CN104278259A - 一种化学沉铜液的配方 - Google Patents

一种化学沉铜液的配方 Download PDF

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Publication number
CN104278259A
CN104278259A CN201410498947.XA CN201410498947A CN104278259A CN 104278259 A CN104278259 A CN 104278259A CN 201410498947 A CN201410498947 A CN 201410498947A CN 104278259 A CN104278259 A CN 104278259A
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formula
copper deposition
deposition liquid
chemical copper
plating solution
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杨彦涛
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Wuxi Changhui Machinery & Electronics Technology Co Ltd
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Wuxi Changhui Machinery & Electronics Technology Co Ltd
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Priority to CN201410498947.XA priority Critical patent/CN104278259A/zh
Publication of CN104278259A publication Critical patent/CN104278259A/zh
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

本发明公开了一种化学沉铜液的配方，硫酸铜9-12g/L,乙二胺四乙酸二钠30-32g/L，四羟丙基乙二胺15-16g/L，氢氧化钠12-15g/L，铁氰化钾0.09-0.1g/L，亚铁氰化钾0.01-0.03g/L，甲醛12-15g/L，提供了一种稳定性高，具有良好延伸率的一种化学沉铜液的配方。

Description

一种化学沉铜液的配方
技术领域
本发明涉及一种印制板镀铜工艺中沉铜液的配方。
背景技术
目前使印制板各层导电图形的电气互连的一种工艺过程主要是通过孔金属化技术来实现的。采用最多的就是化学沉铜进行孔金属化的工艺，对印制板加工来说，是沉积在经活化处理后的印制板基材和孔壁表面。现有化学镀铜工艺采用酒石酸钾钠为络合剂的化学镀铜配方，其沉积出的铜颗粒粗大，延展性差，经高低温循环试验容易断裂或脱层。
发明内容
发明目的：本发明解决了上述问题，提供了一种稳定性高，具有良好延伸率的一种化学沉铜液的配方。
技术方案：一种化学沉铜液的配方，硫酸铜9-12g/L,乙二胺四乙酸二钠30-32g/L，四羟丙基乙二胺15-16g/L，氢氧化钠12-15g/L，铁氰化钾0.09-0.1g/L，亚铁氰化钾0.01-0.03g/L，甲醛12-15g/L。
具体的，pH值为12.5。
具体的，温度控制在40-45℃。
有益效果：本发明与现有技术相比，其优点在于本发明用乙二胺四乙酸二钠和四羟丙基乙二胺为双络合剂体系，具有优异的溶液稳定性且延展性更好。
具体实施方式
下面结合具体实施方式，进一步阐明本发明。
实施例1
一种化学沉铜液的配方，硫酸铜9-12g/L,乙二胺四乙酸二钠30-32g/L，四羟丙基乙二胺15-16g/L，氢氧化钠12-15g/L，铁氰化钾0.09-0.1g/L，亚铁氰化钾0.01-0.03g/L，甲醛12-15g/L。溶液配制时pH值为12.5，温度控制在40-45℃。
在配制这种化学沉铜液时，由于主盐硫酸铜在无络合物的条件下，极容易生成氢氧化铜的沉淀，所以配制时先用60%的去离子水或蒸馏水溶解络合物和主盐硫酸铜，再用另一个容器用30%的去离子水或蒸馏水溶解氢氧化钠，然后不断搅拌将溶解的氢氧化钠缓缓注入上述络合剂与硫酸铜的混合溶液中，颜色会逐渐变深蓝色，用少量的去离子水或蒸馏水分别溶解配方所需要的铁氰化钾、亚铁氰化钾，再倒入上述化学镀铜溶液中搅拌均匀。
将上述配制好的溶液加热至规定的温度，最后加入甲醛，甲醛加入后5-10分钟后，便可浸入经活化处理后的印制板进行化学沉铜操作。

Claims (3)

1.一种化学沉铜液的配方，其特征在于：硫酸铜9-12g/L,乙二胺四乙酸二钠30-32g/L，四羟丙基乙二胺15-16g/L，氢氧化钠12-15g/L，铁氰化钾0.09-0.1g/L，亚铁氰化钾0.01-0.03g/L，甲醛12-15g/L。
2.根据权利要求1所述的一种化学沉铜液的配方，其特征在于：pH值为12.5。
3.根据权利要求1所述的一种化学沉铜液的配方，其特征在于：温度控制在40-45℃。
CN201410498947.XA 2014-09-26 2014-09-26 一种化学沉铜液的配方 Pending CN104278259A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107460457A (zh) * 2017-08-24 2017-12-12 深圳市新日东升电子材料有限公司 用于化学镀厚铜的高效络合剂及其制备方法
CN111155074A (zh) * 2019-12-30 2020-05-15 惠州市永隆电路有限公司 一种化学镀铜前处理方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1130223A (zh) * 1995-02-27 1996-09-04 北京航空航天大学 电热、屏蔽、防静电多功能导电织物及其制备方法
CN101122016A (zh) * 2007-09-07 2008-02-13 中国矿业大学 硅橡胶化学镀铜工艺

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1130223A (zh) * 1995-02-27 1996-09-04 北京航空航天大学 电热、屏蔽、防静电多功能导电织物及其制备方法
CN101122016A (zh) * 2007-09-07 2008-02-13 中国矿业大学 硅橡胶化学镀铜工艺

Non-Patent Citations (4)

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（美）戴维斯（DAVIS，J.R.）等: "《金属手册.案头卷.下册：原书第2版》", 31 March 2014 *
《化工防蚀》编辑部: "《防腐蚀实用技术》", 31 October 1995 *
YI-MAO LIN ET AL: "Effects of additives and chelating agents on electroless cooper plating", 《APPLIED SURFACE SCIENCE》 *
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107460457A (zh) * 2017-08-24 2017-12-12 深圳市新日东升电子材料有限公司 用于化学镀厚铜的高效络合剂及其制备方法
CN111155074A (zh) * 2019-12-30 2020-05-15 惠州市永隆电路有限公司 一种化学镀铜前处理方法

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Application publication date: 20150114