the frame portion are produced, and, for example, In other words, the manufacturing method 1 〇 如 ) ) ) ) ) ) ) ) ) ) ) 连续 连续 连续 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚 聚'And cut the polyurethane foam along the central portion of the groove to two; 2) continuously cut two individually fabricated polyurethane foams in the longitudinal direction a method of forming the frame portion 13 on one side; 3) 15 cutting a polyurethane foam into two in the longitudinal direction, and continuously cutting each polyurethane foam in the longitudinal direction The method of forming the frame portion 13 on one side and the like. In the manufacturing method of the first aspect of the invention, the width of each of the long polishing fields 9 is not particularly limited, but is usually 30 to 125 cm, and the width of the frame portion 13 is 20 degrees and the height is the same as described above. The material for forming the long light-transmitting field 10 is not particularly limited. However, it is preferably used for performing high-precision optical end point measurement in the state of being polished, and the light transmittance is 4% in the entire range of wavelengths of 300 to 800 nm. For the above materials, a material having a light transmittance of 50% or more is more preferable. For example, such a material of 2008, 2008, 236, for example, a polyamino carboxylic acid resin, a polyester resin, a benzoquinone resin, a urea tree. Known, melamine resin, epoxy resin, acrylic resin and other thermosetting 1± tree, polyurethane resin, polyester resin, polyamide resin, cellulose resin, acrylic resin, polycarbonate Thermoplastic resin such as resin, halogen resin (poly 5 vinyl chloride, polytetrafluoroethylene, polyvinylidene fluoride, etc.), polystyrene, and olefinic resin (such as ethylene, polypropylene, etc.); by ultraviolet light or electron A photocurable resin which is cured by light such as rays, a photosensitive resin, or the like, and these resins may be used singly or in combination of two or more kinds. Further, it is preferable that the thermosetting resin is cured by using a relatively low temperature, and when a photohardening resin is used, it is preferred to use a photopolymerization initiator in combination. Among these resins, a thermosetting resin is preferably used, and in particular, a thermosetting polyurethane resin is preferably used. For example, the convex long light transmitting field 10 can be formed by extrusion molding or casting molding. Further, as shown in Fig. 3, most of the groove processing is performed on the resin sheet 5 15 at predetermined intervals, and then the central portion of the groove 16 is cut in the longitudinal direction, whereby the convex long light can be efficiently produced. Field 1〇. Fig. 4 is a cross-sectional view of the resin sheet 15 cut in the width direction, and the visibility and height of the shoulder portion 17 of the long light-transmitting field should correspond to the width and depth of the frame portion 13 of the long-polishing field, and The width of 18 should also correspond to the width of the through hole 12 of the long grinding field 9 by 20 degrees'. The thickness (h) of the thickest part of the long light transmission area must be at least thinner than the thickness of the long grinding field 9, and preferably For the length of the long grinding field of 50 to 90% 'more ideally 60 to 85%. The transparent support film used in the first invention is not particularly limited. However, it is preferably a resin film having high transparency, heat resistance and flexibility. 200831236 resin film, for example, 兮 炉 furnace wax* ^ r.4 Secret material can be bribed as: polyester; poly-propene; polystyrene; poly-imine; polyvinyl alcohol; polyethylene B;; poly = gas-containing resin; nylon; cellulose; Waiting for the project: r" ♦ 嶋 imine, (four) _ and (four) 飒 plastic, etc. The thickness of the mad transparent support film is not particularly limited, however, if it is from the point of view of strength or winding, it is suitable for the fan , again, transparent support film

There is no particular limitation on the width. However, if the size of the required polishing layer is considered, it is preferably 60 to 25 () em, and the length of the transparent support film can be matched with the required polishing layer. The guide material (2m before and after) 疋 necessary 'thus usually 9~, and preferably 1〇~15m 〇 1st - A manufacturing method of the long polishing pad of the present invention includes: the aforementioned long light transmission field 10 is a program provided in the opening portion 14 of the long polishing field 9 and a procedure for bonding the transparent support film 11 to the polishing side of the long polishing field 9. In addition, it is not necessary to describe which of the procedures can be performed first, and can also be performed simultaneously. - 1st - B The method for manufacturing a long polishing pad according to the present invention includes the program A' in which two long polishing fields 9 are arranged in parallel, and the frame portion and the frame portion are opposed to each other, and the opening portion 14 is formed to be inserted. In the long light transmission field, the program B is configured such that the long light transmission region 10 is disposed in the opening portion 14; and the program C' is to adhere the transparent support film 11 to the polishing inner side of the long polishing field 9 By. Alternatively, the program C may be executed after the program A and the program B have been performed, or the program B may be performed after the program A and the program C have been performed. 29 200831236 In the aforementioned procedure A, the spacing of the two long abrasive fields 9 corresponds to the width of the head 18 of the long light transmitting field 10. When the long light-transmitting region 10 is placed in the opening portion 14, it is preferable to pass the adhesive layer 20 to the frame portion 13 and the shoulder portion 17, whereby the penetration of the slurry can be completely prevented. The adhesive for the raw material of the adhesive layer 20 is not particularly limited, and a known adhesive can be used. However, from the viewpoint of automation, high speed, and labor saving of the working procedure, it is preferable to use a hot melt adhesive, in particular, It is preferable to use an EVA-based or synthetic rubber-based hot-melt adhesive which is excellent in adhesion and has a low softening point. The method is not particularly limited. For example, it can be carried out by the following method: 10 15 20, that is, the long grinding field 9 is applied to the fourth (four), and the age of the adhesive is applied to the frame portion 13, After the long light transmission field is placed in the opening, the heating is performed in the field of heating (11) long light transmission, and the bottle degree can be appropriately adjusted according to the softening point of the hot melt adhesive. Interest can be applied to the shoulders of the long light field.彳σ The method of bonding the transparent support film 11 to the inner side of the long-grinding field 9 is Μ Lu Yin敁盥, 歹 歹 牛 如 · 精 精 由 由 精 精 精 精 精 精 精 精 精 精 精 精 精 精 精 精And grinding the inner side of the coating (four) ^ method; in the field of long grinding in the transparent ^ transparent field film method, etc., however, the film corresponds to the through hole 12 of the eight VIII 夫 晋 晋 晋 雔 amp amp amp 胶带Agent. The knife must be/the page is not provided with another aspect. In the second invention, the grinding of the reed 1 field #ibJL has a fine bubble polyamine group =: grinding_: the raw material with the acid vinegar is the same as the above . The H-polyaminomethyl-poly-glycolic acid brewing foaming system of the body is produced by dispersing the bubble-dispersed carbamic acid 30 200831236 and hardening the object, and the aforementioned traveler and Japanese person, Tian Jinyi, The tartaric acid ester composition is obtained by the second component of the nitrogen-based compound of the β-isocyanate s|based compound. The s: terminal prepolymer system constitutes an isocyanate-containing chain extension. = 5 =! Hydrogen condensate, in the secondary formation method, the hetero- ary system constitutes an isocyanate-containing compound to form an active hydrogen-containing compound. Stretching agent and polyol component structure (spooning machine ^ / loose wire K composition by mechanical foaming method (= mechanical recording method) to women, (four) is to make (four) grain based Wei burning plate = copolymer and A mechanical foaming method of the (IV) surfactant which does not contain an active hydrogen group is preferred. The above-mentioned Shishi surfactant may, for example, be an appropriate compound such as SH-192, i_ 5340 (manufactured by Toray Dow Corning), and In the polyamine-based foam, (4) the surfactant is preferably added in an amount of 〇〇5 to 5 by weight. When the surfactant is less than (4) 5% by weight, there is a tendency that the fine bubble foam cannot be obtained. On the other hand, When it is more than 5% by weight, there is a tendency that it is difficult to obtain a high-hardness polyurethane foam due to the plasticizing effect of the lanthanoid surfactant. Further, a stabilizer such as an antioxidant or a lubricant may be added as needed. Agent, pigment, filler, destaticizing agent, and other additives. 20 Hereinafter, a method of preparing a bubble-dispersed urethane composition will be described. The preparation method of the bubble-dispersed urethane composition is described below. ^Making isocyanate end prepolymer gas The foaming procedure of the dispersion is carried out by adding a lanthanide interface activity 31 200831236 agent to the isocyanate end prepolymer (the first component), and stirring in the presence of a non-reactive gas, while making the non-reactive gas The fine bubbles are dispersed to form a bubble dispersion. When the prepolymer is solid at normal temperature, it can be preheated to an appropriate temperature and melted, and then used. 2) A curing agent (chain extender) mixing procedure 5 is added to the bubble dispersion described above. The chain extender (second component) was mixed and stirred to prepare a bubble-dispersed urethane composition. The non-reactive gas and the stirring device for forming the above-mentioned fine bubbles are the same as described above. In the bubble-dispersed urethane composition, a tertiary amine-based catalyst or the like may be added, and a catalyst which promotes the reaction of the polyurethane may be added. The type and amount of the catalyst may be considered to flow into a predetermined shape after the mixing procedure. The flow time in the mold is chosen. The transparent support film used in the second invention is not particularly limited, and the same as the above may be mentioned.

The material for forming a light-transmitting region used in the second invention is not particularly limited, and the same as the above may be mentioned. Hereinafter, a method of manufacturing the long polishing pad of the second aspect of the present invention will be described. Fig. 5 is a plan view showing the long grinding boring of the second invention, and Fig. 6 is a view showing a manufacturing procedure of the second long polishing pad of the second invention. . The rear 2m is larger than the long mold frame, and the long 杈24 series is composed of the chassis and the long mold frame. First, the transparent support η is disposed on the chassis, and the transparent cleavage is performed on the transparent shackle to perform the mold clamping of the wire and the long difficulty. The material of the money casting does not leak out of the gap between the transparent support film and the long mold frame. Transparent support 臈 设置 ^ 吁 — — ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 The width of the frame is also not particularly limited. However, if the required size of the polishing layer is considered, it is preferably ~25 Gem, and there is no particular limitation on the degree of the long mold frame. However, if it is required by the grinding field, 5 Thickness and the prevention of overflow when washing scales, it should be H) ~ 60 faces. Then, as disclosed in Fig. 6, a transparent field forming mold frame 25 is disposed at a predetermined position on the transparent supporting film 11. Fig. 7(a) is a schematic view showing a cross-sectional structure of a frame for forming a light-transmitting region in a direction, and Fig. 7-(b) is a schematic view showing a structure of a frame for forming a light-transmitting region. [7-(4) The figure shows a schematic view of the underlying structure of the mold frame for forming a light-transmitting field. For example, the transparent frame forming frame 25 can be made by using a metal or plastic material as a raw material by a die-casting method. As disclosed in FIG. 6, if the length of the transparent frame is set, the length can be set. There is no special limit on the length of the long model. The transparent frame forming frame has an injection hole 26 and an injection wall 27. The injection hole is used to inject a light-transmitting field forming material to form a hole of the light-transmitting field 10, and the injection wall is used to form the light-transmitting field forming material 28 and The bubble urethane hydrate composition 23 does not mix the wall, and is a wall for forming a certain gap between the transparent field and the polishing field 9 . 20 The length of the injection hole 26 can be appropriately adjusted according to the length of the inner wall of the long mold, and the width of the injection hole 26 can be appropriately set to match the width of the required light-transmitting field, but it is preferably 0·5~2 cm, and The injection hole % may be continuously provided as in the case of Fig. 7 - (b), or a plurality of intervals may be intermittently set at predetermined intervals. The height of the injection wall 27 is usually 1〇~6〇mm, and the ideal height is 20~50mm, depending on the thickness of the required grinding field and the view of preventing the overflow during the washing. The thickness of the injection wall 27 can be appropriately set in consideration of the space width between the light-transmitting field and the polishing field, but is preferably 1 mm or less, and more preferably 0.9 mm or less. Alternatively, the surface of the injection wall 27 should be subjected to a 5 release treatment. Then, the light-transmitting-domain forming material 28 is ejected into the injection hole 26, and the light-transmitting-domain forming material 28 is hardened to form a light-transmitting region. Further, the bubble-dispersed urethane composition 23 is discharged onto the transparent support film n outside the injection hole 26, and the bubble-distributed urethane composition 10 is cured to form a polishing field 9. Which of the above two procedures can be performed first or simultaneously, and if the work efficiency is considered, the above two procedures should be performed simultaneously. The amount of discharge of the light-transmitting region forming material 28 and the bubble-dispersed amine-based formic acid I composition 23 can be appropriately adjusted in consideration of the thickness and area of the light-transmitting field and the thickness and area of the polishing field. For example, the curing of the light-transmitting region forming material 28 and the bubble-dispersing urethane composition 23 is performed by uniformly adjusting the thickness by passing it through a heating oven provided on the conveyor, and heating the temperature system. 4〇~1〇〇C, heating time is 5~10 minutes. The reaction of the bubble-dispersed amino phthalate composition which does not flow until it is heated is carried out, and the post-curing has an effect of improving the physical properties of the poly 20-amino phthalic acid vinegar foam. In addition, when the light-transmitting field forming material is a thermoplastic resin, the bubble-dispersed amine-formic acid composition may be thermally cured, and then cured by cooling the light-transmitting region forming material, and the light-transmitting region forming material is light. In the case of a curable resin, it can be cured by irradiation with light such as ultraviolet rays or electron beams. If it is seen from the viewpoint of increasing the light transmittance, it is preferable to say that the light-transmitting field does not contain bubbles as much as possible. Then, the light-transmissive field was formed by demolding the mold frame and the long mold to form a long polishing layer having a gap between the light-transmitting field and the polishing field. The obtained long-grinding layer can be post-cured or appropriately adjusted to a length of 5 degrees in accordance with the polishing apparatus to be used. Further, the long-grinding layer is formed by a process of forming a textured structure on the polished surface to constitute a long polishing pad.

