TW200932431A - Process for manufacturing polishing pad - Google Patents

Process for manufacturing polishing pad Download PDF

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Publication number
TW200932431A
TW200932431A TW097118661A TW97118661A TW200932431A TW 200932431 A TW200932431 A TW 200932431A TW 097118661 A TW097118661 A TW 097118661A TW 97118661 A TW97118661 A TW 97118661A TW 200932431 A TW200932431 A TW 200932431A
Authority
TW
Taiwan
Prior art keywords
polishing
polishing pad
urethane composition
bubble
dispersed
Prior art date
Application number
TW097118661A
Other languages
English (en)
Chinese (zh)
Other versions
TWI357843B (https=
Inventor
Akinori Sato
Junji Hirose
Kenji Nakamura
Takeshi Fukuda
Masato Doura
Original Assignee
Toyo Tire & Rubber Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Tire & Rubber Co filed Critical Toyo Tire & Rubber Co
Publication of TW200932431A publication Critical patent/TW200932431A/zh
Application granted granted Critical
Publication of TWI357843B publication Critical patent/TWI357843B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24364—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] with transparent or protective coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW097118661A 2007-05-31 2008-05-21 Process for manufacturing polishing pad TW200932431A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007145583A JP4943233B2 (ja) 2007-05-31 2007-05-31 研磨パッドの製造方法

Publications (2)

Publication Number Publication Date
TW200932431A true TW200932431A (en) 2009-08-01
TWI357843B TWI357843B (https=) 2012-02-11

Family

ID=40093475

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097118661A TW200932431A (en) 2007-05-31 2008-05-21 Process for manufacturing polishing pad

Country Status (6)

Country Link
US (1) US8409308B2 (https=)
JP (1) JP4943233B2 (https=)
KR (1) KR101475252B1 (https=)
CN (1) CN101663132B (https=)
TW (1) TW200932431A (https=)
WO (1) WO2008149650A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404596B (zh) * 2009-09-22 2013-08-11 San Fang Chemical Industry Co 製造研磨墊之方法及研磨墊

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US7927452B2 (en) * 2005-07-15 2011-04-19 Toyo Tire & Rubber Co., Ltd. Layered sheets and processes for producing the same
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WO2007119875A1 (ja) 2006-04-19 2007-10-25 Toyo Tire & Rubber Co., Ltd. 研磨パッドの製造方法
US20100009611A1 (en) * 2006-09-08 2010-01-14 Toyo Tire & Rubber Co., Ltd. Method for manufacturing a polishing pad
WO2008087797A1 (ja) 2007-01-15 2008-07-24 Toyo Tire & Rubber Co., Ltd. 研磨パッド及びその製造方法
JP4593643B2 (ja) * 2008-03-12 2010-12-08 東洋ゴム工業株式会社 研磨パッド
TWI402147B (zh) * 2010-07-27 2013-07-21 Li Chang Wei Ti 墊體的加工方法
JP5687118B2 (ja) * 2011-04-15 2015-03-18 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP5759888B2 (ja) * 2011-12-28 2015-08-05 東洋ゴム工業株式会社 研磨パッド
US9156125B2 (en) * 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
TW201509610A (zh) * 2013-09-06 2015-03-16 Ming-Fan Liu 具編織面板的工具定位墊及其製法
JP2015059199A (ja) * 2013-09-20 2015-03-30 Dic株式会社 ウレタン組成物及び研磨材
US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
KR102398130B1 (ko) * 2014-10-31 2022-05-13 주식회사 쿠라레 연마층용 비다공성 성형체, 연마 패드 및 연마 방법
CN105922126B (zh) * 2016-06-03 2018-05-11 湖北鼎龙控股股份有限公司 化学机械抛光垫的检测窗及其制备方法
US10293456B2 (en) * 2017-04-19 2019-05-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them
US10207388B2 (en) * 2017-04-19 2019-02-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aliphatic polyurethane optical endpoint detection windows and CMP polishing pads containing them
JP7220130B2 (ja) * 2019-07-11 2023-02-09 株式会社クラレ 研磨パッド及び研磨パッドの製造方法
JP7624858B2 (ja) * 2021-03-25 2025-01-31 富士紡ホールディングス株式会社 研磨パッドの製造方法
CN116693913B (zh) * 2023-06-26 2026-01-20 陕西科技大学 一种无溶剂刮涂法制备聚氨酯研磨垫的方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404596B (zh) * 2009-09-22 2013-08-11 San Fang Chemical Industry Co 製造研磨墊之方法及研磨墊
US9862071B2 (en) 2009-09-22 2018-01-09 San Fang Chemical Industry Co., Ltd. Method for manufacturing polishing pad and polishing pad

Also Published As

Publication number Publication date
KR20100015303A (ko) 2010-02-12
WO2008149650A1 (ja) 2008-12-11
CN101663132B (zh) 2011-06-01
JP4943233B2 (ja) 2012-05-30
US20100162631A1 (en) 2010-07-01
CN101663132A (zh) 2010-03-03
US8409308B2 (en) 2013-04-02
KR101475252B1 (ko) 2014-12-22
JP2008296333A (ja) 2008-12-11
TWI357843B (https=) 2012-02-11

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MM4A Annulment or lapse of patent due to non-payment of fees