TWI335051B - - Google Patents

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Publication number
TWI335051B
TWI335051B TW095129297A TW95129297A TWI335051B TW I335051 B TWI335051 B TW I335051B TW 095129297 A TW095129297 A TW 095129297A TW 95129297 A TW95129297 A TW 95129297A TW I335051 B TWI335051 B TW I335051B
Authority
TW
Taiwan
Prior art keywords
wafer
collet
flat
ring
blowing
Prior art date
Application number
TW095129297A
Other languages
English (en)
Chinese (zh)
Other versions
TW200717636A (en
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200717636A publication Critical patent/TW200717636A/zh
Application granted granted Critical
Publication of TWI335051B publication Critical patent/TWI335051B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7501—Means for cleaning, e.g. brushes, for hydro blasting, for ultrasonic cleaning, for dry ice blasting, using gas-flow, by etching, by applying flux or plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/40—Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW095129297A 2005-10-21 2006-08-10 Bonding apparatus and bonding method TW200717636A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005307303A JP4530966B2 (ja) 2005-10-21 2005-10-21 ボンディング装置及びボンディング方法

Publications (2)

Publication Number Publication Date
TW200717636A TW200717636A (en) 2007-05-01
TWI335051B true TWI335051B (ja) 2010-12-21

Family

ID=38097883

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095129297A TW200717636A (en) 2005-10-21 2006-08-10 Bonding apparatus and bonding method

Country Status (3)

Country Link
JP (1) JP4530966B2 (ja)
KR (1) KR100779613B1 (ja)
TW (1) TW200717636A (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5953022B2 (ja) * 2011-09-19 2016-07-13 ファスフォードテクノロジ株式会社 ボンディング方法
KR101566714B1 (ko) * 2013-07-25 2015-11-13 한미반도체 주식회사 플립칩 본딩장치
JP6064831B2 (ja) 2013-08-08 2017-01-25 三菱電機株式会社 試験装置、試験方法
CN104319251B (zh) * 2014-10-29 2018-02-06 三星半导体(中国)研究开发有限公司 芯片拾取装置
US11508599B2 (en) 2017-01-30 2022-11-22 Shinkawa Ltd. Pick-up device and pick-up method
CN106847674B (zh) * 2017-03-21 2023-05-26 优然沃克(北京)科技有限公司 一种蓝宝石晶片加工用快速脱片装置
KR102012720B1 (ko) 2017-06-30 2019-11-04 프리시스 주식회사 진공밸브 엑츄에이터
JP7134804B2 (ja) * 2018-09-20 2022-09-12 株式会社東芝 コレットチャック、半導体製造装置、および半導体装置の製造方法
KR102199450B1 (ko) * 2019-04-09 2021-01-06 레이저쎌 주식회사 레이저 리플로우 장치의 레이저 가압 헤드 모듈
JP7471862B2 (ja) * 2020-02-27 2024-04-22 キオクシア株式会社 貼合装置および貼合方法
US11552031B2 (en) * 2020-03-13 2023-01-10 Asmpt Singapore Pte. Ltd. High precision bonding apparatus comprising heater
CN117080127B (zh) * 2023-10-11 2024-01-05 江苏快克芯装备科技有限公司 芯片吸取异常检测装置及检测方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2530013B2 (ja) * 1988-11-18 1996-09-04 富士通株式会社 半導体装置の製造方法
JPH1168300A (ja) * 1997-08-25 1999-03-09 Ueno Seiki Kk ボール吸着治具の制御方法およびボール吸着治具システム
JP2000225679A (ja) * 1999-02-05 2000-08-15 Canon Inc オフセット印刷方法、装置及びそれにより製造する高精細パターン基板
JP2002186923A (ja) * 2000-12-19 2002-07-02 Shibaura Mechatronics Corp 基板のクリーニング装置、及びクリーニング方法
JP4190161B2 (ja) * 2001-05-08 2008-12-03 株式会社新川 ウェーハリングの供給返送装置

Also Published As

Publication number Publication date
TW200717636A (en) 2007-05-01
KR20070043597A (ko) 2007-04-25
JP2007115979A (ja) 2007-05-10
KR100779613B1 (ko) 2007-11-26
JP4530966B2 (ja) 2010-08-25

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