The average bubble diameter in the field of grinding is preferably 3 〇 8 〇 ,, and more ideally 3 卜 60 Å. When it is out of this range, the polishing rate is lowered or the flatness (flatness) of the material to be polished (wafer) after polishing tends to decrease. The thickness of the grinding field is not particularly limited, 4 mm, and preferably 1 to 2.5 mm. However, the proportion of the 0.8 grinding field is usually 〇.5~u. If the specific gravity is less than 〇5, the strength of the polished surface will be lowered, and the flatness (flatness) of the material to be polished will be improved. If it is greater than 13, the number of fine bubbles on the polished surface will decrease, and although The flattening property is good, but there is a tendency that the polishing speed is deteriorated. The hardness in the field of grinding is preferably from 45 to 70 degrees by means of an Askar D hardness tester. If the D hardness is 45 degrees, the age of the material can be flattened (flatness), the tendency to deteriorate is 3 ,, and the right is greater than 7 ,, although the flatness is good, 20 has the material to be polished. Sexuality (homogeneity) tends to deteriorate. Further, for the same reason as described above, the thickness error in the polishing field is preferably ΙΟΟμηι or less. The thickness of the light-transmitting field is not particularly limited, however, it is preferable to form the same thickness as the thickness of the grinding field or less. Transparency field specific grinding 35 200831236 When the field is thick, there is a possibility that the object to be polished is scratched due to the protruding portion during the grinding. In the long polishing shot of the second aspect of the invention, the polishing surface which is in contact with the material to be polished (wafer) preferably has a concavo-convex structure for holding and renewing the slurry as described above. On the other hand, Figs. 8 and 9 are cross-sectional views of the long polishing pad 8 of the third invention. The long-polishing field 9 is composed of a polyaminocarbamic acid-foam having fine bubbles, and the raw material of the polyurethane is the same as described above. The im polyaminic acid brewing foaming system is produced by curing the bubble-dispersed urethane composition, and the bubble-dispersed urethane composition 10 is mixed with the first component containing the iso-purine-based compound and A compound having a second component containing an active chlorine-based compound. The above-mentioned bubble-dispersed ureidocarboxylic acid brewing composition can be prepared by the same method as described above. The separator raw material used in the third invention is not particularly limited, and examples thereof include, for example, a polyurethane resin, a polyester resin, a b-polyamide resin, a cellulose resin, and acrylic acid. Thermoplastic resin such as resin, polycarbonate resin, resin, polystyrene and olefin resin; heat of acrylic resin, polyurethane resin, urethane resin, phenol resin and epoxy resin Curing resin; rubber such as natural rubber, isoprene rubber, butadiene rubber, neoprene rubber, styrene-butadiene rubber, 2-inch recycled rubber and polyisobutylene rubber; dimethyl polystone Oxygen-fired, diphenyl poly-stone, etc., such as Shixia resin. By using a thermoplastic resin, it can be stored and supplied to the face material in a wound state. Therefore, it is more reasonable, and in particular, S is made of a flexible material. The shape of the * 疋 partition is not particularly limited, but it should be a cross section (4) 36 200831236. At this time, the rabbit degree can be considered to be 5 to 1 in shape stability, and more preferably in the field of light transmission. Below the width, the height is preferably 10 to 50% of the thickness of the long abrasive field, and more desirably 15 to 40%. The length of the separator is not particularly limited, and may be an elongated shape (several m) or a short shape (a few cm 5 to several tens of cm). Further, for example, the separator may be obtained by the following method or the like. Manufactured, that is, formed by extrusion molding; a resin block which has been extruded into a cylindrical shape is cut into a spiral shape to form a strip shape; and the resin sheet is cut at a predetermined width and length. The material for forming the light-transmitting regions 10a and 10b is not particularly limited, and may be the same as described above. When a resin having an aromatic hydrocarbon group is used, since the light transmittance on the short-wavelength side tends to decrease, it is not preferable to use such a resin, and a thermoplastic resin is preferably used, and in particular, a thermoplastic polyamic acid is preferably used. Ester resin. For example, the light-transmitting field l〇a can be produced by the extrusion forming method or the casting forming method, and the cross-sectional shape of the light-transmitting field l〇a is not particularly limited, but it is preferably rectangular. The width of the light field 1〇& can be considered to be 5 to 15 mm in shape stability and expansion, and to ensure the grinding field. In order to prevent deformation in the light transmission field caused by pressurization during polishing, the light transmission field is 1〇a. The width should preferably be greater than the width of the divider. The thickness of the light-transmitting field l〇a is preferably 50 to 90% of the thickness of the long-grinding 20 field 9, and more preferably 60 to 85%. Further, the length of the light-transmitting field 10a is not particularly limited, and The elongated shape (the number may also be a short shape (several cm to several tens of cm), and it is preferable to match the length of the aforementioned partition member. On the other hand, for example, the concave light-transmitting field l〇b may be formed by extrusion molding Alternatively, it can be produced by a casting method, and as shown in FIG. 1 , a plurality of groove processing is performed on the resin sheet 29 in a predetermined space 37 200831236, and then the center of the convex portion is cut in the longitudinal direction, thereby effectively A long (several m) light-transmitting field 10b having a concave portion 30 is formed. Fig. 11 is a cross-sectional view of the resin sheet 29 cut in the width direction, and the width (W) of the light-transmitting field 10b can be considered for shape stability and expansion to ensure grinding. 5 The field is preferably 1 to 15 mm, and the thickness (H) of the light-transmitting field 10b can be appropriately adjusted in consideration of the thickness of the long-polishing field 9. The width (w) of the concave portion 3 can take shape stability and laser light. The incident field is preferably 5 to 10 mm, and the depth (8) of the recess 30 is preferably 1 to 5 厚度 of the thickness (H) of the light transmission field. %, and more is considered to be 15 to 40%. 10 Further, a plurality of concave portions 30 are formed on the resin sheet 29 at predetermined intervals, and then the center of the convex portion is cut into a lattice shape, whereby it can be efficiently produced. There is a short (number of cm to tens of cm) light transmission field 凹b of the concave portion 30. In addition, the width (W) and the thickness (H) of the short light transmission field and the width (w) and depth (h) of the concave portion 30 The transparent support film 11 used in the third aspect of the invention is not particularly limited, and the same as the above may be mentioned. The method for producing the long polishing pad of the third invention is as follows. Fig. _ shows a schematic diagram of a manufacturing procedure example of the third invention of the present invention. • The length of the long mold 24 is 5 l5 m, and it is desirable to consider the length of the long grinding field required by the right. 7~i〇m, if considering the size of the required grinding field, then the degree should be 6〇~(4)(10), and if the thickness of the 7-member field is to be polished by the desired length and the overflow prevention during washing, In view of the degree, the degree of return is 1 〇~6〇mm 0 百先, and the partition and the light-transmitting area 1〇a are arranged and fixed in a laminated state. 38 200831236 In the predetermined position of the long mold 24, at this time, the partition member may be disposed in the mold and then the light-transmitting field 10a may be laminated on the partition member, or vice versa. Moreover, the elongated partition member and the transparent field l〇a It may be provided only in the mold, or may be provided in plural. However, in order to increase the area of the grinding field to improve the grinding efficiency, and only one of the centers in the width direction of the mold is used, and the short partition and the transparent field are used. At 10a, it is preferable to set plural numbers at the center in the width direction of the mold at predetermined intervals.

On the other hand, when the concave light-transmissive field 1〇b is used, it is disposed at a predetermined position of the mold and the concave portion 3〇 is formed on the lower side, and, as described above, it is preferable to provide only one in the center in the width direction of the crucible. Further, when the short concave light-transmissive field 10b is used, it is preferable to provide a plurality of holes in the center in the width direction of the mold at a predetermined interval and in the longitudinal direction. The method of fixing is not particularly limited, and examples thereof include a method of bonding using a double-sided tape, and a method of applying 15 pressure from the separator and the light-transmitting field to press against the bottom surface of the mold. Then, the bubble-dispersed urethane composition 23 is discharged in a region where the separator and the light-transmitting region 1a or the concave-type light-transmitting region 10b are not disposed, and the bubble-dispersed urethane composition is cured. A long-grinding field 9 composed of a polyurethane foam was produced. The discharge of the bubble-dispersed amino phthalate composition 20 23 can be appropriately adjusted in consideration of the thickness and area of the long-grinding field. For example, the hardening of the bubble-dispersed urethane composition 23 is carried out by uniformly adjusting the thickness and then passing it through a heating oven provided on a conveyor, and the heating temperature is 40 to l〇〇t :, heating time is 5~1〇39 200831236 minutes. The bubble-dispersed urethane composition which has been reacted until it does not flow is heated and post-cured has an effect of improving the physical properties of the polyurethane foam. Then, the light-transmissive field and the long-grinding field which have been integrally formed are demolded from the long mold, and the separator is peeled off from the long-grinding field in the manufacturing method of the third invention. On the other hand, Fig. 13 is a view showing another example of the manufacture of the long polishing pad of the third invention. The bubble-dispersed amino phthalate composition 23 is prepared by a mechanical foaming method, and the so-called mechanical foaming method is a method in which a raw material component is placed in a mixing chamber of the mixing head 32 while being mixed with the aforementioned non-reactive reaction. The gas is mixed and stirred by a mixer such as an OAKS mixer, and the non-reactive gas is made into a fine bubble state and dispersed in the raw material mixture. Since the mechanical foam method can easily adjust the density of the polyurethane foam by adjusting the amount of the non-reactive gas to be mixed, it is an ideal method. The surface material 33 sent from the roller is moved by the conveyor 34. First, the separator and the light-transmitting region 10a are placed and fixed in a predetermined state inside the surface material 33 by being fed from a roller or the like. In this case, the partition 20 may be first disposed on the face material 33 and then the light-transmitting field i〇a may be laminated on the partition member, or vice versa. Further, the elongated partition member and the light-transmitting region 1a may be provided only on the face member 33, or may be provided in plural. However, for the same reason as described above, it is preferable to set only in the center of the width direction of the face member 33. One, in addition, when using the short partition and the light-transmissive field 1 (^, it is preferable to set the plural in the center of the width direction at a predetermined interval from the surface of the face material 33, 200831236. On the other hand, the concave light-transmissive field 10b is used. When it is disposed, it is fixed to the predetermined position of the face material 33 or the transparent support film! 且 and the concave portion 邛 is formed on the lower side, and, as described above, it is preferable that only the width of the face material 33 or the transparent support film is 5 degrees. One of the center of the direction is provided, and when the short concave-type light-transmissive field 1 〇b is used, it is preferable to set a plurality of the longitudinal direction of the face material 33 or the transparent support film u at a predetermined interval in the longitudinal direction. In place of the surface material 33, the surface material 33 can be omitted from the surface of the transparent support film having the surface of the recessed portion. Therefore, it is preferable to use 10 in terms of manufacturing efficiency. The specific limitation is, for example, a paper, a cloth, a non-woven fabric, a resin film, etc., however, it is preferable to use a resin film having heat and flexibility, for example, a resin for forming a face material. For example, polybutylene terephthalate, ethylene glycol, polystyrene, polystyrene, polyvinyl alcohol, polyvinyl chloride, polystyrene, gas-containing resin, nylon , cellulose, etc. The thickness of the face material is not particularly limited. However, from the viewpoint of strength or winding, it is preferably 20 to 200 μm, and the width of the face material is not particularly limited. However, in consideration of the size of the long grinding field required, it is preferably 60 to 250 cm. In addition, the surface of the face material should be subjected to a mold release treatment, whereby the peeling of the face material can be easily performed after the long grinding field is produced. Then, the bubble-dispersing amine group is continuously discharged from the mixing nozzle of the mixing (4) without being disposed with the separator and the light-transmitting field 1〇a or the concave-shaped light-transmissive beam 200831236 朗b±33 or the transparent reading film 11. Formic acid hydrate composition 23. Surface material 33 or transparent The moving speed of the film 11 or the discharge amount of the bubble-dispersed urethane composition 23 can be appropriately adjusted in consideration of the thickness and area of the long-grinding field. Thereafter, the bubble-dispersed urethane composition is discharged.层面 The layer material 33 is stacked, and the thickness is uniformly adjusted, and the bubble-dispersed composition is hardened to form a long-polishing field 9 composed of a polyamino phthalate foam. For example, a mechanism for uniformly adjusting the thickness may be exemplified by a roller 35 such as a roll or a coating roller, a doctor blade, etc., and, for example, the hardening of the bubble-dispersed urethane composition 23 is uniform. The thickness is adjusted and then passed through a heating oven (not shown) provided on the conveyor. The heating temperature is 4 〇 to i 〇〇 ° c, and the heating time is 5 to 1 〇 minutes. 15 Then, the self-contained light-transmissive field and the long-polishing field are peeled off from the surface material, and the separators are peeled off from the long-grinding field in the manufacturing methods of the third to third and third to third embodiments. For example, the obtained light-transmitting field and the long-grinding field are cut into a number of meters by a cutting machine, and the length can be appropriately adjusted according to the grinding device 20 used, but usually 5 to 15 m, and More ideally 7 to 10m. In addition, post-curing may be performed before the surface material is peeled off, and post-curing may be performed after the surface material is peeled off. However, since the heat shrinkage rate of the surface material and the abrasive jaw region is usually different, if it is prevented from being deformed by the grinding field, From the point of view, it is appropriate to post-cure after peeling off the facestock. After the post-curing, in order to adjust the length of 42 200831236 and make the thickness uniform, it is also possible to cut the end of the long grinding field. The cell diameter, specific gravity and hardness The average of the polyurethane foam is the same as described above. It is in contact with the material to be polished (wafer) to hold and renew the unevenness of the slurry. In the long polishing pad of the third aspect of the invention, it is preferable that the polishing surface has the same structure as described above.

15

The thickness of the long grinding is not particularly limited, but is usually 〜4rnm, and preferably 1 to 2.5 mm. ... Again, for the same reason as described above, the thickness error in the long grinding field is ΙΟΟμηι or less. It is known that in the field of long grinding, the surface of the separator has been peeled off or the transparent collar or the surface of the separator has a transparent support film, and a long abrasive layer having a space portion 36 between the light-transmitting field and the moon-receiving film is produced. . For example, in the above-mentioned long-polishing field, the method of laminating the transparent support film 11 can be exemplified by a method of cooling and pressurizing the long-polished field 9 and the transparent support film by the double-sided tape 37; The surface of the field 9 is coated with the transparent support film 接着 followed by d, but the double-sided tape 37 or the adhesive must not be provided on the portion of the transparent support film corresponding to the space portion 36. The length or width of the long abrasive layer can be suitably adjusted in accordance with the polishing apparatus used, but the length is usually 5 to 15 m and the width is usually 60 to 25 cm. The long polishing pad of the first to third aspects of the present invention is also characterized in that the long polishing layer and the buffer sheet (buffer layer) are bonded together.

