TWI347373B - Formaldehyde free electroless copper compositions - Google Patents

Formaldehyde free electroless copper compositions

Info

Publication number
TWI347373B
TWI347373B TW096123946A TW96123946A TWI347373B TW I347373 B TWI347373 B TW I347373B TW 096123946 A TW096123946 A TW 096123946A TW 96123946 A TW96123946 A TW 96123946A TW I347373 B TWI347373 B TW I347373B
Authority
TW
Taiwan
Prior art keywords
electroless copper
formaldehyde free
copper compositions
free electroless
compositions
Prior art date
Application number
TW096123946A
Other languages
English (en)
Other versions
TW200809004A (en
Inventor
Mark A Poole
Andrew J Cobley
Amrik Singh
Deborah V Hirst
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW200809004A publication Critical patent/TW200809004A/zh
Application granted granted Critical
Publication of TWI347373B publication Critical patent/TWI347373B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW096123946A 2006-07-07 2007-07-02 Formaldehyde free electroless copper compositions TWI347373B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US81924906P 2006-07-07 2006-07-07

Publications (2)

Publication Number Publication Date
TW200809004A TW200809004A (en) 2008-02-16
TWI347373B true TWI347373B (en) 2011-08-21

Family

ID=38654598

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096123946A TWI347373B (en) 2006-07-07 2007-07-02 Formaldehyde free electroless copper compositions

Country Status (6)

Country Link
US (1) US7501014B2 (zh)
EP (1) EP1876259B8 (zh)
JP (2) JP2008121107A (zh)
KR (1) KR101389287B1 (zh)
CN (1) CN101173352B (zh)
TW (1) TWI347373B (zh)

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US7752996B2 (en) * 2006-05-11 2010-07-13 Lam Research Corporation Apparatus for applying a plating solution for electroless deposition
TWI348499B (en) * 2006-07-07 2011-09-11 Rohm & Haas Elect Mat Electroless copper and redox couples
TWI347982B (en) * 2006-07-07 2011-09-01 Rohm & Haas Elect Mat Improved electroless copper compositions
EP1876262A1 (en) * 2006-07-07 2008-01-09 Rohm and Haas Electronic Materials, L.L.C. Environmentally friendly electroless copper compositions
US8207261B2 (en) * 2009-03-25 2012-06-26 E.I. Du Pont De Nemours And Company Plastic articles, optionally with partial metal coating
US8591636B2 (en) * 2010-12-14 2013-11-26 Rohm And Haas Electronics Materials Llc Plating catalyst and method
US8946087B2 (en) 2012-02-02 2015-02-03 Lam Research Corporation Electroless copper deposition
US8765001B2 (en) * 2012-08-28 2014-07-01 Rohm And Haas Electronic Materials Llc Texturing of monocrystalline semiconductor substrates to reduce incident light reflectance
US9611550B2 (en) 2012-12-26 2017-04-04 Rohm And Haas Electronic Materials Llc Formaldehyde free electroless copper plating compositions and methods
US8673779B1 (en) 2013-02-27 2014-03-18 Lam Research Corporation Interconnect with self-formed barrier
US9598787B2 (en) 2013-03-14 2017-03-21 Rohm And Haas Electronic Materials Llc Method of filling through-holes
US8828863B1 (en) 2013-06-25 2014-09-09 Lam Research Corporation Electroless copper deposition with suppressor
US9364822B2 (en) 2013-06-28 2016-06-14 Rohm And Haas Electronic Materials Llc Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
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CN103556134B (zh) * 2013-11-13 2015-11-25 湖南省化讯应用材料有限公司 非电解镀镍的预处理方法
CN104711648B (zh) * 2013-12-17 2019-08-16 Ykk株式会社 闪镀铜镀敷液
US9869026B2 (en) * 2014-07-15 2018-01-16 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
CN104264139A (zh) * 2014-10-11 2015-01-07 无锡长辉机电科技有限公司 一种印制板镀铜浓缩液配方
US10512174B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
US10508357B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
JP6645881B2 (ja) 2016-03-18 2020-02-14 上村工業株式会社 銅めっき液及び銅めっき方法

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Also Published As

Publication number Publication date
JP2008121107A (ja) 2008-05-29
US7501014B2 (en) 2009-03-10
EP1876259B1 (en) 2012-02-22
EP1876259B8 (en) 2012-06-20
EP1876259A2 (en) 2008-01-09
CN101173352B (zh) 2011-09-14
JP5655099B2 (ja) 2015-01-14
US20080038451A1 (en) 2008-02-14
KR101389287B1 (ko) 2014-04-25
EP1876259A3 (en) 2010-03-24
TW200809004A (en) 2008-02-16
KR20080005128A (ko) 2008-01-10
JP2013076171A (ja) 2013-04-25
CN101173352A (zh) 2008-05-07

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees