TWI335631B - Mounting device for electric components - Google Patents

Mounting device for electric components Download PDF

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Publication number
TWI335631B
TWI335631B TW095103361A TW95103361A TWI335631B TW I335631 B TWI335631 B TW I335631B TW 095103361 A TW095103361 A TW 095103361A TW 95103361 A TW95103361 A TW 95103361A TW I335631 B TWI335631 B TW I335631B
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TW
Taiwan
Prior art keywords
pressure
pressing force
pressing
crimping
pressure adjusting
Prior art date
Application number
TW095103361A
Other languages
English (en)
Other versions
TW200636894A (en
Inventor
Shiyuki Kanisawa
Original Assignee
Sony Chemicals Corp
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Filing date
Publication date
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Publication of TW200636894A publication Critical patent/TW200636894A/zh
Application granted granted Critical
Publication of TWI335631B publication Critical patent/TWI335631B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
    • B30B15/022—Moulds for compacting material in powder, granular of pasta form
    • B30B15/024—Moulds for compacting material in powder, granular of pasta form using elastic mould parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/065—Press rams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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Description

1335631 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種將諸如半導體晶片等電氣元件構裝 於配線基板上之技術，尤其是關於1使用黏著劑來、 電氣元件之技術。 & 【先前技術】 以往，在印刷配線板等配線基板上直接構裝裸晶片之
