WO2008047631A1

WO2008047631A1 - Method for producing long polishing pad

Info

Publication number: WO2008047631A1
Application number: PCT/JP2007/069685
Authority: WO
Inventors: Yoshiyuki Nakai; Tsuyoshi Kimura; Tetsuo Shimomura; Takeshi Fukuda; Kazuyuki Ogawa
Original assignee: Toyo Tire & Rubber Co., Ltd.
Priority date: 2006-10-18
Filing date: 2007-10-09
Publication date: 2008-04-24
Also published as: TWI349595B; TW200831236A

Abstract

Disclosed is a method for producing a long polishing pad, which is capable of preventing slurry leakage and excellent in optical detection accuracy, with high productivity. Specifically disclosed is a method for producing a long polishing pad, which comprises a step for forming a long polishing unit (9) made of a polyurethane foam, a step for forming an opening, which is composed of a through hole (12) and a shelf portion (13), in the long polishing unit (9), a step for forming a convex-shaped long light-transmitting unit (10) which is thinner than the long polishing unit (9), a step for arranging the long light-transmitting unit (10) in the opening of the long polishing unit, and a step for bonding a transparent supporting film (11) on the rear surface of the long polishing unit.

Description

Specification

Manufacturing method of long polishing pad

Technical field

[0001] The present invention relates to optical materials such as lenses and reflecting mirrors, silicon wafers, glass substrates for hard disks, aluminum substrates, and materials that require high surface flatness such as general metal polishing. The present invention relates to a method for producing a long polishing pad that can be processed stably and at high and / or high polishing efficiency. The long polishing pad obtained by the production method of the present invention is a silicon wafer and a device having an oxide layer, a metal layer, etc. formed thereon, and further laminating these oxide layers and metal layers. It is preferably used in the process of flattening before forming.

Background art

[0002] When manufacturing a semiconductor device, a conductive film is formed on the wafer surface and a wiring layer is formed by photolithography, etching, etc., and an interlayer insulating film is formed on the wiring layer. These steps cause irregularities made of a conductor such as metal or an insulator on the wafer surface. In recent years, the power of miniaturization of wiring and multilayer wiring for the purpose of increasing the density of semiconductor integrated circuits has been accompanied by the importance of a technique for flattening the unevenness of the wafer surface.

[0003] As a method for flattening the unevenness of the wafer surface, chemical mechanical polishing (hereinafter referred to as CMP) is generally employed. CMP is a technique of polishing using a slurry-like abrasive (hereinafter referred to as slurry) in which abrasive grains are dispersed with the surface to be polished of the wafer pressed against the polishing surface of the polishing pad. For example, as shown in FIG. 1, a polishing apparatus generally used in CMP includes a polishing platen 2 that supports a polishing pad 1 and a support base (polishing) that supports a workpiece (semiconductor wafer) 4. Head) 5 and a backing material for uniformly pressing the wafer, and an abrasive supply mechanism. The polishing pad 1 is attached to the polishing surface plate 2 by attaching it with a double-sided tape, for example. The polishing surface plate 2 and the support base 5 are arranged so that the polishing pad 1 and the material to be polished 4 that are supported respectively face each other, and are provided with rotating shafts 6 and 7, respectively. Also, press the workpiece 4 against the polishing pad 1 on the support 5 side. A pressure mechanism is provided for this purpose.

[0004] Conventionally, such a polishing pad has 1) a method in which a resin material is poured into a mold to produce a resin block, and the resin block is sliced with a slicer. 2) a resin material is applied to the mold. 3) Manufactured by a notch method, such as a method of manufacturing into a thin sheet by pouring in and pressing, and 3) Dissolving the raw resin and extruding it from a T-die and directly manufacturing it into a sheet It had been. For example, Patent Document 1 manufactures a polishing pad by a reaction injection molding method.

[0005] Also, in the case of a laminated polishing pad, since it was manufactured by laminating a plurality of resin sheets such as a polishing layer and a cushion layer obtained by the above method with an adhesive or double-sided tape, production with many manufacturing processes Had a problem of poor sex. In order to solve the problem, in Patent Document 2, a laminated polishing pad is manufactured using an extruder.

[0006] In addition, a method of continuously producing a polyurethane / polyurea abrasive sheet material has been proposed in order to prevent variations in hardness, bubble size, and the like due to a batch-type production method (Patent Document 3). . Specifically, a polyurethane raw material is mixed with a fine powder having a particle size of 300 πι or less or an organic foaming agent, and the mixture is discharged between a pair of endless track belts and cast. Thereafter, a polymerization reaction of the mixture is performed by a heating means, and the formed sheet-like molded product is separated from the face belt to obtain an abrasive sheet material.

[0007] On the other hand, as a polishing pad used for high-precision polishing, a polyurethane foam sheet is generally used. However, the polyurethane foam sheet is excellent in local flattening ability, but it is difficult to apply uniform pressure to the entire wafer surface due to insufficient cushioning. For this reason, usually, a soft and strong cushion layer is separately provided on the back surface of the polyurethane foam sheet, and is used as a laminated polishing pad for polishing. For example, the following have been developed as laminated polishing nodes.

[0008] A polishing pad in which a relatively hard first layer and a relatively soft second layer are laminated, and a groove having a predetermined pitch or a protrusion having a predetermined shape is provided on the polishing surface of the first layer is disclosed. (Patent Document 4).

[0009] Further, the first sheet-like member having elasticity and having irregularities formed on the surface thereof, and the surface of the first sheet-like member provided with the irregularities are opposed to the polished surface of the substrate to be processed. Have a surface to do An abrasive cloth having a second sheet-like portion is disclosed! /, (Patent Document 5).

Furthermore, a polishing pad is disclosed that includes a polishing layer and a support layer that is laminated on one surface of the polishing layer and is a foam having a higher compressibility than the polishing layer (Patent Document 6).

However, since the conventional laminated polishing pad is manufactured by bonding the polishing layer and the cushion layer with a double-sided tape (adhesive layer), the slurry is interposed between the polishing layer and the cushion layer during polishing. And the adhesive strength of the double-sided tape weakens, and as a result, the polishing layer and the cushion layer peel off.

In addition, there is a problem in determining the flatness of the wafer surface when performing CMP. In other words, it is necessary to detect when the desired surface characteristics and planar state are reached. Conventionally, with respect to the thickness of the oxide film, the polishing rate, etc., a test wafer has been processed periodically, and after confirming the result, the product wafer has been polished.

[0013] In this method, the time and cost of processing the test wafer are wasted, and the force and the first processing are completely applied! /, NA! /, The test wafer and the product wafer However, due to the loading effect peculiar to CMP, the polishing results differ, and it is difficult to accurately predict the processing results unless the product wafer is actually processed.

[0014] Therefore, recently, in order to solve the above-described problems, there is a demand for a method capable of detecting a point in time when desired surface characteristics and thickness are obtained in the CMP process. For such detection, a film thickness monitoring mechanism using a laser beam is incorporated into the rotating platen in terms of the force S in which various methods are used, measurement accuracy, and spatial resolution in non-contact measurement. Optical detection methods (Patent Documents 7 and 8) are becoming mainstream.

[0015] The optical detection means specifically means polishing by irradiating a wafer with a light beam through a window (light transmission region) through a polishing node and monitoring an interference signal generated by the reflection. This is a method of detecting the end point of.

[0016] Currently, as a light beam, He—Ne laser light having a wavelength of around 600 nm or 380 nm is used.

White light using a halogen lamp having a wavelength of ˜800 nm is generally used.

In such a method, the end point is determined by monitoring the change in the thickness of the surface layer of the wafer and knowing the approximate depth of the surface irregularities. This change in thickness is the depth of the unevenness. When it becomes equal to, the CMP process is terminated. Various methods have been proposed for detecting the end point of polishing using such optical means and for the polishing pad used in the method.

[0018] For example, there is disclosed a polishing pad having at least a part of a transparent polymer sheet that transmits solid, homogeneous light having a wavelength of 190 nm to 3500 nm (Patent Document 9). Further, a polishing pad in which a stepped transparent plug is inserted is disclosed (Patent Document 10). Also, a polishing pad having a transparent plug that is flush with the polishing surface is disclosed (Patent Document 11).

On the other hand, proposals (Patent Documents 12 and 13) for preventing the slurry from leaking from the boundary (seam) between the polishing region and the light transmission region have also been made. However, even when these transparent leakage prevention sheets are provided, the slurry leaks out from the boundary (seam) between the polishing region and the light transmission region to the lower part of the polishing layer, and the slurry accumulates on this leakage prevention sheet, resulting in an optical end point. There is a problem with detection.

[0020] Further, a rod or plug of the first resin is disposed in the liquid second resin, the second resin is cured to produce a molded product, and the molded product is sliced to transmit light. A method of manufacturing a polishing pad in which a region and a polishing region are integrated is disclosed (Patent Document 14). However, in the above manufacturing method, stress due to the difference in thermal shrinkage between the two materials remains at the bonding interface between the two materials at the time of molding, and slurry leakage may occur due to easy peeling at the bonding interface.

[0021] Further, before rapidly cooling the primary-annealed window to a predetermined temperature, a polishing pad material is supplied to the outer periphery of the primary-annealed window, and the window and the polishing pad material are connected to each other. A method of manufacturing a polishing pad by annealing and then slicing the molded product is disclosed (Patent Document 15). However, in the above manufacturing method, when the polishing pad material is hardened and contracted, excessive stress is applied to the window, and there is a possibility that residual stress deformation or swelling occurs in the window. Thereby, the flatness of the window is impaired, the optical detection accuracy is a fear force ^s decreases.

[0022] Further, in order to prevent slurry leakage, a method of disposing a transparent film having an adhesive applied on the upper and lower surfaces between an upper layer pad and a lower layer pad is disclosed (Patent Document 16). Shi However, if there is an adhesive layer between the light transmissive region and the transparent film, the light transmittance is lowered and the optical detection accuracy may be lowered.

Patent Document 1: JP 2004-42189 A

Patent Document 2: Japanese Patent Laid-Open No. 2003-220550

Patent Document 3: Japanese Patent Application Laid-Open No. 2004-169038

Patent Document 4: JP 2003 53657 A

Patent Document 5: Japanese Patent Laid-Open No. 10-329005

Patent Document 6: Japanese Unexamined Patent Application Publication No. 2004-25407

Patent Document 7: US Patent No. 5069002

Patent Document 8: US Patent No. 5081421

Patent Document 9: Japanese Patent Publication No. 11 512977

Patent Document 10: JP-A-9 7985

Patent Document 11: Japanese Patent Laid-Open No. 10-83977

Patent Document 12: JP 2001-291686 A

Patent Document 13: Special Table 2003-510826

Patent Document 14: Japanese Unexamined Patent Application Publication No. 2005-210143

Patent Document 15: Japanese Unexamined Patent Publication No. 2005-354077

Patent Document 16: Japanese Patent Laid-Open No. 2003-68686

Disclosure of the invention

Problems to be solved by the invention

[0024] An object of the present invention is to provide a method for producing a long polishing pad that can prevent slurry leakage and is excellent in optical detection accuracy with high productivity.

Means for solving the problem

[0025] As a result of intensive studies to solve the above problems, the present inventors have found that the above object can be achieved by the following method for producing a long polishing pad, and have completed the present invention. .