The above-mentioned buffer sheet compensates for the characteristics of the polishing layer, and the buffer sheet system C Μ P 43 200831236 2 can take into consideration the planarity of the mutual compensation relationship and the __ _ %. The flatness of the wafer at the time of the formation of the fine concavities and convexities generated during pattern formation, and the uniformity of μ means the uniformity of the entire wafer. The characteristics of the straw are improved by the characteristics of the foam sheet, and the characteristics of the cushion sheet are improved, and the slab is made of a long polishing pad which is slower than the present invention, and is used in a field which is softer than the polishing field. For example, the buffer sheet may be, for example, a fiber cloth such as a non-woven fabric 16 acrylic acid non-woven fabric; a resin impregnated non-woven fabric such as a polyamine/10 15 non-woven fabric; a polyurethane foam, a fine cellulose foam, etc. A polymer resin foam; a rubber or a photosensitive resin such as a butyl rubber or a pentamer rubber. For example, a method of bonding the long abrasive layer and the buffer sheet may be, for example, a method of sandwiching and pressurizing the long abrasive layer and the buffer sheet by a double-sided tape. The long polishing pad of the first to third inventions may be provided with a double-sided tape on the side of the long abrasive layer or the buffer layer and the back surface of the laminate. 20 Polishing The semiconductor element is manufactured by a process of polishing the surface of the semiconductor wafer using the long polishing pad. Further, the semiconductor wafer is generally formed by laminating a wiring metal and an oxide film on a circular circle. The polishing method and the polishing apparatus of the semiconductor wafer are not particularly limited. For example, the following method can be used. Figure 14 is a schematic view showing a method of polishing a semiconductor wafer using a web type polishing apparatus. Initially, the long polishing pad 8 is mainly wound on the supply roller 2la. Further, if a plurality of semiconductor wafers 4 are polished, the polishing pad of the used field is wound by the recovery roller 2lb, and the polishing pad of the unused field is used. It will be sent from the supply roller 21a with 44 200831236. Fig. 15 is a view showing a method of polishing a semiconductor wafer using a linear type polishing apparatus. The long polishing pad 8 is arranged in a strip shape and can be rotated around the lepton, and is further applied to the linearly moving polishing pad. ' (4) Figure carefully read (4) research money to set up the material of the conductor wafer ^ ^. The Changyan Qian 8 ship is placed in a wire shape and can be moved between the rollers 22 to i, and then the semiconductor wafer 4 is grounded on the ground (respectively). 1〇$, although not shown in the figure, however, the above-mentioned polishing apparatus generally includes: a polishing plate (layer) for supporting a long polishing pad; a support table (grinding head) for supporting a semiconductor The waferr; the gasket material is used to perform the two-round uniform-pressurization; and the abrasive (slurry) supply mechanism. The polishing platen 15 is provided with a support pad configured to support a long polishing pad and a semiconductor wafer, and has a center of rotation, and the support table has a rotating shaft. During polishing, the support table is rotated. • The semiconductor wafer is pressed against the long polishing pad, and the slurry is supplied while polishing. The flow rate of the slurry, the polishing load, and the number of wafer rotations are not limited. Properly adjusted. '2' This allows the semiconductor device to be removed from the surface of the semiconductor wafer and polished to a flat surface. The semiconductor device is fabricated by dicing, bonding, packaging, etc., and the body element is used in an arithmetic processing device or a memory. EXAMPLES The following examples are given to illustrate the invention, but the invention is not limited to the examples. 45 200831236 [1st invention] Example 1 was added to a container, and the mixing temperature was adjusted to 7 (TC isocyanate terminal prepolymer (UNIROYAL Co., Ltd., ADIPRENE L-325) 100 parts by weight of a lanthanoid surfactant (manufactured by Toray Dow Corning Co., Ltd., SH-192), 3 parts by weight, adjusted to 80 ° C for defoaming under reduced pressure, and then rotated at 900 rpm using a biaxial mixer Fiercely

Stir for about 4 minutes to take air bubbles into the container. Further, 26.2 parts by weight of 4,4, a monomethylene bis(anthraceneline aniline) (manufactured by IHARA 10 Chemical Co., Ltd., CUAMINE MT), which has been previously melted to 120 ° C, was added thereto, and The mixture was stirred for about 70 seconds to prepare a foaming reaction liquid. The foaming reaction 15 20 was poured into a long mold (width: 80 cm, length: 520 cm, height: 3 cm), and placed in an oven at a time when the fluidity of the mixed solution disappeared, and was carried out for 12 hours at 8 〇 to 85 °. Thereafter, it was cured, and a polyamino phthalate foam sheet (average bubble diameter: 50 μm, specific gravity: 〇·86, hardness: 55 degrees) was obtained. Next, the surface of the polyurethane foam sheet was subjected to surface polishing treatment using a polishing machine (manufactured by AMITEC Co., Ltd.) until a composition of 1.1 mm was strictly produced, and a polyamine having an adjusted thickness precision was prepared. Carbamate hair, coated tablets. Further, a groove processing machine (TECHN〇y; 迕制迕) was used to carry out a groove + household 6 mm, a groove depth of 0.7 mm, and a groove length in the central portion in the width direction of the polyurethane foam sheet. The 5 〇〇 cm frame is grooved, and/or along the central portion of the formed groove, the polyamine urethane foam sheet is cut into two pieces by a Ν1Ί^ knife, and then used. Ditch processing machine (Tieke II: manufactured by Siji), which is used for the surface of each polyurethane foam sheet, and is prepared for the sulcus of the slurry with a thickness of 6 mm 200831236 5 • 1 mm, a groove spacing of 6 mm, and a groove depth of 0.4 mm. Processing and making two long grinding fields with a frame. The isocyanate-terminated prepolymer with a mixing temperature of 80 °C (manufactured by Nippon Polyurethane Co., Ltd., C-2612) 70 parts by weight, three armor 9 parts by weight of a propane and 21 parts by weight of a polytetramethylene glycol of a number average molecular weight of 650, and defoaming to prepare a material for forming a light-transmitting region. The material for forming the light-transmitting region flows into a long mold (width 80 cm, length) 5〇〇em, height 3mm), and put into the oven at the time when the fluidity of the material disappears, and 1 After curing for 12 hours at 〇~105 ° C, a non-foamed sheet was obtained. Next, 10 the surface of the non-foamed sheet was polished using a polishing machine (manufactured by Amitoc) until a thickness of 0.9 mm was formed. And made a non-foamed sheet with adjusted thickness accuracy. Also, using a groove processing machine (manufactured by Tecno Corporation), the groove width is 6 mm, the groove length is 5 〇〇cm, the groove spacing is 12 mm, and the groove is formed in the entire non-foamed sheet. A groove having a depth of 0.2 mm, and then cutting all the grooves of the 15th portion along the central portion of the groove to produce a long light transmission field with a maximum height (h) of 0.9 mm and a length of 500 cm (shoulder width, width 3 mm, height ( X7mm, head: width 6mm). Apply hot-melt adhesive to the shoulder of the long light-transparent