方法’已知有使用結合劑（binde〇巾分散著導電粒子之 異向導電性黏著膜之方法。 使用異自導電性黏著膜之構裝方&中，於貼合有異向 導電性黏著膜之基板上裝載IC晶片&，以陶瓷與金屬製 等:㈣接頭肖IC晶片進行加|、加熱來使異向導電性 黏著臈硬化而進行熱壓接構裝。 ^使用上述金屬等I接頭進行加壓、加熱之方法之情形， 田進订熱愚接時對IC晶片周圍之黏著劑之邊綠（⑴Μ ) 部之加熱會不足，而成為連接可靠性降低之原目，又亦會 有複數個1C晶片之構裝產生困難之問題。 ^ 近年來，為了解決該等問題，揭示有使用由矽 乳橡膠等彈性體構成之熱壓接頭來進# 1C晶片执壓接之 技術（例如，參考專利文獻卜2)。 ”、 A八…、而，於上述習知技術中，由於1C晶片與基板之連接 塊/、圖案）間之加壓力不足，故會有無法進行充 分的連接、；5 、4_ 汉熬法充分確保初期導通電阻以及經時後之連 接可靠性之問題。 5 1335631 使用由彈性體構成之熱壓接頭進行加壓、加熱之 方法中，當進行壓接時會有IC晶片與基板產生偏移之問 題。 再者’上述偏移尤其在將複數個ic晶片整批構裝之情 形有變顯著之傾向。 專利文獻1 :特開2000_796n號公報 專利文獻2 :特開2002-359264號公報 【發明内容】 本發明係為了解決上述習知技術之問題而構成，其目 的在於提供一種構裝裝置，能使用黏著劑將複數個電氣元 件以高可靠性來進行構裝。 為了達成上述目的，本發明係一種電氣元件之構裝裝 置’其具備有：熱壓接頭，於壓接頭本體具有由既定彈性 體構成之壓接構件；以及緊壓力調整機構，按照該壓接構 件之壓接面區域來調整緊壓力；使該壓接構件以既定壓力 對配置於配線基板上之電氣元件進行緊壓。 本發明’於上述發明中’該緊壓力調整機構，係設置 於該壓接頭本體之複數個框狀緊壓力調整部，於該緊壓力 調整部内側配置該壓接構件。 本發明’於上述發明中，該緊壓力調整機構，係設置 於該壓接頭本體之突起狀緊壓力調整部。 本發明，於上述發明中，該緊壓力調整部之高度不同。 本發明’於上述發明中，該緊壓力調整機構埋設於該 壓接構件内。 6 1335631 本發明，於上述發明中，該緊壓力調整機構，係設置 於該壓接構件之缺口部。 本發明’於上述發明中，該緊壓力調整機構，係將複 數個該壓接構件組合成一體而構成。 本發明，於上述發明中，具有支持該配線基板之基台， 於該基台設置加熱器。 於本發明中，當進行熱壓接時，若藉由由既定彈性體 構成之壓接構件來緊壓電氣元件，則以既定壓力對配線基 板緊壓電氣元件之緊壓側區域（例如與壓接構件相對向之 頂部區域），再者，以較緊壓側區域小之壓力來緊壓該電 氣元件之側部區域。 其結果，可對電氣元件與配線基板之連接部分施加充 分之壓力’再者’亦可以不產生空隙的方式來對電氣元件 周圍之邊緣部進行加壓，據此，能使用例如異向導電性黏 著膜來進行高可靠性之ic晶片等連接》 且，於本發明中，由於設置按照壓接構件之壓接面區 域來調整緊壓力之緊壓力調整機構，故當藉由各壓接部將 複數個電氣元件整批緊壓時，可分別對各電氣元件之緊壓 側區域以及侧部區域以最適當之力量來緊壓，據此，當進 行壓接時，可防止各電氣元件與基板產生偏移而進行高可 靠性之構裝。 具體而言’於本發明中，緊壓力調整機構，係設置於 壓接頭本體之複數個框狀緊壓力調整部，於配置壓接構件 在該等緊壓力調整框部内側之情形，對於所對應之電氣元 7 ^35631 件，能確實以側部區域之壓力小於緊壓側區域之壓力的方 式來進行緊壓。又，由於可從材質、硬度等觀點來微調緊 壓力調整框部内之壓接構件，故可確實防止當將多數個電 氣元件整批構裝時產生偏移。 又，於本發明中，緊壓力調整機構，係設置於該壓接 頭本體之突起狀緊壓力調整部、或緊壓力調整部之高度不 同，則可將壓接構件之壓接面各區域之緊壓力做最適當調 整，可更確實防止複數個電氣元件之位置偏移同時進行埶 壓接。 ^ 再者，於本發明中，緊壓力調整機構埋設於壓接構件 内，則即使電氣元件位於緊壓力調整機構下方亦可進行壓 接故可於壓接面之各區域進行平順的緊壓，其結果，部 需要準備對應電氣元件之數量、配置、及大小等之熱壓接 貝可防止各種電氣元件之位置偏移同時進行複數之熱壓 接0 再者於本發明中，緊壓力調整機構，係設置於壓接 構件之缺口部之，陪犯，&拓， Ά^ 緊壓力不會傳遞至缺口部二邊之相 鄰#位而僅使對應電氣元件之部分產生壓、缩，故不需要設 置框部而能僅以簡易的機構來防止電氣元件之位置偏移。 ^•处再者於本發明中’緊壓力調整機構，係將複數個該 邊接構件組合成—<§*而姐_ 體而構成之情形，由於可於壓接構件形 成與设置上述缺口# 、。卩之情形同樣的間隙，故不需要設置框 口P而能僅以簡易的m急 機構來防止電氣元件之位置偏移。 依據本發明，At m 此使用黏著劑以高可靠性來構裝複數個 8 1335631 電氣元件。 · 【實施方式】 以下，參考圖式來詳細說明本發明之電氣元件之構裝 裝置之實施形態。 圖1 ( a )所不係本實施形態之構裝裝置局部之概要構 成圖，圖1 ( b )所示係相同構裝裝置之熱壓接頭與IC晶 片之位置關係之說明圖。 如圖1 ( a ) 、（ b )所示，本實施形態之構裝裝置i 具備有：基台2，用以裝載配線基板丨〇 (形成有配線圖案 l〇a);以及熱壓接頭4,用以對設置有凸塊2〇b之1〇：晶 片（電氣元件）20進行加壓與加熱。 在此，基台2由既定金屬構成，其内部設置有加熱用 加熱器3。 再者，熱壓接頭4具有由既定金屬構成之壓接頭本體 5’其内部設置有未圖示之加熱用加熱器。 又，壓接頭本體5上與基台2相對向之部分以對應複 數個1C晶片20之方式設置複數個緊壓力調整框（緊壓力 調整機構）5a’據此，設置分割為複數個區域之凹部讣。 於本發明中，以密合於各凹部5b内壁之方式安裝由平 板狀之彈性體構成之壓接構件6。 本實施形態之壓接構件6係以平面狀 平之方式來配置。再者，譲件6之_面：面為= 晶片2〇之頂部2〇a施加均勻之力量，其構成較頂部池之 面積大。 9 又，從對IC晶片.20之頂) Λ a . 貝20a及後述之側部的邊緣 部7c以最適當之壓力來加壓 二二―… -爻觀點來考量，壓接構件6之 厚度最好與IC晶片20之厚度相同或更厚。 再者，本發明之情形，未特別限定壓接構件6之彈性 體種類’但從使連接可靠性提升之觀點來考量，最好使用 橡膠硬度為40〜80者。
橡膠硬度不滿40之彈性體，對於1C晶片20之壓力不 充分而有初期電阻以及連接可靠性差之缺陷，橡膠硬度大 ϋ 8〇之彈性體’因對於邊緣部分之壓力不充分，會於黏 者劑之結合劑樹脂中產生空隙而有連接可#性差之缺陷。 此外，本說明書中，橡膠硬度為適用以jis s 6〇5〇為 依據之規格（溫度條件為室溫：5〜35。匸）。 在此，在JIS S 6〇5〇中，針對橡膠硬度之測定方法記 載如下。 ” *亦即，使用壓針形狀為直徑5 〇8±〇 〇2mm之半球狀的 鲁=簧硬度試驗機，對保持水平之試片表面，使試驗機之壓 ，，成為鉛垂而接觸加壓面，立即以正數讀取刻度。 * 、此外，試片之測定部位係將表面整體3等分對每一 j刀的中央部分逐—進行測定，以其中央值做為試片之硬 ^備'主1 .壓針之高度’當刻度為0時係2.54±0.02mm， 田刻度為100時係0mm。 〇 54傷在2 .刻度與彈簧力（N )之關係，當刻度為〇時係 §刻度為10時係1.32，當刻度為20時係2.11，當 1335631 刻度為25時係2.50 ’當刻度為30時係2·89，當刻度為4〇 時係3.68,當刻度為50時係4.46,當刻度為60時係5 25， 當刻度為70時係6.03，當刻度為75時係6·42，當刻度為 80時係6.82 ’當刻度為90時係7.60，當刻度為1〇〇時係 8.39 〇 ' 此外’依據本發明人等之實驗，已確認壓接構件6自 室溫加熱至240°C之情形，其彈性體之橡膠硬度幾乎不產 生變化（±2左右）。
