TWI353807B - Manufacturing method of mounting substrate withref - Google Patents

Manufacturing method of mounting substrate withref Download PDF

Info

Publication number
TWI353807B
TWI353807B TW94133473A TW94133473A TWI353807B TW I353807 B TWI353807 B TW I353807B TW 94133473 A TW94133473 A TW 94133473A TW 94133473 A TW94133473 A TW 94133473A TW I353807 B TWI353807 B TW I353807B
Authority
TW
Taiwan
Prior art keywords
substrate
reflector
mounting substrate
manufacturing
resin
Prior art date
Application number
TW94133473A
Other languages
English (en)
Chinese (zh)
Other versions
TW200704309A (en
Inventor
Goro Narita
Original Assignee
Element Denshi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Element Denshi Co Ltd filed Critical Element Denshi Co Ltd
Publication of TW200704309A publication Critical patent/TW200704309A/zh
Application granted granted Critical
Publication of TWI353807B publication Critical patent/TWI353807B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
TW94133473A 2005-07-04 2005-09-27 Manufacturing method of mounting substrate withref TWI353807B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005195610A JP3963923B2 (ja) 2005-07-04 2005-07-04 リフレクタ付き実装基板の製造方法

Publications (2)

Publication Number Publication Date
TW200704309A TW200704309A (en) 2007-01-16
TWI353807B true TWI353807B (en) 2011-12-01

Family

ID=37597689

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94133473A TWI353807B (en) 2005-07-04 2005-09-27 Manufacturing method of mounting substrate withref

Country Status (4)

Country Link
JP (1) JP3963923B2 (ja)
KR (1) KR101155693B1 (ja)
CN (1) CN1892979A (ja)
TW (1) TWI353807B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100958329B1 (ko) * 2009-08-14 2010-05-17 (주)참빛 마스크를 적용하여 측면 반사면을 금속 코팅한 발광 다이오드 패키지 기판 및 그 제조 방법
JP5780044B2 (ja) * 2011-08-05 2015-09-16 大日本印刷株式会社 リフレクタ付基板の製造方法
JP2013110179A (ja) * 2011-11-18 2013-06-06 Citizen Holdings Co Ltd 半導体発光装置
KR101292197B1 (ko) * 2012-04-10 2013-08-01 대덕전자 주식회사 발광다이오드 실장 회로기판에 반사판을 제조하는 방법
JP2014063777A (ja) * 2012-09-19 2014-04-10 Chang Wah Electromaterials Inc 発光ダイオードパッケージの製造方法及びその構造

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11220178A (ja) * 1998-01-30 1999-08-10 Rohm Co Ltd 半導体発光装置

Also Published As

Publication number Publication date
KR101155693B1 (ko) 2012-06-12
JP3963923B2 (ja) 2007-08-22
CN1892979A (zh) 2007-01-10
JP2007013067A (ja) 2007-01-18
KR20070004402A (ko) 2007-01-09
TW200704309A (en) 2007-01-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees