TWI349167B - Coating and developing apparatus, coating and developing method, and recording medium - Google Patents
Coating and developing apparatus, coating and developing method, and recording mediumInfo
- Publication number
- TWI349167B TWI349167B TW096110728A TW96110728A TWI349167B TW I349167 B TWI349167 B TW I349167B TW 096110728 A TW096110728 A TW 096110728A TW 96110728 A TW96110728 A TW 96110728A TW I349167 B TWI349167 B TW I349167B
- Authority
- TW
- Taiwan
- Prior art keywords
- coating
- developing
- recording medium
- developing apparatus
- developing method
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02027—Setting crystal orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/60—Substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02019—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006112704A JP4816217B2 (ja) | 2006-04-14 | 2006-04-14 | 塗布、現像装置、塗布、現像方法及び記憶媒体 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200745765A TW200745765A (en) | 2007-12-16 |
TWI349167B true TWI349167B (en) | 2011-09-21 |
Family
ID=38759378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096110728A TWI349167B (en) | 2006-04-14 | 2007-03-28 | Coating and developing apparatus, coating and developing method, and recording medium |
Country Status (5)
Country | Link |
---|---|
US (2) | US7955011B2 (zh) |
JP (1) | JP4816217B2 (zh) |
KR (2) | KR101121314B1 (zh) |
CN (1) | CN100508115C (zh) |
TW (1) | TWI349167B (zh) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5006122B2 (ja) | 2007-06-29 | 2012-08-22 | 株式会社Sokudo | 基板処理装置 |
JP5160204B2 (ja) * | 2007-11-30 | 2013-03-13 | 株式会社Sokudo | 基板処理装置 |
JP5128918B2 (ja) | 2007-11-30 | 2013-01-23 | 株式会社Sokudo | 基板処理装置 |
JP5318403B2 (ja) | 2007-11-30 | 2013-10-16 | 株式会社Sokudo | 基板処理装置 |
JP5001828B2 (ja) * | 2007-12-28 | 2012-08-15 | 株式会社Sokudo | 基板処理装置 |
JP5179170B2 (ja) | 2007-12-28 | 2013-04-10 | 株式会社Sokudo | 基板処理装置 |
CN101615562B (zh) * | 2008-06-25 | 2010-12-15 | 沈阳芯源微电子设备有限公司 | 新型结构的涂胶显影设备 |
JP5274148B2 (ja) * | 2008-08-19 | 2013-08-28 | 東京エレクトロン株式会社 | 処理システム |
JP5410212B2 (ja) * | 2009-09-15 | 2014-02-05 | 株式会社Sokudo | 基板処理装置、基板処理システムおよび検査周辺露光装置 |
JP5736687B2 (ja) * | 2009-10-06 | 2015-06-17 | 東京エレクトロン株式会社 | 基板処理装置 |
JP5408059B2 (ja) | 2010-07-09 | 2014-02-05 | 東京エレクトロン株式会社 | 塗布、現像装置、塗布、現像方法及び記憶媒体 |
JP5338757B2 (ja) | 2010-07-09 | 2013-11-13 | 東京エレクトロン株式会社 | 塗布、現像装置、塗布、現像方法及び記憶媒体 |
JP5397399B2 (ja) | 2010-07-09 | 2014-01-22 | 東京エレクトロン株式会社 | 塗布、現像装置 |
JP5223897B2 (ja) * | 2010-09-02 | 2013-06-26 | 東京エレクトロン株式会社 | 塗布、現像装置、塗布、現像方法及び記憶媒体 |
KR101987283B1 (ko) | 2011-06-24 | 2019-06-10 | 삼성전자주식회사 | 무선 전력을 이용한 통신 시스템 |
JP5565422B2 (ja) * | 2012-02-08 | 2014-08-06 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
JP6099449B2 (ja) | 2013-03-25 | 2017-03-22 | 株式会社Screenセミコンダクターソリューションズ | 基板処理装置 |
US9020633B1 (en) * | 2013-11-29 | 2015-04-28 | Taiwan Semiconductor Manufacturing Company Ltd. | Automating storage, retrieval, and routine for process flow |
CN105097499B (zh) * | 2014-05-09 | 2019-05-17 | 盛美半导体设备(上海)有限公司 | 涂胶方法及涂胶装置 |
JP6292155B2 (ja) * | 2015-03-19 | 2018-03-14 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
CN105304535B (zh) * | 2015-11-21 | 2018-09-18 | 武汉华星光电技术有限公司 | 显示面板制造系统 |
CN108873626B (zh) * | 2018-07-02 | 2021-04-23 | 京东方科技集团股份有限公司 | 涂胶显影设备 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3455458B2 (ja) * | 1999-02-01 | 2003-10-14 | 東京エレクトロン株式会社 | 塗布、現像装置及び塗布現像処理における基板再生システム |
KR100558508B1 (ko) * | 1999-10-25 | 2006-03-07 | 동경 엘렉트론 주식회사 | 기판의 처리시스템 및 기판의 처리방법 |
KR100348938B1 (ko) * | 1999-12-06 | 2002-08-14 | 한국디엔에스 주식회사 | 포토리소그라피 공정을 위한 반도체 제조장치 |
JP3612265B2 (ja) | 2000-07-18 | 2005-01-19 | 東京エレクトロン株式会社 | 塗布、現像装置 |
SG94851A1 (en) * | 2000-07-12 | 2003-03-18 | Tokyo Electron Ltd | Substrate processing apparatus and substrate processing method |
KR100811964B1 (ko) * | 2000-09-28 | 2008-03-10 | 동경 엘렉트론 주식회사 | 레지스트 패턴 형성장치 및 그 방법 |
JP2002329661A (ja) * | 2001-04-27 | 2002-11-15 | Yoshitake Ito | 基板処理装置及び基板処理方法及び基板の製造方法 |
JP2003158056A (ja) * | 2001-11-21 | 2003-05-30 | Tokyo Electron Ltd | パターン形成システム |
JP3916468B2 (ja) * | 2002-01-11 | 2007-05-16 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
JP4357861B2 (ja) * | 2003-04-07 | 2009-11-04 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP4202220B2 (ja) * | 2003-09-22 | 2008-12-24 | 大日本スクリーン製造株式会社 | 検査装置、基板処理装置および基板処理方法 |
JP2005142372A (ja) * | 2003-11-06 | 2005-06-02 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
JP4381121B2 (ja) * | 2003-12-11 | 2009-12-09 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP4194495B2 (ja) * | 2004-01-07 | 2008-12-10 | 東京エレクトロン株式会社 | 塗布・現像装置 |
JP4955977B2 (ja) * | 2005-01-21 | 2012-06-20 | 東京エレクトロン株式会社 | 塗布、現像装置及びその方法 |
US7267497B2 (en) * | 2005-01-21 | 2007-09-11 | Tokyo Electron Limited | Coating and developing system and coating and developing method |
US7403260B2 (en) * | 2005-03-11 | 2008-07-22 | Tokyo Electron Limited | Coating and developing system |
JP4414921B2 (ja) * | 2005-03-23 | 2010-02-17 | 東京エレクトロン株式会社 | 塗布、現像装置及び塗布、現像方法 |
-
2006
- 2006-04-14 JP JP2006112704A patent/JP4816217B2/ja active Active
-
2007
- 2007-03-28 TW TW096110728A patent/TWI349167B/zh active
- 2007-04-10 US US11/733,441 patent/US7955011B2/en active Active
- 2007-04-13 KR KR1020070036386A patent/KR101121314B1/ko active IP Right Grant
- 2007-04-16 CN CNB2007100966089A patent/CN100508115C/zh active Active
-
2011
- 2011-05-02 KR KR1020110041642A patent/KR101121321B1/ko active IP Right Grant
- 2011-05-09 US US13/103,290 patent/US8313257B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR101121314B1 (ko) | 2012-03-26 |
CN101055835A (zh) | 2007-10-17 |
KR20070102426A (ko) | 2007-10-18 |
US20080014333A1 (en) | 2008-01-17 |
KR20110061532A (ko) | 2011-06-09 |
US8313257B2 (en) | 2012-11-20 |
CN100508115C (zh) | 2009-07-01 |
JP2007287887A (ja) | 2007-11-01 |
US20110211825A1 (en) | 2011-09-01 |
JP4816217B2 (ja) | 2011-11-16 |
KR101121321B1 (ko) | 2012-03-09 |
US7955011B2 (en) | 2011-06-07 |
TW200745765A (en) | 2007-12-16 |
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