TWI344392B - - Google Patents
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- Publication number
- TWI344392B TWI344392B TW097121584A TW97121584A TWI344392B TW I344392 B TWI344392 B TW I344392B TW 097121584 A TW097121584 A TW 097121584A TW 97121584 A TW97121584 A TW 97121584A TW I344392 B TWI344392 B TW I344392B
- Authority
- TW
- Taiwan
- Prior art keywords
- chamber
- substrate
- opening
- processing
- processing chamber
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007221246 | 2007-08-28 | ||
JP2008046223A JP2009202088A (ja) | 2008-02-27 | 2008-02-27 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200916199A TW200916199A (en) | 2009-04-16 |
TWI344392B true TWI344392B (ja) | 2011-07-01 |
Family
ID=40692804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097121584A TW200916199A (en) | 2007-08-28 | 2008-06-10 | Substrate processing apparatus |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100933125B1 (ja) |
TW (1) | TW200916199A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013191779A (ja) * | 2012-03-14 | 2013-09-26 | Toshiba Corp | 処理装置および処理方法 |
KR102618629B1 (ko) * | 2021-08-24 | 2023-12-27 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001156035A (ja) | 1999-11-25 | 2001-06-08 | Hitachi Ltd | 基板処理装置及びその隣接処理槽への飛沫の浸入防止方法 |
JP2007073649A (ja) | 2005-09-06 | 2007-03-22 | Sharp Corp | レジスト剥離洗浄装置、レジスト剥離洗浄方法および基板製造方法 |
-
2008
- 2008-06-10 TW TW097121584A patent/TW200916199A/zh not_active IP Right Cessation
- 2008-06-24 KR KR1020080059490A patent/KR100933125B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20090023057A (ko) | 2009-03-04 |
TW200916199A (en) | 2009-04-16 |
KR100933125B1 (ko) | 2009-12-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |