TWI352373B - Curved door member with flexible coupling - Google Patents

Curved door member with flexible coupling Download PDF

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Publication number
TWI352373B
TWI352373B TW095142124A TW95142124A TWI352373B TW I352373 B TWI352373 B TW I352373B TW 095142124 A TW095142124 A TW 095142124A TW 95142124 A TW95142124 A TW 95142124A TW I352373 B TWI352373 B TW I352373B
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Taiwan
Prior art keywords
processing chamber
door member
lever arm
substrate transfer
deformable
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TW095142124A
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English (en)
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TW200727332A (en
Inventor
Jae-Chull Lee
David E Berkstresser
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
    • F16K1/16—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members
    • F16K1/18—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps
    • F16K1/20—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps with axis of rotation arranged externally of valve member
    • F16K1/2007—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps with axis of rotation arranged externally of valve member specially adapted operating means therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
    • F16K1/16—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members
    • F16K1/18—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps
    • F16K1/20—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps with axis of rotation arranged externally of valve member
    • F16K1/2021—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps with axis of rotation arranged externally of valve member with a plurality of valve members
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
    • F16K1/16—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members
    • F16K1/18—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps
    • F16K1/20—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps with axis of rotation arranged externally of valve member
    • F16K1/2028—Details of bearings for the axis of rotation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
    • F16K1/16—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members
    • F16K1/18—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps
    • F16K1/20—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps with axis of rotation arranged externally of valve member
    • F16K1/2042—Special features or arrangements of the sealing
    • F16K1/205—Special features or arrangements of the sealing the sealing being arranged on the valve member
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
    • F16K1/16—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members
    • F16K1/18—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps
    • F16K1/20—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps with axis of rotation arranged externally of valve member
    • F16K1/2042—Special features or arrangements of the sealing
    • F16K1/2078—Sealing means for the axis of rotation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
    • F16K1/24—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with valve members that, on opening of the valve, are initially lifted from the seat and next are turned around an axis parallel to the seat
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)

Description

1352373 r (―一gth)上的變化，因此能夠延長該門致動機構的 使用期限，同時可將因對轉動構件的束轉所產生的不欲求粒 子降至最低量。本發明將會在下面被描述為使用在平板處理 系統統中例如’可以從ΑΚτ公司（應用材料公司在加利福 尼亞州SantaClara市的分部）晴得該平板處理系統。铁而， 應瞭解本發明Μ以用I密封具有不同構造的其他類型的 處理設備中的基板轉移通道。 第2圖是處理系，统25〇的—實施例的俯視平面圖，該系 統適合處理大面積基板（如，平面區域超過約〇16平方公尺 的玻璃或聚合體基板）。處理系統25〇典型地包括一移送室 208’其藉由一負載鎖定室2〇〇與一工廠介面212連接。移 送至208至少有一真空機械人234置於其中適以在多數周 邊的處理室232和負載鎖定室2〇〇之間進行基板的移送。該 等處理至232特別可以是一化學氣相沈積處理室、一物理氣 相沈積處理室、一量測處理室或一熱處理室等等。典型地， 移送室208需保持在一真空狀態下，以消除在轉移每一基板 後需調節移送室2 0 8和個別處理處理室2 3 2之間壓力的必要 性。 工廠介面212通常包括多數基板存儲匣盒238和至少一 大氣機械人23 6 »匣盒23 8 一般以可拆卸方式設置在多數、 建立在工廠介面212 —側的隔室（bay ) 240中。大氣機械人 236適於在£盒238與負載鎖定室2〇〇之間移送基板210。 典型地’工廠介面212保持在等於或略微大於大氣壓力。 第3圖是第2圓中負載鎖定室2〇〇的一實施例的剖面 9 1352373 南果送和排放循環。在第3圊所描述的實施例！|7，每—基板 移送室320、322、324具有一小於約2〇0〇公升的内部體積 (在一實施例中内部艘積是約1400公升），以提供具有平 面表面積大於約3.7平方公尺的基板，例如大於或等於$平 方公尺。可以預見’可以設置本發明的基板移送室具有其他 的寬度、長度和/或高度’用以容納不同尺寸的基板。
處理室主體312包括第一側壁302 ' —第二側壁304、一 第二側壁306、底部308和頂部310。一第四側壁318(部分 圖示在第3圖中）與第三側壁306相對。主體3 12由一種適 於在真空狀態下使用的剛性材料構成。處理室主體312由單 獨一塊（如’ 一片）銘或其他適合的材料製成，或由模組型 材製成。
基板210由第一移送室320的底部308和用以界定出第 二和第三基板移送室322、324底部的内壁314，此兩者上方 的多個基板支撐件344來支承。基板支撐件344被間隔設置 以於一高於底部308(或壁314)的高度處來支承基板21〇, 以避免基板與處理室主體312接觸。基板支撐件344係配置 成使基板所受到的括損和污染達到最小程度。在第3圖續示 的實施例中，基板支撐件344是具有圓形頂端346的不鏽鋼 銷。其他合適的基板支樓件揭示在2〇〇3年3月5日申請的 美國專利申請Νο·6,528,767、2001年1〇月27曰申請的美國 專利申請Ν〇·09/982,406以及2003年2月27日申請的美國 專利中請No.60/376,857中。 每一基板移送至320、322、324的至少一側壁包括至少 11 1352373 411的一個孔504。該鐘形螺絲41〇的一頭部5〇2能夠防止 該鐘形螺絲41〇通過該彈性襯套411。該襯套⑴之彈性允 許該鐘形螺絲41〇可相對於該門構件4〇2做萬向樞轉（亦即， 在至少二平面轉動，例如繞著χ軸及ζ轴轉動 該彈性襯套4 1 1的内直徑504比該鐘形螺絲4丨〇的直徑 5〇6來得大。因此，該鐘形螺絲41〇能夠在該彈性襯套々η 内橫向移動，而使該門構件402可相對於該桿臂413横向移
動。 在桿臂413内之一凹部540内亦設置有至少一彈性襯套 411。一形成在該凹部540内的孔542，允許該鐘形螺絲4ι〇 可通過該桿f 413。在帛5 示之實施例+，二彈性概 套4 1 1於該私臂4丨3的凹部内以圍繞該鐘形螺絲4丨〇的方式 配置。螺合在該鐘形螺絲410上的螺帽415，可抓住在該桿 臂413凹部内之該彈性襯套411。該螺帽415可以藉由另外 的方法加以固定、鎖定、或緊固，用以防止其從該鐘形螺絲 410上意外脫離。在一實施例，使用一固定螺釘516來將該 螺帽4 1 5固定在該鐘形螺絲4丨〇上。 在第5圖所繪示之實施例中，具有一間隔物423插入其 間的二彈性概套41 i係位於該桿臂413之凹部内的該鐘形螺 絲41〇上。該等彈性襯套411允許該鐘形螺絲41〇相對於該 桿臂4U做萬向樞轉（例如㈣χ轴及y轴轉動）。該等彈性 襯套411的内直徑512大於該鐘形螺絲411之一直徑514, 而使得該門構件402可相對於該桿臂413來横向移動。該鐘 形間隔物423可爲配置在該桿臂413之襯套4ιι内的該鐘形 14 1352373 螺絲4 1 0的移動增 一止推墊圈421係配置在該門構 伸旰及該桿臂413 間。該止推墊圈421提供一順應構件 〜傅仟用以挺尚該門構件 與桿臂413之間的抗摩擦性，因此 四此可在連續地開啟及關閉 該門構件402的循環間，提高可實曾 门*貫質維持該門構件402相對 於該反應室密封表面之定位的堅硬性及記憶性。 該概套 4 1 1 係由一jfei -fto _l> . 坪往材科製成，例如聚合物、或彈簧
型式。適合之聚合物材料的例子可, 〇竹刃例于了以疋聚胺基甲酸酯聚醯 胺-醯亞胺，例如 TORLON®、VITOXT® ^^ V 11 0N®、或其他適合的彈性材 料。其他可構成該襯套411的其他性材料的例子包括彈性形 式，例如碟形彈簧（BeUeviUe springs)，係由金屬及其他適合 的彈簧材料製成。 該襯套411之彈性允許該連接構件45〇可改變相對於該 桿臂413及/或相對於該門構件4〇2之角度及横向位置兩者。 該襯套4Π的移動能夠彌補該負載鎖定室操作期間該門構件 402之方位改變。例如，當該門構件4〇2的末端向外移動（在 X-方向）使該門變得扁平併接萼該處理室主體312時，，該襯 套411可在不必將過量的橫向力量轉移至該桿臂413的情況 下’吸納一往該鐘形螺絲41〇的橫向移動。因此，隨著該襯 套411可實質吸收該橫向力的轉移，該桿臂413不會被迫使 進入一個會產生束缚的位置。而且，該可形變的連接部419 可吸納該門構件402在曲度上的變化（圍繞Z_軸）而不會產生 束缚及/或使該桿臂413(或軸404、406)變形，因此，能夠將 磨耗減少最低並減少潛在的粒子源。此外，當藉由與該處理 15 1352373
度差異（例如曲狀和扁平狀），係藉由第6A-B圖所繪示之從該 門構件402末端延伸的虛線600、602之偏移來說明。該門 構件412之擴展導致該鐘形螺絲4丨〇改變方位並相對於該桿 臂413呈某一角度的傾斜。該襯套411亦允許該鐘形螺絲41〇 孝κ向移動’用以彌補該門構件402在長度的變化。該可形變 的連接部419亦允許該桿臂413，相對於通過該處理室主體 3 1 2之該轴404、406實質上維持無變化。此外，當該門構件 402框轉至其表面與反應室壁接觸對準而使該曲狀門構件 402變直時所導致之移動’該可形變的連接部419亦提供在 第二平面轉動。 第7圖係該密封塊組件408的一實施例的剖視圖》該密 封塊組件408包含一殼體702、一内襯套704' —外襯套706、 及一或多個轴密封件708。該殼體702通常藉由多數緊固件 710連結至處理室主體312。一個〇型環712配置在該殼體 702與處理室主體312之間’用以在其等之間提供一真空密 封。
該殼體702包含一通孔714其允許該軸406通過該殼體 702。該孔714在每一末端具有複數個鑽枉坑（c〇unterb〇res)， 用以收容該内外軸承704、706。複數扣環718用以防止該等 軸承704、706從孔714移出。該等轴承704、706係壓配在 該軸406’用以協助轉動。在第7圖所繪示之實施例，該軸 承 704、706 係交叉報轴承（cross-roller bearings)。 該一或多個軸密封件708係配置在一孔714内，並在該 第二轴406與該殼體702之間提供一動態真空密封。第7圖 17 1352373 所繪不之實施例’顯示多數個轴密封件7〇8被間隔物716隔 開。 該第二轴406之一内側末端720係以一種玎確實將旋轉 移動從該轴406轉移至該桿臂413的方式連結至該桿臂 413»例如’該桿臂413可以與該轴4〇6相匹配或者包括一 鍵來確保其旋轉。或者，桿臂413可以被夾在、釘在、壓配 在、焊接在或者黏接在轴406上。
第8圖繪示一桿臂413實施例的示意圖，隨著該第一軸 404的轉動運動’該第一轴4〇4之一外部末端740係以一種 可確實將該外部致動器臂414的移動加以轉移的方式，連接 至該外部致動器臂414。該第二轴406之配置也類似。例如， 該外部致動器臂414可以與該軸404相匹配或者包括一鍵 802來確保其旋轉。或者，内部致動器臂414可以被夾在、 釘在、壓配在、焊接在或者黏接在軸4〇4上。
第9-10圖描述門構件402的一實施例的主視圖和俯視 圖。門構件402通常是細長的，由鋁或其他適合的材料製造 而成°門構件402包括較長邊（major sides) 902、904，較 短邊（minor side) 906、908 ’ 一密封面 910 和一背面 912。 該桿臂4 1 3係個別藉由一可形變的連接部4 1 9連接到門構件 402的背面912的相對兩端，靠近較短邊906、908。在一實 施例中’門構件402是矩形的，並且在較短邊906、9〇8之 間的寬度至少為1260毫米。可以預見，門構件4〇2在寬度 上可長些或短些，以適合不同尺寸的基板。 密封概片（seal gland) 914形成在諸側902、904、906、 18 1352373 908裏面的密封面910内。該密封襯片914可限制門構件402 的中心部分，其可覆蓋通過處理室主體312的基板進出埠 316。密封件916 —般設計成當受到致動器330、430的擠壓 時，可防止門搆件402與處理室主體312間有接觸。在一實 施例中，密封件916由含氟聚合物或其他適合的材料製成的 0型環構成。其他密封材料的例子包括氟破化合物（fkm ) 或全氟彈性體（ffkm )、腈橡穆·（ nbr )和碎化物。可見，密
封件916和密封襯片914可被選擇性地設置在處理室主體 312 上。 該門構件402的該密封面910至少相對於連接較短邊 906、908的主轴1002彎曲。該主軸1 002平行於由門構件 402密封該處理室主體312的一密封表面ι〇12界定的一假相 線1〇〇〇。為清楚起見’在第1〇圖中，該密封表面ι〇ΐ2和該 門構件402顯示為一放大的間隔分離的關係。假想線〖 也可以平行於該轴404、406，並且與該較短邊9〇6、9〇8垂 直。在第10圖描述的實施例中，該密封面91〇相對於該線 900係凸出的，這樣當門構件4〇2閉合時，該密封面gw的 中心首先接觸到處理室主體312,藉此在門構件4〇2内部產 生彈力。 在操作中，與設置在較短邊906、9〇8上的桿臂々Η相連 的致動器330、430使門構件402旋轉關閉。由致動器、 43 0引起的曲狀的門上的負載力在笛n 取力在第11圖中由箭頭1102描 述。當該門旋轉關閉’由該彈性襯套41丨所接 听知：供之該鐘形螺 栓410的橫向移動’因而允許在一相對 、^稈臂4 1 3之縱向 19 1352373 移動。由於門構件402的彎曲，門構件4〇2的中心首先與處 理室主體312接觸。因為致動器33〇、43〇的力使門構件4〇2 變平，門構件402的弩曲就產生了一彈力從而增大了門構件 402中心區域的密封件9丨6。由門構件4〇2的彈力而引起的 負載力在第11圊_由箭頭n〇4描述。經過致動器 的門端部的高負載的合力被門構件4〇2的中心彈力抵消從 而在基板進出埠316的周圍均勻地施壓和載入密封件gw。
負載力1102、1104的合力總和在第u圖中由箭頭η %描 述》在致動器的合力和門構件4〇2產生的彈力的作用下，變 平的密封面910在通過處理室主體312的通道周圍提供均勻 的密封負載8i6 ’藉此確保了通道週邊的真空密封均勻而可 靠，同時增加了密封的期限。為了預先確定門的幾何尺寸和 理想的真空狀況，密封面川㈣曲程度將由先束的偏 析決定。 再者’當第一和第二桿404、4〇6比門構件4〇2和負載鎖 U⑽的寬度短時1的偏轉較小，從而使力更有效地從 致動益330、430傳遞到門構件402。較短的軸4〇4、4〇6還 可考慮利用較小的袖直徑，藉此減少與成本有關的長軸其 等因硬度需要更大的直徑和更大尺寸的相關硬體。另外 於内部致動器冑412被設置在處理室主冑316的凹部川 内’為了一提前確定的基板進出帛σ的寬度，負載鎖定室2〇〇 的寬度和内邛體積可以最小化以利於減少製造負載鎖定 200的成本，並藉由減小負載鎖定室綱的體積而增加 力，需要在運轉期間通風和栗送作業。 20 1352373 第7圊係沿著第4圖的線5_5截取的 pack assembly)的實施例的剖視圖。 塊組件（似1 第8圖是第2圏中的負載鎖定 視圖β Λ知*例的局部切開側
第 第 第 9-10圖是一門構件的實施例的主視圖 11圖是門構件上的密封力的示意圏。 和俯視圖 示共通 於另外 應 為係限 12圖疋負載鎖定室的另一實施例的局部剖視圖。 了容易理解，儘可能指定相同的對照號字來表示各圖 的元件，預期一實施例之元件及特徵能夠便利地使用 的實施例中時，則未加以詳述。 瞭解附圖只例示本發明的例示性實施例，因此不能認 定本發明的範圍，本發明可包括其他等效的實施例。 【主 鸯'元件符號說明 1 02 支架 106 處理室主體 110 門 114 軸承 118 致動器 208 移送室 212 工廠介面 234 真空機械人 238 匣盒 250 處理系統 104、 120軸 108 通道 112 箭頭 116 密封件 200 負載鎖定室 210 基板 232 處理室 236 大氣機械人 240 隔室 3〇〇 門組件
22 1352373
302 側 壁 304 第 二 側 壁 306 側 壁 308 底 部 310 頂 部 3 12 處 理 室 主 體 314 内 壁 3 16 基 板 進 出 埠 3 18 側 壁 320 基 板 移 送 室 322 基 板 移 送 室 324 基 板 移 送 室 330 致 動 器 340 埠 342 系 統 344 支 撐 件 402 門 構件 404 轴 406 軸 408 密 封 塊 組 件 410 鐘 形 螺 栓 41 1 襯 套 412 内 部 致 動 器 臂 41.3 桿 臂 414 外 部 致 動 器 臂 415 螺 帽 419 可 形 變 的 連 接部 421 止 推 墊 圈 423 間 隔 物 430 致 動 器 450 連 接 構 件 502 頭 部 504 内 部 直 徑 512 内 部 直 徑 5 14 直 徑 516 固 定 螺 釘 530 凹 部 532 礼 540 凹 部 542 扎 600 虚 線 602 虛 線 702 殼 體 704 内 韩 承 706 外 承 708 袖 密 封 件 710 多 數 個 緊 固 件 712 0 型 環 23 1352373
714 通孔 716 間隔物 718 扣環 720 内側末端 740 外側末端 802 鍵 902 較長邊 904 較長邊 906 較短邊 908 較短邊 910 密封面 912 背面 914 密封襯片 916 密封件 1000 線 1002 主轴 1012 密封表面 1102 負載力 1104 負載力 1106 合力 1200 負載鎖定室 1202 致動器 1204 致動器 1212 處理室主體
24

Claims (1)

1352373 第？功π號專利案b年夕月修正 、申請專利範圍： l—種處理室，包括： 一處理室主體，其 丹具有一第一基板移送埠： —門構 #，A B 有一曲狀密封面能夠改變位置來選擇性 地遗封該第一基板移送埠； 擇性 一桿臂；
T形變的連接部，係連接該桿臂至該門構件，該可形 變·、接部係试置成可允許該門構件相對於該桿臂橫向移 動其中該可形變的連接部更包括： 至少—第一彈性襯套；及 連接構件’其通過該第一彈性襯套、該門構件、及該 桿臂。 2. 如申請專利範圍第1項所述之處理室，其中該可形變 的連接部更包括： 一第二彈性襯套，其具有該連接構件設於其中，該第一 與第二彈性襯套係由該桿臂所分開。 3. 如申請專利範圍第2項所述之處理室，其中該可形變 的連接部更包括： 一第三彈性襯套，其具有該連接構件設於其中’並且其 位置係鄰接該第二彈性襯套。 4. 如申請專利範圍第3項所述冬處理室，其中該第二彈 25 13^2373 性概套與該第 二彈性襯套係由 一間隔物所分開
通過一第一孔（該第一孔係穿過 及一第二孔（該第二孔係穿過
5.一種處理室，包括： 一處理室主體，复 « ^ "具有一第一基板移送埠 1構件，其具有—曲狀密封面能夠改變 地密封該第一基板移送埠； 一桿臂； 變的連接部係設置成可允許該門構件相對 動’其中該可形變的連接部更包括： 一螺栓，其 端而形成的）、 的）； 第一彈性襯套，其圍繞該螺栓而配置， 件而與該桿臂分開；及 第一彈性概套’其圍繞該螺栓而配置， 來與該門構件分開。 6·如申請專利範圍第5項所述之處理室， 一間隔物，其配置在該桿臂與該門構件之 7.如申請專利範圍第5項所述之處理室， 包括： -形成於其中之凹部，該第二彈性襯套侍 位置來選擇性 構件，該可形 該桿臂橫向移 該門構件一末 該桿臂所形成 並藉由該門構 並藉由該桿臂 更包括： 間。 其中該桿臂更 :設置在該凹部 26 1-352373 内。 8.—種處理室，包括： 4理至主體’其具有一第一基板移送埠； 門構件其具有一曲狀密封面能夠改變位置來選擇性 地密封該第一基板移送埠； 一桿臂； 可形變的連接邹，係連接該桿臂至該門構件，該可形 變的連接部係設置成可允許該門構件相對於該桿臂橫向移 動 轴其配置成穿過該主體並連接至該桿臂；及 一致動器’其係以可操作的方式連接至該軸。 9. 一種處理室，包括： —處理室主體，复a ΐφ 4* 王肢再具有一第—基板移送埠；
置來選擇性 門構件，其具有一曲狀密封面能夠改變位 地密封該第一基板移送埠； —桿臂； 變的動 —可形變的連接部，係連接該桿臂至該門構件 連接部係設置成可允許該門構件相對於該桿 ，該可形 臂橫向移 —第一末端 "第二末端 的一第一末端。 換至一貫穿該處理室主體的第一轴；及 其藉由該可形變的連接料接至該門構件 27 1-352373 10. 如申請專利範圍第9項所述之處理室，更包括 —第二可形變的連接部；及 一第二桿臂其具有一第一末端及一第二末端，該 端係連接至一貫穿該處理室主體的第二軸，該第二末 由該第二可形變的連接部連接至該門構件的一第二末 11. 如申請專利範圍第1項所述之處理室，其中該 第一末 端則藉 端。 處理室
複數個堆疊的單一基板移送室。 12.如申請專利範圍第5項所述之處理室，其中該 主體更包括： 處理室 複數個堆疊的單一基板移送室。 # 13.如申請專利範圍第8項所述之處理室，其中該 主體更包括： 處理室 複數個堆疊的單一基板移送室。 14.如申請專利範圍第9項所述之處理室，其中該 主體更包括： 處理室 複數個堆疊的單一基板移送室。 28
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Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7845618B2 (en) * 2006-06-28 2010-12-07 Applied Materials, Inc. Valve door with ball coupling
KR101650320B1 (ko) 2008-08-28 2016-08-23 어플라이드 머티어리얼스, 인코포레이티드 오링을 이동하는 대응 부분에 커플링시키기 위한 슬롯이 형성된 ｔｓｓｌ 도어
CN101994097B (zh) * 2009-08-25 2013-08-21 鸿富锦精密工业（深圳）有限公司 镀膜装置
TWI396179B (zh) * 2009-08-26 2013-05-11 Raydium Semiconductor Corp 低功率之顯示面板驅動方法及驅動電路
TWI558841B (zh) * 2009-12-22 2016-11-21 應用材料股份有限公司 狹縫閥通道支撐件
US11171008B2 (en) 2011-03-01 2021-11-09 Applied Materials, Inc. Abatement and strip process chamber in a dual load lock configuration
CN203746815U (zh) 2011-03-01 2014-07-30 应用材料公司 用于处理基板的腔室
CN103403852B (zh) 2011-03-01 2016-06-08 应用材料公司 双负载闸配置的消除及剥离处理腔室
CN107164742B (zh) * 2011-03-01 2020-10-16 应用材料公司 具有共享泵的真空腔室
CN104137248B (zh) 2012-02-29 2017-03-22 应用材料公司 配置中的除污及剥除处理腔室
WO2014085497A1 (en) * 2012-11-30 2014-06-05 Applied Materials, Inc Process chamber gas flow apparatus, systems, and methods
US9530623B2 (en) * 2013-11-26 2016-12-27 Applied Materials, Inc. Process chamber apparatus, systems, and methods for controlling a gas flow pattern
JP5890929B1 (ja) * 2015-07-01 2016-03-22 株式会社ブイテックス ゲートバルブ
JP6882625B2 (ja) * 2017-01-12 2021-06-02 株式会社島津製作所 真空バルブ
WO2019001680A1 (en) * 2017-06-26 2019-01-03 Applied Materials, Inc. CONFIGURED DOOR FOR SEALING AN OPENING IN A VACUUM PROCESSING SYSTEM, VACUUM PROCESSING SYSTEM, AND METHOD FOR OPERATING A DOOR
US11581203B2 (en) * 2020-09-02 2023-02-14 Applied Materials, Inc. Systems for integrating load locks into a factory interface footprint space

Family Cites Families (145)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US512727A (en) 1894-01-16 Tub national lithog
US3557837A (en) 1969-01-21 1971-01-26 Controls Co Of America Modulating valve
US3972504A (en) * 1974-12-02 1976-08-03 Ametek, Inc. Main steam isolation check valve
US3976330A (en) * 1975-10-01 1976-08-24 International Business Machines Corporation Transport system for semiconductor wafer multiprocessing station system
US4047624A (en) 1975-10-21 1977-09-13 Airco, Inc. Workpiece handling system for vacuum processing
US5187115A (en) * 1977-12-05 1993-02-16 Plasma Physics Corp. Method of forming semiconducting materials and barriers using a dual enclosure apparatus
US4178113A (en) 1977-12-05 1979-12-11 Macronetics, Inc. Buffer storage apparatus for semiconductor wafer processing
CH626214GA3 (zh) * 1979-02-07 1981-11-13
US4680061A (en) * 1979-12-21 1987-07-14 Varian Associates, Inc. Method of thermal treatment of a wafer in an evacuated environment
US4512391A (en) * 1982-01-29 1985-04-23 Varian Associates, Inc. Apparatus for thermal treatment of semiconductor wafers by gas conduction incorporating peripheral gas inlet
US5374147A (en) 1982-07-29 1994-12-20 Tokyo Electron Limited Transfer device for transferring a substrate
US5259881A (en) 1991-05-17 1993-11-09 Materials Research Corporation Wafer processing cluster tool batch preheating and degassing apparatus
US4801241A (en) * 1984-03-09 1989-01-31 Tegal Corporation Modular article processing machine and method of article handling therein
US4693777A (en) 1984-11-30 1987-09-15 Kabushiki Kaisha Toshiba Apparatus for producing semiconductor devices
US4759681A (en) * 1985-01-22 1988-07-26 Nissin Electric Co. Ltd. End station for an ion implantation apparatus
US5224809A (en) * 1985-01-22 1993-07-06 Applied Materials, Inc. Semiconductor processing system with robotic autoloader and load lock
US4687542A (en) * 1985-10-24 1987-08-18 Texas Instruments Incorporated Vacuum processing system
US4966519A (en) 1985-10-24 1990-10-30 Texas Instruments Incorporated Integrated circuit processing system
US5044871A (en) 1985-10-24 1991-09-03 Texas Instruments Incorporated Integrated circuit processing system
US4709655A (en) 1985-12-03 1987-12-01 Varian Associates, Inc. Chemical vapor deposition apparatus
US4836733A (en) * 1986-04-28 1989-06-06 Varian Associates, Inc. Wafer transfer system