field (Okamoto, Ltd.), SUPERTECH 1942, EVA, softening point 88 °C, At 177 ° C, 4000 cps), and placed at room temperature for about 1 hour. 20 The two long grinding fields were placed and fixed on the belt conveyor 'and as shown in Figure 2, the through hole is fixed. The width (about 6 mm) is formed between the frame portion and the frame portion, and then the length is The light field is disposed in the opening portion of the long-grinding field, and is temporarily fixed by the tape so that the long light-transmitting field is not offset to obtain a long piece. Further, the long piece is moved, and the temperature adjustment 47 is used, and the temperature is adjusted to 100 ° C. The roll heats and presses the long light-transmitting field, and then obtains the abrasive sheet in the long-transparent field and the long-grinding field, and then peels off the temporary fixing tape, and uses a laminating machine to make the double-sided tape (made by Sekisui Chemical Co., Ltd., # 5782W) adhered to the opposite side of the abrasive sheet and the groove processing surface. Further, the double-sided tape corresponding to the position of the long light-transmitting field is cut by a 5 NT cutter, and the laminate is used to be transparent. A support film (manufactured by Toyobo Co., Ltd., E5001, PET film, thickness 75 μm) was bonded to the above-mentioned double-sided tape to prepare a long polishing pad. [Second invention] 10 Example 1 An isocyanate terminal prepolymer (manufactured by U.S.A., sub-Pulsing L-325) having a temperature adjusted to 7 〇 ° C in 100% by weight and broken 3 parts by weight of a surfactant (manufactured by Toray Dow Cornedew Co., Ltd., SH-192), and adjusted to 8 ° C for degassing under reduced pressure, and then using a biaxial mixing 15 to rotate a number of 9 rpm Stir vigorously for about 4 minutes to take in air bubbles in the container. In addition, 26 2 parts by weight of a mixture of 14 , 曱 (〇-chloroaniline) (manufactured by Iorihara Chemical Co., Ltd.), which has been pre-refined to 12 ° C, is added thereto, and the mixture is added. The bubble-dispersed amino phthalic acid vinegar composition was prepared by mixing for about 7 seconds. 20 100 parts by weight of an isocyanate-terminated prepolymer (manufactured by Nippon Polyurethane Co., Ltd., C-2612) with a mixing temperature of 80 100, 100 parts by weight of trishydroxypropyl propyl ketone, and 9 lumps of average weight of 650 21 parts by weight of tetramethylene ether glycol was defoamed to prepare a material for forming a light-transmitting region. On the chassis with aluminum coated with Teflon (registered trademark) on the surface 48 200831236 Laminated transparent support film (PET, manufactured by Toyobo Co., Ltd., E5001, thickness: 75μιη) 'and coated with Teflon (registered) The long mold frame (internal length: 520 cm, inner width: 80 cm, internal height: 30 mm) made of aluminum of the trademark) is placed on the transparent support film, and then the mold and the long mold frame are clamped. (5) The thickness of the transparent support film is set to be 2 m larger than the long mold frame, and then the shape of the transparent region formed by the release of the shape shown in Fig. 7 is formed (the length of the injection hole of SUS ': 520 cm, The width of the injection hole: I2 mm, the south of the injection wall: 30 mm, the thickness of the injection wall: 1 mm) is placed in the center of the width direction of the long mold frame. 10, a bubble-dispersed amino phthalic acid composition is discharged onto the transparent support film outside the injection hole, and a transparent field forming material is sputtered on the transparent support film in the injection hole, and then the long mold is placed in a temperature Adjusted to 8 〇 to 85 ° C in an oven for 10 hours to make the bubble-dispersed urethane composition and the light-transmitting field forming material harden, and form the field of polishing and light transmission, and then, 15 to form the light-transmitting field The mold frame and the long mold frame were demolded to produce a long abrasive layer (thickness: about 2 mm) having a gap (1 mm) between the light transmitting field and the polishing field. Next, the surface of the long polishing layer was polished by a polishing machine (manufactured by Amitoc) to adjust the thickness to Mmm, and a groove processing machine (manufactured by Toho Steel Co., Ltd.) was used to grind the long polishing layer. A long polishing pad is produced by performing a groove processing on the surface of the field. [3rd invention] Example 1 was added to a container, and the mixing temperature was adjusted to 7 (rc isocyanuric acid terminal prepolymer (manufactured by Yosemite Co., Ltd., sub-pree L-325) (10) parts by weight, 49 200831236 矽The surfactant (manufactured by Toray Dow Corning Co., Ltd., SH-192) was damaged by 3 weights and adjusted to 80 C, and then degassed under reduced pressure. Then, the mixture was vigorously stirred at a rotation number of 900 rpm for about 4 minutes using a biaxial mixer. Air bubbles were taken in the container. In addition, the addition was pre-melted to 12 〇. 4,4, 亚 双 5 5 (〇 笨 笨 )) (manufactured by Iorihara Chemical Co., Ltd., Kuantan) 26·2 The mixture was stirred for about 7 sec to prepare a bubble-dispersed urethane composition. The mixing temperature was adjusted to 80. (: Isocyanate-terminated prepolymer (manufactured by Japan Polyurethane Co., Ltd.) , C—2612) 70 parts by weight, 9 parts by weight of trimethylolpropane hydride and a weight fraction of polytetramethylene ether glycol having a number average molecular weight of 650, and defoaming to prepare a light-transmitting domain forming material. The light-transmitting field forms a material that flows into the long mold (internal width 8 〇 cm, internal The temperature is 52 〇cm, the internal height is 30 mm), and it is placed in an oven at the time when the fluidity of the material disappears, and is cured at 100 to 105 ° C for 12 hours, and at the same time, a 15 foam-free sheet is obtained. Secondly, it is used. The polishing machine (manufactured by Amitoc) performs the surface polishing treatment of the non-hair/package sheet until the thickness O gmni is formed, and the non-foamed sheet having the thickness precision adjusted is formed. Further, the cutter is cut by the cutter. Non-foamed sheet' and made most long-light transmission areas (length 520cm, width i0mm, thickness 〇.6mm). 20 Tielong (registered trademark) long separator (length 520cm, width 10mm, thickness 〇.5mm) Arranged in the center of the width direction of the long mold (internal width 80cm, inner length 520cm, inner height 30mm), and fixed by double-sided tape, and the long light transmission area is disposed on the partition, and by double 50 200831236 Further, the bubble-dispersed urethane composition is discharged from a long mold which is not provided with the long separator and the long light-transmitting field, and is left to stand for about 10 minutes, and then the long mold is placed. Put the temperature adjustment to 80~ 85. The bubble-dispersed amino phthalate composition is hardened in the supply box for 12 hours to form a long-grinding field, and after 5, the long mold is released and the long-grinding field is peeled off by Teflon (registered trademark). Long separator and double-sided tape. Secondly, the surface of the long grinding field was polished by a polishing machine (manufactured by Amitoc) to adjust the thickness to _ 1.1 mm, and a groove processing machine (Dongbang Steel Machinery Co., Ltd.) was used. (manufacturing), X-groove processing is performed on the surface of the long-grinding field, and then a double-sided tape 10 (manufactured by Sekisui Chemical Co., Ltd., #5782W) is pasted on the surface opposite to the groove processing surface by a laminator . Further, the above-mentioned double-sided tape corresponding to the position in the long light-transmitting field was cut by a *NT cutter, and a transparent support film (manufactured by Toyobo Co., Ltd., E5001, PET film, thickness 75 μηι) was bonded using a laminator. A long grinding burr was produced on the double-sided tape described above. 