做為上述彈性體，可使用天然橡膠、合成橡膠中任一 種，但從耐熱性、耐壓性之觀點來考量，最好使用矽氧橡 膠。 圖2 ( a)、（ b )所示係使用本實施形態之構裝裝置 之構裝方法之一例之製程圖。 於本實施形態中，在進行IC晶片2〇之構裝時如圖 2 (a)所不，於基台2上配置配線基板1〇，於此配線基板 上裝载異向導電性黏著膜7。此異向導電性黏著膜^係 結合劑樹脂7a中分散導電粒子几者。 此外，若結合劑樹脂7a中分散之導電粒子7b之量為 少量，則本發明所使用之黏著劑的炫融黏度不會因為有無 刀散導電粒子7b而受到影響。
接者，於上述異向導電性黏著膜7上裝載1C晶片2〇， 透過未圖示之保護膜將熱壓接頭4之壓接面6a壓貼於IC 既定條件進行預壓接，再以下述條 11 1335631 、本發明之情形，從·可對1C晶片20周圍之邊緣部八充 分加熱來確實防止空隙產生的觀點來考量，當進行正式壓 接時，最好以既定溫度來加熱Ic晶片2〇側，且以較上述 既定溫度高之溫度來加熱配線基板1〇側。 具體而言，以壓接構件6之溫度達到1〇(rc左右之方 式來控制熱壓接頭4之加熱器，以異向導電性黏著膜7之 f合劑樹脂7a達到20(TC左右之方式來控制基台2之加熱 器3 〇 2據此，當進行該熱壓接時，以熔融黏度成為ι 〇χ
WmPa· sM.OxWmPa· s之方式加熱黏著劑異向導電性 黏著膜7。 在此，當進行熱壓接時，異向導電性黏著膜7之熔融 黏度不滿l.0xl02mPa· s之情形，熱壓接時結合劑樹脂h 之流動性強，會產生空隙而有初期電阻與連接可靠性差之 缺陷，熔融黏度大於l.〇Xl〇5mpa · S之愔拟舢『 lit形，熱壓接時於 連接部分無法將結合劑樹脂7a充分排除，會產生空隙而有 初期電阻與連接可靠性差之缺陷。 ' 此外，正式壓接時之壓力，每一個Ic曰y 叫化曰曰片20以100Ν 左右進行約1 5秒。 如圖 〇)所示，於本實施形態中，藉由以上述彈性 體構成之壓接構件6來進行加壓，以既宏 疋疋壓力對配線基板 1 〇緊壓1C晶片20之頂部20a，再者，以鲂 M較對頂部20a施 加之壓力小之壓力來緊壓1C晶片20 據此’可對1C晶片20與配線基板 之側部的邊緣部7c， 10之連接部分施加充 12 1335631 分的壓力，再去、丨, 者亦可以不產生空隙的方式對 周圍之邊緣部7c加壓。 t ic晶片20 /、、’。果，依據本實施形態，可使用異向導 7來進行高可靠性之IC晶片2〇等之連接。 者膜 且，於本實施形態中，由於藉由緊壓力 整各壓接構件6之緊愿Λ，始a 框5a來調 1C曰Μ Μ Μ,肢 谷坚接構件ό將複數個 1C日日片20整批緊壓時’能分別 分比日日片之頂部2 0 a w 及側部以最適當之力量（尤其是 .^ . θ , 疋耵1C日日片2〇之側部以均
句之力！）進行緊壓，據此’可防止當進行壓接時各K 晶片20與基板10產生偏移而進行高可靠性之構裝。 圖3〜圖6所示係本發明之其他實施形態之概要構成 圖，以下，對應上述實施形態之部分附加相同符號而省略 其詳細說明。 圖3所示之構裝裝置1A，與上述實施形態之壓接頭本 體5相同’於設置於壓接頭本體5之凹部^設置有複數 個緊壓力調整框5a，但本實施形態之情形，該等緊壓力調 整框5a埋設於配置於凹部5b内形成一體之壓接構件6内。 再者，在此，於緊壓力調整框5a之間設置有高度較緊 壓力調整框5a低之不同高度的緊壓力調整框5〇。 再者，於本實施形態中，藉由改變緊壓力調整框5a、 5〇之位置、高度，可按照壓接構件6之壓接面6a區域來 調整緊壓力。 依據具有上述構成之本實施形態，即使IC晶片2 0以 及配線基板10位於緊壓力調整框5a下方亦可進行壓接， 13 1335631 故於壓接面6a之各區域可進行平順的緊壓，其結果，不需 要準備對應1C晶片2〇之數量、配置、大小等之熱壓接頭 4,可防止複數個IC晶片20產生位置偏移同時進行熱壓 接。 關於其他構成以及作用效果，由於與上述實施形態相 同故省略其詳細說明。 圖4所示之構裝裝置1B，係於安裝在壓接頭本體5之 凹部5b内之壓接構件6的壓接面6a，設置有缺口部6b做 為緊壓力調整機構。 此情形，隔著既定間隔設置複數個缺口部6b。