US4770590A (en) 1986-05-16 1988-09-13 Silicon Valley Group, Inc. Method and apparatus for transferring wafers between cassettes and a boat
US4775281A (en) 1986-12-02 1988-10-04 Teradyne, Inc. Apparatus and method for loading and unloading wafers
US5292393A (en) * 1986-12-19 1994-03-08 Applied Materials, Inc. Multichamber integrated process system
US5882165A (en) * 1986-12-19 1999-03-16 Applied Materials, Inc. Multiple chamber integrated process system
US4951601A (en) * 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
US4784377A (en) 1986-12-23 1988-11-15 Northern Telecom Limited Apparatus for locating and supporting ceramic substrates
US4785962A (en) 1987-04-20 1988-11-22 Applied Materials, Inc. Vacuum chamber slit valve
US4913929A (en) * 1987-04-21 1990-04-03 The Board Of Trustees Of The Leland Stanford Junior University Thermal/microwave remote plasma multiprocessing reactor and method of use
JPS63291419A (ja) 1987-05-24 1988-11-29 Tatsumo Kk 加熱処理装置
US4846102A (en) * 1987-06-24 1989-07-11 Epsilon Technology, Inc. Reaction chambers for CVD systems
US4828224A (en) * 1987-10-15 1989-05-09 Epsilon Technology, Inc. Chemical vapor deposition system
JPH0333058Y2 (zh) 1987-06-26 1991-07-12
JPS6411320A (en) * 1987-07-06 1989-01-13 Toshiba Corp Photo-cvd device
US4816098A (en) * 1987-07-16 1989-03-28 Texas Instruments Incorporated Apparatus for transferring workpieces
US4911103A (en) * 1987-07-17 1990-03-27 Texas Instruments Incorporated Processing apparatus and method
US5001327A (en) * 1987-09-11 1991-03-19 Hitachi, Ltd. Apparatus and method for performing heat treatment on semiconductor wafers
US5020475A (en) * 1987-10-15 1991-06-04 Epsilon Technology, Inc. Substrate handling and transporting apparatus
FR2621930B1 (fr) * 1987-10-15 1990-02-02 Solems Sa Procede et appareil pour la production par plasma de couches minces a usage electronique et/ou optoelectronique
US4822001A (en) * 1988-01-13 1989-04-18 Sisk David E Positive fluid seal butterfly valve
US5202716A (en) * 1988-02-12 1993-04-13 Tokyo Electron Limited Resist process system
US5259883A (en) 1988-02-16 1993-11-09 Kabushiki Kaisha Toshiba Method of thermally processing semiconductor wafers and an apparatus therefor
US4857689A (en) * 1988-03-23 1989-08-15 High Temperature Engineering Corporation Rapid thermal furnace for semiconductor processing
EP0343530B1 (de) * 1988-05-24 2001-11-14 Unaxis Balzers Aktiengesellschaft Vakuumanlage
US5536128A (en) * 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
US4952299A (en) * 1988-10-31 1990-08-28 Eaton Corporation Wafer handling apparatus
US4923584A (en) * 1988-10-31 1990-05-08 Eaton Corporation Sealing apparatus for a vacuum processing system
US5186718A (en) * 1989-05-19 1993-02-16 Applied Materials, Inc. Staged-vacuum wafer processing system and method
US5254170A (en) 1989-08-07 1993-10-19 Asm Vt, Inc. Enhanced vertical thermal reactor system
US5227708A (en) * 1989-10-20 1993-07-13 Applied Materials, Inc. Two-axis magnetically coupled robot
ES2130295T3 (es) 1989-10-20 1999-07-01 Applied Materials Inc Aparato de tipo robot.
US5447409A (en) 1989-10-20 1995-09-05 Applied Materials, Inc. Robot assembly
US5060354A (en) 1990-07-02 1991-10-29 George Chizinsky Heated plate rapid thermal processor
US5252807A (en) 1990-07-02 1993-10-12 George Chizinsky Heated plate rapid thermal processor
JP2644912B2 (ja) * 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
US5261935A (en) 1990-09-26 1993-11-16 Tokyo Electron Sagami Limited Clean air apparatus
JP2595132B2 (ja) * 1990-11-26 1997-03-26 株式会社日立製作所 真空処理装置
US5685684A (en) 1990-11-26 1997-11-11 Hitachi, Ltd. Vacuum processing system
US5199483A (en) * 1991-05-15 1993-04-06 Applied Materials, Inc. Method and apparatus for cooling wafers
US5131460A (en) * 1991-10-24 1992-07-21 Applied Materials, Inc. Reducing particulates during semiconductor fabrication
JP2598353B2 (ja) * 1991-12-04 1997-04-09 アネルバ株式会社 基板処理装置、基板搬送装置及び基板交換方法
DE4203473A1 (de) * 1992-02-07 1993-08-12 Leybold Ag Drehschleuse zum ein- und/oder ausbringen eines substrats aus der einen in eine benachbarte behandlungskammer
KR100230697B1 (ko) 1992-02-18 1999-11-15 이노우에 쥰이치 감압 처리 장치
US5404894A (en) * 1992-05-20 1995-04-11 Tokyo Electron Kabushiki Kaisha Conveyor apparatus
JPH0616206A (ja) * 1992-07-03 1994-01-25 Shinko Electric Co Ltd クリーンルーム内搬送システム
US5697749A (en) 1992-07-17 1997-12-16 Tokyo Electron Kabushiki Kaisha Wafer processing apparatus
US5516732A (en) * 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
US5352294A (en) * 1993-01-28 1994-10-04 White John M Alignment of a shadow frame and large flat substrates on a support
DE69304038T2 (de) * 1993-01-28 1996-12-19 Applied Materials Inc Vorrichtung für ein Vakuumverfahren mit verbessertem Durchsatz
US5607009A (en) 1993-01-28 1997-03-04 Applied Materials, Inc. Method of heating and cooling large area substrates and apparatus therefor
JP3258748B2 (ja) 1993-02-08 2002-02-18 東京エレクトロン株式会社 熱処理装置
KR100261532B1 (ko) 1993-03-14 2000-07-15 야마시타 히데나리 피처리체 반송장치를 가지는 멀티챔버 시스템
US5695568A (en) 1993-04-05 1997-12-09 Applied Materials, Inc. Chemical vapor deposition chamber
KR100221983B1 (ko) 1993-04-13 1999-09-15 히가시 데쓰로 처리장치
KR100267617B1 (ko) * 1993-04-23 2000-10-16 히가시 데쓰로 진공처리장치 및 진공처리방법
US5421889A (en) * 1993-06-29 1995-06-06 Tokyo Electron Limited Method and apparatus for inverting samples in a process
JP3654597B2 (ja) 1993-07-15 2005-06-02 株式会社ルネサステクノロジ 製造システムおよび製造方法
DE69402918T2 (de) 1993-07-15 1997-08-14 Applied Materials Inc Substratfangvorrichtung und Keramikblatt für Halbleiterbearbeitungseinrichtung
US5616208A (en) * 1993-09-17 1997-04-01 Tokyo Electron Limited Vacuum processing apparatus, vacuum processing method, and method for cleaning the vacuum processing apparatus
US5588827A (en) 1993-12-17 1996-12-31 Brooks Automation Inc. Passive gas substrate thermal conditioning apparatus and method
US5738767A (en) * 1994-01-11 1998-04-14 Intevac, Inc. Substrate handling and processing system for flat panel displays
US5934856A (en) * 1994-05-23 1999-08-10 Tokyo Electron Limited Multi-chamber treatment system
US5586585A (en) 1995-02-27 1996-12-24 Asyst Technologies, Inc. Direct loadlock interface
JP3270852B2 (ja) * 1995-04-20 2002-04-02 東京エレクトロン株式会社 圧力調整装置及びこれを用いた部屋の連通方法
JP3288200B2 (ja) * 1995-06-09 2002-06-04 東京エレクトロン株式会社 真空処理装置
TW309503B (zh) 1995-06-27 1997-07-01 Tokyo Electron Co Ltd
US5615988A (en) * 1995-07-07 1997-04-01 Pri Automation, Inc. Wafer transfer system having rotational capability
JPH0936198A (ja) * 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
US5716207A (en) * 1995-07-26 1998-02-10 Hitachi Techno Engineering Co., Ltd. Heating furnace
CH691376A5 (de) * 1995-10-17 2001-07-13 Unaxis Balzers Ag Vakuumanlage zur Oberflächenbearbeitung von Werkstücken.
JP2713276B2 (ja) * 1995-12-07 1998-02-16 日本電気株式会社 半導体装置の製造装置およびこれを用いた半導体装置の製造方法
US5751003A (en) 1996-02-16 1998-05-12 Eaton Corporation Loadlock assembly for an ion implantation system
US5793050A (en) * 1996-02-16 1998-08-11 Eaton Corporation Ion implantation system for implanting workpieces
JPH09284344A (ja) * 1996-04-11 1997-10-31 Fujitsu Ltd Ａｔｍ／ｓｔｍ混在ネットワークシステム
US6176667B1 (en) * 1996-04-30 2001-01-23 Applied Materials, Inc. Multideck wafer processing system
US6224680B1 (en) * 1996-07-09 2001-05-01 Gamma Precision Technology, Inc. Wafer transfer system
US5891251A (en) * 1996-08-07 1999-04-06 Macleish; Joseph H. CVD reactor having heated process chamber within isolation chamber
JP3202929B2 (ja) * 1996-09-13 2001-08-27 東京エレクトロン株式会社 処理システム
US6048154A (en) * 1996-10-02 2000-04-11 Applied Materials, Inc. High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock
US5855681A (en) * 1996-11-18 1999-01-05 Applied Materials, Inc. Ultra high throughput wafer vacuum processing system
US5961269A (en) * 1996-11-18 1999-10-05 Applied Materials, Inc. Three chamber load lock apparatus
US6082950A (en) * 1996-11-18 2000-07-04 Applied Materials, Inc. Front end wafer staging with wafer cassette turntables and on-the-fly wafer center finding