[0026] That is, the manufacturing method of a long polishing pad of the first A of the present invention includes a step of producing a long polishing region having a polyurethane foam force, and an opening composed of a through hole and a shelf is formed in the long length. A step of forming in the polishing region, a step of producing a convex long light transmission region thinner than the long polishing region, a step of installing the long light transmission region in the opening of the long polishing region, and A step of attaching a transparent support film to the back side of the long polishing region.

[0027] The manufacturing method of the long polishing pad of the first B of the present invention includes a step of producing a long polishing region made of polyurethane foam, and a shelf is continuously formed on one side and in the length direction of the long polishing region. A step of forming, a step of producing a convex long light transmission region that is thinner than the long polishing region, an opening for inserting the long light transmission region so that the shelf and the shelf are opposed to each other A step of disposing the two long polishing regions in parallel so as to form a step, a step of installing the long light transmission region in the opening, and a transparent support film on the polishing back surface side of the long polishing region. The process of bonding is included.

[0028] According to the above manufacturing method, it is possible to easily manufacture a long polishing pad having a long light transmission region. Further, since the light transmission region and the polishing region are formed on the transparent support film, the slurry does not leak below the transparent support film during polishing. In addition, since the long polishing pad of the present invention has a space between the long light transmission region and the transparent support film, the light transmission region and the support film are bonded using an adhesive. Compared to the above, the optical detection accuracy is excellent. In the long polishing pad of the present invention, a cushion layer may be laminated on one side of the transparent support film.

[0029] The thickness of the thickest portion of the long light transmission region is preferably 50 to 90% of the thickness of the long polishing region. If it is less than 50%, the long light transmission area disappears or becomes too thin due to wear due to long use of the long polishing pad, optical detection becomes impossible, or optical detection due to slurry leakage. The accuracy tends to decrease. On the other hand, if it exceeds 90%, the back surface of the long light transmission region may come into contact with the adhesive layer for laminating the transparent support film during production, which is not preferable for production.

[0030] The method for producing a long polishing pad according to the second aspect of the present invention includes a step of preparing a cell-dispersed urethane composition by a mechanical foaming method, a transparent support film is disposed in a long mold, and the process is performed on the support film. A step of disposing a mold for forming a light transmission region having an injection hole and an injection wall at a predetermined position; discharging a light transmission region forming material into the injection hole; Curing to form a light transmission region, discharging the cell-dispersed urethane composition onto the transparent support film outside the injection hole, curing the cell-dispersed urethane composition, and forming a polished region; and A step of releasing the light transmission region forming mold and the long mold to produce a long polishing layer having a gap between the light transmission region and the polishing region.

[0031] According to the above manufacturing method, a long polishing layer having a light transmission region can be easily manufactured, and a long polishing pad can be manufactured with high productivity. Further, since the light transmission region and the polishing region are formed on the transparent support film, the slurry does not leak below the transparent support film during polishing. In addition, since the light transmission region of the present invention is directly formed (self-adhering) on the transparent support film, the optical transmission region and the support film are bonded to each other using an adhesive. Excellent detection accuracy. Furthermore, in the manufacturing method of the present invention, since a gap is provided between the light transmission region and the polishing region, no stress due to the thermal shrinkage difference remains between the two materials. As a result, it is possible to solve the disadvantage that both members are peeled off due to residual stress during polishing as in a conventional polishing pad, and the polishing characteristics are affected. The obtained long polishing layer can be used as a long polishing pad of a laminated type by laminating a cushion layer on one side of a transparent support film which can be used alone as a long polishing pad.

[0032] It is preferable that the light transmission region is made of a thermosetting resin, and it is particularly preferable that the light transmitting region is a thermosetting polyurethane resin. In that case, since the light transmission region forming material and the cell dispersed urethane composition can be thermally cured simultaneously, the production process becomes simple.

[0033] The thickness of the injection wall of the light transmission region forming mold is preferably lmm or less! /.

When the thickness force of the injection wall exceeds mm, the gap between the light transmission area and the polishing area becomes too wide, and the slurry tends to accumulate in the gap, so that scratches tend to occur.

[0034] The method for producing a long polishing pad according to the third aspect of the present invention includes a step of preparing a cell-dispersed urethane composition by a mechanical foaming method, and a spacer and a light transmission region in a long mold. The step of arranging in a laminated state, the spacer and the light transmitting region are arranged. /, Discharge the cell-dispersed urethane composition to the area, cure the cell-dispersed urethane composition, Laminating a transparent support film on the side of the surface where the spacer of the long polishing region was peeled off, the step of producing a long polishing region made of a foamed foam, the step of peeling the spacer from the long polishing region, And a step of producing a long polishing layer having a space portion between the light transmission region and the transparent support film.

[0035] According to the above manufacturing method, it is possible to easily manufacture a long polishing pad having a light transmission region. Further, since the long polishing region is self-adhering to the light transmission region, the slurry does not enter the interface between the two regions. In addition, since the long polishing pad of the present invention has a space between the light transmission region and the transparent support film, the light transmission region and the support film are bonded together using an adhesive. Compared with the optical detection accuracy.

[0036] It is preferable that the spacer and the light transmission region are of a long type. By using a long-type spacer and a light transmission region, the light transmission region is always formed in the length direction of the long polishing pad as well as making the long polishing pad simpler. Also preferred from a detection point of view.

[0037] The width of the spacer is preferably equal to or less than the width of the light transmission region in order to prevent deformation of the light transmission region due to pressurization during polishing.

[0038] The thickness of the light transmission region is preferably 50 to 90% of the thickness of the long polishing region. If it is less than 50%, the light transmission area disappears or becomes too thin due to wear due to long use of the long polishing pad, optical detection becomes impossible, and optical detection accuracy decreases due to slurry leakage. Tend to. On the other hand, if it exceeds 90%, the back surface of the light-transmitting region may come into contact with the adhesive layer for laminating the transparent support film during production, which is not preferable for production.

[0039] The third-B manufacturing method of the long polishing pad of the present invention includes a step of preparing a cell-dispersed urethane composition by a mechanical foaming method, and a concave light-transmitting region in the long mold is depressed below. A step of disposing the light-transmitting region, discharging the cell-dispersed urethane composition to the region, curing the cell-dispersed urethane composition, and forming a polyurethane foam. A long polishing layer having a space portion between the light transmission region and the transparent support film, wherein a transparent support film is laminated on the surface side having the depression of the light transmission region. The process of producing is included. [0040] According to the above manufacturing method, it is possible to easily manufacture a long polishing pad having a light transmission region. Further, since the long polishing region is self-adhering to the light transmission region, the slurry does not enter the interface between the two regions. In particular, in the manufacturing method of the second aspect of the present invention, since the concave light transmission region having the same thickness as the polishing region is used, it is possible to suppress the deformation of the light transmission region during polishing, and the optical detection. Intrusion of the slurry can be further prevented by increasing the adhesion area with the long polishing region as well as improving accuracy. Further, since the long polishing pad of the present invention has a space between the light transmission region and the transparent support film, when the light transmission region and the support film are bonded together using an adhesive, Compared with optical detection accuracy.

[0041] The light transmission region is preferably a long type for the same reason as described above.

[0042] The depth of the recess is preferably 10 to 50% of the thickness of the light transmission region. If it is less than 10%, the bottom surface of the recess may come into contact with the adhesive layer for laminating the transparent support film during production, which is not preferable for production. On the other hand, if it exceeds 50%, the light transmission area disappears or becomes too thin due to wear due to long use of the long polishing pad, optical detection becomes impossible, or optical detection accuracy due to slurry leakage It is in the direction when it declines.

[0043] A method for producing a 3-C long polishing pad according to the present invention includes a step of preparing a cell-dispersed urethane composition by a mechanical floss method, and a spacer is fed into the surface material while feeding the surface material. A step of disposing one and a light transmission region in a stacked state, a step of continuously discharging the cell-dispersed urethane composition onto the face material on which a spacer and a light transmission region are not disposed, A step of laminating another face material on the cell-dispersed urethane composition, a step of curing the cell-dispersed urethane composition while uniformly adjusting the thickness, and creating a long polishing region made of polyurethane foam, A step of peeling the face material and the spacer from the polishing region, and a transparent support film is laminated on the surface side from which the spacer of the long polishing region is peeled, and a space is formed between the light transmission region and the transparent support film. A long polishing layer having a portion Including the process of making.

[0044] The spacer and the light transmission region are preferably long types for the same reason as described above. In addition, the width of the spacer is equal to or less than the width of the light transmission region for the same reason as described above. It is preferable that In addition, the thickness of the light transmission region is preferably 50 to 90% of the thickness of the long polishing region for the same reason as described above.

[0045] A method for producing a 3-D long polishing pad according to the present invention includes a step of preparing a cell-dispersed urethane composition by a mechanical floss method, and a concave light is provided inside the face material while feeding the face material. A step of disposing the transmissive region so that the depression is on the lower side, a step of continuously discharging the cell-dispersed urethane composition onto the face material on which the light-transmitting region is not disposed, The step of laminating another face material on the urethane composition, the step of curing the cell-dispersed urethane composition while uniformly adjusting the thickness, and producing a long polishing region comprising a polyurethane foam, the long polishing A step of peeling the face material from the region, and laminating a transparent support film on the surface side having the indentation of the light transmission region, to produce a long polishing layer having a space portion between the light transmission region and the transparent support film The process of carrying out.

[0046] A method for producing a 3-E long polishing pad of the present invention includes a step of preparing a cell-dispersed urethane composition by a mechanical floss method, a concave mold inside the transparent support film while feeding out the transparent support film. A step of disposing the light transmission region of the hollow so that the depression is on the lower side, the light transmission region is disposed, and the bubble-dispersed urethane composition is continuously formed on the transparent support film. A step of laminating a face material on the discharged cell-dispersed urethane composition, a long polishing region comprising a polyurethane foam by curing the cell-dispersed urethane composition while uniformly adjusting the thickness. Forming a long polishing layer having a space between the light transmission region and the transparent support film, and peeling the face material from the long polishing region.

[0047] The light transmission region is preferably a long type for the same reason as described above. In addition, the depth of the recess is preferably 10 to 50% of the thickness of the light transmission region for the same reason as described above.

[0048] According to the above manufacturing method, a long polishing layer can be continuously manufactured, and a long polishing pad can be manufactured with high productivity. Further, the obtained long polishing pad has the same excellent function as described above.

Brief Description of Drawings

[0049] FIG. 1 is a schematic configuration diagram showing an example of a polishing apparatus used in CMP polishing. FIG. 2 is a schematic view showing an example of a cross section of the long polishing pad of the first invention.

FIG. 3 is a schematic view showing an example of a resin sheet in which a large number of grooves are formed at predetermined intervals.

FIG. 4 is a schematic view showing an example of a cross section when a resin sheet is cut in the width direction.

FIG. 5 is a schematic view showing an example of a cross section of the long polishing pad of the second invention.

FIG. 6 is a schematic view showing an example of the production process of the long polishing pad of the second invention.

FIG. 7 is a schematic diagram showing an example of the structure of a mold for forming a light transmission region

FIG. 8 is a schematic view showing an example of a cross section of the long polishing pad of the third invention.

FIG. 9 is a schematic view showing an example of a cross section of the long polishing pad of the third invention.

FIG. 10 is a schematic view showing an example of a resin sheet in which a number of depressions are formed at predetermined intervals.

FIG. 11 is a schematic view showing an example of a cross section when a resin sheet is cut in the width direction.

FIG. 12 is a schematic view showing the production process of the long polishing pad of the third invention.

FIG. 13 is a schematic view showing a production process of the long polishing pad of the third invention.

FIG. 14 is a schematic view showing a method for polishing a semiconductor wafer using a web-type polishing apparatus.

FIG. 15 is a schematic diagram showing a method for polishing a semiconductor wafer using a linear polishing apparatus.

FIG. 16 is a schematic diagram showing a method for polishing a semiconductor wafer using a reciprocating polishing apparatus.

1: Polishing pad

2: Polishing surface plate

3: Abrasive (Slurry)

4: Material to be polished (semiconductor wafer)

5: Support base (polishing head)

6, 7: Rotation axis

8: Long polishing pad (long polishing layer)

9: (Long) Polishing area

10 (10a, 10b): (Long) Light transmission area

11: Transparent support film 15: Resin sheet

16: Groove

17: Shoulder

18: Head

19: Cutting position

20: Adhesive layer

21 a: Supply roll

21b: Collection roll

22: Ronore

23: Cell-dispersed urethane composition

24: Long mold

25: Form for forming light transmission region

26: Injection hole

27: Injection wall

28: Light transmission region forming material

29: Resin sheet

30:: Recess

31:: Cutting position

32: Mixing head

33:: Face material

34: Conveyor

35: Ronore

36: space

37: Double-sided tape (adhesive layer)

BEST MODE FOR CARRYING OUT THE INVENTION

FIG. 2 is a cross-sectional view of the long polishing pad of the first invention. The long polishing region 9 is made of a polyurethane foam having fine bubbles. Polyurethane is excellent in wear resistance and has a raw material composition Since a polymer having desired physical properties can be easily obtained by variously changing the thickness, it is a preferable material as a forming material of the polishing region.

[0052] The polyurethane comprises an isocyanate component, a polyol component (high molecular weight polyol, low molecular weight polyol), and a chain extender.

[0053] As the isocyanate component, a compound known in the field of polyurethane can be used without particular limitation. Isocyanate components include 2,4-toluene diisocyanate, 2, 6

Aromatic diisocyanates such as tarendene isocyanate, p-phenylene diisocyanate, m-phenylene diisocyanate, p-xylylene diisocyanate, m-xylylene diisocyanate, ethylene diisocyanate 2, 2, 4-trimethylhexamethylene diisocyanate, aliphatic diisocyanates such as 1,6-hexamethylene diisocyanate, 1,4-cyclohexane diisocyanate, 4,4,1 dicyclo Hexylmethane diisocyanate, Toka S. These may be used alone or in combination of two or more.

[0054] As the isocyanate component, in addition to the diisocyanate compound, a polyfunctional polyisocyanate compound having three or more functions can be used. As the polyfunctional isocyanate compound, a series of diisocyanate adduct compounds are commercially available as Desmodur-N (manufactured by Bayer) and trade name Deuranate (manufactured by Asahi Kasei Kogyo).

[0055] Among the above-mentioned isocyanate components, it is preferable to use an aromatic diisocyanate and an alicyclic diisocyanate in combination, and particularly preferable to use toluene diisocyanate and dicyclohexylmethane diisocyanate in combination!

[0056] Examples of the high molecular weight polyol include a polyether polyol typified by polytetramethylene ether glycol, a polyester polyol typified by polybutylene adipate, and a polyester polycarbonate polyol exemplified by a reaction product with xylene carbonate. A polyester polycarbonate polyol obtained by reacting ethylene carbonate with a polyhydric alcohol and then reacting the resulting reaction mixture with an organic dicarboxylic acid, and a polyol. Examples thereof include polycarbonate-polyol obtained by a transesterification reaction between a lithium compound and aryl carbonate. These may be used alone or in combination of two or more.

[0057] The number average molecular weight of the high molecular weight polyol is not particularly limited, but is preferably 500 to 2000 from the viewpoint of the elastic properties of the resulting polyurethane resin. When the number average molecular weight is less than 500, a polyurethane resin using the number average molecular weight does not have sufficient elastic properties and becomes a brittle polymer. For this reason, the polishing area produced from this polyurethane resin becomes too hard, which causes scratches on the wafer surface. Moreover, since it is easy to wear, it is not preferable from the viewpoint of pad life. On the other hand, when the number average molecular weight exceeds 2000, the polyurethane resin using the number average molecular weight is too soft and strong, so that the polished region produced from this polyurethane resin tends to have poor planarization characteristics.

[0058] In addition to the above-described high molecular weight polyol as a polyol component, ethylene glycol, 1,2-propylene glycolanol, 1,3-propylene glycolanol, 1,4 butanediol, 1,6-hexanediol, neopentyl glycol It is preferable to use a low molecular weight polyol such as 1,4-cyclohexanedimethanol, 3-methyl-1,5-pentanediol, diethylene glycol, triethylene glycol, or 1,4 bis (2hydroxyethoxy) benzene. Use low molecular weight polyamines such as ethylenediamine, tolylenediamine, diphenylmethanediamine, and ethylenetriamine.

[0059] The ratio of the high molecular weight polyol to the low molecular weight polyol in the polyol component is determined by the characteristics required for the polishing region produced from these.

[0060] In the case where a polyurethane foam is produced by the prepolymer method, a chain extender is used for curing the prepolymer. The chain extender is an organic compound having at least two or more active hydrogen groups. Examples of the active hydrogen group include a hydroxyl group, a primary or secondary amino group, and a thiol group (SH). Specifically, 4, 4'-methylene bis (o chloroaniline) (MOCA), 2, 6 dichloro-p-phenylenediamine, 4, 4'-methylene bis (2, 3 -dichloroaniline), 3, 5 bis ( Methylthio) 1, 2, 4 Toluenediamine, 3, 5 Bis (methylthio) 2,6 Toluenediamine, 3, 5 Jetyltoluene 2,4 Diamine, 3, 5 Jetyltoluene 2,6 Diamine, Trimethyleneglycol diamino Zoate, 1,2 bis (2aminophenylthio) ethane, 4,4, -diamino-3,3, -diethyl-5,5'-dimethyldiphenylmethane, N, N'-dibutyl butyl-4,4 ' Aminodiphenylmethane, 3, 3 'jetyl 4,4'-diaminodiphenylmethane, m-xylylenediamine, N, N, 1-sec sec butyl p-phenylenediamine, m-phenylenediamine, p-xylylenediamine, etc. Examples thereof include polyamines exemplified above, and the low molecular weight polyols and low molecular weight polyamines described above. These may be used alone or in combination of two or more.

[0061] The ratio of the isocyanate component, the polyol component, and the chain extender can be variously changed depending on the molecular weight of each, the desired physical properties of the polishing region, and the like. In order to obtain a polishing region having the desired polishing characteristics, the number of isocyanate groups of the isocyanate component relative to the total number of active hydrogen groups (hydroxyl group + amino group) of the polyol component and the chain extender is 0.80-1.20. It is preferable that there is, more preferably from 0.99 to 1.15. When the number of isocyanate groups is out of the above range, curing failure occurs and the required specific gravity and hardness cannot be obtained, so that the polishing characteristics are deteriorated.

[0062] The polyurethane foam can be produced by either the pre-polymer method or the one-shot method. An isocyanate-terminated prepolymer is synthesized beforehand from an isocyanate component and a polyol component, and chain extension is performed on this. The prebolimer method in which the agent is reacted is preferable because the resulting polyurethane has excellent physical properties.

[0063] Examples of the method for producing a polyurethane foam include a method of adding hollow beads, a mechanical foaming method (including a mechanical froth method), and a chemical foaming method.

[0064] Particularly preferred is a mechanical foaming method using a silicone surfactant, which is a copolymer of a polyalkylsiloxane and a polyether and does not have an active hydrogen group. Examples of suitable silicon surfactants include SH-192 and L-5340 (manufactured by Toray Dow Coung Silicon).

[0065] An example of a method for producing a long polishing region made of polyurethane foam will be described below. The manufacturing method of the force and the long polishing region has the following steps.

1) Foaming process for producing bubble dispersion of isocyanate-terminated prepolymer

Add a silicone-based surfactant to the isocyanate-terminated polymer (first component) Stir in the presence of a reactive gas to disperse the non-reactive gas as fine bubbles to obtain a bubble dispersion. When the prepolymer is solid at room temperature, it is preheated to an appropriate temperature and melted before use.

2) Hardener (chain extender) mixing process

A chain extender (second component) is added to the above bubble dispersion, mixed and stirred to obtain a foaming reaction solution. 3) Casting process

The foaming reaction solution is poured into a long mold.

4) Curing process

The foaming reaction liquid poured into the long mold is heated and cured by reaction.

[0066] The non-reactive gas used to form the fine bubbles is preferably a non-flammable gas, specifically nitrogen, oxygen, carbon dioxide gas, a rare gas such as helium or argon, or a mixture thereof. Gas is exemplified, and the use of air that has been dried to remove moisture is most preferable in terms of cost.

[0067] As a stirrer for dispersing non-reactive gas in the form of fine bubbles and dispersing in the first component containing the silicon-based surfactant, a known stirrer can be used without particular limitation, and specifically, a homogenizer. Examples include dissolvers, two-axis planetary mixers (planetary mixers), etc. The shape of the stirring blade of the stirring device is not particularly limited, but it is preferable to use a Whisper type stirring blade to obtain fine bubbles!

[0068] It is also preferable that different stirring devices are used for the stirring for creating the cell dispersion in the foaming step and the stirring for adding and mixing the chain extender in the mixing step. In particular, it is preferable to use a stirring device that does not entrain large bubbles even if the stirring in the mixing step is not stirring that forms bubbles. As such a stirring device, a planetary mixer is preferable. It is also suitable to adjust the stirring conditions, such as adjusting the rotation speed of the stirring blades as necessary, even if the same stirring device is used as the stirring device for the foaming step and the mixing step.

[0069] In the method of producing a polyurethane foam, heating and post-curing the foam that has reacted until the foaming reaction liquid is poured into the mold and no longer flows has the effect of improving the physical properties of the foam. Is very suitable. Pour foaming reaction liquid into long mold Even under such conditions, heat is not immediately transferred to the reaction components, so that the bubble diameter does not increase. The curing reaction is preferably performed at normal pressure because the bubble shape is stable.

[0070] In addition, a foaming reaction liquid is prepared by a mechanical floss method, and the foaming reaction liquid is continuously discharged while feeding the face material, and the foaming reaction liquid is cured while uniformly adjusting the thickness. A long polishing region made of polyurethane foam may be continuously produced. When a polyurethane foam is produced by a mechanical calfloss method, it is preferable that the viscosity of the foaming reaction liquid at the time of discharge is about 5 to about lOPa's.

[0071] The average cell diameter of the polyurethane foam is a force S of 30 to 80 m, preferably S, and more preferably 30 to 60 111. When deviating from this range, the polishing rate tends to decrease or the planarity (flatness) of the polished material (Weno) after polishing tends to decrease.

[0072] The specific gravity of the polyurethane foam is preferably 0.5 to 1.3. When the specific gravity is less than 0.5, the surface strength of the polishing region decreases and the planarity of the material to be polished tends to decrease. On the other hand, when the ratio is larger than 1.3, the number of bubbles on the surface of the polishing region decreases, and the smoothness is good, but the polishing rate tends to decrease.

