CN104264139A - 一种印制板镀铜浓缩液配方 - Google Patents

一种印制板镀铜浓缩液配方 Download PDF

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Publication number
CN104264139A
CN104264139A CN201410531681.4A CN201410531681A CN104264139A CN 104264139 A CN104264139 A CN 104264139A CN 201410531681 A CN201410531681 A CN 201410531681A CN 104264139 A CN104264139 A CN 104264139A
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printed board
board copper
concentrated solution
copper plating
solution formula
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杨彦涛
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Wuxi Changhui Machinery & Electronics Technology Co Ltd
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Wuxi Changhui Machinery & Electronics Technology Co Ltd
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Priority to CN201410531681.4A priority Critical patent/CN104264139A/zh
Publication of CN104264139A publication Critical patent/CN104264139A/zh
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

本发明公开了一种印制板镀铜浓缩液配方，其特征在于：包括以下成分按重量配比，氯化铜280g/L，磷酸盐60g/L，酒石酸钾钠450g/L，氯化钠250g/L，甲醛12ML/L；提供了一种稳定性高，易配置的一种印制板镀铜浓缩液配方。

Description

一种印制板镀铜浓缩液配方
技术领域
本发明涉及一种印制板的制造方法，尤其涉及一种印制板镀铜浓缩液配方。
背景技术
 目前使印制板各层导电图形的电气互连的一种工艺过程主要是通过孔金属化技术来实现的。采用最多的就是化学沉铜进行孔金属化的工艺，对印制板加工来说，是沉积在经活化处理后的印制板基材和孔壁表面。为实现优质、高效快速、准确的操作与质量的控制，化学镀铜溶液多数都是以浓缩液的方式存储、运输、开缸和补充添加的。现有的镀铜浓缩液中含有硫酸铜，不好控制浓度，当酸度过高就会影响浓缩液的使用性能，且对成本消耗大，加速了工作液的老化。
发明内容
发明目的：本发明解决了上述问题，提供了一种稳定性高，易配置的一种印制板镀铜浓缩液配方。
技术方案：一种印制板镀铜浓缩液配方，包括以下成分按重量配比，氯化铜280g/L，磷酸盐60g/L，酒石酸钾钠450g/L，氯化钠250g/L，甲醛12ML/L。
具体地，所述甲醛的浓度为37%。
具体地，水溶液PH值为12.5—13.2。
有益效果：本发明与现有技术相比，其优点在于使用氯化铜配置成中性或弱酸性来保存二价铜离子，提高了存储的稳定性。                     
具体实施方式
下面结合具体实施方式，进一步阐明本发明。
一种印制板镀铜浓缩液配方，包括以下成分按重量配比，氯化铜280g/L，磷酸盐60g/L，酒石酸钾钠450g/L，氯化钠250g/L，浓度为37%甲醛12ML/L；配制时水溶液的PH值保持在12.5—13.2。
实施例1
先取800mL的去离子水注入容器中，再将350g/L的酒石酸钾钠与50g/L的氯化钠溶液融合，搅拌均匀，再加入280g/L的氯化铜和50g/L的磷酸盐，搅拌均匀，此时溶液中会产生少许絮状沉淀物，再继续加入100g/L的酒石酸钾钠和200g/L的氯化钠此时沉淀消失，配置完成。
在使用过程中，可根据铜离子的消耗程度来补加氯化铜和磷酸盐，以保证铜离子的含量在一定范围内。使得溶液稳定性好。
本发明操作简便，使用方便，使用氯化铜配置成中性或弱酸性来保存二价铜离子，提高了存储的稳定性。

Claims (3)

1.一种印制板镀铜浓缩液配方，其特征在于：包括以下成分按重量配比，氯化铜280g/L，磷酸盐60g/L，酒石酸钾钠450g/L，氯化钠250g/L，甲醛12ML/L。
2.根据权利要求1所述的一种印制板镀铜浓缩液配方，其特征在于：所述甲醛的浓度为37%。
3.根据权利要求1所述的一种印制板镀铜浓缩液配方，其特征在于：水溶液PH值为12.5—13.2。
CN201410531681.4A 2014-10-11 2014-10-11 一种印制板镀铜浓缩液配方 Pending CN104264139A (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2874072A (en) * 1956-09-17 1959-02-17 Gen Electric Autocatalytic copper plating process and solution
US3257215A (en) * 1963-06-18 1966-06-21 Day Company Electroless copper plating
DE2046114A1 (en) * 1970-09-18 1972-03-23 Licentia Gmbh Electroless copper deposition - from plating baths contg added chlorides, esp for plating aluminium
CN1867697A (zh) * 2003-10-17 2006-11-22 株式会社日矿材料 无电镀铜溶液和无电镀铜方法
CN101173352A (zh) * 2006-07-07 2008-05-07 罗门哈斯电子材料有限公司 不含甲醛的无电镀铜组合物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2874072A (en) * 1956-09-17 1959-02-17 Gen Electric Autocatalytic copper plating process and solution
US3257215A (en) * 1963-06-18 1966-06-21 Day Company Electroless copper plating
DE2046114A1 (en) * 1970-09-18 1972-03-23 Licentia Gmbh Electroless copper deposition - from plating baths contg added chlorides, esp for plating aluminium
CN1867697A (zh) * 2003-10-17 2006-11-22 株式会社日矿材料 无电镀铜溶液和无电镀铜方法
CN101173352A (zh) * 2006-07-07 2008-05-07 罗门哈斯电子材料有限公司 不含甲醛的无电镀铜组合物

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
唐济才: "印制电路板孔金属化工艺", 《电子工艺技术》 *
姜晓霞等: "《化学镀理论及实践》", 30 June 2000, 国防工业出版社 *
郑雅杰等: "化学镀铜及其应用", 《材料导报》 *

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Application publication date: 20150107