再者， 藉由改變缺口部6b之數量、方向、深度，可按照壓接構 件6之壓接面6a區域來調整緊壓力。 依據具有上述構成之本實施形態，例如以缺口部6b以 外之部分來緊壓1C晶片20之情形，緊壓力不會傳遞至缺 口部6b二邊之相鄰部位而僅使該緊壓部分產生壓縮，其 結果，不需要設置框部而能僅以簡易的機構來防止1C晶 片20之位置偏移。 此外，由於本實施形態之缺口部6b的間隙小，故即使 Ic晶片20位於缺口部6b下方之情形，當進行熱壓接時亦 不會產生1C晶片20之位置偏移，可於壓接面6a之各區域 進行平順的緊壓。 再者’依據具有上述構成之本實施形態，亦不需要準 備對應1C晶片20之數量、配置、大小等之熱壓接頭4， 可防止複數個1C晶片20之位置偏移同時進行熱壓接。 14 1335631 關於其他構成以及作用效果，由於與上述實施形態相 同故省略其詳細說明。 圖5所不之構裝裝置丨c，係組合圖3所示實施形態與 圖4所示實施形態所得者。 亦即’於本實施形態中，將緊壓力調整框5a、50埋設 於壓接頭本體5之凹部5b的壓接構件6内，且於該壓接 構件6之壓接面6a設置缺口部6b。 再者’依據本實施形態’亦不需要準備對應1C晶片20 之數量、配置、大小等之熱壓接頭4，可防止複數個1(：晶 片20之位置偏移同時進行熱壓接。 尤其是在本實施形態中，由於採用將壓接頭本體5之 緊壓力調整框5a、5G與壓接構件6之缺口部6b併用之構 成來做為緊壓力調整機構，故能於壓接構件6之壓接面“ 各區域對緊壓力進行微調。 關於其他構成以及作用效果，由於與上述實施形態相 同故省略其詳細說明。 圖6所示之構裝裝置1D，係將緊壓力調整框5a埋設 於上述壓接頭本體5之凹部5b的壓接構件…且將複 數（本實施形態為2種類）個壓接構件61、62组合 體。 a如圖6所不，於本實施形態中’於壓接頭本體5之凹 P 5b的第1壓接構件61設置例如長方體形狀之凹部，並 嵌合與此凹部相同形狀之第2壓接構件62,據此，形成平 面的壓接面6a。 15 〜JVJJ丄 壓接使壓接頭本體5之緊壓力調整框5a貫通第2 v接構件62並加以λ杜 , 址 支持’例如使用黏著劑來固定第1壓
接構件61之壓接頭太栌< M 接頭本體5之凹部5a側的界面01a。 據此，於第2壓接盖 按構件62之側部面與第1壓接構件61 之壁面之間形成間隙60。 據/、有上述構成之本實施形態，由於在第丨壓接構 牛61與第2壓接構件62之間形成與上述實施形態之缺口 部讣相1¾的間「朿6〇，故不需要設置框部而能僅以簡易的 機構來防止1C晶片20之位置偏移。 ^此情形，與上述實施形態之情形相同，由於此間隙60 微小’故即使IC晶片2G位於其下方之情形，當進行熱壓 接時亦不會產生1C晶片20之位置偏移。 此外，彳文確實發揮本發明之效果而使連接可靠性提升 之觀點來考置’使用橡膠硬度較第1壓接構件61小者做 為第2壓接構件62較有效果。 再者’依據本實施形態，亦不需要準備對應ic晶片20 之數星配置、大小等之熱壓接頭4，可防止複數個ic晶 片20之位置偏移同時進行熱壓接。 關於其他構成以及作用效果，由於與上述實施形態相 同故省略其詳細說明。 此外’本發明並不侷限於上述實施形態，可進行各種 變更。 例如’在上述實施形態中，做為緊壓力調整機構，於 壓接頭本體設置框狀緊壓力調整部，但本發明並不侷限於 16 1335631 此’亦可設置如下之突.起狀緊壓力調整部。 例如，於圖7 (a) 、（b)所示之實施形態中，於上 述壓接頭本體5之緊壓力調整框5a内側的凹部5b設置複 數個突起狀之緊壓力調整部51。 在此，以高度較周圍的緊壓力調整框5a低之方式來設 置緊C力調整部51，據此，緊壓力調整部51埋設於上述 壓接構件6内。 再者，依據本實施形態，亦不需要準備對應ie晶片2〇 之數量、配置、大小等之熱壓接頭4，可防止複數個1(：晶 片2〇之位置偏移同時進行熱壓接。 又，在上述實施形態中，以使用異向導電性黏著膜來 構名1C晶片的情形為例做說明，但本發明並不侷限於此， 亦可使用不含導電粒子之黏著劑。 再者，於上述實施形態中，以構裝具有凸塊電極之Ic 晶片之情形為例做說明，但亦可適用於不具有凸塊電極之 1C晶片。 【圖式簡單說明】 圖1(a)所示係本實施形態之構裝裝置局部之概要構 成圖’圖1 ( b )所示係相同構裝裝置之熱壓接頭與ic晶 片之位置關係之說明圖。 圖2 ( a )、（ b )所示係使用本實施形態之構裝裝置 之構裝方法之一例之製程圖。 圖3所不係本發明之其他實施形態之概要構成圖。 圖4所不係本發明之其他實施形態之概要構成圖。 17 |Ξ| C · 厅不係本發明·之其他實施形態之概要構成圖。 圖6所不係本發明之其他實施形態之概要構成圖。 圖 7 Γ a、 >4匕一" ;所不係本發明之其他實施形態之壓接頭本體 之俯視圖’圖7(b)係圖7(a)之A-A線截面圖。 【主要元件符號說明】 1 構裝裝置 1A 構裝裝置
1B 構裝裝置 1 C 構裝裝置 1 D 構裝裝置 2 基台 3 加熱器 4 熱壓接頭 5 壓接頭本體 5a 緊壓力調整框（框狀之緊壓力調整部、緊壓力調整機構） 5b 凹部
6 壓接構件 6a 壓接面 6b 缺口部 7 異向導電性黏著膜 7 a 結合劑樹脂 7b 導電粒子 7c 邊緣部 10 配線基板 1335631 10a 配線圖案. 20 IC晶片（電氣元件） 20a 頂部 20b 凸塊 50 緊壓力調整框 51 緊壓力調整部 60 間隙 61 第1壓接構件 61a 界面 62 第2壓接構件 19

Claims (1)

1335631
十、申請專利範圍： • ι_種構裝裝置’係電氣元件之構裝裝置，其特徵在 於，係具備： 熱壓接頭，於壓接頭本體具有由既定彈性體構成之壓 接構件；以及 緊壓力調整機構，按照該壓接構件之壓接面區域來調 整緊壓力； 使該壓接構件以既定壓力對配置於配線基板上之電氣 • 元件進行緊壓。 2·如申請專利範圍第1項之構裝裝置，其中，該緊壓 • 力调整機構，係設置於該壓接頭本體之複數個框狀緊壓力 調整部； 於該緊壓力調整部内側配置該壓接構件。 3.如申請專利範圍第1項之構裝裝置，其中，該緊壓 力調整機構，係設置於該壓接頭本體之突起狀緊壓力調整 部。 ▲ - 4.如申請專利範圍帛2《3項之構裝裝置，其中，該 緊壓力調整部之高度不同。 5.如申請專利範圍第丨項之構裝裝置，其中，該緊壓 力調整機構埋設於該壓接構件内。 6·如申請專利範圍第1項之構裝裝置，其中，該緊壓 力調整機構，係設置於該壓接構件之缺口部。 7·如申請專利範圍第1項之構裝裝置，其中，該緊壓 力調整機構’係將複數個該壓接構件組合成—體而構成。 20 1335631 8.如申請專利範圍第1項之構裝裝置，其中，具有支 持該配線基板之基台，於該基台設置加熱器。 十一、圖式： 如次頁。
21
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US7857028B2 (en) 2010-12-28
US20080035274A1 (en) 2008-02-14
KR101253794B1 (ko) 2013-04-12
JP4841431B2 (ja) 2011-12-21
CN100557783C (zh) 2009-11-04
JPWO2006082744A1 (ja) 2008-06-26
WO2006082744A1 (ja) 2006-08-10
EP1845556A1 (en) 2007-10-17
EP1845556A4 (en) 2010-02-10
KR20070099679A (ko) 2007-10-09
EP2264748A2 (en) 2010-12-22
CN101111932A (zh) 2008-01-23
HK1116920A1 (en) 2009-01-02

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