[0073] The polyurethane foam preferably has a hardness of 45 to 70 degrees as measured by a Asker D hardness meter. When the Asker D hardness is less than 45 degrees, the planarity of the material to be polished is reduced. When the hardness is greater than 70 degrees, the planarity is good, but the uniformity of the material to be polished is decreased. Tend to.

[0074] The polishing surface in contact with the material to be polished in the long polishing region preferably has a concavo-convex structure for holding and renewing the slurry. The polishing area made of foam has many openings on the polishing surface and holds and renews the slurry. However, the slurry is held and renewed by forming an uneven structure on the polishing surface. Further, it can be carried out more efficiently, and the destruction of the material to be polished due to adsorption with the material to be polished can be prevented. The concavo-convex structure is not particularly limited as long as it holds and renews the slurry. For example, X grooves, XY lattice grooves, concentric circular grooves, through holes, non-through holes, polygonal columns, cylinders, Examples include spiral grooves, eccentric circular grooves, radiant grooves, and combinations of these grooves. In addition, these rugged structures generally have a regular force, and desirable slurry retention and renewability. Therefore, it is possible to change the groove pitch, groove width, groove depth, etc. for each certain range.

[0075] The thickness of the long polishing region is not particularly limited, but is usually about 0.8 to 4 mm, preferably! To 2.5 mm. As a method for producing the polishing region of the thickness, a method of making the foam block a predetermined thickness using a band saw type or canna type slicer, pouring a resin into a long mold having a predetermined thickness of the cavity, and curing the resin. And a method using a coating technique or a sheet forming technique.

[0076] The thickness variation of the long polishing region is preferably 100 m or less. When the thickness variation exceeds 100 m, the long polishing area has a large undulation, and there are parts with different contact conditions with the material to be polished, which adversely affects the polishing characteristics. Moreover, in order to eliminate the thickness variation in the long polishing region, generally, the ability to dress the polished surface with a dresser in which diamond abrasive grains are electrodeposited and fused in the initial stage of polishing exceeds the above range. As a result, the dressing time becomes longer and the production efficiency is lowered.

[0077] As a method of suppressing the thickness variation in the long polishing region, a method of buffing the surface with a buffing machine can be mentioned. In addition, when puffing, it is preferable to perform in stages with abrasives with different particle sizes.

[0078] The length and width of the long polishing region can be appropriately adjusted according to the polishing apparatus used. The length is usually about 5 to 15 m, and the width is usually about 60 to 250 cm.

[0079] In the manufacturing method of the first A of the present invention, a through hole is then formed in the long polishing region 9.

An opening 14 consisting of 12 and a shelf 13 is formed. The formation position and the number of openings are not particularly limited, but it is preferable to form one at the center in the width direction of the long polishing region and continuously in the length direction.

[0080] The opening 14 may be formed by, for example, 1) punching a polyurethane foam at a predetermined position with a Tomson blade or the like to form the through hole 12, and cutting both sides of the through hole 12 with a tool or the like. A method of forming shelf 13 by IJ, 2) Cutting a polyurethane foam at a predetermined position to the depth of shelf 13 with the width of opening 14 to form a groove, and then forming the groove with the width of through hole 12 And a method of forming the through-hole 12 and the shelf 13 by punching out the polyurethane foam, and 3) a method of using a long mold having the shape of the opening 14. In addition, using a grooving machine When the opening 14 is formed, the long polishing region 9 is wound around a roll, punched or cut while being fed out, and then the processed long polishing region 9 is wound around the roll again. Adopt it.

[0081] The width of the through-hole 12 is not particularly limited, but is usually about 5 to 15 mm. The width and height of the shelf 13 are not particularly limited, but the width is usually about 2 to 5 mm and the height is about 0.3 to 0 • 5 mm.

[0082] On the other hand, in the manufacturing method of the first B of the present invention, after that, a shelf is continuously formed in one side of the long polishing region in the length direction, and the long polishing region having the shelf is divided into two. Make one. For example, 1) a polyurethane foam at a predetermined position is cut at a depth of the shelf 13 and twice as wide as the shelf 13 to form continuous grooves in the length direction; A method of cutting the polyurethane foam into two along the central part of the groove, 2) Continuously cutting one side of two individually produced polyurethane foams in the length direction to form each shelf 13 3) One polyurethane foam is cut into two in the length direction, and one side of each polyurethane foam is continuously cut in the length direction to form a shelf 13 respectively. .

[0083] In the 1B manufacturing method of the present invention, the width of each long polishing region 9 is not particularly limited, but is usually about 30 to about 125 cm. The width and height of the shelf 13 are the same as described above.

[0084] The material for forming the long light transmission region 10 is not particularly limited! /, But it is possible to detect the optical end point with high accuracy in the state of polishing! /, In the entire range of wavelengths from 300 to 800 nm. It is preferable to use a material having a light transmittance of 40% or more, more preferably a material having a light transmittance of 50% or more. Examples of such materials include thermosetting resins such as polyurethane resins, polyester resins, phenol resins, urea resins, melamine resins, epoxy resins, and acrylic resins; polyurethane resins, polyester resins, polyamide resins, cellulose resins, Thermoplastic resins such as acrylic resin, polycarbonate resin, halogen resin (polyvinyl chloride, polytetrafluoroethylene, polyvinylidene fluoride, etc.), polystyrene, and olefin resin (polyethylene, polypropylene, etc.); for light such as ultraviolet rays and electron beams Examples thereof include a photo-curable resin and a photosensitive resin that are more cured. These resins are single Two or more types may be used in combination. It is preferable that the thermosetting resin is hardened at a relatively low temperature. When using a photocurable resin, it is preferable to use a photopolymerization initiator in combination. Among these, it is preferable to use a thermosetting resin, and it is particularly preferable to use a thermosetting polyurethane resin.

[0085] The convex long light transmission region 10 can be produced by, for example, an extrusion molding method or a casting molding method. In addition, as shown in FIG. 3, the resin sheet 15 is subjected to a number of groove processing at predetermined intervals, and then the central portion of the groove 16 is cut in the length direction to efficiently produce the convex long light transmission region 10. can do. FIG. 4 is a cross-sectional view of the resin sheet 15 cut in the width direction. It is preferable that the width and height of the shoulder portion 17 of the long light transmission region 10 correspond to the width and depth of the shelf portion 13 of the long polishing region. Further, the width of the head portion 18 is preferably made to correspond to the width of the through hole 12 in the long polishing region 9. Further, the thickness (h) of the thickest portion of the long light transmission region 10 needs to be at least thinner than the thickness of the long polishing region 9, and is 50 to 90% of the thickness of the long polishing region. More preferably, it is 60 to 85%.

[0086] The transparent support film used in the first present invention is not particularly limited, but is preferably a resin film having high transparency and heat resistance and flexibility. Examples of the material for the resin film include polyesters; polyethylene; polypropylene; polystyrene; polyimides; polybulal alcohol; polychlorinated burs; fluorine-containing resins such as polyfluoroethylene; nylon; cellulose; Engineering plastics; special engineering plastics such as polyetherimide, polyetheretherketone, and polyethersulfone.

[0087] The thickness of the transparent support film is not particularly limited, but is preferably about 20 to 200111 from the viewpoints of strength, winding and the like. Further, the width of the transparent support film is not particularly limited, but is preferably about 60 to 250 cm in consideration of the required size of the polishing layer. In addition, the length of the transparent support film can be set appropriately according to the required length of the polishing layer. Since a lead part (about 2m each in front and back) is required, it is usually about 9-20m, preferably 10 ~; 15m.

[0088] In the manufacturing method of the long polishing pad of the first A of the present invention, the long light transmission region 10 is provided in front of the long light transmission region 10. A step of installing in the opening 14 of the long polishing region 9 and a step of bonding the transparent support film 11 to the polishing back surface side of the long polishing region 9. Note that either of the steps may be performed first or simultaneously.

[0089] In the first B manufacturing method of the long polishing pad of the present invention, the opening 14 is formed so that the shelf and the shelf face each other and the long light transmission region 10 is inserted. Step A for arranging the two long polishing regions 9 in parallel, Step B for installing the long light transmission region 10 in the opening 14, and transparent on the polishing back side of the long polishing region 9 It includes the process C for attaching the support film 1 1. Step C may be performed after performing steps A and B, or step B may be performed after performing steps A and C.

In the step A, it is preferable that the distance between the two long polishing regions 9 corresponds to the width of the head portion 18 of the long light transmission region 10.

[0091] When the long light transmission region 10 is installed in the opening 14, it is preferable to bond the shelf 13 and the shoulder 17 via the adhesive layer 20. Thereby, the infiltration of the slurry can be completely prevented. The adhesive that is the raw material of the adhesive layer 20 is a known adhesive with no particular limitation. The power that can be used S The hot melt adhesive is preferably used from the viewpoint of automation of the work process, speedup, and labor saving. In particular, it is preferable to use an EVA-based or synthetic rubber-based hot melt adhesive having excellent adhesiveness and a low softening point.

[0092] The bonding method is not particularly limited. For example, the hot-melt adhesive is applied on the shelf 13 while moving the long polishing region 9 on the conveyor belt, and the long light in the opening 14 is applied. After the transmission region 10 is installed, it can be applied by heating and pressing the long light transmission region using a nip roll with a heater. The heating temperature is appropriately adjusted in consideration of the softening point of the hot melt adhesive. The hot melt adhesive may be applied to the shoulder portion of the long light transmission region.

[0093] In addition, as a means of attaching the transparent support film 11 to the polishing back surface side of the long polishing region 9, for example, a method of sandwiching and pressing the long polishing region and the transparent support film with a double-sided tape, a long length For example, an adhesive may be applied to the polishing back surface side of the polishing region and a transparent support film may be attached. However, it is necessary not to provide a double-sided tape or an adhesive at the portion corresponding to the through hole 12 on the transparent support film. On the other hand, the polishing region of the polishing layer in the second aspect of the present invention is made of a polyurethane foam having fine bubbles. The raw material of the polyurethane is the same as described above.

[0095] The polyurethane foam is produced by curing a cell-dispersed urethane composition obtained by mixing a first component containing an isocyanate group-containing compound and a second component containing an active hydrogen group-containing compound. . In the prepolymer method, the isocyanate-terminated polymer is an isocyanate group-containing compound, and the chain extender is an active hydrogen group-containing compound. In the one-shot method, the isocyanate component becomes an isocyanate group-containing compound, and the chain extender and the polyol component become active hydrogen group-containing compounds.

[0096] The cell-dispersed urethane composition is prepared by a mechanical foaming method (including a mechanical calfloss method). Particularly preferred is a mechanical foaming method using a silicone surfactant, which is a copolymer of polyalkylsiloxane and polyether and does not have an active hydrogen group. Examples of suitable silicon-based surfactants include SH-192, L-5340 (manufactured by Toray Dow Coung Silicon) and the like. The addition amount of the silicone-based surfactant is preferably 0.05 to 5% by weight in the polyurethane foam. When the amount of the silicon-based surfactant is less than 0.05% by weight, a fine-bubble foam tends to be not obtained. On the other hand, when it exceeds 5% by weight, it tends to be difficult to obtain a high-hardness polyurethane foam due to the plastic effect of the silicon surfactant.

[0097] If necessary, stabilizers such as antioxidants, lubricants, pigments, fillers, antistatic agents, and other additives may be added! /.

[0098] An example of a method for preparing a cell-dispersed urethane composition will be described below. The method for preparing such a foam-dispersed urethane composition has the following steps.

Add a silicon-based surfactant to the isocyanate-terminated polymer (first component) and stir in the presence of a non-reactive gas to disperse the non-reactive gas as fine bubbles to obtain a cell dispersion. When the prepolymer is solid at room temperature, it is preheated to an appropriate temperature and melted before use.

2) Hardener (chain extender) mixing process

Add the chain extender (second component) to the above bubble dispersion, mix, and stir to create a bubble dispersion urethane. A composition is prepared.

[0099] The non-reactive gas and the stirring device used to form the fine bubbles are the same as described above.

[0100] To the cell-dispersed urethane composition, adding a catalyst that promotes a known polyurethane reaction, such as a tertiary amine compound, does not work. The type and amount of catalyst to be selected are selected in consideration of the flow time for pouring into a mold having a predetermined shape after the mixing step.

[0101] The transparent support film used in the second aspect of the present invention is not particularly limited.

[0102] The light transmitting region forming material used in the second present invention is not particularly limited, and the same thing as mentioned above can be cited by the force S.

[0103] Hereinafter, a method for producing the long polishing pad of the second aspect of the present invention will be described. FIG. 5 is a cross-sectional view of the long polishing pad of the second invention. FIG. 6 is a schematic view showing an example of the production process of the long polishing pad of the second invention.

[0104] The long mold 24 includes a bottom plate and a long formwork. First, the transparent support film 11 is placed on the bottom board, and a long form frame is placed on the transparent support film 11. Then, the bottom plate and the long mold are clamped so that the cast material does not leak from the gap between the transparent support film and the long mold. The transparent support film is preferably provided about 2 m larger than the long frame. The length of the long frame is a force that can be set as appropriate in consideration of the required length of the polishing layer. Usually 5 to 15 m, preferably 7 to 10 m. The width of the long form is not particularly limited, but it is preferably about 60 to 250 cm in consideration of the required size of the polishing layer. The height of the long form is not particularly limited, but is preferably about 10 to 60 mm from the viewpoint of the required thickness of the polishing area and prevention of overflow during casting.

Thereafter, as shown in FIG. 6, a light transmission region forming mold 25 is arranged at a predetermined position on the transparent support film 11.

FIG. 7 (a) is a schematic diagram showing a cross-sectional structure in the X direction of the light transmission region forming mold. FIG. 7- (b) is a schematic view showing the top structure of the light transmission region forming mold. FIG. 7 (c) is a schematic diagram showing the bottom structure of the light transmission region forming mold. [0107] The mold 25 for forming a light transmission region can be produced by a casting molding method using, for example, metal or plastic as a raw material. The length of the light transmission region forming form is not particularly limited as long as it can be set on the long mold as shown in FIG. The mold for forming a light transmission region has an injection hole 26 and an injection wall 27. The injection hole is a hole for injecting the light transmission region forming material 28 to form the light transmission region 10. The injection wall is a wall for preventing the light transmission region forming material 28 and the cell dispersed urethane composition 23 from being mixed, and for forming a certain gap between the light transmission region 10 and the polishing region 9. The wall.

[0108] The length of the injection hole 26 is appropriately adjusted according to the inner wall length of the long mold. Further, the width of the injection hole 26 can be appropriately set according to the required width of the light transmission region, but is preferably about 0.5 to 2 cm. In addition, one injection hole 26 may be provided continuously as shown in FIG. 7- (b)! /, Or a plurality of injection holes may be provided intermittently at predetermined intervals! /, May! / .

[0109] The height of the injection wall 27 is usually about 10 to 60 mm, preferably 20 to 50 mm, from the viewpoint of the required thickness of the polishing region and prevention of overflow during casting. Further, the thickness of the injection wall 27 is preferably 1 mm or less, more preferably 0.9 mm or less, which can be appropriately set in consideration of the space width between the light transmission region and the polishing region. The surface of the injection wall 27 is preferably subjected to a mold release treatment.

Thereafter, the light transmission region forming material 28 is discharged into the injection hole 26, and the light transmission region forming material 28 is cured to form the light transmission region 10. Further, the cell-dispersed urethane composition 23 is discharged onto the transparent support film 11 outside the injection hole 26, and the cell-dispersed urethane composition 23 is cured to form a polishing region 9. Either of the above two steps may be performed first or simultaneously. Considering the work efficiency, it is preferable to perform the above two processes simultaneously! The discharge amount of the light transmission region forming material 28 and the cell dispersed urethane composition 23 is appropriately adjusted in consideration of the thickness and area of the light transmission region and the thickness and area of the polishing region.

[0111] The light transmissive region forming material 28 and the cell dispersed urethane composition 23 are cured by, for example, adjusting the thickness uniformly and then passing through a heating oven provided on a conveyor. The heating temperature is about 40 to 100 ° C, and the heating time is about 5 to 10 minutes. Heating and post-curing the foam-dispersed urethane composition that has reacted until it stops flowing Has the effect of improving the physical properties of the polyurethane foam. In the case where the light transmitting region forming material is a thermoplastic resin, the light transmitting region forming material is cured by cooling after the cell-dispersed urethane composition is thermally cured. When the light transmission region forming material is a photocurable resin, it is cured by irradiation with light such as ultraviolet rays or electron beams. The light transmission region preferably contains as few bubbles as possible from the viewpoint of increasing the light transmittance.

[0112] After that, the light transmission region forming mold and the long mold are released to produce a long polishing layer having a gap between the light transmission region and the polishing region. The obtained long polishing layer may be post-cured, or the length may be appropriately adjusted according to the polishing apparatus to be used. Further, the long polishing layer becomes a long polishing pad through a step of forming a concavo-convex structure on the polishing surface.

[0113] The average bubble diameter in the polishing region is preferably 30 to 80 111, more preferably 30 to 60 111. When deviating from this range, the polishing rate tends to decrease or the planarity (flatness) of the polished material (Weno) after polishing tends to decrease.

[0114] The thickness of the polishing region is not particularly limited, but is usually about 0.8 to 4 mm, and preferably 1.2 to 2.5 mm.

[0115] The specific gravity of the polishing region is preferably 0.5 to 1.3. When the specific gravity is less than 0.5, the strength of the polished surface decreases, and the planarity of the material to be polished tends to deteriorate. On the other hand, when the ratio is larger than 1.3, the number of fine bubbles on the polishing surface decreases, and the planarization characteristics are good, but the polishing rate tends to deteriorate.

[0116] The hardness of the polishing region is preferably 45 to 70 degrees as measured by an Asker D hardness meter. When the D hardness is less than 45 degrees, the planarity of the material to be polished tends to deteriorate. On the other hand, when it is greater than 70 degrees, planarity is good, but the uniformity (uniformity) of the material to be polished tends to deteriorate.

[0117] Further, the thickness variation in the polishing region is preferably 100 m or less for the same reason as described above.

[0118] The thickness of the light transmission region is not particularly limited, but is preferably equal to or less than the thickness of the polishing region. If the light transmission region is thicker than the polishing region, the object to be polished may be damaged by the protruding portion during polishing. [0119] In the long polishing pad of the second aspect of the present invention, the polishing surface that comes into contact with the material to be polished (wafer) preferably has a concavo-convex structure for holding and renewing the slurry in the same manner as described above.

On the other hand, FIGS. 8 and 9 are cross-sectional views of the long polishing pad 8 of the third aspect of the present invention. The long polishing region 9 is made of a polyurethane foam having fine bubbles. The raw materials for polyurethane are the same as described above.

[0121] The polyurethane foam is produced by curing a cell-dispersed urethane composition obtained by mixing a first component containing an isocyanate group-containing compound and a second component containing an active hydrogen group-containing compound. . The cell-dispersed urethane composition can be prepared by the same method as described above.

[0122] The raw material of the spacer used in the third aspect of the present invention is not particularly limited. For example, a polyurethane resin, a polyester resin, a polyamide resin, a cellulose resin, an acrylic resin, a polycarbonate resin, a fluororesin, Thermoplastic resins such as polystyrene and olefin resins; Thermosetting resins such as acrylic resins, polyurethane resins, acrylic urethane resins, phenol resins, and epoxy resins; natural rubber, isoprene rubber, butadiene rubber, chloropredimethylpolyethylene Examples thereof include silicone resins such as siloxane and diphenylpolysiloxane. It is preferable to use a thermoplastic resin because it can be stored and supplied on a face material in a wound state. In particular, it is preferable to use a fluororesin from the viewpoints of flexibility and releasability.

[0123] The shape of the spacer is not particularly limited, but the cross section is preferably rectangular. In that case, considering the shape stability, the width is preferably about 5 to 15 mm, more preferably less than the width of the light transmission region. Further, the height is preferably 10 to 50% of the thickness of the long polishing region. S is preferably 15 to 40%. The length of the spacer is not particularly limited, and may be a long type (several meters) or a short type (several centimeters to several tens of centimeters). Spacers are, for example, a method of forming by extrusion molding, a method of cutting a resin block extruded into a cylindrical shape into a strip shape by spirally cutting, a method of cutting a resin sheet with a predetermined width and length, etc. Can be manufactured.

[0124] The material for forming the light transmission regions 10a and 10b is not particularly limited, and examples thereof are the same as described above. Can. When a resin having an aromatic hydrocarbon group is used, the light transmittance on the short wavelength side tends to be lowered. Therefore, it is preferable not to use such a resin. In addition, it is preferable to use a thermoplastic resin, and it is particularly preferable to use a thermoplastic polyurethane resin.

[0125] The light transmission region 10a can be produced by, for example, an extrusion molding method or a casting molding method. The cross-sectional shape of the light transmission region 10a is not particularly limited, but is preferably rectangular. In this case, the width of the light transmission region 10a is preferably about 5 to 15 mm in consideration of ensuring the shape stability and the polishing region. Further, the width of the light transmission region 10a is preferably equal to or larger than the width of the spacer in order to prevent deformation of the light transmission region due to the pressure applied during polishing. The thickness of the light transmission region 10a is preferably 50 to 90% of the thickness of the long polishing region 9 and more preferably 60 to 85%. The length of the light transmission region 10a is not particularly limited, and may be a long type (several meters) or a short type (several centimeters to several tens of centimeters)! / ,. Moreover, it is preferable to match the length of the spacer.

On the other hand, the concave light transmission region 10b can be produced by, for example, an extrusion molding method or a casting molding method. In addition, as shown in FIG. 10, the resin sheet 29 is subjected to a number of groove processing at predetermined intervals, and then the center of the convex portion is cut in the length direction, whereby a long (about several m) light having the depression 30 is obtained. The transmissive region 10b can be efficiently produced. FIG. 11 is a cross-sectional view of the resin sheet 29 cut in the width direction. The width (W) of the light transmission region 10b is preferably about 10 to 15 mm in consideration of shape stability and ensuring a wide polishing region. The thickness (H) of the light transmission region 10b can be appropriately adjusted in consideration of the thickness of the long polishing region 9. The width (w) of the recess 30 is preferably about 5 to 10 mm in consideration of shape stability and the incident region of the laser beam. The depth (h) of the indentation 30 is preferably 10 to 50% of the thickness (H) of the light transmission region S, more preferably 15 to 40%.