15 Example 2: Isocyanate-terminated prepolymer (manufactured by Sigma Polyurethane Co., Ltd., C-2612) having a mixing temperature adjusted to 80 ° C, 70 parts by weight, trimethylolpropane, 9 parts by weight, and amount The polytetramethylene ether glycol having an average molecular weight of 650 was used in an amount of 21 parts by weight, and defoaming was carried out to prepare a material for forming a light-transmitting region. The light-transmitting collar 2 〇 domain forming material is poured into a long mold (internal width 80 cm, inner length 520 cm, internal length 30 mm), and placed in an oven at a time when the fluidity of the material disappears, and is 100 to 105^ Curing was carried out after 12 hours while obtaining a non-foamed sheet. Next, the non-hair/pack sheet surface polishing treatment was carried out using a polishing machine (manufactured by Amitoc) until a thickness of 1.1 mm was formed, and a non-foamed sheet having a thickness precision adjusted in 51 200831236 was prepared. Further, a groove processing machine (manufactured by Tecno Corporation) was used to form a groove having a groove width of 6 mm, a groove length of 520 cm, a groove pitch of 10 mm, and a groove depth of 0.5 mm in the entire non-foamed sheet, and then along the center of the convex portion. A large concave light-transmissive field (length 520 cm, width l〇mm, thickness 1.1 mm) having a concave portion (width: 6 mm, depth: 5 〇.5 mm) is produced by cutting, and the long light-transmitting field is disposed in the long mold (internal width) A center of the width direction of 8 〇cm, an inner length of 520 cm, and an inner height of 30 mm), and a concave portion was formed on the lower side, and fixed by a double-sided tape. 10 and 'dissolving the bubble-dispersed urethane composition on the long mold not disposed in the long light-transmitting field and standing for about 1 minute, and then placing the long mold in a temperature adjustment of 80 to 85° The bubble-dispersed amine phthalate composition was hardened in an oven of C for 12 hours to form a long-grinding field, and then the long mold was released to peel off the double-sided tape from the long-grinding field. Next, the surface of the long-grinding field was polished by a polishing machine (manufactured by A 15 Mitex Co., Ltd.) to adjust the thickness to L1mm, and a groove addition machine (manufactured by Toho Steel Co., Ltd.) was used in the field of long grinding. The surface was subjected to grooving, and then a double-sided tape (manufactured by Sekisui Chemical Co., Ltd., #5782W) was adhered to the surface on the opposite side of the long-ground area from the groove-processed surface using a laminator. In addition, the double-sided tape which is corresponding to the position of the concave portion is cut by a *NT cutter, and a transparent support film (manufactured by Toyobo Co., Ltd., E5〇〇1, pET film, thickness 75 μm) is used. A long polishing pad is formed by bonding to the above double-sided tape. Example 3 (Adjustment of bubble-dispersed urethane composition by mechanical foaming method 52, 200831236) Mixed isocyanate terminal prepolymer (manufactured by Youli Company, sub-Puri L-325) 100 parts by weight, 矽It is a mixture of 3 parts by weight of a surfactant (made by Toray Dow Corning Co., Ltd., SF2938F) and a temperature of 80 ° C, and 4,4'-methylene bis(indole-chloroaniline) which has been melted to 120 ° C. (manufactured by Ihara Chemical Co., Ltd., Iharahara A) 2 6 · 2 parts by weight is mixed in a mixing chamber before discharge, and air is dispersed in the mixture by mechanical stirring to prepare a bubble-dispersed amine group. Acidate composition. The long light-transmitting field 10 produced in the first embodiment is bonded to the long-term separator of the Teflon (registered trademark) by a double-sided tape, and the double-sided tape is bonded to one side of the separator to obtain a laminate. member. A surface material (thickness: 50 μm, width: 100 cm) made of polyethylene terephthalate (PET) is supplied, and the laminated member is continuously bonded to the central portion of the surface material, and the long separator is continuously disposed in a laminated state. The bubble-dispersed amine phthalate composition is continuously discharged from the mixing head on the face material to which the laminated member is not disposed, and then the surface of the long light-transmitting collar 15 is not disposed. Further, the bubble-dispersed urethane composition was covered with another face material (thickness: 5 μμm, width: 1 cm) composed of PET, and the thickness was uniformly adjusted using a roll, and then heated to 80 by heating. The composition was hardened at ~85 ° C, and a long-grinding field composed of a polyaminomethane 20 ester foam was produced, and then the long-grinding field was cut at a length of 520 cm, and the face material was long. The separator and the double-sided tape were peeled off, and cured at 8 ° C for 6 hours to obtain a long abrasive sheet composed of a long-grinding field and a long-light-transmitting field. Next, the surface of the long-grinding field was polished by a polishing machine (manufactured by Amitoc) to adjust the thickness to a thickness of 53 200831236 5 • 10 to 1.1 mm, and a groove processing machine (manufactured by Toho Steel Co., Ltd.) was used. X-groove processing was performed on the surface of the long-grinding field, and then a double-sided tape (manufactured by Sekisui Chemical Co., Ltd., #57 82W) was adhered to the surface on the side opposite to the groove processing surface by a laminator. Further, the above-mentioned double-sided tape corresponding to the position in the long light-transmitting field was cut by an NT cutter, and a transparent support film (manufactured by Toyobo Co., Ltd., E5001, PET film, thickness: 75 μm) was bonded using a laminator. A long polishing pad was formed on the double-sided tape described above. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing an example of a polishing apparatus used in CMP polishing. Fig. 2 is a schematic view showing an example of a cross section of the long polishing pad of the first invention. Fig. 3 is a view showing an example of a resin sheet in which a plurality of grooves are formed at predetermined intervals. 15 Fig. 4 is a schematic view showing an example of a cross section when the resin sheet is cut in the width direction. Fig. 5 is a schematic view showing an example of a cross section of the long polishing pad of the second invention. Fig. 6 is a view showing an example of a manufacturing procedure of the long polishing pad of the second invention. Fig. 7 is a view showing an example of a structure of a mold frame for forming a light-transmitting region. Fig. 8 is a view showing an example of a section of the long polishing pad of the third invention. Fig. 0 54 200831236 Fig. 9 is a schematic view showing an example of the section of the long grinding crucible of the third invention. Fig. 10 is a view showing an example of a resin sheet in which a plurality of four portions are formed at predetermined intervals. 5 The nth figure shows a schematic view of an example of cutting the resin sheet in the width direction. Fig. 12 is a view showing the manufacturing procedure of the long polishing pad of the third invention.