US5902088A (en) * 1996-11-18 1999-05-11 Applied Materials, Inc. Single loadlock chamber with wafer cooling function
US5909994A (en) * 1996-11-18 1999-06-08 Applied Materials, Inc. Vertical dual loadlock chamber
US5833426A (en) 1996-12-11 1998-11-10 Applied Materials, Inc. Magnetically coupled wafer extraction platform
US5795355A (en) * 1996-12-24 1998-08-18 Applied Materials, Inc. Integrated micro-environment container loader apparatus having a semipermeable barrier
KR100234539B1 (ko) * 1996-12-24 1999-12-15 윤종용 반도체장치 제조용 식각 장치
JP3549141B2 (ja) * 1997-04-21 2004-08-04 大日本スクリーン製造株式会社 基板処理装置および基板保持装置
US6059507A (en) * 1997-04-21 2000-05-09 Brooks Automation, Inc. Substrate processing apparatus with small batch load lock
US5944857A (en) * 1997-05-08 1999-08-31 Tokyo Electron Limited Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor
KR100271758B1 (ko) * 1997-06-25 2001-01-15 윤종용 반도체장치 제조설비 및 이의 구동방법
US6089543A (en) * 1997-07-11 2000-07-18 Applied Materials, Inc. Two-piece slit valve door with molded-in-place seal for a vacuum processing system
US6034000A (en) * 1997-07-28 2000-03-07 Applied Materials, Inc. Multiple loadlock system
JPH1154496A (ja) * 1997-08-07 1999-02-26 Tokyo Electron Ltd 熱処理装置及びガス処理装置
JP4048387B2 (ja) * 1997-09-10 2008-02-20 東京エレクトロン株式会社 ロードロック機構及び処理装置
US6235634B1 (en) * 1997-10-08 2001-05-22 Applied Komatsu Technology, Inc. Modular substrate processing system
JP2002504744A (ja) * 1997-11-28 2002-02-12 マットソン テクノロジイ インコーポレイテッド 真空処理を行う非加工物を、低汚染かつ高処理能力で取扱うためのシステムおよび方法
US6270582B1 (en) * 1997-12-15 2001-08-07 Applied Materials, Inc Single wafer load lock chamber for pre-processing and post-processing wafers in a vacuum processing system
US6042623A (en) * 1998-01-12 2000-03-28 Tokyo Electron Limited Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor
KR100265287B1 (ko) * 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
US6517303B1 (en) * 1998-05-20 2003-02-11 Applied Komatsu Technology, Inc. Substrate transfer shuttle
US6213704B1 (en) * 1998-05-20 2001-04-10 Applied Komatsu Technology, Inc. Method and apparatus for substrate transfer and processing
US6206176B1 (en) * 1998-05-20 2001-03-27 Applied Komatsu Technology, Inc. Substrate transfer shuttle having a magnetic drive
US6215897B1 (en) * 1998-05-20 2001-04-10 Applied Komatsu Technology, Inc. Automated substrate processing system
US6079693A (en) * 1998-05-20 2000-06-27 Applied Komatsu Technology, Inc. Isolation valves
US6176668B1 (en) * 1998-05-20 2001-01-23 Applied Komatsu Technology, Inc. In-situ substrate transfer shuttle
US6086362A (en) * 1998-05-20 2000-07-11 Applied Komatsu Technology, Inc. Multi-function chamber for a substrate processing system
US6192827B1 (en) * 1998-07-03 2001-02-27 Applied Materials, Inc. Double slit-valve doors for plasma processing
US6016611A (en) * 1998-07-13 2000-01-25 Applied Komatsu Technology, Inc. Gas flow control in a substrate processing system
JP2000195925A (ja) * 1998-12-28 2000-07-14 Anelva Corp 基板処理装置
KR100506972B1 (ko) * 1999-01-12 2005-08-09 삼성전자주식회사 이온 주입기의 로드락 도어 개폐 장치
US6106634A (en) * 1999-02-11 2000-08-22 Applied Materials, Inc. Methods and apparatus for reducing particle contamination during wafer transport
US6410455B1 (en) * 1999-11-30 2002-06-25 Wafermasters, Inc. Wafer processing system
US6568899B1 (en) * 1999-11-30 2003-05-27 Wafermasters, Inc. Wafer processing system including a robot
US6558509B2 (en) * 1999-11-30 2003-05-06 Applied Materials, Inc. Dual wafer load lock
US6949143B1 (en) 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
KR20030032034A (ko) * 2000-09-15 2003-04-23 어플라이드 머티어리얼스, 인코포레이티드 처리 장비용 두 개의 이중 슬롯 로드록
US6471181B2 (en) * 2001-01-11 2002-10-29 Vat Holding Ag Suspension of a valve plate of a vacuum valve
US6427969B1 (en) * 2001-04-27 2002-08-06 Helix Technology Inc. Adjustable gate valve assembly for vacuum chamber
US6528767B2 (en) 2001-05-22 2003-03-04 Applied Materials, Inc. Pre-heating and load lock pedestal material for high temperature CVD liquid crystal and flat panel display applications
US20030072639A1 (en) 2001-10-17 2003-04-17 Applied Materials, Inc. Substrate support
TW503973U (en) * 2001-12-31 2002-09-21 Helix Technology Inc Independent valve structure
US6917755B2 (en) 2003-02-27 2005-07-12 Applied Materials, Inc. Substrate support
US7207766B2 (en) * 2003-10-20 2007-04-24 Applied Materials, Inc. Load lock chamber for large area substrate processing system
US7575220B2 (en) * 2004-06-14 2009-08-18 Applied Materials, Inc. Curved slit valve door

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TW200727332A (en) 2007-07-16
CN101005012A (zh) 2007-07-25
JP5221879B2 (ja) 2013-06-26
CN100524611C (zh) 2009-08-05
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US7497414B2 (en) 2009-03-03
US20060151735A1 (en) 2006-07-13

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