[0127] In addition, a large number of depressions 30 are formed in the resin sheet 29 at a predetermined interval, and then the center of the convex portion is cut into a lattice shape so that light of a short length (several centimeters to several tens of centimeters) having the depression 30 is obtained. The transmissive region 10b can be efficiently produced. The width (W) and thickness (H) of the short light transmission region 10b and the width (w) and depth (h) of the recess 30 are the same as described above.

[0128] The transparent support film 11 used in the third aspect of the present invention is not particularly limited, and is the same as described above. The power of S

[0129] Hereinafter, a method for producing the long polishing pad of the third aspect of the present invention will be described. FIG. 12 is a schematic view showing an example of the production process of the long polishing pad of the third invention.

[0130] The length of the long mold 24 is usually about 5 to 15 m, preferably 7 to 10 m in consideration of the length of the required long polishing region. The width is preferably about 60 to 250 cm in consideration of the required size of the long polishing region. The height is preferably about 10 to 60 mm from the viewpoint of the required thickness of the long polishing region and the prevention of overflow during casting.

[0131] First, the spacer 1 and the light transmission region 10a are disposed and fixed at predetermined positions of the long mold 24 in a laminated state. In that case, the spacer may be first arranged in the mold, and the light transmission region 10a may be laminated thereon, or vice versa. In addition, the long type spacer and the light transmission region 10a may be provided in the mold, or a plurality of them may be provided. However, the polishing area is increased by increasing the area of the polishing region. Therefore, it is preferable to provide only one at the center in the width direction of the mold. In addition, when using a short type spacer and the light transmission region 10a, it is preferable to provide a plurality at a predetermined interval in the center in the width direction of the mold.

On the other hand, when the concave light transmission region 10b is used, it is disposed and fixed at a predetermined position of the mold so that the recess 30 is on the lower side. As above, it is preferable to provide only one at the center in the width direction of the mold. In addition, when using a short-type concave light transmitting region 10b, it is preferable to provide a plurality at the center in the width direction of the mold and at predetermined intervals in the length direction.

[0133] The fixing method is not particularly limited, and examples thereof include a method of bonding using a double-sided tape, and a method of applying pressure to the spacer and the light transmission region to press against the mold bottom.

[0134] Thereafter, a spacer and a light transmissive region 10a or a concave light transmissive region 10b are provided, and the cell dispersed urethane composition 23 is discharged to the V, Na! The object is cured to produce a long polishing region 9 made of polyurethane foam. The discharge amount of the bubble-dispersed urethane composition 23 is appropriately adjusted in consideration of the thickness and area of the long polishing region. [0135] Curing of the cell-dispersed urethane composition 23 is performed, for example, by allowing the thickness to be uniformly adjusted and then passing through a heating oven provided on the competitor. The heating temperature is 40 to about 100 ° C, and the heating time is about 5 to 10 minutes. Heating and post-curing the cell-dispersed urethane composition that has reacted until it no longer flows has the effect of improving the physical properties of the polyurethane foam.

[0136] Thereafter, the integrally formed light transmission region and the long polishing region are released from the long mold, and in the case of the third-A manufacturing method of the present invention, the spacer is peeled off from the long polishing region. You

On the other hand, FIG. 13 is a schematic view showing another production example of the long polishing pad of the third invention.

[0138] The cell-dispersed urethane composition 23 is prepared by a mechanical calf loss method. In the mechanical Carlos method, raw material components are put into the mixing chamber of the mixing head 32, the non-reactive gas is mixed, and mixed and stirred with a mixer such as an Oaks mixer to make the non-reactive gas into a fine bubble state. This is a method of dispersing in the raw material mixture. The mechanical Carlos method is a preferable method because the density of the polyurethane foam can be easily adjusted by adjusting the mixing amount of the non-reactive gas.

[0139] The face material 33 fed from the roll is moving on the conveyor 34. First, the spacer and the light transmission region 10a are arranged and fixed at predetermined positions inside the face member 33 by feeding them from a roll or the like in a laminated state. In that case, the spacer may be first disposed on the face member 33, and the light transmission region 10a may be laminated thereon, or vice versa. In addition, only one or a plurality of long-type spacers and light transmission regions 10a may be provided on the face material 33. For the same reason as described above, the width direction of the face material 33 may be provided. It is preferable to install only one in the center. Further, in the case of using a short type spacer and the light transmission region 10a, it is preferable to provide a plurality of spacers at the center in the width direction of the face member 33 and at predetermined intervals in the length direction.

[0140] On the other hand, when the concave light transmission region 10b is used, it is disposed and fixed at a predetermined position of the face member 33 or the transparent support film 11 so that the recess 30 is on the lower side. Face material as above 3 3 or only one is preferably provided at the center of the transparent support film 11 in the width direction. Further, in the case of using the short-type concave light transmission region 10b, it is preferable to provide a plurality at the center in the width direction of the face member 33 or the transparent support fin 11 and at predetermined intervals in the length direction. By using the transparent support film 11 instead of the face material 33, it is possible to omit the step of laminating the transparent support film on the surface side having the recess 30 after the production of the long polishing region. Preferred from a viewpoint!

[0141] The face material to be used is not particularly limited, and examples thereof include paper, cloth, nonwoven fabric, and a resin film. A resin film having heat resistance and flexibility is particularly preferable.

[0142] Examples of the resin for forming the face material include polyethylene terephthalate, polyester, polyethylene, polypropylene, polystyrene, polyimide, polybulal alcohol, polychlorinated butyl, and fluororesin such as polyfluoroethylene, nylon, and cellulose. Use the power S to lift up.

[0143] The thickness of the face material is not particularly limited, but is preferably about 20 to 200 111 from the viewpoints of strength and winding. The width of the face material is not particularly limited, but is preferably about 60 to 250 cm in consideration of the required size of the long polishing region.

[0144] The surface of the face material is preferably subjected to a mold release treatment. Thus, the face material can be easily peeled off after the long polishing region is produced.

[0145] After that, the spacer and the light transmissive region 10a or the concave light transmissive region 10b are disposed, and the cell dispersed urethane composition 23 is placed on the V, Na! /, Face material 33 or the transparent support film 11. Discharge continuously from the discharge nozzle of the mixing head 32. The moving speed of the face material 33 or the transparent support film 11 and the discharge amount of the cell dispersed urethane composition 23 are appropriately adjusted in consideration of the thickness and area of the long polishing region.

[0146] Thereafter, a face material 33 is laminated on the discharged cell-dispersed urethane composition 23, and the cell-dispersed urethane composition 23 is cured while uniformly adjusting the thickness, thereby forming a long length of polyurethane foam. A polishing region 9 is produced. Examples of means for uniformly adjusting the thickness include a roll 35 such as a nip roll and a coater roll, a doctor blade, and the like. Further, the curing of the cell dispersed urethane composition 23 is, for example, after the thickness is uniformly adjusted, This is done by passing through a heating oven (not shown) provided on the conveyor. The heating temperature is about 40 to 100 ° C, and the heating time is about 5 to 10 minutes.

Thereafter, the face material is peeled off from the integrally formed light transmission region and the long polishing region, and in the case of the third-A and third-C production methods of the present invention, the long polishing region force, Remove the spacer.

[0148] The obtained light transmission region and the long polishing region are cut into, for example, a several meter parabolic shape by a cutting machine. The length is appropriately adjusted according to the polishing apparatus used, but is usually about 5 to 15 m, preferably 7 to 10 m. Note that post-curing may be performed before the face material is peeled off or post-curing may be performed after the face material is peeled off. From the viewpoint of prevention, it is preferable to boss cut after peeling off the face material. After post-cure, the end of the long polishing area may be cut and removed to adjust the length and make the thickness uniform! /.

[0149] The average cell diameter, specific gravity, and hardness of the polyurethane foam are the same as described above.

[0150] In the long polishing pad of the third aspect of the present invention, it is preferable that the polishing surface in contact with the material to be polished (wafer) has a concavo-convex structure for holding and renewing the slurry as described above.

[0151] The thickness of the long polishing region is not particularly limited, but is usually about 0.8 to 4 mm, preferably! To 2.5 mm.

[0152] The thickness variation in the long polishing region is preferably 100 m or less for the same reason as described above.

[0153] After that, a transparent support film is laminated on the surface side where the spacer of the long polishing region is peeled off or the surface side having a dent in the light transmission region, and a gap is formed between the light transmission region and the transparent support film. A long polishing layer having an interspace 36 is produced.

[0154] As a means for laminating the transparent support film 11 on the long polishing region 9, for example, a method of sandwiching and pressing the long polishing region 9 and the transparent support film 11 with a double-sided tape 37, the long polishing region 9 Examples include a method of applying an adhesive on the surface side and bonding the transparent support film 11 together. However, it is necessary not to provide the double-sided tape 37 or the adhesive on the portion corresponding to the space 36 on the transparent support film 11.

[0155] The length and width of the long polishing layer can be appropriately adjusted according to the polishing apparatus to be used. The length is usually 5 to about 15 m, and the width is usually about 60 to 250 cm.

[0156] The first to third long polishing pads of the present invention may be a laminate of the long polishing layer and a cushion sheet (cushion layer).

[0157] The cushion sheet supplements the characteristics of the polishing layer. Cushion seats are necessary in order to achieve both planarity and unity that have a trade-off relationship in CMP. Planarity refers to the flatness of the pattern area when a wafer with minute irregularities that occurs during pattern formation is polished. Uniformity refers to the uniformity of the entire wafer. Planarity is improved by the characteristics of the foam sheet, and uniformity is improved by the characteristics of the cushion sheet. For the long polishing pad of the present invention, it is preferable to use a cushion sheet that is softer than the polishing area.

[0158] Examples of the cushion sheet include fiber nonwoven fabrics such as polyester nonwoven fabrics, nylon nonwoven fabrics, and talil nonwoven fabrics, and resin-impregnated nonwoven fabrics such as polyester nonwoven fabrics impregnated with polyurethane, and polymer resin foams such as polyurethane foams and polyethylene foams. Body, butadiene rubber, rubber resin such as isoprene rubber, photosensitive resin, etc.

Yes

[0159] Examples of means for attaching the long polishing layer and the cushion sheet include a method in which the long polishing layer and the cushion sheet are sandwiched with a double-sided tape and pressed.

[0160] In the first to third long polishing pads of the present invention, a double-sided tape is provided on the side of the long polishing layer or the cushion layer that contacts the platen!

[0161] The semiconductor device is manufactured through a step of polishing the surface of the semiconductor wafer using the long polishing pad. A semiconductor wafer is generally a laminate of a wiring metal and an oxide film on a silicon wafer. The semiconductor wafer polishing method and polishing apparatus are not particularly limited. For example, the semiconductor wafer is polished by the following method.

FIG. 14 is a schematic diagram showing a method for polishing a semiconductor wafer using a web-type polishing apparatus. First, the long polishing pad 8 is mainly wound around the supply roll 21a. When a large number of semiconductor wafers 4 are polished, the polishing pad in the used area is wound up by the recovery roll 21b, and accordingly, the polishing pad in the unused area is sent out from the supply roll 21a. FIG. 15 is a schematic diagram showing a method for polishing a semiconductor wafer using a linear polishing apparatus. The long polishing pad 8 is arranged in a belt shape so as to rotate around the roll 22. Then, the semiconductor wafers 4 are polished one after another on the polishing pad moving linearly.

FIG. 16 is a schematic view showing a method for polishing a semiconductor wafer using a reciprocating polishing apparatus. The long polishing pad 8 is arranged in a belt shape so as to reciprocate between the rolls 22. Then, the semiconductor wafers 4 are polished one after another on the polishing pad that reciprocates left and right.

[0165] Although not shown in the figure, the above polishing apparatus usually has a polishing surface plate (platen) for supporting a long polishing pad, a support base (polishing head) for supporting a semiconductor wafer, and uniform to the wafer. It is equipped with a backing material for pressurization and an abrasive (slurry) supply mechanism. The polishing surface plate and the support table are disposed so that the long polishing pad and the semiconductor wafer supported by each of the polishing table and the support table face each other, and the support table includes a rotation shaft. In polishing, the semiconductor wafer is pressed against a long polishing pad while rotating the support base, and polishing is performed while supplying slurry. The flow rate of the slurry, the polishing load, the number of rotations of the wafer, etc. are not particularly limited, and are appropriately adjusted.

[0166] Thereby, the protruding portion of the surface of the semiconductor wafer is removed and polished flat.

Thereafter, semiconductor devices are manufactured by dicing, bonding, packaging, and the like. The semiconductor device is used for an arithmetic processing device, a memory, and the like.

Example

[0167] Hereinafter, the present invention will be described with reference to examples, but the present invention is not limited to these examples.

[First invention]

Example 1

Add 100 parts by weight of isocyanate-terminated polybolymer (uniroyal, adiprene L 325) adjusted to 70 ° C, and 3 parts by weight of silicone surfactant (manufactured by Toray Dow Cowing Silicone, SH-192). The mixture was adjusted to 80 ° C and degassed under reduced pressure. Then, using a twin-screw mixer, vigorously so that air bubbles are taken into the container at a rotation speed of 900 rpm. Stirring was carried out for about 4 minutes. Thereto was added 26.2 parts by weight of 4,4'-methylenebis (o black aniline) (Ciamine MT, manufactured by Ihara Chemical Co., Ltd.) previously melted at 120 ° C, and the mixture was stirred for about 70 seconds to foam the reaction solution. Was prepared. The foaming reaction liquid was poured into a long mold (width 80 cm, length 520 cm, height 3 cm). When the liquid mixture is no longer fluid, it is placed in an oven and post-cured at 80 to 85 ° C for 12 hours. Polyurethane foam sheet (average cell diameter: 50 111, specific gravity: 0.86, hardness: 55 degrees).

[0169] Next, using a buffing machine (manufactured by Amitech), the surface of the sheet was puffed to a thickness of 1.1 mm to obtain a sheet with an adjusted thickness accuracy. Then, using a grooving machine (manufactured by Techno Co., Ltd.), groove processing for a shelf portion having a groove width of 6 mm, a groove depth of 0.7 mm, and a groove length of 500 cm was performed at the center in the width direction of the sheet. Thereafter, the sheet was cut into two with an NT cutter along the central portion of the formed groove. Then, using a grooving machine (manufactured by Techno Co., Ltd.), each sheet surface is subjected to X-groove processing for slurry with groove width lmm, groove pitch 6mm, groove depth 0.4mm and long polishing with shelf Two regions were created.

[0170] 70 parts by weight of isocyanate-terminated polymer adjusted to 80 ° C (manufactured by Nippon Polyurethane Co., C 2612), 9 parts by weight of trimethylolpropane, and 21 parts by weight of polytetramethylene ether glycol having a number average molecular weight of 650 were mixed. Then, defoaming was performed to prepare a light transmission region forming material. The light transmission region forming material was poured into a long mold (width 80 cm, length 500 cm, height 3 mm). When the fluidity of the material ceased, it was put in an oven and post-cured at 100 to 105 ° C for 12 hours to obtain an unfoamed sheet. Next, the surface of the sheet was buffed to a thickness of 0.9 mm using a puffing machine (Amitech Co., Ltd.) to obtain a sheet with an adjusted thickness accuracy. Then, a groove having a groove width of 6 mm, a groove length of 500 cm, a groove pitch of 12 mm, and a groove depth of 0.2 mm was formed on the entire surface of the non-foamed sheet using a groove processing machine (manufactured by Techno). After that, cut all the grooves along the central part of the groove and height (h) 0.9mm, length 500cm long light transmission area (shoulder part: width 3mm, height 0.7mm, head part : A width of 6 mm).

[0171] A hot melt adhesive (Okamoto Chusho Co., Ltd., SUNO ITEC 1942, EVA type, soft base point 88. C, 4000cps atl 77. C) was applied to the shoulder of the manufactured long light transmission region. It was applied and left at room temperature for about 1 hour.

[0172] As shown in Fig. 2, the two long polishing areas thus produced had a through hole between the shelves. It was placed on a belt conveyor and fixed so as to be formed with a constant width (about 6 mm). Thereafter, the long light transmission region was disposed in the opening of the long polishing region, and the long light transmission region was temporarily fixed with a tape so that the long light transmission region was not displaced, thereby obtaining a long sheet. Then, while moving the long sheet, the long light transmission region is heated and pressed using a nip roll whose temperature is adjusted to 100 ° C., and the long light transmission region and the long polishing region are bonded to each other. Got. Thereafter, the temporary fixing tape was peeled off, and a double-sided tape (manufactured by Sekisui Chemical Co., Ltd., # 5782W) was attached to the surface of the polishing sheet opposite to the grooved surface using a laminator. Then, the double-sided tape at a position corresponding to the long light transmission region was cut off with an NT cutter. A laminating machine was used to attach a transparent support film (E5001, PET vinylom, thickness 75 m) to the double-sided tape to produce a long polishing pad.

[Second Invention]

Example 1

Add 100 parts by weight of isocyanate-terminated polybolymer (uniroyal, adiprene L 325) adjusted to 70 ° C, and 3 parts by weight of silicone surfactant (manufactured by Toray Dow Cowing Silicone, SH-192). The mixture was adjusted to 80 ° C and degassed under reduced pressure. Thereafter, the mixture was vigorously stirred for about 4 minutes using a twin-screw mixer so that bubbles were taken into the container at a rotation speed of 900 rpm. Thereto, 26.2 parts by weight of 4,4′-methylenebis (o black aniline) melted at 120 ° C. (Ciamine MT, manufactured by Ihara Chemical Co., Ltd.) was added, and the mixture was stirred for about 70 seconds to foam the cell dispersed urethane. A composition was prepared.

[0174] 100 parts by weight of isocyanate-terminated polymer adjusted to 80 ° C (manufactured by Nippon Polyurethane, C 2612), 9 parts by weight of trimethylolpropane, and 21 parts by weight of polytetramethylene ether glycol having a number average molecular weight of 650 were mixed. Then, defoaming was performed to prepare a light transmission region forming material.

[0175] A transparent support film (PET, manufactured by Toyobo Co., Ltd., E5001, thickness: 75 m) is laid on the bottom plate made of aluminum coated with Teflon (registered trademark) on the surface, and the surface of Teflon is coated on the transparent support film. A long mold frame made of (registered trademark) coated aluminum (internal length: 520 cm, internal width: 80 cm, internal height: 30 mm) was placed. Thereafter, the bottom plate and the long formwork were clamped. The transparent support film was placed about 2m longer than the long formwork. Then long type At the center in the width direction of the frame, a mold for forming a light transmission region having a mold shape as shown in FIG. 7 (manufactured by SUS, injection hole length: 520 cm, injection hole width: 12 mm, injection wall height: 30 mm, injection wall thickness: lmm).

[0176] Then, the cell-dispersed urethane composition was discharged onto the transparent support film outside the injection hole, and the light transmission region forming material was discharged onto the transparent support film inside the injection hole. Thereafter, the long mold was placed in an oven adjusted to a temperature of 80 to 85 ° C. for 10 hours to cure the cell-dispersed urethane composition and the light transmission region forming material, thereby forming a polishing region and a light transmission region. . Thereafter, the mold for forming a light transmission region and the long mold were released to prepare a long polishing layer (thickness: about 2 mm) having a gap (lmm) between the light transmission region and the polishing region. Next, the surface of the long polishing layer was puffed using a puffing machine (manufactured by Amitech) to adjust the thickness to 1. lmm. Then, a long polishing pad was prepared by performing groove processing on the surface of the polishing region of the long polishing layer using a groove processing machine (manufactured by Toho Koki Co.).

[0177] [Third Invention]

Example 1

Add 100 parts by weight of isocyanate-terminated polybolymer (uniroyal, adiprene L 325) adjusted to 70 ° C, and 3 parts by weight of silicone surfactant (manufactured by Toray Dow Cowing Silicone, SH-192). The mixture was adjusted to 80 ° C and degassed under reduced pressure. Thereafter, the mixture was vigorously stirred for about 4 minutes using a twin-screw mixer so that bubbles were taken into the container at a rotation speed of 900 rpm. Thereto, 26.2 parts by weight of 4,4′-methylenebis (o black mouth aniline) (Ihara Chemical Co., Ltd., Cuamine MT) previously melted at 120 ° C. was added, and the mixture was stirred for about 70 seconds to produce a cell dispersed urethane. A composition was prepared.

[0178] 70 parts by weight of isocyanate-terminated polybolomer (manufactured by Nippon Polyurethane Co., Ltd., C 2612) adjusted to 80 ° C., 9 parts by weight of trimethylolpropane, and 21 parts by weight of polytetramethylene ether glycol having a number average molecular weight of 650 were mixed. Then, defoaming was performed to prepare a light transmission region forming material. The light transmission region forming material was poured into a long mold (internal width 80 cm, internal length 520 cm, internal height 30 mm). When the fluidity of the material ceased, it was put in an oven and post-cured at 100 to 105 ° C for 12 hours to obtain an unfoamed sheet. Next, using a buffing machine (Amitech Co., Ltd.), the surface of the sheet is buffed to a thickness of 0.6 mm. A sheet with an adjusted thickness accuracy was obtained. The non-foamed sheet was cut with a slitter to produce a large number of long light transmission regions (length 520 cm, width 10 mm, thickness 0.6 mm).

[0179] Teflon (registered trademark) long spacer (length 520 cm, width 10 mm, thickness 0.5 mm) at the center of the width direction of the long mold (internal width 80 cm, internal length 520 cm, internal height 30 mm) ) And fixed with double-sided tape. Then, the long light transmission region was disposed on the spacer 1 and fixed with double-sided tape.

[0180] Then, the cell-dispersed urethane composition was discharged onto a long mold in which the long spacer and the long light transmission region were not provided, and left for about 10 minutes. Thereafter, the long mold was placed in an oven adjusted to 80 to 85 ° C. for 12 hours to cure the cell-dispersed urethane composition to form a long polishing region. Thereafter, the long mold was released, and the long spacer made of Teflon (registered trademark) and the double-sided tape were peeled from the long polishing region. Next, the surface of the long polishing region was puffed using a puffing machine (Amitec) to adjust the thickness to 1.1 mm. And the X-groove process was given to the surface of this long grinding | polishing area | region using the groove processing machine (made by Toho Steel Machine Co., Ltd.). Thereafter, a double-sided tape (manufactured by Sekisui Chemical Co., Ltd., # 5782W) was attached to the surface of the long polishing region opposite to the grooved surface using a laminator. Then, the double-sided tape at a position corresponding to the long light transmission region was cut off with an NT cutter. A laminating machine was used to attach a transparent support film (E5001, PET film, thickness 75 m) to the double-sided tape to produce a long polishing pad.