Fig. 13 is a view showing the manufacturing procedure of the long polishing pad of the third invention. Figure 14 is a schematic view showing a method of polishing a semiconductor wafer using a web type polishing apparatus. Fig. 15 is a view showing a method of grinding a semiconductor wafer using a linear type polishing apparatus. 15 Fig. 16 is a schematic view showing a method of polishing a conductor wafer using a reciprocating type polishing apparatus. [Explanation of main component symbols] 1.. Polishing pad 2.. Polishing plate 3···Abrasive agent (slurry) 4··. Material to be polished (semiconductor wafer) 5···Support table (buffing head) 6 ' 7···Rotary shaft 8...long polishing pad (long polishing layer) 9...(long) grinding jaw 10 (10a,10b)···(long) light transmission field 11...transparent support film 12··· Through hole 13...frame portion 14·.. opening portion 15 '29···resin sheet 55

200831236 16"·Ditch 17...shoulder 18..head 19,31...cutting position 20..subsequent layer 21a...feeding roller 21b...recycling roller 22,35...roller 23.. Bubble-dispersed amino phthalate composition 24...long mold y 25.. Light-transmissive field forming mold frame 26.. injection hole 27.. injection wall 28.. light-transmitting field forming material 30.. .Concave 32.. Mixing head 33··. Face material 34.. Conveyor 36.. Space part 37···Double-sided tape (adhesive layer) 56

Claims (1)

200831236 5 X. Patent application scope: 1. A method for manufacturing a long polishing pad, comprising the following steps: preparing a long grinding field composed of a polyamine phthalate foam; forming a through hole in the long grinding field And an opening formed by the frame portion; forming a convex long light transmission field thinner than the long polishing field; providing the long light transmission region in the opening portion of the long polishing field; and bonding the transparent support film to the length The grinding field is ground inside 10 sides. 2. The method for producing a long polishing pad comprising the following steps: producing a long-grinding field composed of a polyurethane foam; forming a frame continuously on one side of the long-grinding field and extending in the longitudinal direction a portion 15 that produces a convex long light-transmissive field that is thinner than the long-grinding field; • two long-grinding fields arranged in parallel, the frame portion being opposed to the frame portion, and an opening portion formed to be inserted into the long light-transmitting field The long light transmission region is disposed in the opening portion; and the transparent support film is bonded to the polishing inner surface 20 side of the long polishing field. 3. The method of manufacturing a long polishing pad according to claim 1 or 2, wherein the thickness of the thickest portion of the long light transmission region is 50 to 90% of the thickness of the long abrasive region. 4) A method for producing a long polishing pad comprising the following procedure: 57 200831236 Modulating a bubble-dispersed carbamic acid g composition by a mechanical foaming method; arranging a transparent support film in a long mold and having an injection hole And the transparent region forming frame of the injection and the light is disposed at a predetermined position on the support film; the light-transmitting region forming material is discharged into the injection hole, and the light-transmitting region forming material is hardened to form a light-transmitting region; Discharging the bubble-dispersed amino phthalate composition onto the transparent support film outside the injection hole, and curing the bubble-dispersed urethane composition to form a polishing field, and In the field formation, a long abrasive layer having a gap between the light-transmitting field and the polishing field is produced by demolding a mold frame and a long mold. 5. The method of producing a long polishing pad according to item 4 of the patent application, wherein the light-transmitting field is composed of a thermosetting resin. 6. The method for producing a long polishing pad according to the fourth aspect of the invention, wherein the thermosetting resin is a polyurethane resin. 7. The method of producing a long polishing pad according to item 4 of the patent application, wherein the thickness of the injection wall is 1 mm or less. 8. A method for producing a long polishing pad comprising the steps of: modulating a bubble-dispersed urethane composition by a mechanical foaming method; and disposing the separator and the light-transmitting region in a long mold in a laminated state; The bubble-dispersed amino phthalate composition is discharged to a field in which the separator and the light-transmitting region are not disposed, and the bubble-dispersed urethane composition is cured to prepare a polyurethane foam. The long-grinding field is formed; 58 200831236 peeling off the separator from the long-grinding field; and in the long-grinding field, the surface side of the separator is peeled off and transparently supported, (4) in the light-transmitting field and the transparent support film A long abrasive layer having a space portion therebetween. A method for manufacturing a long-term recording, comprising the following steps: modulating a bubble-dispersed urethane composition by a mechanical foaming method; arranging a concave-shaped light-transmitting field with a flank, and forming a concave portion on a lower side; The bubble is divided into a field in which the above-mentioned transparent domain is not disposed, and the bubble-dispersed urethane acetate is hardened to produce a field of polyurethane foaming; and And a surface-layered transparent film having the concave portion in the light-transmitting region, and having a space portion between the light-transmitting region and the transparent support film; a long abrasive layer 1(), a method for manufacturing a long-length polishing pad, comprising the following steps: modulating a bubble-dispersed carbamic acid cool composition by a mechanical foam method to deliver a face material and arranging the separator and the light-transmitting field in a laminated state The inside of the face material; 20, the bubble-dispersed urethane composition is continuously discharged to the surface material not disposed in the separator and the light-transmitting field; and the bubble-dispersed urethane composition is discharged Adding other surface materials of the current layer; ' uniformly adjusting the thickness, so that the bubble-dispersed carbamic acid g composition 59 200831236 5 hardening to produce a long-grinding field composed of polyurethane foam; In the long polishing field, the surface material and the separator are peeled off; and in the long polishing field, the surface side transparent support film of the separator is peeled off, and a long polishing layer having a space portion between the light transmission region and the transparent support film is produced. 11. A method of manufacturing a long polishing pad comprising the steps of: • modulating a bubble-dispersed amine phthalate composition by a mechanical foaming method; delivering a facestock and arranging a concave light-transmissive region within the facestock; And forming the concave portion on the lower side; and continuously discharging the bubble-dispersed urethane composition to the surface material not disposed in the light-transmitting region; and discharging the bubble-distributing amino carboxylic acid vinegar composition Laminating other face materials; 15 uniformly adjusting the thickness to make the bubble-dispersed urethane composition harden to form a long-grinding field composed of polyurethane foam; peeling off from the long-grinding field The surface material and the surface-side transparent support film having the concave portion in the light-transmitting region are formed in a long polishing layer having a space portion between the light-transmitting region and the transparent support film. 12. A method for producing a long polishing pad comprising the steps of: modulating a bubble-dispersed urethane composition by a mechanical foaming method; feeding a transparent support film and arranging a concave light-transmissive region in the transparent 60 200831236 10 Support a concave portion is formed on the lower side of the film; the bubble-dispersed urethane composition is continuously discharged onto the transparent support film not disposed in the light-transmitting region; and the bubble-dispersed amine group is discharged The phthalate composition is superimposed on the layer material; the thickness is uniformly adjusted, and the bubble-dispersed amine group (iv) vinegar composition is hardened to form a long-grinding field composed of polyamine hydrazine foam, which is produced in the above-mentioned transparent domain. And a transparent polishing layer having a space portion; and the surface material is peeled off from the long grinding field. 13. The method of manufacturing a long-grinding apparatus according to claim 8 or 10, wherein the partition member and the light-transmitting region are elongated. 14. The length of the aforementioned spacer is the width of the above-mentioned spacer in the case of the long polishing pad of the 8th or 10th patent application. The length of the above-mentioned spacer is 15. The long polishing pad of the 8th or 10th item of the patent application. System! In the thickness of the field, the thickness of the light-transmitting field is 90% or less of the width of the aforementioned long-term research. 50 16 · As in the patent application scope 9, the long-term research method of the coffee, wherein the light-transmitting field is elongated. The manufacturing method of the invention is as follows: 17. The long-grinding crucible method according to the ninth and 1st aspect of the patent application, wherein the depth of the concave portion is 50% of the manufacturing side of the light transmission. Or the thickness of 10~ 61