[0181] Example 2

70 parts by weight of isocyanate-terminated prepolymers adjusted to 80 ° C (manufactured by Nippon Polyurethane Co., Ltd., C 2612), 9 parts by weight of trimethylolpropane, and 21 parts by weight of poly (tetramethylene ether glycol) having a number average molecular weight of 650 were mixed and defoamed. Thus, a light transmission region forming material was prepared. The light transmission region forming material was poured into a long mold (internal width 80 cm, internal length 520 cm, internal height 30 mm). When the fluidity of the material ceased, it was put in an oven and post-cured at 100 to 105 ° C for 12 hours to obtain an unfoamed sheet. Next, using a buffing machine (Amitech Co., Ltd.), the surface of the sheet was buffed to a thickness of 1.1 mm to obtain a sheet with an adjusted thickness accuracy. Then, using a groove processing machine (Techno Co., Ltd.), a groove with a groove width of 6 mm, a groove length of 520 cm, a groove pitch of 10 mm, and a groove depth of 0.5 mm is opened on the entire surface of the non-foamed sheet. Made. After that, cut all along the center of the convex part and make many concave long light transmission areas (length 520cm, width 10mm, thickness 1.1mm) with indentations (width 6mm, depth 0.5mm).

; ^^

[0182] The long light transmitting region was arranged at the center in the width direction of a long mold (internal width 80 cm, internal length 520 cm, internal height 30 mm) and fixed with double-sided tape.

[0183] Then, the long light transmission region was arranged,! /, NA! /, The bubble-dispersed urethane composition was discharged onto the long mold, and allowed to stand for about 10 minutes. Thereafter, the long mold was placed in an oven whose temperature was adjusted to 80 to 85 ° C. for 12 hours to cure the cell-dispersed urethane composition to form a long polishing region. Thereafter, the long mold was released, and the double-sided tape was peeled from the long polishing region. Next, the surface of the long polishing area was buffed using a knoff machine (Amitech) to adjust the thickness to 1.1 mm. Then, X-groove processing was performed on the surface of the long polishing region using a groove processing machine (manufactured by Toho Koki Co., Ltd.). Thereafter, a double-sided tape (manufactured by Sekisui Chemical Co., Ltd., # 5782W) was attached to the surface of the long polishing region opposite to the grooved surface using a laminator. Then, the double-sided tape at the position corresponding to the indentation was cut off with an NT cutter. Then, a laminating machine was used to bond a transparent support film (E5 001 PET vinylom, thickness 75 Hm) to the double-sided tape to produce a long polishing pad.

[0184] Example 3

(Preparation of cell-dispersed urethane composition by mechanical calfloss method)

Isocyanate-terminated prepolymer (manufactured by Uniroyal, Adiprene L-325) 100 parts by weight, silicone surfactant (manufactured by Toray Dow Cowing Silicone, SF2938F) 3 parts by weight, and a mixture adjusted to a temperature of 80 ° C 2,4'-methylenebis (o-chloroaniline) (Ihara Chemical Co., Ltd., Iharacuamine MT) melted at 120 ° C and mixed with 26.2 parts by weight in a mixing chamber before discharging, and air is simultaneously mixed into the mixture. A cell-dispersed urethane composition was prepared by dispersing the mixture by mechanical stirring.

[0185] The long light transmission region prepared in Example 1 and the Teflon (registered trademark) long spacer were bonded with a double-sided tape, and further, the double-sided tape was bonded to one side of the spacer. Thus, a laminated member was obtained.

[0186] Face material (thickness 50 m, width 100 cm) made of polyethylene terephthalate (PET) However, the laminated member was continuously bonded to the center of the face material, and the long spacer and the long light transmission region were continuously arranged in a laminated state. Thereafter, the cell-dispersed urethane composition was continuously discharged from the mixing head onto the face material on which the laminated member was not provided. Then, the cell-dispersed urethane composition was covered with another face material made of PET (thickness 50 m, width 100 cm), and the thickness was uniformly adjusted using a nip roll. Thereafter, the composition was cured by heating to 80 to 85 ° C. to produce a long polishing region made of polyurethane foam. Then, the long polishing area is cut to a length of 520 cm, the face material, long spacer and double-sided tape are peeled off, and post-cured at 80 ° C for 6 hours to transmit the long polishing area and the long light. A long abrasive sheet comprising the region was obtained. Next, the surface of the long polishing area was buffed using a puff machine (Amitech) to adjust the thickness to 1.1 mm. And the X-groove process was given to the surface of this long grinding | polishing area | region using the groove processing machine (made by Toho Steel Machine Co., Ltd.). Thereafter, a double-sided tape (manufactured by Sekisui Chemical Co., Ltd., # 5782W) was attached to the surface of the long polishing area opposite to the grooved surface using a laminator. Then, the double-sided tape at a position corresponding to the long light transmission region was cut off with an NT cutter. Then, using a laminating machine, a transparent support film (Toyobo Co., Ltd., E5001, PET film, thickness 75 μm) was bonded to the double-sided tape to produce a long polishing pad.

Claims

The scope of the claims

[1] A step of producing a long polishing region made of polyurethane foam, a step of forming an opening made of a through hole and a shelf in the long polishing region, and a convex long shape thinner than the long polishing region A long process including a step of producing a light transmission region, a step of installing the long light transmission region in an opening of the long polishing region, and a step of attaching a transparent support film to the polishing back surface side of the long polishing region Manufacturing method of polishing pad.

[2] A step of producing a long polishing region made of polyurethane foam, a step of continuously forming a shelf in one side of the long polishing region in the length direction, and a convex length thinner than the long polishing region A step of creating a long light transmission region, the two long polishing regions are parallel to each other so that the shelf and the shelf face each other, and an opening is formed to insert the long light transmission region. A method for producing a long polishing pad, comprising: a step of disposing a transparent support film on a polishing back surface side of the long polishing region, and a step of placing the long light transmission region in the opening.

[3] The method for producing a long polishing pad according to claim 1 or 2, wherein the thickness of the thickest portion of the long light transmission region is 50 to 90% of the thickness of the long polishing region.

[4] A step of preparing a cell-dispersed urethane composition by a mechanical foaming method, a transparent support film placed in a long mold, and a mold for forming a light transmission region having injection holes and injection walls at predetermined positions on the support film A step of disposing a frame; a step of discharging a light transmission region forming material into the injection hole; and a step of curing the light transmission region formation material to form a light transmission region; on the transparent support film outside the injection hole; Discharging the cell-dispersed urethane composition, curing the cell-dispersed urethane composition to form a polished region, and releasing the light-transmitting region forming mold and the long mold to form a light-transmitting region; A method for producing a long polishing pad, comprising a step of producing a long polishing layer having a gap with a polishing region.

5. The method for producing a long polishing pad according to claim 4, wherein the light transmission region is made of a thermosetting resin.

6. The method for producing a long polishing pad according to claim 4, wherein the thermosetting resin is a polyurethane resin.

7. The method for producing a long polishing pad according to claim 4, wherein the thickness of the injection wall is 1 mm or less.

[8] A step of preparing a cell-dispersed urethane composition by a mechanical foaming method, a step of arranging a spacer and a light transmission region in a laminated state in a long mold, the spacer and the light transmission region To produce a long polishing region made of polyurethane foam by discharging the cell-dispersed urethane composition to the region and curing the cell-dispersed urethane composition; A step of peeling the spacer from the long polishing region, and a transparent support film is laminated on the surface side of the long polishing region from which the spacer has been peeled, so that the space between the light transmission region and the transparent support film is laminated. A method for producing a long polishing pad, comprising a step of producing a long polishing layer having a space.

[9] A step of preparing a cell-dispersed urethane composition by a mechanical foaming method, a step of disposing a concave light-transmitting region in the long mold so that the depression is on the lower side, and disposing the light-transmitting region. ! /, Na! /, A step of discharging the cell-dispersed urethane composition to the region, curing the cell-dispersed urethane composition to produce a long polished region made of polyurethane foam, and a depression of the light transmitting region A method for producing a long polishing pad, comprising a step of laminating a transparent support film on a surface side having a gap to produce a long polishing layer having a space between a light transmission region and a transparent support film.

[10] A step of preparing a cell-dispersed urethane composition by a mechanical floss method, a step of disposing a spacer and a light transmission region in a laminated state while sending out the face material, and a spacer. And / or a light transmission region, and a step of continuously discharging the cell-dispersed urethane composition onto the face material; another surface material on the discharged cell-dispersed urethane composition; The step of laminating, the step of curing the cell-dispersed urethane composition while uniformly adjusting the thickness to produce a long polishing region made of polyurethane foam, and the surface material and the spacer from the long polishing region. A step of peeling, and laminating a transparent support film on the surface side from which the spacer of the long polishing region was peeled off, and forming a long polishing layer having a space between the light transmission region and the transparent support film. Manufacturing method of long polishing pad including manufacturing step

[11] A step of preparing a cell-dispersed urethane composition by a mechanical floss method, a step of disposing a concave light-transmitting region inside the face material while sending out the face material so that the depression is on the lower side, A light transmissive area is provided. /, A step of continuously discharging the cell-dispersed urethane composition onto the face material, and mounting another surface material onto the discharged cell-dispersed urethane composition. A step of layering, a step of preparing a long polishing region made of a polyurethane foam by curing the cell-dispersed urethane composition while uniformly adjusting the thickness, a step of peeling the face material from the long polishing region, And a long polishing pad comprising a step of laminating a transparent support film on the surface side of the light transmission region having a dent, thereby producing a long polishing layer having a space between the light transmission region and the transparent support film. Manufacturing method.

[12] A step of preparing a cell-dispersed urethane composition by the mechanical floss method, while sending out a transparent support film, a concave light-transmitting region is disposed inside the transparent support film so that the depression is on the lower side. A step, a step of continuously discharging the cell-dispersed urethane composition on the transparent support film not provided with the light transmission region, a step of laminating a face material on the discharged cell-dispersed urethane composition, A long polishing region made of polyurethane foam is formed by curing the cell-dispersed urethane composition while adjusting the thickness uniformly, and a long polishing having a space portion between the light transmission region and the transparent support film. A method for producing a long polishing pad, comprising a step of producing a layer and a step of peeling a face material from the long polishing region.

[13] The method for producing a long polishing pad according to claim 8 or 10, wherein the spacer and the light transmission region are of a long type.

14. The method for producing a long polishing pad according to claim 8, wherein the width of the spacer is equal to or less than the width of the light transmission region.

15. The method for producing a long polishing pad according to claim 8, wherein the thickness of the light transmission region is 50 to 90% of the thickness of the long polishing region.

[16] The method for producing a long polishing pad according to [9], [11] or [12], wherein the light transmission region is a long type.

17. The method for producing a long polishing pad according to claim 9, 11 or 12, wherein the depth of the indentation is 10 to 50% of the thickness of the light transmission region.